TWI221862B - Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment - Google Patents

Abstract

This invention particularly relates to an apparatus and a method for electro plating a substrate to fill a metal such as copper in the fine wiring pattern (recess) formed on the semiconductor substrate. The apparatus has a substrate holder 36 to hold the substrate in horizontal for rotation with the surface to be electro plated oriented upwardly; a seal member 90 butting against the peripheral of surface to be plated of the substrate held by said holder 36 to seal it water tightly; and a cathode electrode 88 connecting with the substrate to conduct electricity thereto. A cathode 38 rotates integrally with substrate holder 36. An electrode arm 30 adapted to move vertically and horizontally is disposed over said cathode 38 and is provided downwardly with an anode 98. An electroplating liquid injection means is provided for introducing the liquid into the space between the surface to be plated of the substrate and the anode 98 of electrode arm 30 near said surface. With the arrangement, the electroplating treatment and the incidental treatment can be done in a single unit.

Description

1221862

V. Description of the invention (1) [Detailed description of the invention] [Technical field to which the invention belongs] \ Please read the precautions on the back before filling out this page) This invention relates to a plating device and a plating method for a substrate, and more particularly to a Electroplating method and electrocoagulation device for substrates used for fine wiring patterns (recesses) formed by filling metal such as steel (Cu) on a semiconductor substrate. Furthermore, the present invention relates to an electrolytic treatment method and an electrolytic treatment device for performing electrolytic treatment such as electroplating and etching on the surface of a substrate to be processed. Furthermore, the present invention relates to an electrolytic treatment device for performing electroplating and etching on the surface of a member to be treated, and more particularly, to an electrolytic treatment device and a method for controlling an electric field state of the electrolytic treatment device. [Known technology] The materials used to form wiring circuits on semiconductor substrates are generally aluminum or aluminum alloys. However, as the degree of accumulation increases, materials with a lower conductivity must be used as wiring materials. Therefore, a method is proposed in which a substrate is treated with electricity and a wiring pattern formed on the substrate is filled with copper or an alloy thereof. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This is because copper or its alloy is filled in the wiring pattern. Various methods such as CVD (chemical vapor deposition) and sputtering are known. However, the material of the metal layer is copper. When using it or its alloy, that is, when forming steel wiring, if the cVD method is used, the cost is high, and the sputtering method will lead to a high aspect ratio (the pattern depth ratio is larger than the width). Disadvantages, and electroplating is the most effective reason. Here ’s a method for steel plating on a semiconductor substrate, such as a cup. This paper is sized to the Chinese National Standard (CNS) A4 (210 X 297 mm) 1 312144 1221862

V. Description of the invention (2) The method of printing or immersing the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in the tank is often filled with a plating solution and the substrate is immersed in the plating solution. There are various methods such as a method of filling a plating solution, a method of performing so-called electrolytic plating by applying a potential difference, and a method of performing non-electrolytic plating without applying a potential difference. In the past, in addition to the unit for performing the electro-mineralization step in the electroplating apparatus for performing such copper plating, a unit for performing the pre-processing step attached to the plating in a horizontal state and a unit for performing the washing and drying steps after the plating were provided. There are many units, and a transfer robot that transfers substrates between the units. In addition, while the substrates are being transported between the above-mentioned units, predetermined processing is performed in each unit, and they are sequentially moved to the next step after the plating process. However, the conventional electroplating device is provided with a separate unit at each step of the electroplating process and the pretreatment, and the substrate is transferred to each unit for processing. Therefore, the entire device is not only very complicated, difficult to control, but also takes up a large area. Area, and the manufacturing cost is very expensive. In the electrolytic plating, if there are bubbles in the plating solution filled between the plated surface of the substrate (cathode) and the anode, the bubbles that are themselves insulators have a function similar to the anode mask, and there is a corresponding part The thickness of the plating film formed at the position becomes thin or a complete plating notch occurs. Therefore, in order to obtain a uniform and high-quality galvanic coating, it is necessary to make the plating solution between the plated surface of the substrate and the anode free of air bubbles. Furthermore, electrolytic treatment, especially electrolytic plating is a widely used method for forming a metal film. In recent years, for example, the effectiveness of copper electrolytic copper ore for multilayer wiring, electrolytic gold ore for bump formation (low cost, hole filling characteristics --------------) ----- Order --------- \ Please read the notes on the back before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 2 312144 1221862 Printed by A7, Consumer Cooperatives, Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of Inventions (Third, etc.) Not only attracted the attention of the semiconductor industry but also used by the semiconductor industry. Fig. 71 is a conventional general configuration of an electroplating apparatus that uses a so-called face-down method to perform electrolytic plating on a surface of a substrate to be processed (hereinafter referred to as a substrate) such as a semiconductor wafer. This electroplating device has a cylindrical electroplating tank 602 that is open upward and can hold the plating solution 600 inside, and the substrate can be held down and held freely, and the substrate W is arranged in the upper opening of the closed electric ore tank 602.位置 的 sonarily holding substrate 604. Inside the electric ore tank 6Q2, a flat plate-shaped anode plate 606 immersed in a plating solution of 600 Å and used as an anode is arranged horizontally. On the other hand, a conductive layer S is formed on the lower surface (plated surface) of the substrate, and the conductive layer S has a contact point with the cathode at its peripheral edge portion. A plating solution spraying pipe 608 for forming an upward plating solution spray is connected to the center of the bottom of the electric ore tank 602, and a plating solution storage section 61 is arranged outside the upper part of the plating tank 602. Thereby, the substrate holding portion 604 holds the substrate W downward and distributes it to the upper part of the electric ore tank 602 'and causes the electric ore liquid 600 to be ejected upward from the bottom of the electric ore tank 602' so that the electric ore liquid 600 is sprayed. It is in contact with the lower surface (plating surface) of the substrate w, and at the same time, a predetermined voltage is applied from the plating power source 612 between the anode plate 606 (anode) and the conductive layer S (cathode) of the substrate, so as to form an electric deposit film under the substrate w. At this time, the plating solution 600 overflowing the plating tank 602 is recovered by the plating solution container 610. At this time, wafers or liquid crystal substrates for LSIs (large-scale integrated circuits) tend to develop more and more in a large area, and the thickness of the plating film formed on the substrate surface is uneven. In other words, in order to provide the cathode on the substrate --------------- I ---- ^ ---- I ----, (Please read the precautions on the back before filling this page ) This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) 3 312144 1221862

V. Description of the invention (4) The potential of the Intellectual Property Bureau employee ministry of the Ministry of Economic Affairs prints the potential, and the contact point with the electrode is set on the peripheral portion of the conductive layer formed in advance on the substrate, but when the area of the substrate becomes larger, The resistance of the conductive layer from the contact to the center of the substrate will increase, and a potential difference will be generated in the substrate surface, which will cause the plating speed to be different, so that the thickness of the plated rhenium varies. That is, 'electrolytic electricity is formed on the surface of the substrate to be processed is to form a conductive layer on the surface of the substrate to be processed (hereinafter simply referred to as the "substrate"), and use a contact to give a cathode potential to the conductive layer near the outer periphery of the substrate W On the other hand, an anode is provided at a position facing the substrate W, so that the plating solution is filled between the anode and the substrate W, and then a direct current power source is used to flow a current between the anode and the contacts to perform plating on the conductive layer of the substrate W. However, for a large-area substrate, the resistance from a contact near the periphery of the substrate to the conductive layer in the substrate W will increase, causing a potential difference in the surface of the substrate W, which will cause the plating speed of each part to be different. That is, Fig. 72 shows a case where a conductive layer (copper film) having a thickness of 30 nm, 80 nm, and 150 nm is formed on a silicon substrate having a diameter of 200 mm, and electrolytic copper plating is performed using a conventional general plating device shown in Fig. 71. Film thickness distribution diagram of the copper plating film in the substrate surface. Fig. 73 shows the formation of a conductive layer (steel film) with a film thickness of 100 nm on a dream substrate having a diameter of 100 mm, 200 mm, and 300 mm, and the same is applied to the steel substrate in the surface of the substrate when electrolytic copper plating is performed in the same manner as described above. Film thickness distribution of the coating. As can be seen from Figures 72 and 73, when the conductive layer is thin and the substrate diameter is large, the unevenness of the film thickness distribution of the copper plating film formed by electrolytic plating becomes larger, and it will be completely severe. A steel film cannot be formed near the center of the substrate. -n I ϋ na ^ i ϋ ϋ ϋ > ϋ ϋ ϋ ϋ ϋ II ^ -το- ϋ ϋ. ^ 1 ϋ ^ 1 · ϋ ϋ I _ (Please read the notes on the back before filling this page) This paper Dimensions are applicable to China National Standard (CNS) A4 (210 X 297 mm) 4 312144 1221862 A7

1221862 B7 V. Description of the invention (6) In the method of avoiding these problems, the electrical conductivity. However, the substrate is not made by electroplating: ::::: degree or reduced, and for example, the base plating method is also subject to various restrictions. When the thickness of the pattern is prone to form a thick conductive layer within the pattern, the thickness or the conductivity is changed The L type of the layer cannot easily thicken the conductive layer. In addition, the potential difference in the surface of the substrate can be reduced by introducing the cathode potential introduction contact. 'On the substrate-surface, f cannot be used as an LS or j gas contact. The resistance of the part in the current resistance solution of the plating solution R3, R2, or R4) is also reported to be valid (# 觫 浒 # 浒 私 扯 扯 L L L L L 疋 疋 疋 疋 疋 疋 所有 to change all characteristics of the electroplating bath's electricity If the concentration of electroplating is to be lowered, there is a limitation that the plating speed cannot be sufficiently increased. As described above, a contact is provided around the substrate and a conductive layer on the surface of the substrate is used for electrolytic power ore processing. The size of large substrates 'The problem that the thickness of the electric ore film varies greatly within the substrate surface and is particularly important for the semiconductor industry where the film thickness and process uniformity within the substrate surface to be processed are very important' [Gist of the invention] Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economics. This invention was developed by the above-mentioned problems. Its purpose is to provide a plating device that can use a single device for electroplating and its auxiliary processing. The electroplating method also provides a plating device and a plating method for preventing the bubbles from remaining in the plating liquid filled between the plated surface of the substrate and the anode. Also, the object of the present invention is to provide a method that does not need to change the conductive layer. Thickness, film type, electrolyte of electrolyte, etc., and can be averaged in the surface of the substrate 312144 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 1221862

V. Description of the invention (7) An electrolytic treatment device and method for electrolytic treatment. (Please read the precautions on the back before filling in this page.) Furthermore, the object of the present invention is to provide an electrolytic treatment device capable of controlling the in-plane distribution state of the target film thickness by actively controlling the state of the electric field. Electric field state control method. The first item of the patent application scope of the present invention is to have: a substrate holding portion that holds the substrate with the to-be-plated surface facing upward; a cathode that is in contact with the substrate and energizes it; an anode disposed above the to-be-plated surface of the substrate; The plating solution injection mechanism for injecting a plating solution into a space between the plated surface of the substrate held by the substrate holding portion and the anode near the plated surface is a plating device for the substrate. Thereby, in a state in which the substrate is held upward by the substrate holding portion, a plating solution is filled between the electro-mineral surface and the anode of the electrode arm portion to perform the plating process, and the plated surface and the electrode arm are discharged after the plating process. The electroplating solution between the anodes and the electrode arms are raised at the same time to open the surface to be plated. With the substrate held by the substrate holding portion, the pre-attachment treatment and cleaning and drying can be performed before and after the electro-mine treatment. Processing and other processing. The consumer property cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the second scope of the patent application of the present invention, which is a plating device for a substrate such as the first scope of the patent application, in which a water-retaining material is tightly kept under the anode of the aforementioned electrode arm. The composition of the electric mineral liquid impregnated material. In order to suppress the generation of slime during steel electroplating, it is generally used on the anode to use steel (containing copper) with a content of 0.03 to 0.05%. When using phosphorous copper on the anode as described above, As a result, a so-called "Black Film" black film is formed on the surface of the anode. In this case, the electrolyte solution immersed in the key liquid contains the electric mineral liquid to wet the surface of the anode, which can prevent the black film from falling. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 7 312144 A7

1221862 V. Description of the invention (8) To the plating surface of the substrate, and when the plating solution is injected between the substrate < the plating surface and the anode, the air can be easily exhausted to the outside. The plating device for substrates in the first item of the patent includes 'wherein' there is a cathode portion and a plating liquid tray is arranged on the side of the cathode portion, and the electrode arm portion can move freely between the cathode portion and the electro-mineral liquid tray. Therefore, when the electric ore treatment is not performed, the anode is immersed in the electric money liquid in the electric ore liquid tray and moistened in advance, which can prevent the black film formed on the anode surface from drying or oxidizing. The fourth item of the patent claim of the present invention is the electroplating device for a substrate as described in the first item of the patent application, which has a cathode portion, and a plurality of nozzles are arranged on the side of the cathode portion, and the plurality of nozzles are directed to the substrate. The plated surface of the substrate held by the holding portion sprays a pre-treatment liquid, a cleaning liquid, and a gas. Therefore, in the state where the substrate holding portion holds the substrate before and after the plating process and the surface to be plated is opened upward, the pretreatment liquid and the cleaning liquid are sprayed from the nozzle to the surface to be plated, so that the pretreatment and cleaning treatment can be performed. Item 5 of the scope of patent application of the present invention is a plating device for a substrate as described in item 1 of the scope of patent application, which has a cathode portion, and the substrate holding portion can be at the substrate receiving and receiving position below, and the periphery of the plated surface of the substrate above. The part abuts on the above-mentioned cathode part plating position, and the pre-treatment and cleaning positions therebetween are freely raised and lowered. As described above, the substrate holding portion can be raised and lowered corresponding to each operation position, thereby achieving further miniaturization of the device and improvement in operability. The sixth item in the scope of patent application of the present invention is to seal the peripheral edge portion of the plated surface of the substrate facing upward and conducting with the cathode in a water-tight state, and make the yang -------- 1 ------- -· (Please read the precautions on the back before filling this page) Printed by the Intellectual Property Bureau of the Ministry of Economy ’s Consumer Cooperatives This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) 8 312144 1221862 A7 5 (Explanation of the invention (9 poles are arranged close to the surface to be plated, and then a plating solution is injected into the substrate between the plated surface and the anode, which is sealed in a water-tight state as a feature of the substrate. Plating method of the present invention is the seventh The item is a method for electroplating a substrate characterized by recovering the residual liquid of electroplating from a plating solution recovery nozzle after performing the electroplating of the patent application scope item 6. The patent application scope item 8 of the present invention is based on the patent application scope item 611 In the electroplating method, before performing electroplating, the precoating / recovering arm is moved to a position facing the substrate, and the precoating liquid is supplied from the precoating nozzle to perform the precoating process. Item 9 of the scope of patent application of the present invention is the plating method for a substrate as described in item 6 of the scope of patent application, wherein a water-retentive material is arranged in the space between the aforementioned plated surface and the anode to form a dysprosium liquid immersion material, and This structure contains a plating solution. The tenth item in the scope of patent application of the present invention is to hold the substrate 'by the substrate holding portion, and have an anode disposed above the substrate to be galvanized, and a cathode contacting the substrate to energize it' and The space between the electroplated surface and the anode is configured with an electro-forging fluid impregnating member composed of a water-retaining material to perform electro-mineralization as a substrate for the electro-mineralizing device. The item u of the scope of patent application for the present invention is the first 1〇 == electroplating device, wherein the aforementioned electroplating solution impregnated member is a high-density electric power mining device of the present invention in the scope of application of the patent application No. 12 is a substrate of the application scope of the patent application No. 10, among which, Yi, 4 ·, Thai μ, 1 of which the aforementioned electroplating solution impregnated members are made of ceramic paper and are in accordance with Chinese National Standard (CNS) A4 specifications (210 X 297) 312144 A7

