JP2009119694A5 - - Google Patents

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Publication number
JP2009119694A5
JP2009119694A5 JP2007295452A JP2007295452A JP2009119694A5 JP 2009119694 A5 JP2009119694 A5 JP 2009119694A5 JP 2007295452 A JP2007295452 A JP 2007295452A JP 2007295452 A JP2007295452 A JP 2007295452A JP 2009119694 A5 JP2009119694 A5 JP 2009119694A5
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JP
Japan
Prior art keywords
etching mask
formula
predetermined pattern
substrate
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007295452A
Other languages
English (en)
Japanese (ja)
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JP5470528B2 (ja
JP2009119694A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2007295452A external-priority patent/JP5470528B2/ja
Priority to JP2007295452A priority Critical patent/JP5470528B2/ja
Priority to TW097143003A priority patent/TWI435800B/zh
Priority to US12/742,381 priority patent/US8597769B2/en
Priority to KR1020107012437A priority patent/KR101590650B1/ko
Priority to PCT/JP2008/003309 priority patent/WO2009063639A1/ja
Priority to EP08848634A priority patent/EP2221162A4/en
Publication of JP2009119694A publication Critical patent/JP2009119694A/ja
Publication of JP2009119694A5 publication Critical patent/JP2009119694A5/ja
Publication of JP5470528B2 publication Critical patent/JP5470528B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007295452A 2007-11-14 2007-11-14 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法 Expired - Fee Related JP5470528B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007295452A JP5470528B2 (ja) 2007-11-14 2007-11-14 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法
TW097143003A TWI435800B (zh) 2007-11-14 2008-11-07 An etching mask, a substrate having an etching mask, a method of manufacturing a fine processed product and a fine processed product
PCT/JP2008/003309 WO2009063639A1 (ja) 2007-11-14 2008-11-13 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法
KR1020107012437A KR101590650B1 (ko) 2007-11-14 2008-11-13 에칭 마스크, 에칭 마스크를 구비한 기재, 미세 가공품 및 미세 가공품의 제조방법
US12/742,381 US8597769B2 (en) 2007-11-14 2008-11-13 Etching mask, base material having etching mask, finely processed article, and method for production of finely processed article
EP08848634A EP2221162A4 (en) 2007-11-14 2008-11-13 ACID MASK, BASIC MATERIAL WITH PAINT MASK, FINISHED ARTICLE AND METHOD FOR PRODUCING A FINISHED ARTICLE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007295452A JP5470528B2 (ja) 2007-11-14 2007-11-14 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法

Publications (3)

Publication Number Publication Date
JP2009119694A JP2009119694A (ja) 2009-06-04
JP2009119694A5 true JP2009119694A5 (https=) 2011-01-06
JP5470528B2 JP5470528B2 (ja) 2014-04-16

Family

ID=40638494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007295452A Expired - Fee Related JP5470528B2 (ja) 2007-11-14 2007-11-14 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法

Country Status (6)

Country Link
US (1) US8597769B2 (https=)
EP (1) EP2221162A4 (https=)
JP (1) JP5470528B2 (https=)
KR (1) KR101590650B1 (https=)
TW (1) TWI435800B (https=)
WO (1) WO2009063639A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5448589B2 (ja) * 2009-06-12 2014-03-19 富士フイルム株式会社 パターン形成方法
JP2012149151A (ja) * 2011-01-18 2012-08-09 Jsr Corp エッチングマスク用樹脂及びエッチングマスク用コート材並びにサファイア基板のパターン形成方法
JP5767615B2 (ja) * 2011-10-07 2015-08-19 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
WO2018225707A1 (ja) * 2017-06-09 2018-12-13 三井化学株式会社 微細凹凸パターン付き基板の製造方法、樹脂組成物および積層体
US11802342B2 (en) 2021-10-19 2023-10-31 Tokyo Electron Limited Methods for wet atomic layer etching of ruthenium
US12506011B2 (en) 2023-12-15 2025-12-23 Tokyo Electron Limited Methods for wet atomic layer etching of transition metal oxide dielectric materials

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571375A (en) * 1983-10-24 1986-02-18 Benedikt George M Ring-opened polynorbornene negative photoresist with bisazide
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
KR100682169B1 (ko) * 1999-07-30 2007-02-12 주식회사 하이닉스반도체 신규의 포토레지스트용 공중합체 및 이를 이용한 포토레지스트조성물
JP4780262B2 (ja) * 2000-04-27 2011-09-28 信越化学工業株式会社 高分子化合物、化学増幅レジスト材料及びパターン形成方法
KR100527533B1 (ko) * 2000-06-21 2005-11-09 주식회사 하이닉스반도체 Tips 공정용 포토레지스트 중합체 및 이를 함유하는포토레지스트 조성물
JP2002184719A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd パターン形成方法
JP2002244296A (ja) * 2001-02-19 2002-08-30 Matsushita Electric Ind Co Ltd ホールパターンの形成方法
JP3656991B2 (ja) 2001-09-12 2005-06-08 丸善石油化学株式会社 環状オレフィン系共重合体の製造方法
KR101366505B1 (ko) * 2005-06-10 2014-02-24 오브듀캇 아베 고리형 올레핀 공중합체를 포함하는 임프린트 스탬프
KR100969440B1 (ko) * 2005-09-27 2010-07-14 에스씨아이브이에이엑스 가부시키가이샤 열 임프린트용 수지
US20100019410A1 (en) * 2005-12-09 2010-01-28 Scivax Corporation Resin for Thermal Imprinting
JP2007192875A (ja) * 2006-01-17 2007-08-02 Tokyo Ohka Kogyo Co Ltd 下層膜形成用材料、積層体およびパターン形成方法
WO2007111215A1 (ja) * 2006-03-27 2007-10-04 Pioneer Corporation パターン転写用モールド

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