JP2009099721A - Method of cooling substrate and apparatus of cooling substrate - Google Patents

Method of cooling substrate and apparatus of cooling substrate Download PDF

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JP2009099721A
JP2009099721A JP2007268946A JP2007268946A JP2009099721A JP 2009099721 A JP2009099721 A JP 2009099721A JP 2007268946 A JP2007268946 A JP 2007268946A JP 2007268946 A JP2007268946 A JP 2007268946A JP 2009099721 A JP2009099721 A JP 2009099721A
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substrate
cooling
transport roller
liquid
roller
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Takashi Kakimura
崇 柿村
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Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Priority to JP2007268946A priority Critical patent/JP2009099721A/en
Priority to TW097131017A priority patent/TWI387041B/en
Priority to CN2008101490106A priority patent/CN101414546B/en
Priority to KR1020080092579A priority patent/KR101022089B1/en
Publication of JP2009099721A publication Critical patent/JP2009099721A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To more inexpensively cool a substrate while conveying the substrate using a conveying roller. <P>SOLUTION: A cooling processing section 1C is configured so that the substrate S after heat processing is cooled with the conveying roller 14 while conveying the substrate S using the conveying roller 14. That means, usual-temperature cooling water is splashed into the inside of the conveying roller 14 using a nozzle 26 while conveying the substrate S by the conveying roller 14, and the cooling water is vaporized (evaporated) using heat of the conveying roller 14 and discharged to the outside, thereby cooling the conveying roller 14. Thus, the substrate S is cooled. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、加熱処理が施されたＬＣＤ、ＰＤＰ用ガラス基板等の基板に対して冷却処理を施す基板冷却方法および基板冷却装置に関するものである。   The present invention relates to a substrate cooling method and a substrate cooling apparatus for performing a cooling process on a substrate such as an LCD or a glass substrate for PDP that has been subjected to a heat treatment.

従来、ガラス基板等の製造におけるフォトリソグラフィのプロセスでは、フォトレジスト被膜を基板に形成する前段階の処理として、洗浄後の基板に加熱処理を施して水分を除去する処理（脱水ベーク処理）および加熱後の基板を冷却する冷却処理を順次基板に施すことが行われる。この種の処理は、従来、ホットプレート及びコールドプレートの順に基板をロボットハンドにより移し替えながら行われていたが、近年では、スループットを向上させるべく、特許文献１に記載の装置のように、基板をローラ搬送しながら、搬送ローラに沿って配置されたヒータにより基板を加熱した後、下流側で、所定温度に冷却した冷却ガスを吹き付けることにより基板を冷却することが行われている。なお、この文献１には、冷却ガスが搬送ローラに吹き付けられてローラ自体も冷やされるので、基板からローラへの熱伝導を利用して基板を効率良く冷却することができる点、また、搬送ローラ内に冷却水を循環させることにより、同様の効果を得ることができる点が記載されている。
特開２００６−２４５１１０号公報 Conventionally, in a photolithography process in the production of a glass substrate or the like, as a pre-stage process for forming a photoresist film on a substrate, heat treatment is performed on the cleaned substrate to remove moisture (dehydration bake treatment) and heating. A cooling process for cooling the subsequent substrate is sequentially performed on the substrate. Conventionally, this type of processing has been performed while transferring the substrate by the robot hand in the order of the hot plate and the cold plate. However, in recent years, as in the apparatus described in Patent Document 1, the substrate is improved in order to improve the throughput. While the substrate is being conveyed, the substrate is heated by a heater disposed along the conveying roller, and then the substrate is cooled by blowing a cooling gas cooled to a predetermined temperature on the downstream side. In this document 1, since the cooling gas is blown onto the conveying roller and the roller itself is cooled, the substrate can be efficiently cooled using heat conduction from the substrate to the roller, and the conveying roller. It is described that the same effect can be obtained by circulating cooling water inside.
JP 2006-245110 A

特許文献１に記載のように、搬送ローラにより基板を冷却することは基板の冷却手段として有効である。しかし、冷却ガスを吹き付けて搬送ローラを冷却する場合には、多くの冷熱が必要となるためランニングコストが嵩むという問題がある。また、搬送ローラに冷却水を循環させる場合にも、冷却機能を備えた冷却水の循環設備が必要となり、また、搬送ローラからの液漏れを防止するための特殊なシール構造等が必要となるため、装置コストやランニングコストが嵩むという問題がある。   As described in Patent Document 1, it is effective as a means for cooling the substrate to cool the substrate by the transport roller. However, when the cooling roller is blown to cool the conveying roller, there is a problem that running cost increases because a lot of cooling heat is required. In addition, when cooling water is circulated through the conveyance roller, a cooling water circulation facility having a cooling function is required, and a special seal structure is required to prevent liquid leakage from the conveyance roller. Therefore, there is a problem that the apparatus cost and running cost increase.

本発明は、上記のような事情に鑑みてなされたものであり、搬送ローラにより基板を搬送しながら、より安価な構成で基板を冷却することを目的としている。   The present invention has been made in view of the above circumstances, and an object of the present invention is to cool a substrate with a more inexpensive configuration while the substrate is being transported by a transport roller.

上記の課題を解決するために、本発明に係る基板冷却方法は、加熱処理後の基板を冷却する基板冷却方法であって、前記基板を搬送ローラにより搬送しながら当該搬送ローラの内部に冷却用の液体を導入し、この液体を前記搬送ローラの回転に伴い気化させてその蒸気を当該搬送ローラの外部に排気することにより、前記搬送ローラを介して前記基板を冷却するようにしたものである。   In order to solve the above problems, a substrate cooling method according to the present invention is a substrate cooling method for cooling a substrate after heat treatment, and is used for cooling the inside of the transport roller while transporting the substrate by a transport roller. The liquid is vaporized with the rotation of the transport roller, and the vapor is exhausted to the outside of the transport roller, thereby cooling the substrate via the transport roller. .