1221862 V. Description of invention (10) Porcelain composition. Item 13 of the scope of patent application of the present invention is that the aforementioned plating solution impregnated member is in a state that does not contact the plated surface of the substrate, and the plating solution fills between the plating solution impregnated member and the plated surface of the substrate. An electric mining device that performs electroplating on a substrate with its characteristics in a gap state. Item 14 of the scope of patent application for the present invention is to raise and lower the plating process, cleaning, and drying process according to each operating position while the substrate is held by the substrate holding unit, thereby processing the substrate characterized by a single device. Electroplating device. Item 15 of the scope of patent application of the present invention is a plating device for a substrate as described in item 14 of the scope of patent application, wherein the plating device for the aforementioned substrate has an anode disposed above a plated surface of the aforementioned substrate, and an anode contacting the aforementioned substrate and making it The current-carrying cathode is provided with a plating solution impregnating member made of a water-retaining material in a space between the to-be-ore surface and the anode. Item 16 of the scope of patent application of the present invention is to use a transport robot to take out a substrate from a loading and unloading section of a storage substrate and transport it to the inside of a plating unit. The substrate is held by a substrate holding portion in the unit, and the substrate is held by the substrate holding portion. In this state, the plating process, the cleaning, and the drying process are performed in a single device by raising and lowering in accordance with each operation. Item 17 of the scope of patent application for the present invention is a robotic unit that accepts and receives a substrate by a loading and unloading unit for storing substrates, a single device for electroplating and its auxiliary processing, and a transfer robot that transfers and receives substrates between the loading and unloading unit and the plating unit. It is a plating device for a substrate which is characterized by it. Item 18 of the scope of patent application of the present invention is to hold the substrate by the substrate holding portion. -------------------- Order --------- Please read the back first Please note this page, please fill out this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with the Chinese National Standard (CNS) A4 (210 X 297 public love) A7 --------- 2Z_________ V. Description of the invention (11) The plate is provided with an anode disposed above the plated surface of the substrate, a cathode that is in contact with the plate and is energized, and pure water supply The electric money device using a substrate of a nozzle is characterized in that after the electric key is completed, the substrate and the cathode are simultaneously cleaned by supplying final pure water from the nozzle. Item 19 of the scope of patent application for the present invention is provided with a substrate holding portion for holding the substrate; the cathode 'is in contact with the substrate held by the substrate holding portion to be electrically charged; the' anode 'is arranged close to the aforementioned substrate; electroplating The liquid injection mechanism injects a plating solution into a space between a plated surface of the substrate held by the substrate holding portion and an anode close to the plated surface, and the plating solution injection mechanism is arranged from a portion of the anode or an outer periphery of the anode. In the plating solution injection path, the plating solution is injected between the anode and the electrically depleted surface of the substrate to diffuse on the plated surface of the substrate to constitute a plating device of the substrate. Item 20 of the scope of patent application of the present invention is the electroplating device for a substrate as described in item 9 of the scope of patent application, which includes: a substrate holding portion that holds the substrate to be plated upward, and a cathode portion having a substrate for holding the substrate. The sealing material of the plating solution on the plated surface of the substrate held by the substrate holding portion, and the cathode contacting the substrate to energize it; the electrode arm portion has an anode that is close to the cathode portion and can move freely and linearly in the horizontal and vertical directions. ; Electric money liquid injection mechanism, which injects the plating solution into the substrate holding section, which is held by the above-mentioned ------------ Order Note on the back, please fill out this page again} This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 11 312144 22

V. Description of the invention (12) The space between the plated surface of the substrate and the anode close to the plated surface, and the aforementioned plating solution injection mechanism is provided through a plating solution injection hole provided in a part of the anode or disposed on the anode periphery. The nozzle of the part injects a plating solution between the anode and the plated surface of the substrate, and diffuses the plated surface of the substrate to form a plated device of its characteristics. Therefore, in a state where the substrate is held upward by the substrate holding portion, a plating solution is filled between the surface to be plated and the anode of the electrode arm portion to perform a plating treatment, and after the plating treatment, the plated surface and the electrode are discharged. The plating solution between the anodes of the arms and the electrode arms are raised at the same time so that the surface to be plated is opened. With the substrate held by the substrate holding portion, the pre-treatment and cleaning attached to the electric ore can be performed before and after the plating process. • Other treatments such as drying. In addition, when the plating solution is injected between the plated surface of the substrate and the anode, a liquid flow of the electric mineral liquid diffuses to the entire plated surface of the substrate, and the air between the plated surface of the substrate and the anode follows. The liquid flow of the electric ore liquid is pushed to the outside, and it is possible to prevent air from being mixed in with the plating solution, so that bubbles can be prevented from remaining in the electric ore liquid filled between the plated surface of the substrate and the anode. Item 21 of the scope of patent application of the present invention is the electroplating device for substrates as described in item 20 of the scope of patent application, wherein the aforementioned electro-mineral liquid injection mechanism is on the opposite side of the substrate opposite surface of the anode, and along the diameter direction of the anode It is arranged and has a plating solution introduction path connected to the plating solution supply pipe, and the plating solution injection hole is provided at a position opposite to the plating solution introduction hole provided on the anode side surface of the plating solution introduction path. Therefore, as the plating solution is injected between the plated surface of the substrate and the anode, it will be oriented perpendicular to the plating solution introduction tube -------- ^ --------- (Please read the back first Please pay attention to this page, please fill in this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives This paper is printed in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 12 312144 1221862 V. Description of the invention (13) Electroplating in the direction Fluid flow. Please read the precautions on the back before filling out this page. The 22nd scope of the patent application of the present invention is a plating device for substrates such as the 19th scope of the patent application, where the aforementioned electro-mineral fluid injection mechanism is cross-shaped, radial, or circular. It is arranged on the opposite side of the substrate-opposing surface of the anode, and has a plating solution introduction path connected to the plating solution supply pipe. The plating solution introduction holes on the anode side of the plating solution introduction path are opposite to each other. The aforementioned plating solution injection hole is provided at the position. #Here, as the electroforging fluid / mainly enters the plated surface of the substrate and the anode, an electric mineral fluid flow is generated which diffuses radially in each quadrant divided by the electric mineral fluid introduction pipe. Item 23 of the scope of patent application of the present invention is that the anode is arranged close to at least a part of the plated surface of the substrate to which the cathode is energized, and when the plating solution is injected between the plated surface and the anode, the plated surface and the anode are used to crosslink the substrate. An electroplating method for a substrate between the plating solution columns and injecting a plating solution using the plating solution column as a starting point. The Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the scope of application of the present invention for the patent application No. 24 is a plating method for a substrate such as the scope of the patent application No. 23, in which a plating solution is injected from a portion of the anode or the periphery of the anode Inject a plating solution between the plated surface of the substrate and the anode. Item 25 of the scope of patent application of the present invention is that the anode is arranged close to at least a part of the plated surface of the substrate on which the cathode is energized, and when the plating solution is injected into the space between the plated surface and the anode, the plating solution is diffused on the plated surface of the substrate. And, the method of electroplating is to make the substrate and the anode relatively rotate and gradually approach the substrate with its characteristics. Thereby, the air bubbles between the substrate and the anode can be gradually moved outward as the two approach each other, and can be blown out. This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) 13 312144 1221862 A7 V. Description of invention (14) The 26th item in the scope of patent application for this invention is the substrate as in the 25th item in patent scope In the electroplating method, an electroplating solution impregnating material composed of a porous body having a water-retaining property is arranged on the opposite surface of the substrate of the anode, and the electroplating solution is provided on the opposite surface of the substrate of the electroplating liquid impregnation material. A mechanism that relatively rotates the impregnated material and the substrate so that the plating solution therebetween diffuses radially outward. Thereby, the bubbles between the substrate and the anode can be almost completely discharged. Item 27 of the scope of patent application of the present invention is to fill at least a part of the electrolyte between the substrate to be processed having a contact with one of the anode and the cathode of the cathode, and the other electrode facing the substrate to be processed. An electrolytic treatment method with a characteristic of providing a high-resistance structure having a lower electrical conductivity than the electrolytic solution to perform electrolytic treatment on the surface of the substrate to be processed is provided. As a result, the resistance between the anode | y and the cathode immersed in the electrolyte can be made higher through the high-resistance structure than in the case of only the electrolyte, and the current caused by the resistance of the substrate surface treated by | i can be reduced. In-plane difference in density. At this time, the contact between the substrate to be processed and the cathode can be electrolytically plated, and the contact between the substrate to be processed and the anode can be electrolytically etched. The Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs has printed the 28th patent application scope of the present invention, which is an electrolytic treatment method such as the 27th patent application scope, in which the aforementioned high-resistance structural system makes the resistance in its equivalent circuit more The resistance in the equivalent circuit between the contact point of the conductive layer on the surface of the substrate to be processed and the aforementioned electrode and the portion which is electrically farthest from the contact point is high. This can further reduce the in-plane difference in current density caused by the resistance of the conductive layer formed on the substrate to be processed. Item 29 of the scope of patent application of the present invention is to perform the electrolytic unit of the scope of patent application No. 2? With the substrate held by the substrate holding section 312144 1221862 A7 B7 V. Explanation of the invention (15) Principle of electrolysis Approach. _ (Please read the note on the back? Matters before filling out this page) The 30th item in the scope of patent application of the present invention relates to a substrate to be processed having a contact with one of the anode and cathode electrodes, and another object facing the substrate to be processed. An electrolytic treatment device in which one electrode is filled with an electrolytic solution to perform electrolytic treatment of a substrate to be processed is characterized in that a high-resistance structure having an electric conductivity lower than that of the electrolytic solution is provided on at least a part of the electrolytic solution. Item 31 of the scope of patent application of the present invention is the electrolytic processing device according to item 30 of the scope of patent application, which includes a substrate holding section that performs electrolytic processing while holding the substrate upward with the substrate holding section. Item 32 of the scope of patent application of the present invention is the electrolytic treatment device of item 30 of the scope of patent application, in which the aforementioned high-resistance structure system makes the resistance in its equivalent circuit more than that of the conductive layer formed on the surface of the substrate to be processed. The resistance in the equivalent circuit between the contact point of the electrode and the portion which is electrically farthest from the contact point is high. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The scope of application of the invention is No. 33. The electrolytic treatment device is No. 30, in which the aforementioned high-resistance structural system is composed of a porous substance containing an electrolyte inside. Therefore, by intricately injecting the electro-mineral fluid into the porous material, even though it is a thin structure, it can actually pass through the electrolyte along a long path in the thickness direction to increase the resistance as a high-resistance structure. Item 34 of the scope of patent application of the present invention is the electrolytic treatment device of item 33 of the scope of patent application, wherein the aforementioned porous substance is porous ceramic. Examples of the ceramic include alumina, SiC, mullite, hafnium cone, titanium oxide, and emeraldite. In order to maintain the electroplating solution stably, the paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 15 312144 1221862 A7 B7. 5. Inventory (I6) material is better. For example, in the case of alumina-based ceramics, ceramics having a pore diameter of 10 to 300 µω, a porosity of 20 to 60%, a thickness of 0.2 to 200 mm, and preferably about 50 mm can be used. Item 35 of the patent application scope of the present invention is the electrolytic treatment device such as the item 30 of the patent application scope, wherein the high-resistance structure system sandwiches the resistance structure and divides the electrolyte into a plurality of parts. And set. In this way, multiple electrolytes can be used or the pollution and reaction of one electrode will not affect the other electrode. Item 36 of the scope of patent application of the present invention is to provide at least a part of an electrolyte filled between a substrate to be processed having a contact with one of the anode and the cathode, and at least a part of the electrolyte facing the other electrode opposed to the substrate to be processed. A high-resistance structure having a conductivity lower than that of the electrolytic solution, and controlling at least one of the external shape, the internal structure, or the installation of components with different electrical conductivity of the high-resistance structure to control the surface of the substrate to be processed. An electric field state control method for an electrolytic treatment device having an electric field as its characteristic. As described above, when the state of the electric field on the surface of the substrate to be processed is actively controlled to a desired state, the processing state obtained by the electrolytic treatment of the substrate to be processed can be used to form a processing state that is desired to be distributed in the plane. When the electrolytic treatment is an electroplating treatment, the uniformity of the thickness of the plating film formed on the substrate to be processed can be achieved, or the distribution of the thickness of the plating film on the substrate to be processed can be arbitrarily distributed. Item 37 of the scope of patent application of the present invention is the electric field state control method of the electrolytic treatment device according to item 36 of the scope of patent application, wherein the adjustment of the aforementioned shape is the adjustment of the thickness of the local resistance structure and the leveling of the high resistance structure. Read the notes on the back and fill in this page to print the paper printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 16 312144 丄 221862 B7 V. Description of the invention (17 At least one of the adjustments of the shape on the surface. Fan Lan Fan Xi of the patent application of the present invention, the 38th item of the solid power consumption is the electric power of the electrolytic treatment device of the patent application of the patent α, a method of controlling the state of the field, wherein the resistance structure system is composed of a porous substance, The pore size of the porosity of I-shaped porous material with a clever structure and a multi-dimensional structure is 57% of at least one of ▼ adjustment, adjustment of porosity distribution, adjustment of f curvature distribution, and adjustment of material combination 'The item 39 in the patent scope of the present invention is the method for controlling the electric field state of the electrolytic treatment device in the scope of the patent scope', wherein the adjustment of the installation of the components with different electrical conductivity is performed by components with different electrical conductivity. Adjust the shielding area of the high-resistance structure. Item 40 of the scope of patent application of the present invention relates to a substrate to be processed having a contact with a square electrode fixed to the anode and a cathode, and the other electrode opposed to the substrate to be processed is filled with an electrolyte to perform the processing of the substrate. The electrolytic treatment device for electrolytic treatment is characterized in that at least one blade of the electrolyte is provided with a high-resistance structure having a lower electrical conductivity than the electrolyte, and the external and internal structures of the resistance structure are described. At least one of the adjustment mechanisms in the construction, or the installation of printed components of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs with different electrical conductivity, to control the electric field on the surface of the substrate to be processed. Item 41 of the scope of patent application of the present invention is the electrolytic treatment device as described in item 4 of the scope of patent application, wherein the adjustment mechanism of the aforementioned shape is one of the adjustment of the thickness of the high-resistance structure and the shape adjustment on the plane of the high-resistance structure. At least either. Item 42 of the scope of patent application of the present invention is the electrolytic treatment device of item 40 of the scope of patent application, wherein the aforementioned high-resistance structure system is composed of porous materials and paper of appropriate size. ”_ Jia Xian (CNS) A4 Secret-χ 297ϋ) 17 312144 1221862 A7 V. Description of the invention (18) At least one of the adjustment of stomatal pore size distribution, adjustment of porosity distribution = adjustment, adjustment of material combination, and adjustment mechanism of the internal structure of porous material. Item 43 of the scope of patent application of the present invention is the electrolytic treatment device of item 40 of the scope of patent application, in which the adjustment mechanism using the installation of the aforementioned components with different electrical conductivity is used to shield the structured area of the structure with different electrical conductivity. The 44th item in the scope of patent application of the present invention is based on the substrate to be processed having a contact with the anode and the cathode of the square electrode, and the other electrode on the substrate to be processed is filled with an electrolyte to perform An electrolytic treatment device for electrolytic treatment of a substrate to be processed, characterized in that at least a part of the electrolyte is provided with an electric conductivity lower than that of the electrolyte. And the aforementioned high-resistance structural system holds its outer periphery by a holding member, and a sealing member is provided between the high-resistance structural body holding members to prevent the electrolyte from leaking out of this portion so that a current flows. Examples include porous ceramics made of alumina, carbonized ceramics, etc. It is also possible to use gaseous ethylene bundled into a fibrous shape and weld them to each other, or use foams such as polyvinyl alcohol or iron. Those fibers such as furon (trade name) are formed into a woven or non-woven fabric to form a high-resistance structure. Furthermore, 'these may also be conductors and insulators, or a combination of two conductors. The structure in which other types of electrolytes are sandwiched between the diaphragms constitutes a high-resistance structure. The 45th item of the scope of patent application of the present invention relates to a substrate to be treated having a contact with one of an anode and a cathode, and an opposing structure. Processed base

