WO2009063639A1 - エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法 - Google Patents

エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法 Download PDF

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Publication number
WO2009063639A1
WO2009063639A1 PCT/JP2008/003309 JP2008003309W WO2009063639A1 WO 2009063639 A1 WO2009063639 A1 WO 2009063639A1 JP 2008003309 W JP2008003309 W JP 2008003309W WO 2009063639 A1 WO2009063639 A1 WO 2009063639A1
Authority
WO
WIPO (PCT)
Prior art keywords
etching mask
finely processed
processed article
base material
atom
Prior art date
Application number
PCT/JP2008/003309
Other languages
English (en)
French (fr)
Inventor
Yoshiaki Takaya
Takuro Satsuka
Yoshihisa Hayashida
Takahisa Kusuura
Anupam Mitra
Original Assignee
Maruzen Petrochemical Co., Ltd.
Scivax Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maruzen Petrochemical Co., Ltd., Scivax Corporation filed Critical Maruzen Petrochemical Co., Ltd.
Priority to EP08848634A priority Critical patent/EP2221162A4/en
Priority to US12/742,381 priority patent/US8597769B2/en
Publication of WO2009063639A1 publication Critical patent/WO2009063639A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D145/00—Coating compositions based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Coating compositions based on derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Structural Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Architecture (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

　熱インプリント性に優れると共に、耐エッチング性も良好なエッチングマスク、エッチングマスク付き基材、およびこれらを適用した微細加工品および微細加工品の製造方法を提供する。式（１）もしくは式（２）記載の骨格を主鎖中に少なくとも１種類含有する熱可塑性樹脂からなるエッチングマスク。（式(1)、(2)中のR1、R2、R3、R4、R5、R6、R7、R8は異なっていても同一でもよく、それぞれ水素原子、重水素原子、炭素数1～15の炭化水素基、ハロゲン原子、または酸素、硫黄等のヘテロ原子を含有する置換基であり、互いに環構造を形成していてもよい。mおよびnは0以上の整数である。）
PCT/JP2008/003309 2007-11-14 2008-11-13 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法 WO2009063639A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08848634A EP2221162A4 (en) 2007-11-14 2008-11-13 ACID MASK, BASIC MATERIAL WITH PAINT MASK, FINISHED ARTICLE AND METHOD FOR PRODUCING A FINISHED ARTICLE
US12/742,381 US8597769B2 (en) 2007-11-14 2008-11-13 Etching mask, base material having etching mask, finely processed article, and method for production of finely processed article

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-295452 2007-11-14
JP2007295452A JP5470528B2 (ja) 2007-11-14 2007-11-14 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法

Publications (1)

Publication Number Publication Date
WO2009063639A1 true WO2009063639A1 (ja) 2009-05-22

Family

ID=40638494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003309 WO2009063639A1 (ja) 2007-11-14 2008-11-13 エッチングマスク、エッチングマスク付き基材、微細加工品および微細加工品の製造方法

Country Status (6)

Country Link
US (1) US8597769B2 (ja)
EP (1) EP2221162A4 (ja)
JP (1) JP5470528B2 (ja)
KR (1) KR101590650B1 (ja)
TW (1) TWI435800B (ja)
WO (1) WO2009063639A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287793A (ja) * 2009-06-12 2010-12-24 Fujifilm Corp パターン形成方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012149151A (ja) * 2011-01-18 2012-08-09 Jsr Corp エッチングマスク用樹脂及びエッチングマスク用コート材並びにサファイア基板のパターン形成方法
JP5767615B2 (ja) * 2011-10-07 2015-08-19 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
JP6846516B2 (ja) * 2017-06-09 2021-03-24 三井化学株式会社 微細凹凸パターン付き基板の製造方法、樹脂組成物および積層体
US11802342B2 (en) 2021-10-19 2023-10-31 Tokyo Electron Limited Methods for wet atomic layer etching of ruthenium