つまり、搬送ローラの内部に液体を導入し、搬送ローラの回転に伴い当該ローラ内周面に沿って前記液体を移動させることにより当該液体を液膜化、あるいは液滴化させ、これによって当該液体の表面積（気液界面の面積）を増大させて液体の気化を促進させることにより、搬送ローラの有する気化熱の消費を促進させて搬送ローラを冷却する。そして、このように冷却した搬送ローラによって基板を搬送することにより、基板から搬送ローラへの熱伝導により基板を冷却するようにしたものである。このような方法によれば、比較的少ない液体の量で効果的に搬送ローラを冷却することができ、また、搬送ローラ内で液体を気化させつつそのまま排気するので、搬送ローラからの液漏れを防止するための厳密なシール構造等も不要となる。そのため、簡単な構成で基板を冷却することが可能となる。   That is, the liquid is introduced into the inside of the transport roller, and the liquid is made into a liquid film or a droplet by moving the liquid along the inner peripheral surface of the roller as the transport roller rotates. By increasing the surface area (the area of the gas-liquid interface) and promoting the vaporization of the liquid, the consumption roller's heat consumption is promoted to cool the conveyance roller. Then, by transporting the substrate by the transport roller thus cooled, the substrate is cooled by heat conduction from the substrate to the transport roller. According to such a method, the transport roller can be effectively cooled with a relatively small amount of liquid, and since the liquid is vaporized in the transport roller and exhausted as it is, liquid leakage from the transport roller is prevented. A strict seal structure or the like is also unnecessary. For this reason, the substrate can be cooled with a simple configuration.

なお、前記液体としては種々の液体が使用可能であるが、取扱いの利便性やランニングコストを考慮すると、前記液体として常温の水を搬送ローラ内に導入するのが好適である。   Although various liquids can be used as the liquid, it is preferable to introduce water at room temperature into the transport roller as the liquid in consideration of convenience of handling and running cost.

一方、本発明に係る基板冷却装置は、加熱処理後の基板を冷却する基板冷却装置であって、前記基板をその幅方向に亘って連続的に支持するように構成された中空の搬送ローラと、前記搬送ローラの内部に、空間比率が大きい状態が保たれるような範囲内で冷却用の液体を供給する液供給手段と、少なくとも回転中の前記搬送ローラ内を換気する換気手段と、を備えているものである。   On the other hand, a substrate cooling apparatus according to the present invention is a substrate cooling apparatus that cools a substrate after heat treatment, and includes a hollow conveyance roller configured to continuously support the substrate across its width direction. A liquid supply means for supplying a cooling liquid within a range in which a large space ratio is maintained inside the transport roller, and a ventilation means for ventilating at least the rotating transport roller. It is what it has.

この装置によると、液供給手段により搬送ローラ内に液体が導入されることにより搬送ローラの熱が液体の気化熱として消費されて搬送ローラが冷却され、このように冷却された搬送ローラによって基板が搬送されることにより、搬送ローラへの熱伝導により基板が冷却される。このような熱移動が生じることにより基板が冷却されることとなる。特に、搬送ローラに対し、空間比率が大きい状態が保たれるように液体が導入されるとともに搬送ローラ内が換気される構成となっているので、搬送ローラ内では、液体がローラ内周面に沿って移動して液膜化し、あるいは液滴化することにより表面積（気液界面の面積）が増大する。そのため、液体の表面積の増大と上記換気との相互作用により液体の気化が効果的に促進される。従って、上記のような熱移動が円滑に行われ、これによって搬送中の基板が効果的に冷却されることとなる。   According to this apparatus, the liquid is introduced into the transport roller by the liquid supply means, whereby the heat of the transport roller is consumed as the heat of vaporization of the liquid to cool the transport roller, and the substrate is then cooled by the transport roller thus cooled. By being transported, the substrate is cooled by heat conduction to the transport rollers. As a result of such heat transfer, the substrate is cooled. In particular, since the liquid is introduced and the inside of the conveying roller is ventilated so that the space ratio is kept large with respect to the conveying roller, the liquid is placed on the inner peripheral surface of the roller in the conveying roller. The surface area (area of the gas-liquid interface) is increased by moving along the liquid film to form liquid droplets or droplets. Therefore, the vaporization of the liquid is effectively promoted by the interaction between the increase in the surface area of the liquid and the ventilation. Therefore, the heat transfer as described above is performed smoothly, whereby the substrate being transferred is effectively cooled.

この構成において、前記液供給手段は、搬送ローラ内に挿入されてその軸方向に延びるノズルを含み、このノズルは、前記搬送ローラのうち少なくとも基板を支持する領域に前記液体を供給するものであるのが好適である。   In this configuration, the liquid supply means includes a nozzle that is inserted into the transport roller and extends in the axial direction. The nozzle supplies the liquid to at least a region of the transport roller that supports the substrate. Is preferred.

この構成によれば、搬送ローラうち特に基板との接触部分を集中的に冷却することが可能となるため、少ない液量で効果的に基板を冷却することが可能となる。   According to this configuration, it is possible to intensively cool a portion of the transport roller that is in contact with the substrate in particular, so that the substrate can be effectively cooled with a small amount of liquid.