I ij 4 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed to the Chinese National Standard (CNS) A4 size ⑽ x 297 meals 18 312144 Printed by the Consumers’ Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 B7 19) An electrolytic treatment device for filling the electrolyte between the other electrodes of the plate to perform electrolytic treatment of the substrate to be processed, which is characterized in that an electrolyte impregnating material is arranged between the other electrode and the substrate to be processed, and The other electrode is provided with an electrolyte passage hole for supplying an electrolyte into the electrolyte impregnating material, and a tube body is inserted inside the electrolyte passage hole to supply the electrode through the tube body into the electrolyte impregnating material. The electrolytic solution is supplied from the reverse side of the electrolytic solution impregnating material, and is filled between the electrolytic solution impregnating material and the substrate to be processed. The pipe body is preferably selected from materials that are not penetrated by the electrolyte. Therefore, even if the electrolytic treatment step is repeated by this electrolytic treatment device, the inner diameter of the front end of the pipe body will not be enlarged due to the passage of time. Therefore, even after a period of time, the ideal liquid diffusion state at the time of manufacture can be performed similarly without There is a problem that air is entangled, so that bubbles accumulate between the electrolyte impregnated material and the substrate to be processed, and a desired electrolytic treatment can often be obtained. Item 46 of the scope of patent application of the present invention is the electrolytic treatment device 'item 45 of the scope of patent application of the invention, in which' the electrolytic solution passage portion is provided in the aforementioned electrolytic solution impregnating material 'so as to be successive to the aforementioned electrolytic via. Item 47 of the scope of patent application of the present invention relates to a substrate to be processed having a contact with one of an anode and a cathode, and the other electrode opposed to the substrate to be processed is filled with an electrolyte to perform electrolysis of the substrate to be processed. The electrolytic treatment device for processing is characterized in that an electrolytic solution impregnating material is provided between the other electrode and the substrate to be processed, and an electrolytic solution passage portion having a predetermined depth is formed in the electrolytic solution impregnating material, so that One of the electrodes is supplied to the electrolytic solution in the electrolytic solution impregnated material through the electrolytic solution passage portion, and is supplied from the reverse side of the electrolytic solution impregnated material, and is filled with the electrolytic solution impregnated material and the processed material I--II-I I- ---- Order ---------, (Please read the notes on the back before filling this page)

Printed by the Consumers and Consumers Agency of the Intellectual Property Bureau of the Ministry of Economic Affairs 20 1221862 A7 ________B7__ _ 5. Description of the invention (2G) between the substrates. Moreover, even if the electrolytic treatment step is repeated, the inner diameter of the front end of the electrolyte passage portion will not be enlarged due to the passage of time, so even if a period of time elapses, the ideal liquid diffusion state at the time of manufacture can be performed in the same manner without any Air is entrained so that air bubbles accumulate between the electrolyte-impregnated material and the substrate to be processed, and the desired electrolytic treatment can often be obtained. Item 48 of the scope of patent application of the present invention is an electrolytic treatment device such as item 47 of the scope of patent application, which causes a liquid storage section for storing the electrolyte to be placed between the other electrode and the electrolyte impregnating material, The electrolytic solution stored in the liquid storage unit is supplied into the electrolytic solution impregnating material. Item 49 of the scope of patent application of the present invention relates to a substrate to be processed having a contact with one of the anode and the cathode, and the other electrode facing the substrate to be processed is filled with an electrolyte to perform electrolysis of the substrate to be processed. The electrolytic treatment device for processing is characterized in that an electrolytic solution impregnating material is provided between the other electrode and the substrate to be processed, and the electrolytic solution impregnating material is electrolyzed by the electrolytic solution impregnating material according to its installation location. The liquid has different resistances, so that the electrolyte supplied from the other electrode side to the electrolyte impregnated material is filled from the reverse side of the electrolyte impregnated material in accordance with the supply amount of the installation site and filled. Between the electrolyte impregnated material and the substrate to be processed. [Brief Description of Drawings] Figures 1A to 1C are cross-sectional views of an example of a plating process using the electric ore method of the substrate electric ore device of the present invention. Figure 2 is a top view of the entire substrate electric mining device according to an embodiment of the present invention. Figure 3 is a top view of a plating unit. 312144 --- ^^ 1 f% Please note this page before filling in this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1222182 A7 B7 V. Description of Invention (21) Figure 4 is a cross-sectional view taken along line AA in Figure 3. Fig. 5 is an enlarged sectional view of the substrate holding portion and the cathode portion. Figure 6 is a front view of Figure 3. Figure 7 is a right side view of Figure 3. Figure 8 is a rear view of Figure 3. Figure 9 is a left side view of Figure 3. Figure 10 is a front view of the pre-coating / recovering arm. Fig. 11 is a plan view of a substrate holding portion. Figure 12 is a cross-sectional view taken along line B-B in Figure 11. Figure 13 is a sectional view taken along the line OC in Figure 11. Fig. 14 is a plan view of a cathode portion. Fig. 15 is a sectional view taken along line D-D in Fig. 14. Fig. 16 is a plan view of an electrode arm portion. Fig. 17 is a longitudinal sectional front view of Fig. 16; Fig. 18 is a sectional view taken along line E-E in Fig. 16. FIG. 19 is an enlarged view of a part of FIG. 18. Fig. 20 is a plan view showing the case of the electrode portion of the electrode arm portion removed. Fig. 21 is a schematic cross-sectional view of an initial stage in which a plating solution is injected between a plated surface of a substrate and an anode. FIG. 22 is a schematic plan view of a state in which a plating solution is injected between a plated surface of a substrate and an anode, and an electric ore liquid is diffused across the entire surface of the substrate. FIGS. 23A and 23B are equivalent to the second embodiment of the present invention. Article No. ---------— ^ __ w ^ —----- Order --------- (Please read the precautions on the back before filling out this page) This paper size applies to China Standard (CNS) A4 (210 X 297 mm) 21 312144 1221862 A7

