JP2009119868A - セラミックグリーンシート成形用キャリアフィルム及びセラミックグリーンシートの製造方法 - Google Patents
セラミックグリーンシート成形用キャリアフィルム及びセラミックグリーンシートの製造方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 163
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011230 binding agent Substances 0.000 claims abstract description 98
- 239000011347 resin Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000002002 slurry Substances 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000011049 filling Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000012461 cellulose resin Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 56
- 239000010408 film Substances 0.000 description 43
- 230000000052 comparative effect Effects 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- 238000010304 firing Methods 0.000 description 12
- 238000012856 packing Methods 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
- 239000002491 polymer binding agent Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 229920003087 methylethyl cellulose Polymers 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/30—Producing shaped prefabricated articles from the material by applying the material on to a core or other moulding surface to form a layer thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping
- B28B5/02—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type
- B28B5/026—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type the shaped articles being of indefinite length
- B28B5/027—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type the shaped articles being of indefinite length the moulding surfaces being of the indefinite length type, e.g. belts, and being continuously fed
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
- C04B2235/9615—Linear firing shrinkage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Producing Shaped Articles From Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
【解決手段】本発明のセラミックグリーンシート成形用キャリアフィルムは、セラミックグリーンシートの製造のためのフィルム型基材と、上記フィルム型基材上に形成されバインダー用樹脂からなるバインダー層と、上記キャリアフィルムの下面に形成され離型性樹脂からなる剥離層とを含む。また、本発明は、バインダー層を有するセラミックグリーンシート成形用キャリアフィルムを備える段階と、上記キャリアフィルム上にセラミックスラリーを塗布する段階と、上記塗布されたセラミックスラリーを乾燥させることによりセラミックグリーンシートを形成する段階とを含むセラミックグリーンシートの製造方法を提供する。
【選択図】図3
Description
図1は、本発明の一実施形態によるセラミックグリーンシート成形用キャリアフィルムの断面図である。
Claims (9)
- セラミックグリーンシートの製造のためのフィルム型基材と、
前記フィルム型基材上に形成されバインダー用樹脂からなるバインダー層と、
前記フィルム型基材の下面に形成され離型性樹脂からなる剥離層とを含むセラミックグリーンシート成形用キャリアフィルム。 - 前記バインダー用樹脂は、ビニル系樹脂、セルロース系樹脂及びアクリル系樹脂で構成されたグループから選択された少なくとも1種の樹脂であることを特徴とする請求項1に記載のセラミックグリーンシート成形用キャリアフィルム。
- 前記バインダー層と前記フィルム型基材の間に形成され離型性樹脂からなる追加の剥離層をさらに含むことを特徴とする請求項1または請求項2に記載のセラミックグリーンシート成形用キャリアフィルム。
- セラミックグリーンシートの製造のためのフィルム型基材と、前記フィルム型基材上に形成されバインダー用樹脂からなるバインダー層と、前記フィルム型基材の下面に形成され離型性樹脂からなる剥離層とを含むセラミックグリーンシート成形用キャリアフィルムを備える段階と、
前記キャリアフィルム上にセラミックスラリーを塗布する段階と、
前記塗布されたセラミックスラリーを乾燥させることによりセラミックグリーンシートを形成する段階とを含むセラミックグリーンシートの製造方法。 - 前記セラミックグリーンシートの下面に前記バインダー層が維持されるよう前記キャリアフィルムから前記セラミックグリーンシートを分離する段階をさらに含むことを特徴とする請求項4に記載のセラミックグリーンシートの製造方法。
- 前記セラミックスラリーは、少なくともセラミック粉末及びバインダーの混合物を溶媒に混合して備え、前記混合物は全体重量に対して90〜99.5wt%のセラミック粉末と0.5〜10wt%のバインダーを含むことを特徴とする請求項4または請求項5に記載のセラミックグリーンシートの製造方法。
- 前記セラミックグリーンシートは、90%以上のセラミック粉末充填密度を有することを特徴とする請求項4から請求項6の何れかに記載のセラミックグリーンシートの製造方法。
