JP2009141406A - カメラモジュールの製造方法 - Google Patents

カメラモジュールの製造方法 Download PDF

Info

Publication number
JP2009141406A
JP2009141406A JP2007312347A JP2007312347A JP2009141406A JP 2009141406 A JP2009141406 A JP 2009141406A JP 2007312347 A JP2007312347 A JP 2007312347A JP 2007312347 A JP2007312347 A JP 2007312347A JP 2009141406 A JP2009141406 A JP 2009141406A
Authority
JP
Japan
Prior art keywords
lens
insulating substrate
lens holder
camera module
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007312347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009141406A5 (https=
Inventor
Junichi Abe
潤一 阿部
Maki Tamenyama
真樹 田面山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Semiconductor Corp
Original Assignee
Toshiba Corp
Iwate Toshiba Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Iwate Toshiba Electronics Co Ltd filed Critical Toshiba Corp
Priority to JP2007312347A priority Critical patent/JP2009141406A/ja
Publication of JP2009141406A publication Critical patent/JP2009141406A/ja
Publication of JP2009141406A5 publication Critical patent/JP2009141406A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2007312347A 2007-12-03 2007-12-03 カメラモジュールの製造方法 Pending JP2009141406A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007312347A JP2009141406A (ja) 2007-12-03 2007-12-03 カメラモジュールの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007312347A JP2009141406A (ja) 2007-12-03 2007-12-03 カメラモジュールの製造方法

Publications (2)

Publication Number Publication Date
JP2009141406A true JP2009141406A (ja) 2009-06-25
JP2009141406A5 JP2009141406A5 (https=) 2011-01-27

Family

ID=40871628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007312347A Pending JP2009141406A (ja) 2007-12-03 2007-12-03 カメラモジュールの製造方法

Country Status (1)

Country Link
JP (1) JP2009141406A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103995336A (zh) * 2013-02-18 2014-08-20 日立视听媒体股份有限公司 光学部件的粘接构造、制造方法和影像输出装置
CN106405988A (zh) * 2015-06-30 2017-02-15 罗伯特·博世有限公司 用于校准光具的摄像机壳体
CN107755221A (zh) * 2017-11-15 2018-03-06 信利光电股份有限公司 一种摄像头模组的包装方法以及吸塑壳体
JP2019143038A (ja) * 2018-02-20 2019-08-29 ヘンケルジャパン株式会社 Uv熱硬化型接着剤組成物
EP3960828A1 (en) 2020-08-31 2022-03-02 Henkel AG & Co. KGaA Resin composition and cured product thereof
US11460712B2 (en) 2017-01-30 2022-10-04 Sony Semiconductor Solutions Corporation Camera module, method of manufacturing the same, and electronic apparatus
KR20220151629A (ko) 2020-03-23 2022-11-15 헨켈 아게 운트 코. 카게아아 이중-경화성 접착제 조성물

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP2005198103A (ja) * 2004-01-08 2005-07-21 Inter Action Corp カメラモジュールの組立装置および組立方法
JP2006246461A (ja) * 2005-03-02 2006-09-14 Premier Image Technology Corp カメラモジュール及びその製造方法
JP2007036393A (ja) * 2005-07-22 2007-02-08 Smk Corp カメラモジュール及びその製造方法
JP2007110594A (ja) * 2005-10-17 2007-04-26 Hitachi Maxell Ltd カメラモジュール
JP2007274230A (ja) * 2006-03-30 2007-10-18 Mitsumi Electric Co Ltd カメラモジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP2005198103A (ja) * 2004-01-08 2005-07-21 Inter Action Corp カメラモジュールの組立装置および組立方法
JP2006246461A (ja) * 2005-03-02 2006-09-14 Premier Image Technology Corp カメラモジュール及びその製造方法
JP2007036393A (ja) * 2005-07-22 2007-02-08 Smk Corp カメラモジュール及びその製造方法
JP2007110594A (ja) * 2005-10-17 2007-04-26 Hitachi Maxell Ltd カメラモジュール
JP2007274230A (ja) * 2006-03-30 2007-10-18 Mitsumi Electric Co Ltd カメラモジュール