V. Description of the invention (22) The map of the 22 map printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Fig. 24 is a diagram corresponding to Fig. 21 in the third embodiment of the present invention. Fig. 25 is diagram corresponding to Fig. 22 in the third embodiment of the present invention. Fig. 26 is a view corresponding to Fig. 21 according to a fourth embodiment of the present invention. Fig. 27 is a fourth embodiment of the present invention corresponding to the kitchen noodle of Fig. 22. Fig. 28 is a perspective view of a main part of a fifth embodiment of the present invention. D Fig. 29 is a longitudinal sectional front view of a main part of the fifth embodiment of the present invention. Fig. 30 is a perspective view of a main portion of a modification of the fifth embodiment of the present invention. Fig. 31A is a front view of a plating solution impregnating material in a sixth embodiment of the present invention, and Fig. 31B is a bottom view of the plating solution impregnating material in a sixth embodiment of the present invention. Fig. 32A is a front view of a plating solution impregnating material in a seventh embodiment of the present invention, and Fig. 32B is a plan view of the plating solution impregnating material in a seventh embodiment of the present invention. Fig. 33 is a front view of another example of use of the embodiment shown in Fig. 32A. Fig. 34 is an enlarged sectional view showing a state in which a plating solution impregnating material is mounted on an anode. -------- Order --------- ^^^ 1 · (Please read the note on the back ^^ item before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 22 312144 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 B7 V. Description of the invention (23) Figure 35 is an oblique view of the state where the plating solution immersion material is installed on the anode. Fig. 36 is an enlarged cross-sectional view of another state where the plating solution impregnating material is mounted on the anode. Fig. 37 is an enlarged cross-sectional view of another state where the plating solution impregnating material is mounted on the anode. Fig. 38 is an enlarged cross-sectional view of a state in which a plating solution impregnating material is mounted on an anode. Fig. 39 is a schematic diagram of a main part of an electrolytic treatment apparatus to which an electrolytic plating apparatus according to still another embodiment of the present invention is applied. Figure 40 is an electrical equivalent circuit diagram of Figure 39. Fig. 41 is a film thickness distribution diagram of the plated film in the substrate surface when the electroplating device shown in Fig. 39 and the conventional electroplating device are used for electroplating. Fig. 42 is a schematic diagram of a main part of an electrolytic treatment apparatus to which an electrolytic plating apparatus according to still another embodiment of the present invention is applied; Fig. 43 is a graph showing a change in the copper ion concentration of the plating solution in areas A and B when the electroplating apparatus shown in Fig. 42 is used for the plating treatment. Fig. 44 is a schematic diagram of a main part of an electrolytic treatment apparatus to which an electrolytic power ore apparatus according to still another embodiment of the present invention is applied. Fig. 45 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 46 is a graph showing the results of measuring the thickness of the copper plating near the outer peripheral portion of the substrate W when the substrate W is subjected to copper plating. ^ Paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 23 312144 ------------------- Order --------- ^^^ 1 · (Please read the notes on the back before filling out this page)! 221862 A7 B7 V. Description of the Invention (24) Figure 47 is a schematic diagram of the present invention and other embodiments. Fig. 48 is a schematic diagram of still another embodiment of the present invention. " (Please read the precautions on the back before filling out this page) Figure 49 is a schematic diagram of the main parts near the outer periphery of the porous ceramic plate of the electrolytic plating device. Figures 50A and 50B are schematic views of still another embodiment of the present invention. Fig. 51 is a schematic diagram of still another embodiment of the present invention. Figures 52A to 52D are top views of a high-resistance structure used in the electrolytic plating apparatus of Figure 51. Fig. 53 is a schematic diagram of still another embodiment of the present invention. Fig. 54 is a graph showing measurement results of plating film thickness when a porous ceramic plate having a uniform thickness and a porous ceramic plate having a thickness distribution state shown in Fig. 53 are used for plating on a substrate W; Fig. 55 is a schematic diagram of still another embodiment of the present invention. Fig. 56 is a schematic diagram of still another embodiment of the present invention. Fig. 57 is a schematic diagram of still another embodiment of the present invention. Fig. 58 is a schematic diagram of still another embodiment of the present invention. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 59 is a schematic diagram of another embodiment of the present invention. Figures 60A and 60B are schematic views of still another embodiment of the present invention. 61A and 61B are schematic views of an example of an anisotropic structural material. Fig. 62 is a schematic view of a face-down electrolytic plating apparatus according to still another embodiment of the present invention. This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 24 312144 1221862 A7 B7 V. Description of the invention (25) Figure 63 is a schematic diagram of a closed electrolytic money device according to still other embodiments of the present invention. . Fig. 64 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 65 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 66 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 67 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 68 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 69 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 70 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Fig. 71 is a schematic view of a conventional plating apparatus. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 72 shows the film thickness distribution of the electric money film on the substrate surface when electrolytic plating of steel is performed on a substrate with conductive layers of different thicknesses using a conventional electroplating device. Illustration. Fig. 73 is a film thickness distribution diagram of an electro-forged film in a substrate surface when electrolytic plating of steel is performed on a substrate of a different size using a conventional electroplating device. Figure 74 is the electrical equivalent circuit diagram of the electroplating device shown in Figure 71. 0 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 312144 25 1221862 A7 B7 Employees ’Consumption of Intellectual Property Bureau, Ministry of Economic Affairs Printed by the cooperative V. Description of the invention (26) [Description of component symbols] 1 Semiconductor substrate 2 Insulating film 4 (for wiring) Groove 6 Copper layer 1 0 Loading and unloading unit 14 Transport robot 18 Plating solution supply equipment 22 Plating solution tray 26 Swing arm 30 electrode arm portion 34 fixed nozzle 38 cathode portion 42 cylinder 46 rotary motor 50 substrate carrying out inlet 54 up and down motor 58 support shaft 62 cylinder 66 electroplating liquid recovery nozzle 70 support arm 74 pushing piece 78 coil spring 82 support plate la conductive Layer 3 Contact hole 5 Barrier layer 7 Seed layer 12 Plating unit 16 Plating bath 20 Substrate processing section 24 Rotary shaft 28 Electrode section 32 Pre-coating / recovering arm 36 Substrate holding section 40 Cover body 44 Cylinder 48 Conveyor belt 52 Base plate 56 rotation Motor 60 rotary actuator 64 pre-coating nozzle 68 platform 72 positioning plate 7 6 claw portion 80 pressing rod 84 pillar -------------------- order-- ------- ^^^ 1 · (Please read the first Please fill in this page again for the matters needing attention) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 26 312144 1221862 A7 ---------- B7_____ Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Fifth, the description of the invention (27) 86 frame 88 cathode 90 seal material 92 ball bearing 94 housing 9 6 support frame 96a protrusion 9 9 anode 98a key liquid supply port (plating solution injection hole) 98b through hole 98c additive injection hole 100 suction chamber 102 plating solution supply pipe 104 plating solution introduction pipe 104a plating solution introduction path 104b plating solution introduction port 105 additive introduction pipe 10 5a additive introduction path 105b additive introduction port 106 plating solution discharge pipe 110 plating solution immersion Material 1 10a slit 110b protrusion 110c conical surface 112 fixed bolt 112a head 112 b fishing hook portion 112c spire portion 114 plate spring 116 brake rod 120 electric liquid column 120 coil spring 122 adhesive 210 electroplating liquid 212 Plating tank 214 Anode plate 214a Central hole 216 Receiving portion 218 Flange-shaped sealing material 220 Contact point 222 High resistance structure 224 Porous ceramic plate 224a Through hole 226 Plating power supply 230 Mounting table 232 Retainer 234 flange-shaped sealing material This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 27 312144 -------------------- Order — \ Please read the notes on the back before filling this page) Φ. 1221862 A7 B7 — I — -------- Order --I ------ ^^^ 1 _ (Please read the back first Please fill in this page before printing) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (28) 2 3 6 contact 240 high resistance structure 244 first plating chamber 250 plating tank 254 cover 258 contact 260b Diaphragm 262b mesh 266 electrolyte chamber 270 plating solution 274 high resistance plating solution 278 oxygen 3 3 2 holding member 336 contact 339 fine hole 341 plating solution introduction tube 342a porous substance (porous ceramic) 350a insulating member 3 51 insulating type Component holder 360a Sealing member portion 365 Opening 367 Through hole 370 Plating solution 410 Plating solution 238 Anode plate 242 Porous ceramic plate 246 Second plating chamber 252 Anode plate 256 Flange seal 260a Separator 262a Mesh 264 Plating chamber 268 High-resistance electrolyte chamber 272 electrolyte (plating solution) 276 high-resistance structure 330 substrate mounting base 334 flange-shaped sealing material 338 anode plate 340 high-resistance structure 342 porous ceramic plate (porous substance) 350 insulating member 350b insulating member 3 6 0 sealing member 360b insulating member portion 366 holes 368 high-resistance electrolyte chamber 376 high-resistance structure 430 substrate Set the paper size to the Chinese National Standard (CNS) A4 size (210 X 297 mm) 28 312144 1221862 A7 ___ B7 432 holding member 434 flange-shaped sealing material 436 contact 438 anode plate (electrode) 439 electrolyte introduction hole ( Electroplating solution introduction (through hole) 440 porous body 440a (upper) porous body 440b (lower) porous body 441 electroplating liquid introduction tube 445 tube body 447 tube body 450 liquid storage portion 455 plating liquid supply portion 457 electrolyte passage portion 459 Liquid path section 461 Main path 600 Plating solution 602 Plating tank 604 Substrate holding section 6 0 6 Anode plate 608 Plating solution spraying tube 61 〇Plating solution storage section 612 Plating power A Substrate receiving position B Plating position B Bubble C Pre-processing and cleaning position Cl, C2 pore structure M plating Q plating solution R liquid column S conductive layer W substrate [detailed description of the preferred embodiment]-I — — — — — — I— --- I I-- X Please read the notes on the back before filling out this page) 5. Explanation of the invention (29) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The following describes the embodiment of the present invention with reference to the drawings. The substrate plating apparatus of this embodiment is used when a surface of a semiconductor substrate is subjected to electrolytic copper plating to obtain a semiconductor device having a wiring formed of a copper layer. This plating step is described below with reference to FIGS. 1A to 1C. As shown in FIG. 1A, silicon dioxide (Si0) is deposited on the conductive layer 1a on the semiconductor substrate 1 on which the semiconductor element is formed in the semiconductor substrate W. This paper is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 29 312144 1221862 A7 ------- B7 _ V. Insulation film 2 composed of the description of invention (3G), and formed using lithography and etching technology (Π thography 61; 〇11 丨 11 £) A contact layer 3 and a trench 4 for wiring are formed thereon with a barrier layer made of titanium nitride (TiN) or the like, and a seed layer 7 is formed on the barrier layer 5 as an electrolytic plating Power supply layer. Next, as shown in FIG. 1β, copper plating is performed on the surface of the semiconductor substrate W to fill copper in the contact holes 3 and the grooves 4 of the semiconductor substrate 1, and a steel layer 6 is deposited on the insulating film 2. Then, the steel layer 6 on the insulating film 2 is removed by chemical mechanical polishing (CMP), so that the surface of the copper layer 6 filled in the contact hole 3 and the wiring trench 4 is formed on the same plane as the surface of the insulating film 2. Thereby, as shown in FIG. 1C, a wiring composed of the copper layer 6 can be formed. FIG. 2 is a plan view of the entire substrate plating apparatus according to the embodiment of the present invention. As shown in FIG. 2, the plating apparatus is provided in the same equipment. Two plating units 12 for the plating process and its subsidiary processes, a transfer robot 14 that transports the substrate W between the loading and unloading unit 10 and the plating unit 12, and a plating solution supply device 18 having a key liquid tank 16. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as shown in FIG. 3, the aforementioned plating unit 12 is provided with a substrate processing unit 20 for performing plating processing and ancillary processing, and is disposed adjacent to the substrate processing unit 20 to A plating solution tray 22 storing a plating solution. In addition, an electrode arm portion 30 is provided, which is held at the front end of a swing arm 26 that swings about the rotation shaft 24 as a center and has an electrode portion 28 that swings between the substrate processing portion 20 and the plating solution tray 22. In addition, a pre-coating / recovering arm 32 is disposed on the side of the substrate processing section 20, and pure water or ion water is sprayed onto the substrate. ) 21 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 2

A fixed nozzle 34 for a chemical liquid or even a gas. In this embodiment, there are three fixed nozzles 34, and one of them is used to supply pure water. V. Description of the Invention (31) As shown in FIGS. 4 and 5, the substrate processing unit 20 is provided with a substrate holding portion 36 that holds the substrate w with the plating surface facing upward, and surrounds the substrate holding portion 36. The peripheral edge portion is disposed on the cathode portion 38 above the substrate holding portion%. In addition, a substantially cylindrical bottomed cover 40 (cup) surrounding the substrate holding portion 36 to prevent scattering of various chemicals used in the process is disposed, and the cover 40 can move freely up and down through the air cylinder 42. Here, the substrate holding portion 36 is lifted and lowered by the cylinder 44 between the substrate awarding position A below, the power-storage position b above, and the intermediate pre-processing and cleaning positions c, and is transmitted through the rotary motor 46. The conveyor belt 48 is configured to rotate integrally with the cathode portion 38 at an arbitrary acceleration and speed. Relative to the substrate receiving and receiving position A, the side of the transport robot 14 on the side of the frame of the plating unit 12 is provided with a substrate carrying-out port 50 as shown in FIG. 7, and when the substrate holding portion 36 is raised to the plating position 8. The sealing material 90 and the cathode electrode 88 of the cathode portion 38 are in contact with the peripheral edge portion of the substrate W held by the substrate holding portion 36. On the other hand, the cover 40 is such that its upper end is located below the substrate carrying-out port 50, and in the & figure, as shown by the imaginary line, the substrate carrying-out port 50 is covered when it is raised, Then, it reaches above the cathode portion 38. When the electro-mineral liquid tray 22 is not electroplated, the electroplating solution is used to wet the electroplating solution impregnating material 11 and the anode of the electrode arm portion 30 described below, and as shown in FIG. 6, it is set to accommodate the electroplating solution. The size of the impregnated material 11 () is provided with a plating solution supply port and a plating solution drainage port (not shown). In addition, -------- ^ --------- · (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 Public love) 31 312144 1221862 Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (32 A light sensor is installed on the plating solution tray 22, which can be used to fill the plating solution in the plating solution tray 22 with water. That is, the detection of overflow and drainage. The bottom plate 52 of the plating solution tray 22 can be attached and detached, and a local exhaust port (not shown) is provided around the plating solution tray. The aforementioned electrode arm portion 30 is as shown in FIG. 8 and FIG. 9 As shown in the figure, the motor moves up and down through the up-and-down motion motor 54 and a ball screw green (not shown), and rotates (shakes) between the electroplating bath pan 22 and the substrate processing unit 20 through a rotating motor 56. As shown in FIG. 10, the pre-coating / recovering arm 32 is connected to the upper end of the support shaft 58 extending in the up-and-down direction, and is rotated (swayed) by the rotary actuator 60, and passes through the air cylinder 62 (see FIG. 7). (Figure) and up and down. The pre-coating, recovery arm 32 is tied to its free A precoat nozzle 64 for precoat liquid discharge is held on the end side, and a plating liquid recovery nozzle 66 for plating liquid recovery is held on the base end side. The precoat nozzle 64 is connected to, for example, a cylinder driven syringe to make the precoat liquid. It is ejected from the pre-coating nozzle 64 at rest, and the plating solution recovery nozzle 66 is connected to, for example, a cylindrical pump or a suction fan to attract the electro-mineral liquid on the substrate from the plating solution recovery nozzle 66. The aforementioned substrate holding portion 36 is As shown in FIGS. 11 to 13, a circular plate-shaped platform 68 is provided, and brackets 70 are erected at six locations along the circumferential direction of the peripheral edge portion of the platform 68 to place and hold the substrate W horizontally. On the platform 68. The upper end of one of the brackets 70 is fixed with a positioning plate 72 contacting the end surface of the substrate W for positioning, and at the upper end of the bracket 70 opposite to the bracket 70 to which the positioning plate a is fixed, A pressing piece 74 is supported for free rotation. The pressing piece 74 is abutted against the end face of the substrate ff and rotates. Γ The paper size applies the Chinese National Standard (CNS) A4 specification ⑽χ 297 public love) 32 η ---- ----- II -------- Order --------- (Please read the notes on the back first Please fill out this page again) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 " --- * --- B7____ V. Description of the invention (33) ~ — " " And push the substrate W on the positioning plate 72 sides. The other four brackets 70 are supported by a claw portion 76 on the upper end so as to be freely rotatable. The claw portion 76 is rotated and pushed downward from above the substrate W. 〇Here, the lower end of the pressing piece 74 and the claw portion 76 are connected to the pressing rod 80 which is pressed downward through a coil spring 78. As the pressing rod 80 moves downward, the pressing piece 74 and the clasp are pushed downward. The claw portion 76 is turned inward and closed, and a support plate 82 is arranged below the platform 68 to abut the lower surface of the pressing rod 80 and push the upper portion of the pressing rod 80 upward. Thereby, when the substrate holding portion 36 is located at the substrate receiving / receiving position A shown in FIG. 5, the pressing rod 80 will abut against the support plate 82 and be pushed upward, and when the pressing piece 74 and the claw portion 76 face When the platform 68 is lifted by turning the outside, the pressing bar 80 is lowered by the elastic force of the coil spring 78, and the pressing piece 74 and the claw portion 76 are turned inward and closed. As shown in FIGS. 14 and 15, the cathode portion 38 is a ring frame having an upper end of a pillar 84 fixed to a peripheral portion of the support plate 82 (see FIGS. 5 and 13, etc.). A body 86, a cathode 88 that protrudes toward the inside and is mounted below the frame 86 and is divided into six parts in this example, and a ring-shaped sealing material 90 that is mounted on the frame 86 to cover the cathode 88 . The sealing material 90 is configured such that the inner peripheral edge portion thereof is inclined downward inward and the inner peripheral end portion is made thinner and lower downward. As a result, as shown in FIG. 5, when the substrate holding portion 36 is raised to the plating position B, the cathode 88 is pressed against the peripheral portion of the substrate W held by the substrate holding portion 36 and is energized, and the sealing material 90 is simultaneously applied. The inner peripheral end will be crimped to the upper edge of the substrate W, and it will be sealed in a watertight state here. 11 A__w ^ · I ------ til! — Ϊ́Please read the precautions on the back before filling (This page) This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 33 312144 oz. Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. B7. φ ^ ^ I was plated), the plating solution leaked from the end of the substrate, while preventing the plating solution from contaminating the cathode 88. In the second embodiment of the shape disk, the 'cathode portion 38 is rotated by a 1-plate holding portion 36 which cannot move up and down, but it can also be freely moved up and down so that the sealing material M is crimped to the substrate when it is lowered. The electrode section of the aforementioned electrode | section 30 of the electric mine surface is as shown in Fig. 16 to Fig. 8. There is a casing 94 connected to the free end of the swing arm section 26 by a ball bearing 92, and is surrounded by this. A hollow support frame 96 around the casing 94 and an anode at the periphery are held and fixed by the casing 94 and the support frame 96. The anode 98 covers the opening of the casing 94, and a suction chamber 100 is formed inside the casing. Inside the suction chamber 100, a plating solution supply pipe 102 extending from the plating solution supply device i 8 (see FIG. 2) and a plating solution introduction pipe 104 extending in a diameter direction are in contact with each other, and are arranged in Above the anode 98, a plating solution discharge pipe 106 connected to the suction chamber 100 is connected to the casing 94. If the plating solution introduction pipe 104 has a manifold structure, it is very effective for uniformly supplying the plating solution to the surface to be plated. That is, a plating solution introduction path 104a extending continuously in the long-side direction is provided, and a plurality of plating solution introduction ports i04b are communicated at a predetermined interval along the introduction path name 104a, and A shoulder plating solution supply port 98a is provided at a position of the anode 98 corresponding to the plating solution introduction port 104b. Further, the anode 98 is provided with a plurality of through-holes 98b throughout the entire surface, and j communicates up and down. As a result, the plating solution introduced from the plating solution supply tube 10: the plating solution introduced into the plating solution introduction tube 104 will pass from the plating solution introduction port 1041 -------- order ---------. · (Please read the precautions on the back before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210 x 297 mm) 34 312144 1221862 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7. (35) and the plating solution supply port 98a reach below the anode 98, and attract the plating solution discharge pipe with the anode 98 immersed in the plating solution, the plating solution below the anode 98 can pass through the suction hole 98b through the suction chamber 1o. 〇, and discharged from the electric chain liquid discharge pipe 106.