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
JP2001081142A (ja) * 1999-07-30 2001-03-27 Hyundai Electronics Ind Co Ltd フォトレジスト用共重合体とその製造方法、フォトレジスト組成物、フォトレジストパターン形成方法、及び半導体素子
JP2002012623A (ja) * 2000-04-27 2002-01-15 Shin Etsu Chem Co Ltd 高分子化合物、化学増幅レジスト材料及びパターン形成方法
JP2002053612A (ja) * 2000-06-21 2002-02-19 Hynix Semiconductor Inc フォトレジスト重合体、フォトレジスト重合体の製造方法、重合体、フォトレジスト組成物、フォトレジストパターン形成方法、及び半導体素子
JP2002184719A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd パターン形成方法
JP2002244296A (ja) * 2001-02-19 2002-08-30 Matsushita Electric Ind Co Ltd ホールパターンの形成方法
JP2003082017A (ja) 2001-09-12 2003-03-19 Maruzen Petrochem Co Ltd 環状オレフィン系共重合体の製造方法
JP2007055235A (ja) * 2005-06-10 2007-03-08 Obducat Ab 環状オレフィン共重合体を含んでなるインプリントスタンプ
WO2007037085A1 (ja) * 2005-09-27 2007-04-05 Scivax Corporation 熱インプリント用樹脂
WO2007111215A1 (ja) * 2006-03-27 2007-10-04 Pioneer Corporation パターン転写用モールド

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US4571375A (en) * 1983-10-24 1986-02-18 Benedikt George M Ring-opened polynorbornene negative photoresist with bisazide
US20100019410A1 (en) * 2005-12-09 2010-01-28 Scivax Corporation Resin for Thermal Imprinting
JP2007192875A (ja) * 2006-01-17 2007-08-02 Tokyo Ohka Kogyo Co Ltd 下層膜形成用材料、積層体およびパターン形成方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
JP2001081142A (ja) * 1999-07-30 2001-03-27 Hyundai Electronics Ind Co Ltd フォトレジスト用共重合体とその製造方法、フォトレジスト組成物、フォトレジストパターン形成方法、及び半導体素子
JP2002012623A (ja) * 2000-04-27 2002-01-15 Shin Etsu Chem Co Ltd 高分子化合物、化学増幅レジスト材料及びパターン形成方法
JP2002053612A (ja) * 2000-06-21 2002-02-19 Hynix Semiconductor Inc フォトレジスト重合体、フォトレジスト重合体の製造方法、重合体、フォトレジスト組成物、フォトレジストパターン形成方法、及び半導体素子
JP2002184719A (ja) * 2000-12-19 2002-06-28 Matsushita Electric Ind Co Ltd パターン形成方法
JP2002244296A (ja) * 2001-02-19 2002-08-30 Matsushita Electric Ind Co Ltd ホールパターンの形成方法
JP2003082017A (ja) 2001-09-12 2003-03-19 Maruzen Petrochem Co Ltd 環状オレフィン系共重合体の製造方法
JP2007055235A (ja) * 2005-06-10 2007-03-08 Obducat Ab 環状オレフィン共重合体を含んでなるインプリントスタンプ
WO2007037085A1 (ja) * 2005-09-27 2007-04-05 Scivax Corporation 熱インプリント用樹脂
WO2007111215A1 (ja) * 2006-03-27 2007-10-04 Pioneer Corporation パターン転写用モールド

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF THE SURFACE SCIENCE SOCIETY OF JAPAN, vol. 25, no. 10, 2004, pages 628 - 634, XP008136289 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287793A (ja) * 2009-06-12 2010-12-24 Fujifilm Corp パターン形成方法

Also Published As

Publication number Publication date
TWI435800B (zh) 2014-05-01
TW200938362A (en) 2009-09-16
JP5470528B2 (ja) 2014-04-16
EP2221162A1 (en) 2010-08-25
US20100310830A1 (en) 2010-12-09
US8597769B2 (en) 2013-12-03
JP2009119694A (ja) 2009-06-04
EP2221162A4 (en) 2011-12-28
KR101590650B1 (ko) 2016-02-01
KR20100105585A (ko) 2010-09-29

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