JP2009148847A - 異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板 - Google Patents

異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板 Download PDF

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Publication number
JP2009148847A
JP2009148847A JP2007327510A JP2007327510A JP2009148847A JP 2009148847 A JP2009148847 A JP 2009148847A JP 2007327510 A JP2007327510 A JP 2007327510A JP 2007327510 A JP2007327510 A JP 2007327510A JP 2009148847 A JP2009148847 A JP 2009148847A
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JP
Japan
Prior art keywords
etching mask
etching
correction
silicon substrate
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007327510A
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English (en)
Japanese (ja)
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JP2009148847A5 (enExample
Inventor
Kaoru Noguchi
薫 野口
Shigehisa Hotta
薫央 堀田
Kazutoshi Torashima
和敏 虎島
Yutaka Setomoto
豊 瀬戸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2007327510A priority Critical patent/JP2009148847A/ja
Priority to US12/333,910 priority patent/US20090161189A1/en
Priority to CN200810188516.8A priority patent/CN101462692A/zh
Publication of JP2009148847A publication Critical patent/JP2009148847A/ja
Publication of JP2009148847A5 publication Critical patent/JP2009148847A5/ja
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00388—Etch mask forming
    • B81C1/00404—Mask characterised by its size, orientation or shape

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2007327510A 2007-12-19 2007-12-19 異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板 Withdrawn JP2009148847A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007327510A JP2009148847A (ja) 2007-12-19 2007-12-19 異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板
US12/333,910 US20090161189A1 (en) 2007-12-19 2008-12-12 Method of manufacturing a structure based on anisotropic etching, and silicon substrate with etching mask
CN200810188516.8A CN101462692A (zh) 2007-12-19 2008-12-19 基于各向异性蚀刻制造结构的方法和具有蚀刻掩模的硅基片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007327510A JP2009148847A (ja) 2007-12-19 2007-12-19 異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板

Publications (2)

Publication Number Publication Date
JP2009148847A true JP2009148847A (ja) 2009-07-09
JP2009148847A5 JP2009148847A5 (enExample) 2011-02-10

Family

ID=40788273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007327510A Withdrawn JP2009148847A (ja) 2007-12-19 2007-12-19 異方性エッチングによる構造体の作製方法、及びエッチングマスク付きシリコン基板

Country Status (3)

Country Link
US (1) US20090161189A1 (enExample)
JP (1) JP2009148847A (enExample)
CN (1) CN101462692A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8614831B2 (en) 2011-04-06 2013-12-24 Seiko Epson Corporation Actuator and optical scanner
US9293975B2 (en) 2011-03-24 2016-03-22 Seiko Epson Corporation Actuator, optical scanner, and image forming apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106767551A (zh) * 2016-11-18 2017-05-31 合肥工业大学 一种微纳米测量设备用高精度高灵敏弹性簧片的制作方法
DE102017217975A1 (de) * 2017-10-10 2019-04-11 Robert Bosch Gmbh Mikromechanische Federstruktur
JP7174634B2 (ja) * 2019-01-18 2022-11-17 東京エレクトロン株式会社 膜をエッチングする方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6803843B2 (en) * 2001-02-22 2004-10-12 Canon Kabushiki Kaisha Movable-body apparatus, optical deflector, and method of fabricating the same
US6831765B2 (en) * 2001-02-22 2004-12-14 Canon Kabushiki Kaisha Tiltable-body apparatus, and method of fabricating the same
JP3740444B2 (ja) * 2001-07-11 2006-02-01 キヤノン株式会社 光偏向器、それを用いた光学機器、ねじれ揺動体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9293975B2 (en) 2011-03-24 2016-03-22 Seiko Epson Corporation Actuator, optical scanner, and image forming apparatus
US8614831B2 (en) 2011-04-06 2013-12-24 Seiko Epson Corporation Actuator and optical scanner

Also Published As

Publication number Publication date
CN101462692A (zh) 2009-06-24
US20090161189A1 (en) 2009-06-25

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