Here, the aforementioned anode 98 is composed of copper (phosphorus-containing steel) containing phosphorus in order to suppress the generation of residues, and the content of phosphorus is from 0.03 to 0.05%. When copper-containing copper is used for the anode 98 as described above, as the electricity progresses, a so-called black film (black film) is formed on the surface of the anode 98. The black film is a Cu + complex of phosphorus and chlorine (Cl), and is made of Cu2Cl2.Cu20 * Cu P 3 * ·. The formation of this black film can suppress the heterogeneous reaction of copper. Therefore, in order to stabilize the electroplating, it is very important to form a black film stably on the surface of the anode 98. However, when the black film dries or oxidizes and detaches from the anode 98, Will be the cause of particles. Therefore, in this embodiment, a plating solution impregnating material 110 composed of a water-retaining material is installed under the anode 98 to cover the entire surface of the anode 98, and the plating solution impregnating material 110 contains a plating solution to wet The surface of the anode 98 is used to prevent the black film from falling off and oxidized due to the drying of the plated surface of the substrate. At the same time, when the plating solution is injected between the plated surface of the substrate and the anode 98, air is easily discharged to the outside. The electric mineral liquid impregnating material 110 has water retention and permeability, and is excellent in chemical resistance. It is especially durable for acid plating solution containing high concentration of sulfuric acid, and it is made of woven fabric made of fibers such as polypropylene, so that the dissolution of impurities in the sulfuric acid solution will not affect the plating performance (film formation speed, resistance Rate, pattern embedding). In addition, the material of electroplating bath impregnated material 110 ---- Order --------- ίPlease read the precautions on the back before filling in this page >

1221862 V. Description of the invention (36) In addition to polypropylene, it can be combined with polyethylene, polyester, polyethylene, Teflon, polyethenol, and acetone. These derivatives can also be made without iron. Please read the notes on the back before filling in this page.) Cloth or sponge-like structure. In addition, porous ceramics made of aluminum or Sic, sintered polypropylene, etc. are also effective. That is, a plurality of fixed pins 112 having a head at the lower end are housed in a plating solution impregnating material P such that the head can not be detached upward, and the shaft is disposed through the anode 98, and is arranged via u The plate-shaped leaf spring 114 presses the fixing pin 112 upward, so that the plating solution impregnating material 110 is tightly connected through the elastic force of the plate spring 114 and is installed under the anode 98. With the above-mentioned structure, even if the anode 98 becomes thicker and thicker as the plating progresses, the plating solution impregnating material 110 can be surely brought into close contact with the anode 98. Therefore, it is possible to prevent the electric money from being caused by the air mixed between the lower surface of the anode 98 and the plating solution impregnating material i 丨 〇. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy The front end surface of the pin below the pole is coated with an adhesive to adhere and fix the plating solution impregnated material. In the case where the impregnated material such as porous ceramic has sufficient rigidity, it is not necessary to fix the bolt and the like of the impregnated material, and only the anode is placed on the impregnated material. On the other hand, when the substrate holding portion 36 is located at the plating position B (refer to FIG. 5), the gap between the substrate W held by the substrate holding portion 36 and the plating solution impregnating material 110 is reduced to, for example, 0 · 5 to 3 mm, and in this state, the plating solution is supplied from the plating solution supply pipe 102, and the plating solution impregnating material 110 contains the plating solution, and at the same time on the substrate W (the surface to be plated) (CNS) A4 specification (210 X 297 mm) 36 312144 1221862 Printed by A7, Employees ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (37) and the anode 98 are filled with a plating solution, so as to cover the substrate w The plating surface is plated. At this time, as shown in FIG. 21, at the position of the anode 98 substantially corresponding to the plating solution injection hole 98a, the plating solution is brought from the bottom of the plating solution impregnating material 11 to the top of the substrate W (the surface to be plated), A cross-linked electroplating solution impregnating material 110 and a plating solution column 12 on the plated surface of the substrate W can be formed. Then continue to supply the plating solution, then the plating solution column i 20 will slowly grow, or after being connected to each other, as shown in FIG. 22, proceed toward the direction orthogonal to the plating solution introduction tube 104 to generate expansion to The full flow of the electric ore liquid Q on the substrate W of the electric ore surface. Thereby, the bubble B is pushed out to the outside along with the flow of the plating solution Q, and the front line Qi of the flow of the plating solution Q is formed into a substantially straight line, so the plating solution Q does not enclose air. Therefore, bubbles can be prevented from remaining in the plating solution filled between the plating solution impregnating material 110 and the plated surface of the substrate W. In addition, as shown in FIG. 4, a brake rod 116 is erected on the outside of the pillar 84 for supporting the cathode portion 38, and a protruding portion 96 a provided around the support frame 96 abuts on the brake rod 116 to The lowering of the electrode portion 28 is restricted. Next, the operation of the plating apparatus according to the foregoing embodiment will be described. First, the transfer robot 14 is used to remove the substrate W before the electric mining process from the loading and unloading unit 1 (), and with the electric mining surface facing upward, it is moved out from the substrate provided on the side of the frame. Inside the power unit M. At this time, the 'substrate holding portion 36 is located at the lower substrate receiving and receiving position A, and after the arm of the transport robot 14 reaches the level a τ l from ^ J to ten σ 68, the arm ΐ paper size is suitable for the country of wealth. Standard (CNS) A4 Specification (-__ 幻 57 312144 • 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 丨 i 丨 丨 Please read the precautions on the back before filling this page) 1221862 A7

BY V. Description of the invention (38) The substrate is placed on the bracket 70. Then, the arm of the transfer robot 14 is retracted through the substrate carrying-out port 5Q. After the arm of the transfer robot 14 is completely retracted, the lid body 40 is raised and the substrate holding portion 36 at the substrate receiving and receiving position A is raised to the pre-processing / cleaning position C. At this time, in accordance with the upward movement, the substrate placed on the holder 70 is positioned by the positioning plate 72 and the pressing piece ^, and is securely held by the claw portion 76. On the other hand, the electrode portion 28 of the electrode arm portion 30 is located at the usual position on the plating solution holder: t 22 at this time, and the electro-impregnating material 11 or the anode 98 is positioned in the plating solution tray 22, and at this point At the same time as the lid body 40 rises, "supply the plating solution to the plating solution tray 22 and the electrode part. Then, before entering the plating process of the substrate, supply a new plating solution and simultaneously pass through the plating solution discharge pipe 106. The suction is performed to exchange the plating solution contained in the plating solution impregnating material 110 and to discharge air bubbles. In addition, when the cover 40 is raised 70, the substrate carrying-out port 50 on the side of the frame is covered and closed by the cover 40 When the cover 40 rises, it will enter a pre-coating process. That is, the substrate holding portion 36 that has received the substrate W is rotated, and the pre-coating and recovery at the avoiding position are performed. # 32 is moved to a position opposite to the substrate. Then, when the rotation speed of the substrate holding portion 36 reaches a set value, a pre-coating liquid made of, for example, a surface active agent is removed from a pre-coating nozzle 64 provided at the front end of the pre-coating / recovering arm 32. Intermittently Out to the plated surface of the substrate. At this time, since the substrate holding portion is rotating, the pre-coating liquid will spread to the entire plated surface of the substrate ^. Then, the pre-coating / recovering arm 32 is returned to the avoiding position, and Increase substrate holding portion% 312144

I Used this paper size? National Standard (CNS_) A4 Specification (21G χ 297 Gongchu 1221862 A7 V. Description of the invention (39) The rotation speed 'recycling the substrate with centrifugal force and then drying it. ≪ The top coating liquid is pre-coated before entering Electroplating treatment. First, stop the substrate holding part from rotating, or you & ^, rise to the state where the Rech is lowered to the state during the electroforge. The electroplating position B for electroplating. So-come, the substrate? The peripheral part of the fist will contact the cathode 88 and be able to be energized. _Make_90 is connected to the peripheral edge rj of the substrate w to seal the peripheral part of the substrate in a liquid-tight state. Π On the other hand, depending on the carry-in The signal when the substrate W has completed the pre-coating process, the electrode arm portion 30 is rotated in the horizontal direction so that the electrode portion M is moved from above the electro-mineral liquid tray 22 to a position where plating is performed, and when the position is reached, the electrode is made The portion 28 descends toward the cathode portion 38. At this time, the plating solution impregnating material 110 does not contact the substrate surface of the substrate w, but is positioned at a position close to ❹ · 5 to about 3 levels. In the electrode portion 28 When the drop is completed, the plating current is turned on, The plating solution is supplied from the plating solution supply pipe 102 to the inside of the electrode portion M, and the plating solution is supplied from the plating solution injection hole 98a penetrating the anode 98 to the plating solution impregnating material 110. This is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Next, at the position of the anode 98 corresponding to the plating solution injection hole 98a, a plating solution column 120 for cross-linking the plating solution impregnating material 11 and the plated surface of the substrate 1 is formed, and as the plating solution is continuously supplied, The plating solution column 120 will slowly grow and, after being connected to each other, travels in a direction perpendicular to the plating solution introduction tube 104 to diffuse to the entire surface of the substrate to be keyed. Thus, the bubbles will follow the plating solution's liquid. The flow is pushed to the outside, and the plating solution does not cover the air, so it can prevent air bubbles from remaining in the plating solution immersion material 39 312144 1221862 A7 B7 V. Description of the invention (40) t Please read the precautions on the back before filling this page ) 110 and the plating solution between the plated surface of the substrate W. Therefore, the plating solution containing copper ions exuding from the plating solution impregnating material 11 can fill the gap between the plating solution impregnating material 110 and the plated surface of the substrate without leaving bubbles, and can be performed on the plated surface of the substrate. Copper plating. In this case, the substrate holding portion 36 may be rotated at a low speed. When the plating solution is injected, a fixed voltage is preferably applied between the substrate W and the anode 98. Thereby, a current of a fixed density flows at the contact portion of the plating solution, and an appropriate voltage is selected to prevent the steel seed layer of the substrate W from being etched. In addition, during the plating process, the plating solution may be supplied from the plating solution injection hole 98a to the plating solution impregnating material 110 to inject the plating solution between the plating solution impregnating material 110 and the plated surface of the substrate W, and at the same time from the plating The liquid discharge pipe 106 sucks and discharges the electric mineral liquid. Thereby, in the electric ore processing, the plating solution filled between the substrate W and the anode 98 is circulated and stirred, and the air bubbles in the plating solution can be extracted. The injection / attraction of the plating solution can be performed not only in the initial stage but also during the power mining. When the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints a continuous supply of plating solution, the plating solution including copper ions exuding from the plating solution impregnation material 110 will fill the gap between the plating solution impregnation material 110 and the plated surface of the substrate W , And steel plating can be performed on the plated surface of the substrate. In this case, the substrate holding portion 36 may be rotated at a low speed. When the plating process is completed, the electrode arm portion 30 is raised and rotated, and then returned to the top of the plating solution tray 22 and lowered to the usual position. Next, the pre-coating / recovering arm 32 is moved from the avoidance position and lowered to a position opposite to the substrate w, and the plating residue on the substrate W is recovered by the plating solution recovery nozzle 66. This paper is in accordance with China National Standard (CNS) A4 Specifications (210 X 297 mm) 40 312144 1221862 A7 V. Description of the invention (41) body. After the recovery of the residual liquid of the electric mineral liquid, return the pre-coating to the avoidance position. In order to clean the plating surface of the substrate arm 32, the pure water is discharged from the fixed nozzle for pure water toward the center of the substrate. ^ At the same time increase the substrate holding section. It can be used to clean the substrate W by replacing the electro-mineral fluid on the surface of the substrate with pure substrate cleaning as described above, which can prevent the cathode from being polluted by the plating solution when the substrate holding portion is lowered from the plating position B. The situation of the cathode 88 of the portion 38 occurs. a After the cleaning is finished, it is washed with water. ㈣, make the substrate holding portion%

I, the plating position B is lowered to the pre-treatment / cleaning position c ', and the pure water fixing nozzle 34 is used to supply pure water while rotating the substrate holding portion 36 and the cathode portion 38 for water washing. At this time, the sealing material 90 and the cathode 88 can be cleaned simultaneously with the substrate by using pure water directly supplied to the cathode portion or pure water scattered from the surface of the substrate ff. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs After the washing process, it is dried. That is, the supply of pure water from the fixed nozzle 34 is stopped, and the rotation speeds of the substrate holding portion 36 and the cathode portion 38 are increased ', and then the pure water on the substrate surface is shaken off by centrifugal force and dried. At the same time, the sealing material 90 and the cathode 88 can be dried. When the drying process is completed, the rotation of the substrate holding portion 36 and the cathode portion 38 is stopped, and the substrate holding portion 36 is lowered to the substrate receiving and receiving position A. In this way, the gripping claw portion 76 is released from holding the substrate W, and the substrate W is placed on the holder 70. At the same time, the cover body 40 is also lowered. As described above, all the processes such as the plating process and the pre-attachment process and the cleaning and drying process are completed. The transfer robot 14 inserts its arm from the substrate carrying port 50 under the substrate W, and raises the arm in this state. China National Standard (CNS) A4 specification (21 × 297 mm) 41 312144 1221862 Printed by A7, Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (42 Substrate w received from substrate holding section 36. Then, The transfer robot 14 returns the processed substrate w received from the substrate holding portion 36 to the loading and unloading portion 10. However, in this embodiment, when a plating solution immersion material is mounted under the anode to perform the plating process Sometimes, bubbles may enter the pores formed in the plating solution impregnating material 110. These bubbles have the effect of an insulator and may cause the current segment of the electroplating process to be disturbed. For this problem, 'plating Before the treatment, the electroplating solution discharge pipe 10 is sucked, the space where the electroplating solution impregnating material 110 is arranged is decompressed, and then the electroplating solution is introduced into the pipe. 104 The introduction of the plating solution into the plating solution impregnating material 11 is effective. In this way, the air bubbles entering the pores of the plating solution impregnation material 11 can be promoted to run out to the outside, and high quality can be achieved by uniform current distribution. In addition, if this process is also performed when the plating apparatus is raised, it is very effective because the air bubbles that first enter the pores of the plating solution impregnating material 110 can be removed. According to this embodiment, the plating apparatus uses a substrate In the state where the holding part holds the substrate upward, the plating process, the pre-processing attached to the plating process, and other processes such as washing and drying processes can be performed before and after the plating process. Therefore, all processes of plating can be performed in a single device, and The simplification of the device can be achieved, and an electric mining device with a small footprint can be provided at a low cost. In addition, as for the recording unit, it can be mounted on other semiconductor manufacturing devices. It is very advantageous to classify the wiring formation process. Here, as shown in FIG. 23A, it is also possible to use a radial (cross) shape. The wings extending in a direction perpendicular to each other, and along the wings ---- 1 ----- 11 -------- order ---- 1 ---- ^^^ 1 C (Please read the notes on the back before filling out this page)