また、前記ノズルは、前記搬送ローラの長手方向において均等に前記液体を供給するものであるのが好適である。   Further, it is preferable that the nozzle supplies the liquid evenly in the longitudinal direction of the transport roller.

この構成によれば、搬送ローラの長手方向に沿って温度勾配が生じるのを有効に防止することができ、基板を均一に冷却することが可能となる。   According to this configuration, it is possible to effectively prevent a temperature gradient from occurring along the longitudinal direction of the transport roller, and it is possible to cool the substrate uniformly.

なお、上記液体としては種々のものが適用可能であるが、取扱い性やランニングコストを考慮すると水を用いるのが有効である。従って、前記液供給手段は、前記液体として水を供給するものであるのが好適である。   Various liquids can be used as the liquid, but it is effective to use water in consideration of handling property and running cost. Therefore, it is preferable that the liquid supply means supplies water as the liquid.

また、上記構成においては、前記搬送ローラへの供給前に前記液体を冷却する冷却手段を設けるようにしてもよい。   Moreover, in the said structure, you may make it provide the cooling means to cool the said liquid before supply to the said conveyance roller.

この構成によれば、少量の液体でより多くの気化熱を搬送ローラから奪うことが可能となるので、より効果的に搬送ローラを冷却することが可能となり、その分、基板の冷却効果が向上する。   According to this configuration, since it is possible to remove more heat of vaporization from the transport roller with a small amount of liquid, the transport roller can be cooled more effectively, and the cooling effect of the substrate is improved accordingly. To do.

請求項１，２に係る基板冷却方法および請求項３〜７に係る基板冷却装置によると、冷却機構を備えた冷却水の循環設備等を設けることなく、搬送中の基板を搬送ローラにより効果的に冷却することができる。従って、従来のこの種の基板冷却装置に比べ、より安価な構成で基板を冷却することができるようになる。   According to the substrate cooling method according to claims 1 and 2 and the substrate cooling apparatus according to claims 3 to 7, the substrate being transferred can be effectively transferred by the transfer roller without providing a cooling water circulation facility equipped with a cooling mechanism. Can be cooled to. Accordingly, it is possible to cool the substrate with a more inexpensive configuration than this type of conventional substrate cooling apparatus.

本発明の好ましい実施の形態について図面を用いて説明する。   A preferred embodiment of the present invention will be described with reference to the drawings.

図１は、本発明に係る基板冷却装置（本発明に係る基板冷却方法が実施される基板冷却装置）が組み込まれた基板処理装置の要部を概略的に断面図で示している。   FIG. 1 is a schematic cross-sectional view of a main part of a substrate processing apparatus in which a substrate cooling apparatus according to the present invention (a substrate cooling apparatus in which a substrate cooling method according to the present invention is implemented) is incorporated.

この基板処理装置は、ＬＣＤ、ＰＤＰ用のガラス基板Ｓ（以下、基板Ｓという）にフォトリソグラフィのプロセスに従って各種処理を施すもので、上流側から順に、基板Ｓを洗浄する洗浄処理部１Ａ、基板Ｓを所定温度まで加熱する加熱処理部１Ｂおよび加熱後の基板Ｓを所定温度まで冷却する冷却処理部１Ｃ（本発明に係る基板冷却装置に相当する）を有している。この冷却処理部１Ｃの下流側には、さらにレジスト被膜を基板Ｓ上に形成するレジスト塗布部等が設けられている。   This substrate processing apparatus performs various processes on a glass substrate S for LCD and PDP (hereinafter referred to as “substrate S”) according to a photolithography process. A cleaning processing unit 1A for cleaning the substrate S in order from the upstream side, a substrate There is provided a heat treatment section 1B for heating S to a predetermined temperature and a cooling processing section 1C for cooling the heated substrate S to a predetermined temperature (corresponding to the substrate cooling apparatus according to the present invention). On the downstream side of the cooling processing section 1C, a resist coating section for forming a resist film on the substrate S is further provided.

各処理部１Ａ〜１Ｃは、基板搬送用の開口部を通じて互いに連通する箱形の処理槽１０〜１２を有している。これらの処理槽１０〜１２の内部には、所定の間隔で搬送ローラ１４が設けられており、基板Ｓを水平姿勢で搬送しながら、洗浄処理部１Ａから順次下流側の処理部１Ｂ，１Ｃに基板Ｓを搬送するようになっている。   Each of the processing units 1A to 1C includes box-shaped processing tanks 10 to 12 that communicate with each other through an opening for transporting a substrate. Inside these processing tanks 10-12, transport rollers 14 are provided at predetermined intervals, and while the substrate S is transported in a horizontal posture, the cleaning processing unit 1A sequentially moves to the downstream processing units 1B, 1C. The substrate S is transported.

洗浄処理部１Ａには、例えばブラッシング洗浄、ブロー洗浄及びリンス洗浄等を順次基板Ｓに施すための各洗浄手段（図示省略）が設けられ、その最下流側には、リンス処理後、基板Ｓに付着したリンス液を除去するための上下一対のエアナイフ１６ａ，１６ｂが配備されている。   The cleaning processing unit 1A is provided with cleaning means (not shown) for sequentially performing, for example, brushing cleaning, blow cleaning, rinse cleaning, and the like on the substrate S. A pair of upper and lower air knives 16a and 16b for removing the attached rinse liquid is provided.