- 前記バインダー用樹脂は、ビニル系樹脂、セルロース系樹脂及びアクリル系樹脂で構成されたグループから選択された少なくとも1種の樹脂であることを特徴とする請求項4から請求項7の何れかに記載のセラミックグリーンシートの製造方法。
- 前記バインダー層と前記フィルム型基材の間に形成され離型性樹脂からなる追加の剥離層をさらに含むことを特徴とする請求項4に記載のセラミックグリーンシートの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0117234 | 2007-11-16 | ||
KR1020070117234A KR100961125B1 (ko) | 2007-11-16 | 2007-11-16 | 세라믹 그린시트 성형용 캐리어 필름 및 세라믹 그린시트제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2009119868A true JP2009119868A (ja) | 2009-06-04 |
JP4941915B2 JP4941915B2 (ja) | 2012-05-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008292689A Expired - Fee Related JP4941915B2 (ja) | 2007-11-16 | 2008-11-14 | セラミックグリーンシートの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090130473A1 (ja) |
JP (1) | JP4941915B2 (ja) |
KR (1) | KR100961125B1 (ja) |
TW (1) | TW200932514A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101300023B1 (ko) * | 2011-08-09 | 2013-08-23 | 아로 주식회사 | 열경화성 수지를 이용한 소프트 페라이트 시트의 제조방법 |
JP2018144500A (ja) * | 2017-03-01 | 2018-09-20 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルムおよびその製造方法 |
JP2019016688A (ja) * | 2017-07-06 | 2019-01-31 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
Citations (4)
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---|---|---|---|---|
JPH03179714A (ja) * | 1989-12-07 | 1991-08-05 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JPH07241826A (ja) * | 1994-03-07 | 1995-09-19 | Reiko Co Ltd | セラミックシート製造用離型性フイルム |
JPH07312326A (ja) * | 1994-05-18 | 1995-11-28 | Matsushita Electric Ind Co Ltd | 積層型電子部品の製造方法 |
JP2004067392A (ja) * | 2002-06-10 | 2004-03-04 | Kyocera Corp | セラミックグリーンシート |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH106443A (ja) * | 1996-06-26 | 1998-01-13 | Mitsubishi Materials Corp | セラミックスグリーンシート成形用キャリアーフィルム |
JP3760085B2 (ja) * | 2000-07-06 | 2006-03-29 | リンテック株式会社 | セラミックグリーンシート製造用工程フィルム |
-
2007
- 2007-11-16 KR KR1020070117234A patent/KR100961125B1/ko not_active IP Right Cessation
-
2008
- 2008-11-14 TW TW97144016A patent/TW200932514A/zh unknown
- 2008-11-14 JP JP2008292689A patent/JP4941915B2/ja not_active Expired - Fee Related
- 2008-11-14 US US12/271,378 patent/US20090130473A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03179714A (ja) * | 1989-12-07 | 1991-08-05 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JPH07241826A (ja) * | 1994-03-07 | 1995-09-19 | Reiko Co Ltd | セラミックシート製造用離型性フイルム |
JPH07312326A (ja) * | 1994-05-18 | 1995-11-28 | Matsushita Electric Ind Co Ltd | 積層型電子部品の製造方法 |
JP2004067392A (ja) * | 2002-06-10 | 2004-03-04 | Kyocera Corp | セラミックグリーンシート |
Cited By (3)
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KR101300023B1 (ko) * | 2011-08-09 | 2013-08-23 | 아로 주식회사 | 열경화성 수지를 이용한 소프트 페라이트 시트의 제조방법 |
JP2018144500A (ja) * | 2017-03-01 | 2018-09-20 | 東洋紡株式会社 | セラミックグリーンシート製造用離型フィルムおよびその製造方法 |
JP2019016688A (ja) * | 2017-07-06 | 2019-01-31 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
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KR100961125B1 (ko) | 2010-06-07 |
US20090130473A1 (en) | 2009-05-21 |
JP4941915B2 (ja) | 2012-05-30 |
KR20090050662A (ko) | 2009-05-20 |
TW200932514A (en) | 2009-08-01 |
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