JP2009147116A5 - - Google Patents
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- Publication number
- JP2009147116A5 JP2009147116A5 JP2007322993A JP2007322993A JP2009147116A5 JP 2009147116 A5 JP2009147116 A5 JP 2009147116A5 JP 2007322993 A JP2007322993 A JP 2007322993A JP 2007322993 A JP2007322993 A JP 2007322993A JP 2009147116 A5 JP2009147116 A5 JP 2009147116A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- semiconductor
- adhesive sheet
- semiconductors
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 43
- 239000000853 adhesive Substances 0.000 claims 24
- 230000001070 adhesive effect Effects 0.000 claims 24
- 125000000962 organic group Chemical group 0.000 claims 12
- 239000004593 Epoxy Substances 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 8
- 239000000463 material Substances 0.000 claims 7
- 239000004642 Polyimide Substances 0.000 claims 6
- 229920001721 polyimide Polymers 0.000 claims 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 125000001033 ether group Chemical group 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 2
- 125000000542 sulfonic acid group Chemical group 0.000 claims 2
- 125000000101 thioether group Chemical group 0.000 claims 2
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 2
- -1 1,1,1,3,3,3-hexafluoropropyl group Chemical group 0.000 claims 1
- 229920006015 heat resistant resin Polymers 0.000 claims 1
- 239000002648 laminated material Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007322993A JP5292793B2 (ja) | 2007-12-14 | 2007-12-14 | 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007322993A JP5292793B2 (ja) | 2007-12-14 | 2007-12-14 | 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009147116A JP2009147116A (ja) | 2009-07-02 |
| JP2009147116A5 true JP2009147116A5 (enExample) | 2011-01-20 |
| JP5292793B2 JP5292793B2 (ja) | 2013-09-18 |
Family
ID=40917388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007322993A Active JP5292793B2 (ja) | 2007-12-14 | 2007-12-14 | 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5292793B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014192462A (ja) * | 2013-03-28 | 2014-10-06 | Lintec Corp | 樹脂膜形成用シート |
| CN105102221B (zh) | 2013-04-16 | 2017-06-06 | 东洋纺株式会社 | 金属箔层叠体 |
| JP6476517B2 (ja) * | 2015-02-02 | 2019-03-06 | ナミックス株式会社 | フィルム状接着剤、それを用いた半導体装置 |
| KR102202054B1 (ko) | 2018-01-22 | 2021-01-11 | 주식회사 엘지화학 | 액정 배향제 조성물, 이를 이용한 액정 배향막의 제조 방법, 및 이를 이용한 액정 배향막 |
| JP7539769B2 (ja) * | 2019-12-18 | 2024-08-26 | 日東電工株式会社 | ダイボンドシート、及び、ダイシングダイボンドフィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237268A (ja) * | 2000-02-22 | 2001-08-31 | Nec Corp | 半導体素子の実装方法及び製造装置 |
| JP4211569B2 (ja) * | 2002-12-16 | 2009-01-21 | 宇部興産株式会社 | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 |
| US20040132888A1 (en) * | 2002-12-16 | 2004-07-08 | Ube Industries, Ltd. | Electronic device packaging and curable resin composition |
| JP4449325B2 (ja) * | 2003-04-17 | 2010-04-14 | 住友ベークライト株式会社 | 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。 |
| JP2004319823A (ja) * | 2003-04-17 | 2004-11-11 | Sumitomo Bakelite Co Ltd | 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。 |
| WO2006132165A1 (ja) * | 2005-06-06 | 2006-12-14 | Toray Industries, Inc. | 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 |
-
2007
- 2007-12-14 JP JP2007322993A patent/JP5292793B2/ja active Active
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