加熱処理部１Ｂには、搬送ローラ１４を挟んだ上下両側の位置にパネルヒータ１７ａ，１７ｂが配置されている。また、図示を省略しているが、ＨＭＤＳ（ヘキサメチルジシラザン）等、レジスト被膜の密着強化剤を加熱中の基板Ｓに噴霧するためのノズル等が配備されている。   Panel heaters 17a and 17b are arranged at positions on both upper and lower sides of the heat treatment unit 1B with the conveying roller 14 therebetween. Although not shown, a nozzle or the like is provided for spraying a resist coating adhesion enhancing agent such as HMDS (hexamethyldisilazane) onto the substrate S being heated.

冷却処理部１Ｃには、基板Ｓの冷却手段を兼ねる上記搬送ローラ１４が設けられている。つまり、冷却処理部１Ｃでは、基板Ｓから搬送ローラ１４への熱伝導を利用して基板Ｓを冷却するように構成されており、従って、冷却処理部１Ｃの搬送ローラ１４は、他の処理部１Ａ，１Ｂの搬送ローラ１４とは異なり、この熱伝導による基板Ｓの冷却が効果的に行われるように当該搬送ローラ１４が構成されている。この点については後に詳述する。   In the cooling processing unit 1 </ b> C, the transport roller 14 also serving as a cooling unit for the substrate S is provided. That is, the cooling processing unit 1C is configured to cool the substrate S using heat conduction from the substrate S to the transport roller 14, and thus the transport roller 14 of the cooling processing unit 1C is configured to be another processing unit. Unlike the transport rollers 14 of 1A and 1B, the transport rollers 14 are configured so that the substrate S is effectively cooled by this heat conduction. This point will be described in detail later.

上記の構成により、この基板処理装置では、搬送ローラ１４の駆動により基板Ｓを搬送しながら、洗浄処理部１Ａにおいて、ブラッシング洗浄、ブロー洗浄及びリンス洗浄等を基板Ｓに施すことにより基板Ｓを洗浄し、加熱処理部１Ｂにおいて、基板Ｓを所定温度（１００°Ｃ〜１３０°Ｃ）まで加熱して基板Ｓの水分を除去し、冷却処理部１Ｃにおいて、所定温度（常温）まで基板Ｓを冷却する。そしてその後、フォトレジストの塗布等、フォトリソグラフィのプロセスに基づく残りの処理を順次基板Ｓに施すようになっている。   With the above configuration, in this substrate processing apparatus, the substrate S is cleaned by performing brushing cleaning, blow cleaning, rinse cleaning, and the like on the substrate S in the cleaning processing unit 1A while transporting the substrate S by driving the transport roller 14. Then, in the heat treatment unit 1B, the substrate S is heated to a predetermined temperature (100 ° C. to 130 ° C.) to remove moisture from the substrate S, and in the cooling processing unit 1C, the substrate S is cooled to the predetermined temperature (normal temperature). To do. Thereafter, the remaining processing based on the photolithography process, such as application of a photoresist, is sequentially performed on the substrate S.

図２は、冷却処理部１Ｃにおける搬送ローラ１４の構造を断面図で概略的に示している。この図示に示すように、搬送ローラ１４は、その軸方向に貫通する中空形状のローラであって全体が熱伝導性に優れた金属材料（アルミニウム等）により構成されている。   FIG. 2 schematically shows the structure of the transport roller 14 in the cooling processing section 1C in a cross-sectional view. As shown in the figure, the transport roller 14 is a hollow roller penetrating in the axial direction, and is entirely made of a metal material (aluminum or the like) having excellent thermal conductivity.

搬送ローラ１４の前後両端（図２では左右両端）は処理槽１２の前後側板１８，１９に形成される開口部１８ａ，１９ａを介して処理槽１２の外部に導出され、前後側板１８，１９の外側にそれぞれ連設される機械室２０に挿入されている。各機械室２０には支持部材２２が設けられており、前記搬送ローラ１４の両端部がこれら支持部材２２にベアリング２４を介して支持されることにより、搬送ローラ１４が回転可能に支持されている。そして、搬送ローラ１４の後端部分にプーリ１５が固定され、このプーリ１５に駆動ベルト２が掛け渡されることにより、搬送ローラ１４が回転駆動されるようになっている。   Both front and rear ends (left and right ends in FIG. 2) of the transport roller 14 are led out of the processing tank 12 through openings 18a and 19a formed in the front and rear side plates 18 and 19 of the processing tank 12, and the front and rear side plates 18 and 19 It is inserted in a machine room 20 that is continuously provided on the outside. Each machine room 20 is provided with a support member 22, and both ends of the transport roller 14 are supported by the support member 22 via bearings 24 so that the transport roller 14 is rotatably supported. . A pulley 15 is fixed to the rear end portion of the conveying roller 14, and the driving belt 2 is stretched over the pulley 15, so that the conveying roller 14 is rotationally driven.

搬送ローラ１４の内部には、当該ローラ内に冷却水を供給するための軸状のノズル２６が挿入されている。このノズル２６は、搬送ローラ１４を貫通し、両端部が各機械室２０の側壁に支持されることにより、搬送ローラ１４の略中心軸上に配置されている。   A shaft-like nozzle 26 for supplying cooling water into the roller is inserted inside the conveying roller 14. The nozzle 26 penetrates the transport roller 14, and both ends thereof are supported on the side walls of the machine chambers 20, so that the nozzle 26 is disposed on the substantially central axis of the transport roller 14.