312144 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 V. Description of the Invention (Plating solution introduction pipe 104 having plating solution introduction holes 104b at a predetermined position in the longitudinal direction of the Ministry of Use, corresponding to the plating solution introduction holes i 〇4b has an anode (not shown) having a plating solution injection hole 98a. At this time, as described above, at a position substantially corresponding to the plating solution injection hole 98a of the anode, a cross-linked plating solution impregnated material is formed. 110 and the plating liquid column on the plated surface of the substrate W, and with the supply of the plating solution, the plating solution column gradually grows, and it will diffuse into radiation in each quadrant distinguished by the plating solution introduction tube 104. The flow of the electroplating solution Q is spread to spread the electroplating solution q to the entire surface of the substrate. In addition, as shown in FIG. 23B, the electroplating solution introduction pipes ι4 communicate with each other and are arranged in a concentric circle shape. When the plating solution introduction holes 104b are provided at predetermined positions, the same liquid flow of the plating solution q will be generated. The plating solution introduction holes 104b of the plating solution introduction tube 104 may also be provided with holes of equal diameter, but also Adjustable The pitch and aperture are used to control the discharge of the electric ore liquid. Moreover, as shown in FIG. 24 and FIG. 25, one or a plurality of electroplating liquid injection holes 98a may be collectively provided at the end of the anode 98, and the electric ore The key injection liquid is simultaneously introduced into the liquid injection hole 98a. In this case, the plating solution injection hole 98a corresponding to the anode 98 is formed at a position substantially corresponding to the plating solution injection hole 98a of the anode 98 and the substrate W is plated. The electric ore liquid column 120 on the opposite side, and with the continuous supply of the electroplating liquid, the electroplating liquid column gradually grows, and a liquid flow of the electroplating liquid Q flowing in one direction on the opposite side is generated to diffuse the electroplating liquid Q. To the entire surface of the substrate W. I -------- Order --------- (Please read the precautions on the back before filling this page) Furthermore, as shown in Figure 26 and As shown in FIG. 27, the anode 98 side can also be arranged while tilting the anode 98 side while the substrate rating is kept horizontal, and

1221862 A7 V. Description of the invention (44) A plating solution injection hole 98a is provided at a position of the anode 98 near the substrate w, and a plating solution is introduced into the plating solution injection hole 98a, while the anode 98 side is gradually poured down to the substrate W side It is in a horizontal state with the substrate w. At this time, in the same manner as described above, at the position corresponding to the plating solution injection hole 98a of the anode 98, a plating solution column 120 for cross-linking the plating solution impregnating material 11 and the substrate surface of the substrate to be electroplated is formed. The inclination angle between the anode 98 and the substrate W is gradually reduced, and a liquid flow of the electric money liquid Q spreading in a certain direction is generated from the key liquid between the anode 98 and the to-be-charged surface of the substrate W, so that the plating solution q is diffused to the substrate. The entire surface of W is mined. In addition, "contrary to the foregoing, the anode side may be arranged in a horizontal state first", and the substrate may be arranged obliquely to the anode side, and the substrate may be gradually lowered and parallel to the anode side while the electric mineral liquid is injected. Fig. 28 and Fig. 29 show the anode 9 8 and the electro-mineral fluid impregnated material 11 0 according to still another embodiment of the present invention. That is, in this example, the plating solution impregnating material 110 is composed of alumina, silicon carbide, mullite, zirconia, titania, porous ceramics such as lapis lazuli, or hardened materials such as polypropylene and polyethylene. Porous bodies, or composite materials of these. For example, in the case of oxidized ceramics, a plating solution impregnating material having a pore diameter of 30 to 200 μπ1, a porosity of 20 to 95%, and a thickness of 5 to 20 mm, preferably 8 to 15 mm can be used. In addition, the plating solution impregnating material 110 is provided with a flange portion 110a on an upper portion thereof, and is held by the casing 94 and the support frame 96 (see FIGS. 17 and 18) to be fixed, An anode 98 is placed and held on the plating solution impregnated material. In addition, in the case of this embodiment, the size of this paper can be applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 312144 -------- Order --------- ( (Please read the notes on the back before filling out this page) 1221862 A7

Anodes of various shapes such as porous bodies or meshes are printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. As described above, since the plating solution impregnating material 110 is composed of a porous body, it is possible to increase the resistance inside the plating solution impregnation material 110 through the plating solution that enters into the inside complicatedly, and to achieve uniformity of the plating film thickness. Can prevent the generation of particles. Furthermore, since the anode 98 is placed and held on the plating solution impregnating material 110, even if the underside of the anode 98 in contact with the electrolytic solution impregnation material 110 is dissolved as the plating progresses, there is no need to use a fixed anode 98 The jig can have the weight of the anode 98 itself, keep a certain distance between the lower surface of the anode 98 and the substrate W, and prevent air from being mixed thereinto, resulting in air retention. Furthermore, in this example, a cross-shaped plating solution introduction tube 104 extending in the diameter direction is provided on the anode 98 as shown in FIG. 22, and the anode 98 is provided opposite to the plating solution. The plating solution introduction hole 104b of the tube 104 is provided with a plating solution injection hole 98a. In addition, the anode 98 is provided with a plurality of through holes 98b. In addition, this example shows an example in which the anode 98 is placed and held on the plating solution impregnating material 110, but the plating solution impregnating material 110 and the anode 98 may be disposed at separate positions. In this case, especially when a soluble anode is used as the anode 98, the anode will gradually dissolve from below, so sometimes the gap between the anode and the plating solution impregnated material becomes larger with the passage of time, resulting in 0. To a gap of about 20mm. According to this embodiment, a plating solution column 120 is formed at a position substantially corresponding to the plating solution injection hole 98a of the anode 98. The electroplating solution column 120 makes the electroplating solution from the bottom of the electroplating solution impregnating material 110 to the top of the substrate W (electroplated-I — — — — — — I — I ------ f Please read the notes on the back first (Fill in this page again) The paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 45 312144 1221862

V. Description of the invention (46) (Printed surface of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs), the plating surface of the substrate 110 and the substrate w are cross-linked with the plating solution immersion material 110. At this time, when the plating solution flows inside the plating solution impregnating material 110, the plating solution diffuses slightly along the flow direction of the plating solution, so that the seed layer 5 (see FIG. 1A) caused by the plating solution reaching the substrate w can be reduced. The damage, that is, the seed layer phenomenon caused by the local encounter with the jet, can achieve the uniformity of the film thickness of the subsequent electroplating treatment. In addition, as shown by an imaginary line in FIG. 29, after the electroplating liquid column 120 is formed from the bottom of the electroplating solution impregnating material 110 to the upper surface of the substrate W (the surface being electro-mineralized), the electroplating liquid can be lifted up instantly, The plating solution impregnating material J i 0 and the substrate W are brought close to each other in an instant. In addition, the same plating solution column 12 can be formed while applying some pressure to the edge of the substrate to bend into a concave shape, and then release the applied pressure to restore the substrate to its original shape, so as to impregnate the plating solution. The material 110 and the substrate w approached instantaneously. Therefore, for example, in the case where the thickness of the electro-mineral liquid impregnating material 110 is thick and the density is high (low porosity), the resistance when the plating solution flows inside the electro-hydraulic liquid impregnating material 110 increases. Therefore, a predetermined amount of plating solution cannot flow out, and the combination of the plating solution column 120 will be disturbed. Even if air is involved at this time, the plating solution immersion material 110 and the substrate w can be approached instantaneously for electric money. The liquid generates a rapid liquid flow to the outside, and together with the electric mineral liquid, the bubbles are driven out to the outside, and at the same time, the electric liquid can be supplied between the electric mineral liquid immersion material 110 and the substrate W in a short time. In addition, contacting the plating solution with the seed layer 5 (refer to FIG. JA) in a non-energized state will cause the seed layer 5 to decrease. Even in the energized state, if the electric mineral liquid cannot diffuse on the surface of the substrate W in a short time, The film I in the early stage of electricity money —-------- ^ {Please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 46 312144 1221862 Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (47 thickness will produce unevenness, which will cause the thickness uniformity of the plating film to be destroyed afterwards. However, as mentioned above, the plating Supplying a plating solution between the liquid immersion material ij 〇 and the substrate W can prevent these disadvantages. Furthermore, as shown in FIG. 28, the plating solution can be supplied from the plating solution injection hole 98 a to the plating solution impregnation material 11 during the plating process. 〇, inject a plating solution between the plating solution impregnating material 110 and the plated surface of the substrate W, and simultaneously suck and discharge the same amount of plating as the injected plating solution through the through-hole 98b from the plating solution discharge pipe 106. So, borrow By stirring the plating solution during the electroplating process, the bubbles that cannot be exuded when the liquid is diffused and the bubbles generated during the electroplating process after the liquid is diffused can be removed. In addition, in this electroplating device, the plated surface of the substrate W and the anode The interval between 98 is narrow, so only a small amount of plating solution is needed, but on the contrary, the amount of additives and ions in the electric mineral solution is limited. Therefore, in order to effectively perform plating in a short time, it must be evenly distributed in the plating solution. These additives, etc. In this regard, according to this embodiment, the electroplating solution is stirred during the electroplating solution treatment, so that the electric ore can be performed in a state where the additives and ions are uniformly distributed. Moreover, as shown in FIG. 30, An additive introduction pipe 105 may be further provided on the anode 98. The additive introduction pipe 105 has an additive introduction passage 105a and an additive introduction port 105b 'which have the same structure as the plating solution introduction pipe 104, and faces the additive on the anode 98. An additive injection hole 98c is provided at the position of the introduction port i05b, so that the additive injection hole 98c is intermittently or continuously supplied from the additive injection hole 98c during the plating process. Additives such as modifiers and carriers, or M-tension scales are applicable to China National Standard (CNS) A4 specifications (21G X 297 public love) ------ 47 312144 -------- ^ ---- ----- C Please read the precautions on the back before filling this page) 1221862 A7 B7 V. Description of the Invention (48) Ionic liquid (plating solution) to supplement the additives and ions consumed by electroplating. In this case, since the amount of the additive is small, it is not necessary to discharge the plating solution from the through-hole 98b. In addition, changing the additive component ratio during plating can reduce the film thickness difference between the wiring section (1 ine and space section) and the flat section, and can also improve the CMP characteristics of the post-treatment. Figures 31A and 31B and Figures 32A and 32B are different embodiments of the present invention in which the plating solution impregnating material 110 is composed of a hard porous body. These embodiments are based on the plating solution impregnation The surface is provided with a mechanism for relatively rotating the plating solution impregnating material 110 and the substrate W so that the plating solution therebetween diffuses radially outward, and other structures are the same as those shown in FIGS. 28 and 29. The embodiment shown is the same. That is, FIG. 31A and FIG. 31B are provided below the plating solution impregnating material 110, and a plurality of spiral-shaped protrusions (blades) 110b which are bent outward and curved along the rotation direction are provided. The lower surface of the plating solution impregnating material 110 itself forms a conical surface 110c that bulges downward toward the center and has an inclination of about 1/100, for example. These embodiments are performed after forming a plating solution column 120 that cross-links the plating solution impregnation material 11 () and the plated surface of the substrate W, for example, by rotating the substrate ¥, so that the plating solution impregnation material 110 is opposed to the substrate W By rotating, the electroplating liquid impregnating material 11 and the substrate W can be stirred along with the rotation, while the electroplating liquid impregnating material 11 diffuses radially outward to forcefully enter the electroplating liquid impregnating material 11 The bubbles B between 0 and the substrate W are discharged to the outside together with the plating solution, and at the same time, the plating solution can be supplied to the plating solution impregnating material 11 and the substrate W in a short time. ------------ 9 C Please read the notes on the back before filling out this page) —Order --------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy

