JP2009152481A - 撮像用半導体装置および撮像用半導体装置の製造方法 - Google Patents

撮像用半導体装置および撮像用半導体装置の製造方法 Download PDF

Info

Publication number
JP2009152481A
JP2009152481A JP2007330727A JP2007330727A JP2009152481A JP 2009152481 A JP2009152481 A JP 2009152481A JP 2007330727 A JP2007330727 A JP 2007330727A JP 2007330727 A JP2007330727 A JP 2007330727A JP 2009152481 A JP2009152481 A JP 2009152481A
Authority
JP
Japan
Prior art keywords
imaging
sealing material
wiring board
semiconductor device
imaging semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007330727A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009152481A5 (enExample
Inventor
Satoru Shiraishi
哲 白石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007330727A priority Critical patent/JP2009152481A/ja
Publication of JP2009152481A publication Critical patent/JP2009152481A/ja
Publication of JP2009152481A5 publication Critical patent/JP2009152481A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2007330727A 2007-12-21 2007-12-21 撮像用半導体装置および撮像用半導体装置の製造方法 Pending JP2009152481A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007330727A JP2009152481A (ja) 2007-12-21 2007-12-21 撮像用半導体装置および撮像用半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007330727A JP2009152481A (ja) 2007-12-21 2007-12-21 撮像用半導体装置および撮像用半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2009152481A true JP2009152481A (ja) 2009-07-09
JP2009152481A5 JP2009152481A5 (enExample) 2010-10-28

Family

ID=40921257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007330727A Pending JP2009152481A (ja) 2007-12-21 2007-12-21 撮像用半導体装置および撮像用半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2009152481A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035360A (ja) * 2009-07-29 2011-02-17 Kingpak Technology Inc 撮像素子パッケージの製造方法および構造
JP2011165774A (ja) * 2010-02-05 2011-08-25 Canon Inc 固体撮像装置の製造方法
JP2013118230A (ja) * 2011-12-01 2013-06-13 Canon Inc 固体撮像装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04261032A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 光透過用ガラス窓を有する半導体装置の製造方法
JP2002016194A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 半導体装置
JP2006303481A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法、及び固体撮像装置
JP2007035779A (ja) * 2005-07-25 2007-02-08 Canon Inc リードレス中空パッケージ及びその製造方法
JP2007141957A (ja) * 2005-11-15 2007-06-07 Fujitsu Ltd 半導体装置及びその製造方法
JP2007311416A (ja) * 2006-05-16 2007-11-29 Fujifilm Corp 固体撮像装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04261032A (ja) * 1991-01-31 1992-09-17 Mitsubishi Electric Corp 光透過用ガラス窓を有する半導体装置の製造方法
JP2002016194A (ja) * 2000-06-29 2002-01-18 Kyocera Corp 半導体装置
JP2006303481A (ja) * 2005-03-25 2006-11-02 Fuji Photo Film Co Ltd 固体撮像装置の製造方法、及び固体撮像装置
JP2007035779A (ja) * 2005-07-25 2007-02-08 Canon Inc リードレス中空パッケージ及びその製造方法
JP2007141957A (ja) * 2005-11-15 2007-06-07 Fujitsu Ltd 半導体装置及びその製造方法
JP2007311416A (ja) * 2006-05-16 2007-11-29 Fujifilm Corp 固体撮像装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035360A (ja) * 2009-07-29 2011-02-17 Kingpak Technology Inc 撮像素子パッケージの製造方法および構造
JP2011165774A (ja) * 2010-02-05 2011-08-25 Canon Inc 固体撮像装置の製造方法
JP2013118230A (ja) * 2011-12-01 2013-06-13 Canon Inc 固体撮像装置
US8928803B2 (en) 2011-12-01 2015-01-06 Canon Kabushiki Kaisha Solid state apparatus

Similar Documents

Publication Publication Date Title
JP5746919B2 (ja) 半導体パッケージ
JP4204368B2 (ja) 光学装置用モジュール及び光学装置用モジュールの製造方法
CN101346817B (zh) 固体摄像元件模块的制造方法
JP5047243B2 (ja) 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
JP4819152B2 (ja) 光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
CN104576570B (zh) 电子部件、电子装置以及用于制造电子部件的方法
US9327457B2 (en) Electronic device and method for manufacturing electronic device
KR101066175B1 (ko) 전자장치 및 전자장치를 제조하기 위한 방법
CN101752323A (zh) 图像传感器相机模块及其制造方法
JP2004296453A (ja) 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP2011035360A (ja) 撮像素子パッケージの製造方法および構造
KR20160108664A (ko) 반도체 패키지 및 그 제조 방법
US9184331B2 (en) Method for reducing tilt of optical unit during manufacture of image sensor
JP2012178564A (ja) 透光板の傾斜を低減可能にするイメージセンサの製造方法
JP5515223B2 (ja) 半導体装置
US11094722B2 (en) Image sensor package and imaging apparatus
JP4925832B2 (ja) 光センサを実装するための方法
US20120098080A1 (en) Method and package for an electro-optical semiconductor device
JP2009152481A (ja) 撮像用半導体装置および撮像用半導体装置の製造方法
US10529869B2 (en) Electronic component, electronic equipment, and method for manufacturing electronic component
JP2007317719A (ja) 撮像装置及びその製造方法
JP2008047665A (ja) 固体撮像装置の製造方法、及び固体撮像装置
CN102237388A (zh) 制造固态图像传感装置的方法及固态图像传感装置
US20050176168A1 (en) Package structure of optical device and method for manufacturing the same
WO2023112521A1 (ja) 半導体装置、電子機器および半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100913

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100913

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110303

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120911

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121107

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130205