ノズル２６には、その長手方向に沿って所定の間隔で複数のノズル口２６ａが並設されており、その一端側から導入される冷却水を、図３に示すように、搬送ローラ内周面の周方向における特定箇所に向かって（図示の例では下向きに）散水するように構成されている。ノズル口２６ａは、搬送ローラ１４のうち処理槽１２の前後側壁間を含む領域（少なくとも基板Ｓを支持する領域）に亘って設けられている。   The nozzle 26 is provided with a plurality of nozzle openings 26a arranged at predetermined intervals along the longitudinal direction thereof, and the cooling water introduced from one end side of the nozzle 26, as shown in FIG. The water is sprayed toward a specific location in the circumferential direction (downward in the illustrated example). The nozzle port 26 a is provided over a region (at least a region for supporting the substrate S) including the space between the front and rear side walls of the processing tank 12 in the transport roller 14.

冷却水としては常温の水が用いられており、貯水タンク３０からポンプ２８の駆動によりノズル２６に供給されるようになっている。なお、この冷却水の供給系統には、その流量を制御する電磁バルブ等を含む流量制御手段が設けられており、搬送ローラ１４内において、空間比率の方が大きくなるような範囲内で搬送ローラ１４内に冷却水が供給されるように前記ノズル２６に対する冷却水の供給量が制御されるようになっている。すなわち、当実施形態では、当該供給系統および前記ノズル２６等が本発明の液供給手段に相当する。   Normal temperature water is used as the cooling water and is supplied from the water storage tank 30 to the nozzle 26 by driving the pump 28. The cooling water supply system is provided with a flow rate control means including an electromagnetic valve or the like for controlling the flow rate of the cooling water, and the conveying roller within a range in which the space ratio is larger in the conveying roller 14. The amount of cooling water supplied to the nozzle 26 is controlled so that cooling water is supplied into the nozzle 14. That is, in this embodiment, the supply system, the nozzle 26 and the like correspond to the liquid supply means of the present invention.

ノズル２６のノズル口２６ａは、例えば冷却水の導入側（図２では左側）から離れるほど口径が大きくなるように形成されており、これによって長手方向に亘って冷却水の吐出量が略均一となるようにノズル２６が構成されている。   The nozzle opening 26a of the nozzle 26 is formed, for example, such that the diameter increases as the distance from the cooling water introduction side (the left side in FIG. 2) increases, so that the discharge amount of the cooling water is substantially uniform in the longitudinal direction. The nozzle 26 is configured so as to be.

なお、機械室２０の内部は、その下部に形成される排気口２０ａおよび排気通路を通じて図外の負圧ポンプ等により負圧吸引されており、これによって機械室２０から処理槽１２へ開口部１８ａ，１９ａを通じてパーティクル等が侵入することが防止されるとともに、搬送ローラ１４内部の換気が行われるようになっている。すなわち、当実施形態では、機械室２０や負圧ポンプ等が、本発明の換気手段に相当する。   The inside of the machine room 20 is sucked by negative pressure by a negative pressure pump or the like (not shown) through an exhaust port 20a and an exhaust passage formed in the lower part thereof, thereby opening 18a from the machine room 20 to the processing tank 12. , 19a to prevent particles and the like from entering, and the inside of the transport roller 14 is ventilated. That is, in this embodiment, the machine room 20, the negative pressure pump, and the like correspond to the ventilation means of the present invention.

上記の構成により、冷却処理部１Ｃでは、基板Ｓの搬送中に搬送ローラ１４により基板Ｓに対して冷却処理を施す。すなわち、基板Ｓの搬送中は、ポンプ２８の作動によりノズル２６に冷却水が供給され、これにより搬送ローラ１４の内周面に対して冷却水が散水される。従って、この状態で基板Ｓが搬送ローラ１４上を移動すると、基板Ｓから搬送ローラ１４への熱伝導により基板Ｓが冷却され、搬送ローラ１４の熱が冷却水に奪われることにより搬送ローラ１４が冷却される。つまり、このような熱移動が行われる結果、基板Ｓが冷却されることとなる。   With the above configuration, in the cooling processing unit 1 </ b> C, the cooling process is performed on the substrate S by the transport roller 14 during the transport of the substrate S. That is, during the transfer of the substrate S, the cooling water is supplied to the nozzle 26 by the operation of the pump 28, and thereby the cooling water is sprinkled on the inner peripheral surface of the transfer roller 14. Accordingly, when the substrate S moves on the transport roller 14 in this state, the substrate S is cooled by heat conduction from the substrate S to the transport roller 14, and the transport roller 14 is deprived of the heat of the transport roller 14 by the cooling water. To be cooled. That is, as a result of such heat transfer, the substrate S is cooled.

この際、冷却処理部１Ｃに搬入される基板Ｓは、１００°Ｃ〜１３０°Ｃの高温であるため、搬送ローラ１４もこれに近い温度となる。従って、上記のように、搬送ローラ１４内に、空間比率の方が大きくなるような範囲内で常温の冷却水が供給されると、当該冷却水は、速やかに気化することとなり、このように搬送ローラ１４の熱が冷却水の気化熱として消費されることにより搬送ローラ１４が効果的に冷却されることとなる。特にこの場合、冷却水は、搬送ローラ１４の内周面に沿って周方向に移動することにより液膜化し、あるいは液滴化することによりその表面積（気液界面の面積）が増大する。そのため、冷却水の気化が促進され、搬送ローラ１４が効果的に冷却されることとなる。   At this time, since the substrate S carried into the cooling processing unit 1C has a high temperature of 100 ° C. to 130 ° C., the transport roller 14 also has a temperature close thereto. Accordingly, as described above, when the normal temperature cooling water is supplied into the transport roller 14 within a range in which the space ratio is larger, the cooling water is quickly vaporized. Since the heat of the transport roller 14 is consumed as the heat of vaporization of the cooling water, the transport roller 14 is effectively cooled. In particular, in this case, the surface area (area of the gas-liquid interface) of the cooling water is increased by moving in the circumferential direction along the inner peripheral surface of the transport roller 14 to form a liquid film or droplets. Therefore, vaporization of the cooling water is promoted, and the transport roller 14 is effectively cooled.