1221862 A7

V. Description of Invention ㈠ 9) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, especially as shown in Figure 31A and Figure 31B, a protrusion 11 〇b is provided under the plating solution impregnating material 110, and the protrusion 11 〇b has a promotion The rectifying effect of the plating solution diffusion and the stirring effect accompanying the rotation, the limited additives and ions in the plating solution can be evenly distributed on the surface of the substrate W. In addition, it is also possible to provide protrusions that expand radially outward instead of the spiral protrusions 11 0b shown in FIGS. 31A and 31B, or to provide recesses (grooves) instead of these protrusions, and also to form a circular arc Instead of the conical surface iioc shown in Figs. 32A and 32B, the shape is spherical. In addition, as shown in FIG. 33, the plating solution may be diffused in advance above the plated surface of the substrate W that is hermetically sealed at the peripheral edge portion by the sealing material 90, and rotated, for example, as shown in FIGS. 32A and 32B. The electrolyzed liquid impregnating material 110 having a conical surface 11 〇 is lowered so that the electroplating liquid impregnating material 110 and the substrate W are relatively rotated and gradually approached, and the electroplating liquid impregnating material 11 is filled with the electric mineral liquid. Between 0 and the substrate W. As a result, the bubbles B between the electrolytic solution impregnating material 110 and the substrate w can be gradually moved outward as they approach each other, and can be surely extruded, and the electroplating solution can be filled with the key solution without bubbles. Between the collapse material 110 and the substrate W. In addition, each of the aforementioned embodiments shows an example of holding the substrate upward, but the relationship between the substrate and the anode is not limited to this. According to the electroplating apparatus of this embodiment, the substrate holding portion holds the substrate upward, and other processes such as pre-treatment attached to the electric mining process and the electric money processing and cleaning and drying processes can be performed before and after the electric mining process. Therefore, the simplification of the device can be achieved, and at the same time, a plating device having a small footprint can be provided at a low cost. Moreover, the plating solution can be filled with beauty without remaining air bubbles. -------------------- Order ---------. (Please read the note on the back first Please fill in this page again for this matter) This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 49 312144 A7 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ ---- B7 V. Description of Invention (5G) Between the plated surface and the anode of the plate, a uniform and high-quality plated coating film can be formed on the plated surface. Here, as shown in FIG. 34 and FIG. 35, most of the approximately cylindrical fixing pins 112 having a large head 112a at the lower end are embedded and fixed inside the plating solution impregnating material 11 so that the head 112a cannot be pulled out from above, and the shaft portion is penetrated through a through hole ggc provided inside the anode 98, and is arranged to protrude upward. Then, the fixing pin 112 is pushed upward by a U-shaped plate spring 114 made of, for example, a synthetic resin, so that the plating solution impregnating material 110 is tightly attached through the spring force of the plate spring 114 and is mounted under the anode 98. In addition, in this example, a slit 110a of a predetermined depth is provided on the lower side of the electric mineral liquid immersion material 1 1 Q, so that the head 1123 of the fixed bolt 112 is located in the slit 110a, and the shaft portion penetrates the plating solution. Inside the crushed material 110, the fixing plug 112 is fixed to the plating solution-impregnated material 110, and the elasticity of the plating solution-impregnated material 110 is used to restore the opening, thereby closing the slit. Here, the material of the fixed pin 112 may be polypropylene, pEEK, PVC, polyethylene, etc., but it is not limited to this as long as the durability of the plating solution and the strength of the pin are strong. In addition, the diameter of the fixing pin 丨 2 is, for example, about 0.5 to 4 mm. In addition, the mounting pitch of the fixed pins 112 varies depending on the plating solution impregnating material 110 and the plating area used. For example, in the plating of an 8-inch substrate, the mounting pitch is about 5 to 40 colors, and the mounting number is About 10 to 150 pieces, the maximum installation distance is 20 mm, the number of installation is about 50 to 100 pieces. Thereby, the lower surface of the anode 98 on which the black film is formed is wetted by the plating solution held by the plating solution impregnation material 110, and the plating solution impregnation material 11 has -------- ^ ----- ---- (Please read the notes on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) 50 312144

1221862 V. Description of the invention (51) It acts like a filter to prevent the black film from drying out and falling off, or even oxidizing. In addition, with the progress of electroplating, even if the anode 98 is gradually dissolved and consumed to make it thinner, the anode 98 can often be brought into close contact with the plating solution impregnating material 110 by the spring force of the plate spring 114, thereby preventing air retention. form. Generally, the anode 98 consumes about 20 to 40 mm after a month of plating. In addition, as shown in FIG. 36, a fixing pin 112 having a hook-shaped portion 112b at the lower end may be used, and the hook-shaped portion 112b may be hooked from the upper side of the electroplating liquid impregnating material 110 to the electro-mineral liquid impregnating material 11 〇 is fixed, and the fixing pin Π2 is pushed upward by a coil spring made of, for example, a synthetic resin. Furthermore, in terms of mounting method and price, leaf springs are more advantageous than coil springs. In addition, as shown in FIG. 37, a fixed plug 112 made of a cylindrical PVC (gas vinyl) or PET having a diameter of, for example, about 2 mm can be arranged through the through hole 98 c of the anode 98 from the anode upper side, and The adhesive 122 is applied to the front end surface of the fixing pin 112 exposed under the anode 98 to adhere and fix the plating solution impregnating material 110. The adhesive 122 is not limited to these as long as it is a gas-based vinyl, a dream-modifying polymer, an organic substance is dissolved, or particles are generated less. Furthermore, as shown in FIG. 38, a spire-like portion 112c may be provided at the front end of the fixed pin 112, so that it is convenient to insert the fixed pin 112 into the plating solution impregnating material 110 as shown in the figure. At this time, as shown in Fig. 38, a pinhole-shaped slit 110a may be provided on the lower surface side of the plating solution impregnating material 110. Figure 39 is a schematic diagram of the main part of an electrolytic treatment device to which an electrolytic power smelting device according to still another embodiment of the present invention is applied, and Figure 40 is its electrical property -------- ^ ------- -^ Please read the notes on the back before filling this page) Printed on the paper by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 51 312144 1221862 Printed by A7, Consumer Cooperatives of Property Bureau. V. Invention Description (52) Equivalent circuit diagram. In this embodiment, a silicon substrate (hereinafter referred to as a substrate) having a diameter of 200 mm is held face down, and copper plating is performed on the surface (lower surface), and the lower surface (plating surface) of the substrate W is formed. For example, a 100-nm-thick sputtering copper film is used as a conductive layer (seed layer). The electroplating device is provided with a cup-shaped electroplating bath 212 for holding an electroplating solution 210 made of, for example, copper sulfate, and forming an opening upward. The bottom of the electroplating bath 212 is provided with, for example, a central hole 214a having a diameter of 30 mjn.环 anode 板 214. The material of the anode plate 214 is, for example, copper containing 0.004 wt% of phosphorus. Around the plating tank 212, a plating solution storage section 216 for recovering the plating solution 21o overflowing from the upper part of the plating tank 212 is disposed at the periphery of the substrate W, and is provided above the plating tank 212 with a crimp on the substrate. The lower peripheral edge portion is provided with a flange-shaped sealing material 218 that prevents the plating solution 21 from flowing out therefrom, and is located outside the flange-shaped sealing material 2 i 8 and contacts the substrate w to introduce the cathode potential to the substrate w Its contact is 22o. A high-resistance structure 222 having a conductivity lower than that of the plating solution 210 is disposed inside the plating tank 212 between the anode plate 214 and the substrate w. In this example, the high-resistance structure 222 is composed of a porous ceramic plate 224 made of alumina having a porosity of 30%, an average pore diameter of 100 μm, and a thickness L of 20 mm. The plating solution 210 is contained inside. That is, although the porous ceramic plate 224 itself is an insulator, a plating solution 21 is complicatedly injected into the porous ceramic plate 224 to form a relatively long passage in the thickness direction, and a high-resistance structure 222 can be formed. That is, since the porosity of the porous ceramic plate is high, the porous ceramic plate of the same thickness d is more ordered than the porous ceramic plate of the thickness d. ----- f Please read the notes on the back before filling this page)