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103995336A (zh) * 2013-02-18 2014-08-20 日立视听媒体股份有限公司 光学部件的粘接构造、制造方法和影像输出装置
CN106405988A (zh) * 2015-06-30 2017-02-15 罗伯特·博世有限公司 用于校准光具的摄像机壳体
CN106405988B (zh) * 2015-06-30 2020-12-08 罗伯特·博世有限公司 用于校准光具的摄像机壳体
US11460712B2 (en) 2017-01-30 2022-10-04 Sony Semiconductor Solutions Corporation Camera module, method of manufacturing the same, and electronic apparatus
CN107755221B (zh) * 2017-11-15 2020-10-27 信利光电股份有限公司 一种摄像头模组的包装方法以及吸塑壳体
CN107755221A (zh) * 2017-11-15 2018-03-06 信利光电股份有限公司 一种摄像头模组的包装方法以及吸塑壳体
WO2019163629A1 (en) 2018-02-20 2019-08-29 Henkel Ag & Co. Kgaa Thermal- and uv-curing adhesive composition
KR20200123180A (ko) 2018-02-20 2020-10-28 헨켈 아게 운트 코. 카게아아 열 및 uv 경화 접착제 조성물
CN111712764A (zh) * 2018-02-20 2020-09-25 汉高股份有限及两合公司 热固化和uv固化粘合剂组合物
US11111421B2 (en) 2018-02-20 2021-09-07 Henkel Ag & Co. Kgaa Thermal- and UV-curing adhesive composition
JP2019143038A (ja) * 2018-02-20 2019-08-29 ヘンケルジャパン株式会社 Uv熱硬化型接着剤組成物
JP7146409B2 (ja) 2018-02-20 2022-10-04 ヘンケルジャパン株式会社 Uv熱硬化型接着剤組成物
KR102629106B1 (ko) * 2018-02-20 2024-01-24 헨켈 아게 운트 코. 카게아아 열 및 uv 경화 접착제 조성물
KR20220151629A (ko) 2020-03-23 2022-11-15 헨켈 아게 운트 코. 카게아아 이중-경화성 접착제 조성물
EP3960828A1 (en) 2020-08-31 2022-03-02 Henkel AG & Co. KGaA Resin composition and cured product thereof
KR20230058625A (ko) 2020-08-31 2023-05-03 헨켈 아게 운트 코. 카게아아 수지 조성물 및 이의 경화 생성물

Similar Documents

Publication Publication Date Title
JP2009141406A (ja) カメラモジュールの製造方法
JP4762264B2 (ja) カメラモジュールおよびカメラモジュールの製造方法
US7352402B2 (en) Image sensor module and method of making the same
US8063975B2 (en) Positioning wafer lenses on electronic imagers
US8063982B2 (en) Image sensor camera module including a protruding portion and method of manufacturing the same
US7330211B2 (en) Camera module with focus adjustment structure and systems and methods of making the same
JP4510629B2 (ja) 半導体デバイスの製造方法
JP2009141406A5 (https=)
JP2008216891A (ja) 光学部品の固定方法
JPH11345955A (ja) レンズ一体型固体撮像素子並びにそのレンズ装着方法及びレンズ装着装置
KR101724678B1 (ko) 카메라 모듈 및 카메라 모듈의 제조 방법
US20050007484A1 (en) Digital image capturing module assembly and method of fabricating the same
WO2017094078A1 (ja) 撮像装置及び撮像装置の製造方法
US20170351112A1 (en) Assembly methods of a sma assembly and an ois device
KR101993898B1 (ko) 카메라 모듈 및 이를 제조하는 방법
US11310403B2 (en) Camera module and calibration method thereof
JP2013211486A (ja) 半導体装置、および半導体装置の製造方法
JP5484432B2 (ja) 光学部品の固定方法
KR101663832B1 (ko) 카메라 모듈 및 그의 제조 방법
JP2019068140A (ja) 固体撮像装置およびその製造方法
KR101200573B1 (ko) 촬상 소자 장착 구조 및 촬상 소자 장착 방법
JP2007312270A (ja) カメラモジュール及びその製造方法
KR101836331B1 (ko) 카메라 모듈 및 카메라 모듈의 제조 방법
JP2004063776A (ja) 撮像装置及びその製造方法
US20240302623A1 (en) Camera device and manufacturing method thereof

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101203

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101203

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120420

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120807