なお、このようにして搬送ローラ１４内で発生した蒸気は、機械室２０内の負圧吸引（搬送ローラ１４内の換気）に伴い搬送ローラ１４の外部に移動し、前記排気口２０ａを通じて外部に排気されることとなる。従って、搬送ローラ１４内が蒸気により飽和状態となることが防止され、これにより搬送ローラ１４内での冷却水の気化が促進される。そしてこのように冷却水の気化が促進される結果、上記のような熱移動が円滑に行われることとなり、これによって搬送中の基板Ｓの冷却が良好に行われる。   The vapor generated in the transport roller 14 in this way moves to the outside of the transport roller 14 due to negative pressure suction in the machine chamber 20 (ventilation in the transport roller 14), and then to the outside through the exhaust port 20a. It will be exhausted. Therefore, the inside of the conveying roller 14 is prevented from being saturated with steam, and this facilitates vaporization of the cooling water in the conveying roller 14. As a result of promoting the vaporization of the cooling water in this way, the above-described heat transfer is smoothly performed, and thus the substrate S being transported is favorably cooled.

なお、上記のような冷却処理部１Ｃでは、基板Ｓの搬入前においても、搬送ローラ１４が駆動されつつその内部に冷却水が導入され、さらに搬送ローラ１４内が換気されることにより搬送ローラ１４が効果的に冷却される。すなわち、この場合も、ローラ内周面に沿って冷却水が移動することにより液膜化し、あるいは液滴化することにより冷却水の表面積が増大するため、このような冷却水の表面積の増大と上記換気との相互作用により冷却水の気化が促進され、その結果、搬送ローラ１４が効果的に冷却される。従って、効果的に搬送ローラ１４を冷却しておくことができる。   In the cooling processing unit 1C as described above, even before the substrate S is carried in, the conveyance roller 14 is driven, cooling water is introduced into the inside thereof, and the inside of the conveyance roller 14 is further ventilated to further convey the conveyance roller 14. Is effectively cooled. That is, also in this case, the surface area of the cooling water is increased by forming a liquid film or droplets by moving the cooling water along the inner peripheral surface of the roller. The vaporization of the cooling water is promoted by the interaction with the ventilation, and as a result, the transport roller 14 is effectively cooled. Therefore, the conveyance roller 14 can be effectively cooled.

以上のように、搬送ローラ１４内に常温の冷却水を導入してこれを気化させ、気化熱を奪うことにより搬送ローラ１４を冷却する上記のような冷却処理部１Ｃの構成によれば、冷媒を用いて冷却水を事前に冷却することなく比較的少ない水量で効果的に搬送ローラ１４を冷却することができる。しかも、搬送ローラ１４内で気化（蒸発）させた蒸気をそのまま外部排気するように構成されているので、搬送ローラ１４に対して冷却水を循環させる設備が不要で、さらに、搬送ローラ１４内に冷却水を導入しながらも、搬送ローラからの液漏れを防止するための厳密なシール構造も必要ない。   As described above, according to the configuration of the cooling processing unit 1C as described above that cools the transport roller 14 by introducing the normal-temperature cooling water into the transport roller 14 and vaporizing it, and removing the heat of vaporization, the refrigerant The conveying roller 14 can be effectively cooled with a relatively small amount of water without cooling the cooling water in advance. In addition, since the vaporized (evaporated) vapor in the conveying roller 14 is exhausted to the outside as it is, no facility for circulating cooling water to the conveying roller 14 is required, and further, there is no need for the inside of the conveying roller 14. While introducing cooling water, there is no need for a strict sealing structure for preventing liquid leakage from the conveying roller.

従って、基板Ｓから搬送ローラ１４への熱伝導を利用して効果的に基板Ｓを冷却しながらも、従来のこの種の装置、すなわち、搬送ローラ内に液密状態で冷却水を循環させながら当該ローラを冷却し、あるいは冷気を搬送ローラに吹き付けて当該ローラを冷却するようにしている従来の装置に比べると、より安価な構成で効率良く基板Ｓを冷却することができるという効果がある。   Therefore, while effectively cooling the substrate S using the heat conduction from the substrate S to the transport roller 14, this kind of conventional apparatus, that is, while circulating the cooling water in a liquid-tight state in the transport roller, Compared to a conventional apparatus that cools the roller or cools the roller by blowing cool air onto the transport roller, there is an effect that the substrate S can be efficiently cooled with a less expensive configuration.

なお、以上説明した冷却処理部１Ｃは、本発明に係る基板冷却装置（本発明に係る基板冷却方法が実施される基板冷却装置）の好ましい実施形態の一例であって、その具体的な構成は、本発明の要旨を逸脱しない範囲で適宜変更可能である。例えば以下のような構成を適用することも可能である。   The cooling processing unit 1C described above is an example of a preferred embodiment of the substrate cooling apparatus according to the present invention (the substrate cooling apparatus in which the substrate cooling method according to the present invention is implemented), and the specific configuration thereof is as follows. The present invention can be changed as appropriate without departing from the gist of the present invention. For example, the following configuration can be applied.

