JP2009110983A5 - - Google Patents

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Publication number
JP2009110983A5
JP2009110983A5 JP2007278440A JP2007278440A JP2009110983A5 JP 2009110983 A5 JP2009110983 A5 JP 2009110983A5 JP 2007278440 A JP2007278440 A JP 2007278440A JP 2007278440 A JP2007278440 A JP 2007278440A JP 2009110983 A5 JP2009110983 A5 JP 2009110983A5
Authority
JP
Japan
Prior art keywords
silicon interposer
interposer according
wiring board
semiconductor element
buffer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007278440A
Other languages
English (en)
Japanese (ja)
Other versions
JP5248084B2 (ja
JP2009110983A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007278440A priority Critical patent/JP5248084B2/ja
Priority claimed from JP2007278440A external-priority patent/JP5248084B2/ja
Priority to KR1020080101848A priority patent/KR20090042717A/ko
Priority to US12/257,669 priority patent/US20090121344A1/en
Priority to EP08167663.7A priority patent/EP2058858B1/en
Publication of JP2009110983A publication Critical patent/JP2009110983A/ja
Publication of JP2009110983A5 publication Critical patent/JP2009110983A5/ja
Application granted granted Critical
Publication of JP5248084B2 publication Critical patent/JP5248084B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007278440A 2007-10-26 2007-10-26 シリコンインターポーザとこれを用いた半導体装置用パッケージおよび半導体装置 Active JP5248084B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007278440A JP5248084B2 (ja) 2007-10-26 2007-10-26 シリコンインターポーザとこれを用いた半導体装置用パッケージおよび半導体装置
KR1020080101848A KR20090042717A (ko) 2007-10-26 2008-10-17 실리콘 인터포저 및 이를 결합한 반도체 장치 패키지와 반도체 장치
US12/257,669 US20090121344A1 (en) 2007-10-26 2008-10-24 Silicon interposer and semiconductor device package and semiconductor device incorporating the same
EP08167663.7A EP2058858B1 (en) 2007-10-26 2008-10-27 Silicon interposer and semiconductor device package and semiconductor device incorporating the same and interposer manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007278440A JP5248084B2 (ja) 2007-10-26 2007-10-26 シリコンインターポーザとこれを用いた半導体装置用パッケージおよび半導体装置

Publications (3)

Publication Number Publication Date
JP2009110983A JP2009110983A (ja) 2009-05-21
JP2009110983A5 true JP2009110983A5 (zh) 2010-09-09
JP5248084B2 JP5248084B2 (ja) 2013-07-31

Family

ID=40474923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007278440A Active JP5248084B2 (ja) 2007-10-26 2007-10-26 シリコンインターポーザとこれを用いた半導体装置用パッケージおよび半導体装置

Country Status (4)

Country Link
US (1) US20090121344A1 (zh)
EP (1) EP2058858B1 (zh)
JP (1) JP5248084B2 (zh)
KR (1) KR20090042717A (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101167882B1 (ko) 2010-07-20 2012-07-23 (주) 이피웍스 인터포저의 제조 방법
JP5577988B2 (ja) * 2010-09-24 2014-08-27 カシオ計算機株式会社 インターポーザーの製造方法及び半導体装置の製造方法
US20120080318A1 (en) * 2010-10-04 2012-04-05 Gillen James R Forming Through-Substrate Vias by Electrofilling
US9691636B2 (en) 2012-02-02 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Interposer frame and method of manufacturing the same
JP2014011169A (ja) 2012-06-27 2014-01-20 Ps4 Luxco S A R L シリコンインターポーザ及びこれを備える半導体装置
US9070644B2 (en) * 2013-03-15 2015-06-30 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging mechanisms for dies with different sizes of connectors
JP6041731B2 (ja) 2013-03-27 2016-12-14 新光電気工業株式会社 インターポーザ、及び電子部品パッケージ
CN104347548A (zh) * 2013-08-02 2015-02-11 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制造方法
JP6191728B2 (ja) 2015-08-10 2017-09-06 大日本印刷株式会社 イメージセンサモジュール
WO2018105233A1 (ja) * 2016-12-07 2018-06-14 株式会社村田製作所 電子部品及びその製造方法
KR20200121126A (ko) 2019-04-15 2020-10-23 삼성전자주식회사 반도체 패키지
US11990418B2 (en) * 2021-08-27 2024-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Chip package structure with buffer structure and method for forming the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035850A (ja) * 1999-07-19 2001-02-09 Ebara Corp 半導体装置及びその製造方法
JP4074862B2 (ja) * 2004-03-24 2008-04-16 ローム株式会社 半導体装置の製造方法、半導体装置、および半導体チップ
JP4426482B2 (ja) * 2005-02-28 2010-03-03 Ｏｋｉセミコンダクタ株式会社 パッケージ基台およびその製造方法、並びにそのパッケージ基台を備えた半導体パッケージ
JP2006313790A (ja) * 2005-05-06 2006-11-16 Matsushita Electric Works Ltd 基板のスルーホール構造
JP4509869B2 (ja) * 2005-06-08 2010-07-21 新光電気工業株式会社 回路基板の製造方法
US7942182B2 (en) * 2005-06-14 2011-05-17 Cufer Asset Ltd. L.L.C. Rigid-backed, membrane-based chip tooling
JP4698296B2 (ja) 2005-06-17 2011-06-08 新光電気工業株式会社 貫通電極を有する半導体装置の製造方法
US7402515B2 (en) * 2005-06-28 2008-07-22 Intel Corporation Method of forming through-silicon vias with stress buffer collars and resulting devices
WO2007032213A1 (ja) * 2005-09-14 2007-03-22 Nec Corporation プリント配線基板および半導体パッケージ
US20090266589A1 (en) * 2005-10-14 2009-10-29 Ube Industries, Ltd. Process for producing metal wiring board
JP2007184426A (ja) * 2006-01-06 2007-07-19 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP2008004927A (ja) * 2006-05-23 2008-01-10 Olympus Corp 積層実装構造体
JP4996285B2 (ja) * 2007-03-01 2012-08-08 津田駒工業株式会社 クランプスリーブ
US20090084425A1 (en) * 2007-09-28 2009-04-02 Erel Milshtein Scribing Methods for Photovoltaic Modules Including a Mechanical Scribe

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