JP2009111333A5 - - Google Patents
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- Publication number
- JP2009111333A5 JP2009111333A5 JP2008133712A JP2008133712A JP2009111333A5 JP 2009111333 A5 JP2009111333 A5 JP 2009111333A5 JP 2008133712 A JP2008133712 A JP 2008133712A JP 2008133712 A JP2008133712 A JP 2008133712A JP 2009111333 A5 JP2009111333 A5 JP 2009111333A5
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- semiconductor device
- wiring
- dummy
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008133712A JP2009111333A (ja) | 2007-10-12 | 2008-05-22 | 半導体装置 |
| US12/207,790 US8084859B2 (en) | 2007-10-12 | 2008-09-10 | Semiconductor device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007265973 | 2007-10-12 | ||
| JP2008133712A JP2009111333A (ja) | 2007-10-12 | 2008-05-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009111333A JP2009111333A (ja) | 2009-05-21 |
| JP2009111333A5 true JP2009111333A5 (https=) | 2011-06-23 |
Family
ID=40779469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008133712A Pending JP2009111333A (ja) | 2007-10-12 | 2008-05-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009111333A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8299632B2 (en) | 2009-10-23 | 2012-10-30 | Ati Technologies Ulc | Routing layer for mitigating stress in a semiconductor die |
| US8227926B2 (en) | 2009-10-23 | 2012-07-24 | Ati Technologies Ulc | Routing layer for mitigating stress in a semiconductor die |
| US10141202B2 (en) | 2013-05-20 | 2018-11-27 | Qualcomm Incorporated | Semiconductor device comprising mold for top side and sidewall protection |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727966B2 (ja) * | 1986-07-04 | 1995-03-29 | 日立化成工業株式会社 | 半導体装置 |
| JP2919488B2 (ja) * | 1989-07-05 | 1999-07-12 | 株式会社日立製作所 | 半導体集積回路装置 |
| JP3173045B2 (ja) * | 1991-07-09 | 2001-06-04 | ヤマハ株式会社 | 半導体装置 |
| JP2988075B2 (ja) * | 1991-10-19 | 1999-12-06 | 日本電気株式会社 | 半導体装置 |
| JP2003068734A (ja) * | 2001-08-23 | 2003-03-07 | Seiko Epson Corp | 半導体装置およびその製造方法 |
| JP3961335B2 (ja) * | 2002-04-19 | 2007-08-22 | シャープ株式会社 | 半導体集積回路装置 |
| JP2004273591A (ja) * | 2003-03-06 | 2004-09-30 | Seiko Epson Corp | 半導体装置及びその製造方法 |
| JP2005050963A (ja) * | 2003-07-31 | 2005-02-24 | Seiko Epson Corp | 半導体装置、電子デバイス、電子機器および半導体装置の製造方法 |
| JP4072523B2 (ja) * | 2004-07-15 | 2008-04-09 | 日本電気株式会社 | 半導体装置 |
| JP2006066505A (ja) * | 2004-08-25 | 2006-03-09 | Fujikura Ltd | 半導体装置およびこれを備えた電子機器 |
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2008
- 2008-05-22 JP JP2008133712A patent/JP2009111333A/ja active Pending