例えば、上記実施形態では、ノズル２６の長手方向に亘って冷却水の吐出量が略均一となるように、冷却水の導入側（図２では左側）から離れるほどノズル口２６ａの口径が大きくなる構造が採用されているが、これ以外に、例えばノズル口２６ａの口径は均一で、図４に示すように、冷却水の導入側から離れるほど径寸法が小さくなるようなノズル構造を採用することも可能である。この構成の場合も、ノズル２６の長手方向に亘って冷却水の吐出量を均一化することができる。要は、ノズル２６の構造は、冷却水の吐出量を長手方向に均一化できれば如何なる構造も採用可能である。なお、上記実施形態では、ノズル２６の長手方向一方側から冷却水を導入する例について説明したが、ノズル２６の両端から冷却水を導入する場合には、図２や図３の構造に準じ、ノズル２６の長手方向に亘って冷却水の吐出量が均一化されるようなノズル構造を採用すればよい。   For example, in the above embodiment, the diameter of the nozzle port 26a increases as the distance from the cooling water introduction side (the left side in FIG. 2) increases so that the discharge amount of the cooling water becomes substantially uniform over the longitudinal direction of the nozzle 26. In addition to this, for example, a nozzle structure in which the diameter of the nozzle opening 26a is uniform and the diameter decreases as the distance from the cooling water introduction side becomes smaller as shown in FIG. Is also possible. Also in this configuration, the discharge amount of the cooling water can be made uniform over the longitudinal direction of the nozzle 26. In short, any structure can be adopted as the structure of the nozzle 26 as long as the discharge amount of the cooling water can be made uniform in the longitudinal direction. In the above-described embodiment, the example in which the cooling water is introduced from one side in the longitudinal direction of the nozzle 26 has been described. However, when the cooling water is introduced from both ends of the nozzle 26, according to the structure of FIG. What is necessary is just to employ | adopt the nozzle structure that the discharge amount of a cooling water is equalize | homogenized over the longitudinal direction of the nozzle 26. FIG.

また、上記実施形態では、冷却水として常温の水をノズル２６に供給しているが、冷却水を事前に冷却する構成を妨げるものではなく、冷却水の供給系統に、貯水タンク３０から供給される水を冷却する冷却装置を組み込むようにしてもよい。このように冷却水を事前に冷却する構成であっても、冷却処理部１Ｃは、上記のように、空間比率の方が大きくなるような範囲内で搬送ローラ１４内に冷却水を供給する構成であるため、搬送ローラに冷却水を循環させる一般的な構成、つまり、搬送ローラ内に液密状態で冷却水を循環させながら当該ローラを冷却する従来装置に比べると、搬送ローラ１４に供給する冷却水の水量は少なく、冷却水の冷却に必要な冷熱の量も少なくて済む。従って、従来装置に比べると冷却水を冷却するためのランニングコストが易く、その分、安価に基板Ｓを冷却することができる。   Moreover, in the said embodiment, although normal temperature water is supplied to the nozzle 26 as cooling water, it does not prevent the structure which cools cooling water in advance, and is supplied from the water storage tank 30 to the cooling water supply system. A cooling device for cooling the water may be incorporated. Thus, even if it is the structure which cools cooling water in advance, 1 C of cooling processing parts supply cooling water in the conveyance roller 14 within the range where the space ratio becomes large as mentioned above. Therefore, compared with a conventional configuration in which the cooling water is circulated through the conveying roller, that is, the cooling device is cooled while circulating the cooling water in a liquid-tight state in the conveying roller, the cooling roller is supplied to the conveying roller 14. The amount of cooling water is small, and the amount of cold heat required for cooling the cooling water is small. Therefore, the running cost for cooling the cooling water is easier than that of the conventional apparatus, and the substrate S can be cooled at that cost.

また、上記実施形態では、機械室２０内を吸引排気することにより搬送ローラ１４内で発生した蒸気の外部排出を促進させるように本発明の換気手段が構成されているが、換気手段の構成はこれに限定されるものではない。例えば、さらに搬送ローラ１４の一端側に送風機等を設けて搬送ローラ１４内に強制的にエアを吹き込むことにより蒸気の外部排出を促進させるように構成してもよい。   In the above embodiment, the ventilation means of the present invention is configured so as to promote the external discharge of the steam generated in the transport roller 14 by sucking and exhausting the inside of the machine room 20, but the configuration of the ventilation means is as follows. It is not limited to this. For example, a blower or the like may be further provided on one end side of the conveying roller 14 so that air is forcibly blown into the conveying roller 14 to promote the external discharge of steam.

また、上記実施形態では、基板Ｓを水平姿勢で搬送しながら冷却するが、勿論、基板Ｓを傾斜姿勢（搬送方向と直交する方向にその一方側から他方側に傾斜する姿勢）で搬送しながら冷却するようにしてもよい。この場合には、例えば搬送ローラ１４を貫通する実施形態のようなノズル２６の代わりに搬送ローラ１４の上位側の端部に冷却水を供給するノズルを設け、搬送ローラ１４の内底面に沿ってその上位側から冷却水を流下させるように構成してもよい。この構成によれば、冷却水が搬送ローラ１４内を流下する際に搬送ローラ１４から気化熱を奪って気化することとなるので、基板Ｓを水平搬送する場合と同様に搬送ローラ１４を冷却することができる。なお、上記のように冷却水を搬送ローラ１４に沿って流下させる場合には、気化することなく流下する冷却水を搬送ローラ１４の端部で受けて外部に排出する排出手段を設けるようにしてもよい。この構成は、上記実施形態の構成についても採用可能である。   In the above-described embodiment, the substrate S is cooled while being transported in a horizontal posture. Of course, the substrate S is transported in an inclined posture (an posture inclined from one side to the other side in a direction orthogonal to the transport direction). You may make it cool. In this case, for example, a nozzle for supplying cooling water to the upper end of the transport roller 14 is provided instead of the nozzle 26 as in the embodiment penetrating the transport roller 14, and along the inner bottom surface of the transport roller 14. You may comprise so that cooling water may be poured down from the upper side. According to this configuration, when the cooling water flows down the transport roller 14, the transport roller 14 takes the heat of vaporization and vaporizes, so that the transport roller 14 is cooled in the same manner as when the substrate S is transported horizontally. be able to. When cooling water flows down along the transport roller 14 as described above, there is provided a discharge means for receiving the cooling water flowing down without vaporization at the end of the transport roller 14 and discharging it to the outside. Also good. This configuration can also be adopted for the configuration of the above embodiment.

本発明に係る基板冷却装置（本発明に係る基板冷却方法が実施される基板冷却装置）が組み込まれる基板処理装置の要部を示す断面略図である。1 is a schematic cross-sectional view showing a main part of a substrate processing apparatus in which a substrate cooling apparatus according to the present invention (a substrate cooling apparatus in which a substrate cooling method according to the present invention is implemented) is incorporated. 冷却処理部（本発明に係る基板冷却装置）の構成を示す断面図（図１のＡ−Ａ線断面図）である。It is sectional drawing (AA sectional view taken on the line of FIG. 1) which shows the structure of a cooling process part (substrate cooling device which concerns on this invention). 搬送ローラの断面図である。It is sectional drawing of a conveyance roller. 搬送ローラの他の構成を示す断面図である。It is sectional drawing which shows the other structure of a conveyance roller.

符号の説明Explanation of symbols

１Ａ 洗浄処理部
１Ｂ 加熱処理部
１Ｃ 冷却処理部
１０〜１２ 処理槽
１４ 搬送ローラ
２６ ノズル
３０ 貯水タンク
Ｓ 基板 DESCRIPTION OF SYMBOLS 1A Cleaning process part 1B Heat processing part 1C Cooling process part 10-12 Processing tank 14 Conveyance roller 26 Nozzle 30

Claims (7)

加熱処理後の基板を冷却する基板冷却方法であって、
前記基板を搬送ローラにより搬送しながら当該搬送ローラの内部に冷却用の液体を導入し、この液体を前記搬送ローラの回転に伴い気化させてその蒸気を当該搬送ローラの外部に排気することにより、前記搬送ローラを介して前記基板を冷却することを特徴とする基板冷却方法。 A substrate cooling method for cooling a substrate after heat treatment,
By introducing a cooling liquid into the inside of the carrying roller while carrying the substrate by the carrying roller, and evaporating the liquid with the rotation of the carrying roller and exhausting the vapor to the outside of the carrying roller, A substrate cooling method comprising cooling the substrate via the transport roller. 請求項１に記載の冷却方法において、
前記液体として、常温の水を前記搬送ローラ内に導入することを特徴とする基板冷却方法。 The cooling method according to claim 1,
A substrate cooling method, wherein normal temperature water is introduced into the transport roller as the liquid. 加熱処理後の基板を冷却する基板冷却装置であって、
前記基板をその幅方向に亘って連続的に支持するように構成された中空の搬送ローラと、
前記搬送ローラの内部に、空間比率の方が大きくなるような範囲内で冷却用の液体を供給する液供給手段と、
少なくとも回転中の前記搬送ローラ内を換気する換気手段と、
を備えていることを特徴とする基板冷却装置。 A substrate cooling device for cooling a substrate after heat treatment,
A hollow transport roller configured to continuously support the substrate across its width;
Liquid supply means for supplying a cooling liquid to the inside of the conveying roller within a range in which the space ratio is larger;
A ventilation means for ventilating at least the inside of the rotating transport roller;
A substrate cooling apparatus comprising: 請求項３に記載の基板冷却装置において、
前記液供給手段は、搬送ローラ内に挿入されてその軸方向に延びるノズルを含み、このノズルは、前記搬送ローラのうち少なくとも基板を支持する領域に前記液体を供給することを特徴とする基板冷却装置。 The substrate cooling apparatus according to claim 3,
The liquid supply means includes a nozzle that is inserted into a transport roller and extends in the axial direction thereof, and the nozzle supplies the liquid to at least a region of the transport roller that supports the substrate. apparatus. 請求項４に記載の基板冷却装置において、
前記ノズルは、前記搬送ローラの長手方向において均等に前記液体を供給することを特徴とする基板冷却装置。 The substrate cooling apparatus according to claim 4, wherein
The substrate cooling apparatus, wherein the nozzle supplies the liquid evenly in a longitudinal direction of the transport roller. 請求項１乃至５の何れか一項に記載の基板冷却装置において、
前記液供給手段は、前記液体として水を供給することを特徴とする基板冷却装置。 In the substrate cooling device according to any one of claims 1 to 5,
The substrate cooling apparatus, wherein the liquid supply means supplies water as the liquid. 請求項１乃至６の何れか一項に記載の基板冷却装置において、
前記搬送ローラへの供給前の前記液体を冷却する冷却手段を備えていることを特徴とする基板冷却装置。 The substrate cooling apparatus according to any one of claims 1 to 6,
A substrate cooling apparatus comprising cooling means for cooling the liquid before being supplied to the transport roller.
JP2007268946A 2007-10-16 2007-10-16 Method of cooling substrate and apparatus of cooling substrate Pending JP2009099721A (en)

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CN2008101490106A CN101414546B (en) 2007-10-16 2008-09-18 Substrate cooling apparatus
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