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 V. The stomata in the description of invention (53) will form a longer path from 2d to 3d. At the position of the porous ceramic plate 224 opposite to the central hole 214a of the anode plate 214, a plurality of through holes having a diameter of, for example, a twist are formed at a pitch of 5 mm. In addition, the porous ceramic plate 224 may be in close contact with the anode plate 214, or vice versa. By this, the substrate W is disposed downward on the upper part of the electric ore tank 212, and the electric liquid 210 is passed from the bottom of the plating tank 212 through the central hole 21 栳 of the anode plate 214 and the through hole 224a of the porous ceramic plate 224, and then sprayed upward. And the spray of the electroplating solution 210 is brought into contact with the lower surface (plating surface) of the substrate, and a predetermined voltage is applied from the plating power source 226 between the anode plate 214 (anode) and the conductive layer S (cathode) of the substrate ψ to the substrate #The plating film is formed below. At this time, the electric ore liquid 210 overflowing from the electric ore tank 212 is recovered by the electric ore liquid storage section 216. Using the electric mining device of this embodiment, the current density was set to 20 mA / cm2, and the distance B between the upper surface of the anode plate 214 and the lower surface of the substrate was 50 mm. When electrolytic copper plating was performed, a porous ceramic plate 224 was provided. Compared with the previous, the power supply voltage required for electroplating has increased by approximately 2V. This is because the porous ceramic plate 224 is provided with a resistive element having a conductivity lower than that of the plating solution 210. In other words, since the cross-sectional area of the plating tank 212 is about 300 cm2, the resistance of the high-resistance structure 222 becomes approximately 0.333 Ω, In the equivalent circuit shown in FIG. 40, the resistance Rp generated by the high-resistance structure 222 is added as a new resistance. In addition, in Fig. 40, the resistors R1 to R5 show the same resistance as that of the resistors R1 to R5 shown in Fig. 74. 312144 —---- Order --------- (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 B7 V. Description of Invention (54) When the high-resistance structure Rp is generated by the high-resistance structure 222, the ratio of the resistance at the center of the substrate to the resistance at the periphery, that is, (R2 + rp + R3 + R4) / (R2 + Rp + R3 + R4 + R5) is close to 1. The influence of the resistance R5 of the conductive layer becomes negligible, so the in-plane difference in current density caused by the resistance on the surface of the substrate W can be reduced to improve the in-plane uniformity of the electric ore film. The resistance value of the high-resistance structure 222 is, for example, 0.01 Ω or more in the case of a 200 mm wafer, preferably in the range of 0.00 to 2 Ω, more preferably in the range of 0.03 to 1 Ω, and most preferably 0.05. To the range of 0.5. The resistance value of the high-resistance structure 222 is detected by the following steps. First, in the electroplating apparatus, a predetermined value of direct current (I) is passed between the two electrodes formed by the anode plate 214 and the substrate ff separated by a predetermined distance, and plating is performed, and the voltage (VI) of the direct current power source at this time is measured. Following the same electroplating device, a high-resistance structure with a predetermined thickness is arranged between the two electrodes, and direct current (I) of the same value is passed for electroplating, and the voltage (V2) of the direct current power supply at this time is measured. With this, the resistance value of the high-resistance structure can be obtained from Rp = (V2-Vl) / I. At this time, the purity of the copper constituting the anode plate is preferably 99.9% or more. On the other hand, the distance between the anode plate and the substrate formed by the substrate is preferably 5 to 25 mm in the case of a substrate having a diameter of 200 mm, and 15 to 75 mm in the case of a substrate having a diameter of 300 mm. In addition, the resistance R5 of the conductive layer S on the substrate W can be measured by a tester, or the resistance value between the periphery and the center of the substrate can be obtained by calculating the resistivity and thickness of the conductive layer S material. Fig. 41 shows the electroplating device (this embodiment example) provided with a high-resistance structure 222 made of a porous ceramic plate 224 and the electroplating device (a conventional example) without the structure, as described above, and For substrate -------- — — — — — — I ------ Order --------— ^ swi. C Please read the notes on the back before filling this page) Applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 issued) 54 312144 1221862 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (55) Plating on the substrate surface when the boundary surface is plated 臈Film thickness distribution. As can be seen from Fig. 41, in the electroplating apparatus of this embodiment, the thinning of the central portion of the substrate does not occur, and the electroplating can be performed uniformly. On the other hand, the resistivity of the plating solution is about 5.5 Ω · cm, and the cross-sectional area of the plating tank 212 is about 300 cm 2. Therefore, if the distance between the substrate W and the anode plate 214 is to be obtained to obtain the same effect, That is, when a resistance of approximately 0.333 Ω is transmitted to the plating solution 210, it must be separated by approximately 18 cm, which will increase the size of the device. In addition, although this embodiment shows an example in which a high-resistance structure is constituted by a ceramic plate made of alumina, it is understood that the same effect can be obtained by using silicon carbide ceramics of other materials. The porosity, pore diameter, and curvature of the pores can be appropriately selected depending on the purpose. For example, in this embodiment, a 1 mm through-hole is opened in the porous ceramic plate to promote the circulation of the electric mineral liquid, but it is not necessary when the pore size is large. In addition, as long as the gaseous ethylene is bundled into a fibrous shape and welded to each other, a flat plate having a large number of holes penetrating straight in the thickness direction can be obtained. Even if a high-resistance structure is formed with such a flat plate, polyethylene can also be used. Foams such as alcohol or fibers such as Teflon (trade name) are formed into woven or non-woven fabrics to form a resistive structure. Furthermore, the same effect can be obtained by combining this circuit or a conductor and an insulator, or a composite of two conductors. These high-resistance structures can be appropriately pretreated before being assembled in a plating apparatus. It is especially effective for pickling, degreasing, and cleaning with a plating solution or a component in a plating solution. Thickness and shape of high-resistance structure -----— — — — — — in —--- Order ---------. C Please read the notes on the back before filling this page) This paper Standards are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) 55 312144 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 ------- B7______ 5. Description of the invention (56) The subject matter of the invention can of course be changed appropriately. In this embodiment, electrolytic plating is described. However, if the current direction is reversed, the device can be used directly and the polarity of the power supply can be reversed to perform electrolytic etching. In this case, the uniformity of etching can be improved. LSI's steel wiring is electroplated. Conventionally, it is reversed before and after electroplating. Electrolysis is used to perform electrolytic etching. For example, using this device, electroplating is performed at a current density of 20 mA / cm2 for 7.5 seconds to form a 50 nm copper plating film. Then reverse the polarity of the power supply and etch at a current density of 5mA / cm2 for 20 seconds to etch a 33nm steel plating film, and then perform the final plating, which can uniformly etch and indeed improve the embedding characteristics. Fig. 42 shows an electrolytic treatment apparatus applied to electrolytic plating according to still another embodiment of the present invention. This electroplating apparatus adopts a so-called face-up method, and the substrate W is placed on the substrate mounting table 230 in an upward direction, and, for example, a flange-shaped sealing material 234 made of Viton rubber is provided around the substrate W, and the flange is located on the flange. The sealing material 234 is outside and in contact with the conductive layer s of the substrate w so as to introduce the cathode electricity at the contact point 236 of the substrate W. The flange-shaped sealing material 234 has a height of, for example, 10 mm, and can hold the plating solution 21 °. A holder 232 is arranged above the substrate mounting table 230. A porous ceramic plate 242 constituting the anode plate 238 and the high-resistance structure 240 is held and fixed at a predetermined interval from the holder 232. The porous ceramic plate 242 is made of silicon carbide (SiC) with a porosity of 20%, an average pore diameter of 50 mm, and a thickness I of 10 mm in this example, and contains a liquid electrolyte to form a high resistance. Structure 240. The anode plate 238 has a structure completely covered with the holder 232 and the porous ceramic plate 242. In addition, the size of the porous ceramic paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public directors)-* ---- 56 312144 ----------------- 1 丨Order --------- (Please read the notes on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 __ B7 V. Description of Invention (57) The fascia board 242 is best Immerse the bath with other baths (not shown) in which the bath is stored. Between the upper surface of the substrate W and the lower surface of the porous ceramic plate 242, there is provided a first electric ore chamber 244 with a gap Si a of approximately 2ππη, and between the upper surface of the porous ceramic plate 242 and the lower surface of the anode plate 238, There is a second plating chamber 246 having a gap s2 of approximately 1.5 mm, and a plating solution 210 can be introduced into each of the aforementioned plating chambers 244 and 246. The method for introducing the plating solution 210 can be introduced from the gap between the flange-shaped sealing material 234 and the end face of the porous ceramic plate 242, or can be introduced into the back side of the porous ceramic plate 242 (the upper part through a through hole provided in the anode plate 238). ) Pressurized plating solution 21 and other methods. In addition, in this embodiment, the substrate W and the substrate mounting table 230, or the anode plate 238 and the porous ceramic plate 242 may be rotated during electrolytic plating. Using the plating device of this embodiment on the substrate W (plating surface) When the copper plating is performed and the film thickness of the copper plated copper is checked, the in-plane uniformity of the film thickness can be improved by providing the high-resistance structure 240 composed of the porous ceramic plate 242 in the same manner as in the previous embodiment. This embodiment has a structure in which the anode plate 238 is completely covered by the porous ceramic plate 242 and the holder 232, and the electrolytic liquid 210 is filled between the anode plate 238 and the porous ceramic plate 242. By appropriately selecting the porosity, curvature, and pore size of the porous ceramic plate 242, unprecedented new effects can be obtained. The copper ion concentration change in the electroplating solution 210 when the electroplating device of this embodiment is used for 300 seconds (2 // m) of the electroless ore treatment is displayed on page 43. f Please read the precautions on the back before filling in this page ) This paper size applies to China National Standard (CNS) A4 specifications ⑵Q χ Norwegian public issued) 57 312144 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1221862 A7 -------- B7 _ ----- V.发明 说明 (58) Figure. In FIG. 43, area A is data on the plating solution 210 in the plating chamber 244 between the porous ceramic plate 242 and the substrate w, and area b is about the key liquid in the plating chamber 246 between the anode plate 238 and the porous ceramic plate 242. 21〇 data. It is clear from Fig. 43 that in the region a, the copper ion concentration decreases with the progress of electricity. This decrease rate is consistent with the theoretical value of steel ions consumed on the substrate surface by plating. On the other hand, in the region βt, on the contrary, the steel ion concentration will increase, and the increase rate is consistent with the theoretical value of the steel ion generated by the anode plate. From the above, it can be seen that hardly any steel ion exchange occurs between the region A (electric ore chamber 244) and the region B (plating chamber 246) sandwiching the porous ceramic plate 242, and the porous ceramic plate 242 vibrates diaphragmically. . In other words, the reaction caused by the anode side does not affect the substrate side. In addition, special attention must be paid to the anode when electroplating steel. First, in order to capture the monovalent copper ions generated by the anode, a so-called "black film" colloidal black film body must be formed on the surface of the anode. Therefore, phosphorous copper is used as the anode material. This black film body can be called a compound of copper, phosphorus, gas, etc., but it has the function of sending only divalent copper ions into the plating solution and capturing the monovalent copper ions that cause abnormal precipitation on the plating surface. According to the electroplating apparatus of this embodiment, as is clear from Fig. 43, since copper ion exchange does not occur above and below the porous ceramic plate 242, there is no need to worry about the above-mentioned problems. In addition, the anode plate 238 made of copper is sometimes consumed electrolytically with the progress of the power mine, so that its surface is peeled off, but the peeled material can be captured by the porous ceramic plate 242 without being attached to the plating of the substrate w- -i — — — — — — — ^ «1 —-- II f Please read the notes on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 58 312144 1221862 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (59) Surface. Furthermore, instead of a soluble copper anode, a non-soluble anode, such as an anode covered with an oxidized surface on the surface of titanium, may be used. In this case, although a large amount of oxygen is generated on the surface of the anode, the oxygen does not reach the surface of the substrate, so that it is possible to prevent the occurrence of improper conditions such as peeling of a part of the plating film. As described above, it is also possible to obtain a separator effect by introducing a suitable substance into the plating solution as a substance having a small electric conductivity, and arranging the anode and the cathode separately. FIG. 44 shows an electrolytic treatment device applicable to a gold electroplating device according to still another embodiment of the present invention. The electroplating device has a box-shaped plating tank 250 'and one open end of the plating tank 250 is made of, for example, a titanium substrate. The insoluble anode plate 252 coated with iridium oxide is closed, and the open end of the other side is closed by a cover 254 that holds the substrate on the side of the plating tank 250 so that it can be opened and closed freely. In addition, a flange-shaped sealing material 256 which is crimped to the substrate W to prevent the plating solution 210 from flowing out, and a flange-shaped sealing material 256 located outside the flange-shaped sealing material 256 are provided on the side of the cover 254 of the plating tank 250. It is in contact with the conductive layer S of the substrate W to introduce the cathode potential to the contact point 258 of the substrate w. Inside the plating tank 250, there are two diaphragms 260a and 260b, which are provided in advance by a mesh 262a in the plating tank 250. 2 and 2 62b are arranged so as to separate the substrate W and the anode plate 252. As the separators 260a and 260b, for example, a strongly acidic cation exchange membrane such as CMS manufactured by Tokuyama Corporation or n-3 50 manufactured by DuPont Corporation can be used. Thereby, the electricity facing the substrate w is divided and formed inside the electric key groove 250 ------------------- ^ --------- CPlease read the back first Please pay attention to this page, please fill in this page) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) 59 312144 1221862 Printed by A7 of Consumer Cooperatives of Intellectual Property Bureau of Ministry of Economic Affairs ______B7___ V. Description of Invention (60) A chamber 264, an electrolytic solution chamber 266 facing the anode plate 252, and a high-resistance electrolytic solution chamber 268 sandwiched between the separators 260a and 260b. Each of the chambers 264, 266, and 268 is provided with a respective liquid circulation path. Then, a plating solution 270 using, for example, gold potassium cyanide as a basic material is introduced into the plating chamber 264, and an electrolytic solution (plating solution) 272 consisting of a sulfuric acid aqueous solution (80 g / l) is introduced into the electrolytic solution chamber 266. Cycles at 20 liters per minute. The high-resistance electrolytic solution chamber 268 is not limited by the plating treatment, and a high-resistance electrolytic solution 274 having a low electrical conductivity, such as a dilute sulfuric acid aqueous solution (10 g / l), is introduced to form a high-resistance structure. Body 276. As described above, the high-resistance structure 276 composed of the high-resistance electrolytic solution 2 74 such as a dilute sulfuric acid aqueous solution is filled in the high-resistance plating solution chamber 268 divided by the two separators 260a and 26 Ob, and the plating solution 270, Between 272, the plating resistance of the entire device can be increased, and the film thickness distribution of the gold plating film on the substrate surface caused by the resistance of the conductive layer can be greatly reduced. Furthermore, in this example, the resistance value of the electroplating device can be arbitrarily selected by changing the concentration of the dilute sulfuric acid solution, and the power mining conditions can be appropriately changed according to the type of the power mining and the condition of the substrate. In the electric mining device, a substrate 254 is held by a cover 254 and the cover 254 is closed. A plating solution 270 is introduced into the plating chamber 264, and an electrolytic solution (plating solution) 272 is introduced into the electrolyte chamber 266 and circulated. And in a state where the high-resistance electrolytic solution chamber 268 is filled with the high-resistance electrolytic solution 274, a recording current flows from an external power source (not shown) on the anode plate 252 and the conductive layer S on the substrate w, thereby forming an electric current. The oxygen film 278 generated on the surface of the anode plate 252 and the electrolyte (electroplating solution) 272 —are discharged to the outside ^ This paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm)- --------- 60 312144 -------- ^ --------- CPlease read the notes on the back before filling out this page) Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative Printed 1221862 A7 B7 V. Description of the invention (61) In addition, in this embodiment, the same can be obtained by pulling the distance between the anode plate and the substrate very large to increase the resistance of the plating solution itself. Effect, however, this will not only make the device larger, but also must use a large amount of expensive cyano group for gold plating Gold potassium, so the more and more unfavorable on the industry. In the above embodiment, a disc-shaped substrate is used as the substrate to be processed, but it is of course not limited to a disc-shaped substrate, and for example, a rectangular shape may be used. According to the electrolytic processing device of this embodiment, the resistance between the anode and the cathode immersed in the electrolytic solution through the high-resistance structure can be made higher than when the electrolytic solution is composed only of the electrolytic solution, so as to reduce the resistance on the surface of the substrate to be processed. The resulting in-plane difference in current density can further improve the in-plane uniformity of the substrate to be processed during electrolytic processing. [Embodiment using an insulating member as the electric field state control mechanism] Fig. 45 is a schematic configuration diagram of an electrolytic power mining device according to still another embodiment of the present invention. The electrolytic plating apparatus shown in FIG. 45 is an electrolytic plating apparatus using a so-called face-up method, and the substrate ^ is placed on the substrate mounting table 330 in an upward direction. The periphery of the substrate W is in a closed state by abutting on the front end of a ring-shaped flange-shaped sealing material 334, and the inside thereof is filled with a plating solution 31 °. On the outside of the flange-shaped sealing material 334 on the surface side of the substrate W, there is provided a contact layer 336 which contacts the surface of the substrate w to apply a cathode potential. Above the substrate w, a disc-shaped high-resistance structure 340 and a disc-shaped anode plate 338 are held by a holding member 332 with a predetermined gap therebetween. Here, the anode plate 338 is provided with a plurality of fine holes 339 penetrating in the thickness direction, and the anode plate 338 is provided with a plating solution for distributing and supplying the aforementioned fine holes ------------ ---- ^ --------- CPlease read the notes on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) 61 312144 1221862 A7 ----— _B7____ 5. The plating solution introduction pipe 341 of the invention description (62) 339. The high-resistance structure 340 includes a plating solution 310 inside a porous ceramic plate (e.g., made of SiC with a porosity of 20%, an average pore diameter of 50 μm, and a thickness of 10 mm) 342 in this embodiment. The anode plate 338 is completely covered by the holding member 332 and the porous ceramic plate 342. In this embodiment, a band-shaped insulating member 350 is wound around the outer peripheral side surface of a porous ceramic plate (porous substance) 342 to surround it. The insulating member 350 may be made of a stretchable material such as fluorinated rubber. Furthermore, the electroplating solution introduction tube 341 passes through the pores 339 of the anode plate 338, and then the plating solution 31o supplied to the porous ceramic plate 34o is impregnated into the porous ceramic plate 342 and discharged from the lower surface. Thereby, the inside of the porous ceramic plate 342 and the space between the substrate ff and the porous ceramic plate 342 can be filled with the plating solution 310. The plating solution 31 may be introduced from the gap between the flange-shaped sealing material 334 and the end surface of the porous ceramic plate 342. In this case, the plating solution introduction pipe 341 and the pores 339 of the anode plate 338 are unnecessary. In this state, the anode plate 338 and the substrate? When a predetermined current is applied and a DC current is passed, the power ore (such as copper plating) will gradually be applied to the entire conductive layer surface of the substrate. According to this embodiment, 'the porous ceramic plate 342 exists between the anode plate 338 and the substrate w, so it is not easy to be affected by the difference between the boundary surface of the substrate and the distance from the contact point 336 as described above. The effect of the difference can be used to perform a substantially uniform power ore (such as steel electricity) on the entire conductive layer surface of the substrate w. However, near the contact point 336, there is a current density near the periphery, such as ι ____ Zhou Shao, but the current density is applicable to the national standard (CNS) A4 standard of this paper ⑵ 〇 297 publish y ο χ 312 144 862 22

V. Description of the invention (63) The tendency is changed to make the thickness of the ore film thicker than other parts. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Therefore, this embodiment is formed by winding an insulating member 350 around the outer peripheral surface of the porous ceramic plate 342, thereby preventing the current from being concentrated near the outer periphery of the substrate W as shown by a dotted line in FIG. And reduce the current density to be substantially equal to the current density towards the other parts of the substrate W. Fig. 46 is a graph showing the measurement results of the thickness of a steel plating film near the outer peripheral portion of the substrate w when the substrate w is subjected to copper plating using the method described above. As shown in Fig. 46, it can be seen that changing the width L of the insulating member 35 (see Fig. 45) 'changes the thickness of the copper plating film near the outer peripheral portion of the substrate ff. That is, the longer the width L, the lower the current density near the substrate peripheral portion, and the thinner the plating film thickness. Therefore, by using the insulating member 350 having a desired width L (e.g., L = 4min), the thickness of the plating film near the outer peripheral portion of the substrate W can be made the same as that of the other portions. As described above, although the insulating member 35 can adjust the shielding area of the outer peripheral surface of the porous ceramic plate 342 by the length of the width L, the insulating member 350 can adjust the shielding area not only from the width L, but also from the shielding itself. Make holes to adjust the masking area. In addition, the present invention is not only used in the case where the thickness of the electroless film in the vicinity of the outer peripheral portion of the substrate W is adjusted to the same plating film thickness as the other portions. For example, when the thickness of the plating film near the outer peripheral portion of the substrate W is adjusted to be thicker than the other portions, the width L of the insulating member 350 may be reduced, and the width L may be increased otherwise. In other words, according to this embodiment, it is possible to freely control the thickness of the plating film near the outer periphery of the substrate to a desired thickness. Fig. 47 is a drawing showing still another embodiment of the present invention. In this embodiment, the difference from the embodiment shown in Figure 45 above is more than 11 -------- ^ ---------. CPlease read the precautions on the back first (Fill in this page again.) This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 63 312144 1221862 A7 B7 V. Description of the invention (64) A movable cylindrical insulating member is set on the outer periphery of the hole ceramic plate 342 35〇a to replace the band-shaped insulating member 350. The insulating member 350a is provided at the lower end of the insulating member holder 351. The insulating member holder 351 is composed of an unillustrated up-and-down movement driving mechanism and is capable of freely moving up and down. In the above configuration, 'the position of the outer surface of the outer surface of the porous ceramic plate 342 can be arbitrarily controlled by moving the position of the insulating member 350a up and down and changing the relative position with the porous ceramic plate 342'. The current density is the same as the embodiment shown in FIG. 45, and the thickness of the plating film near the outer peripheral portion of the substrate w can be arbitrarily adjusted. Fig. 48 is a drawing showing still another embodiment of the present invention. In this embodiment, the point of difference from the embodiment shown in FIG. 45 is that the outer side surface of the multi-ceramic plate 3 4 2 is coated or impregnated with an insulating material 5 and an insulating member 350b is provided instead of a strip. Insulating member 350. For example, an insulating member 350b is impregnated with an insulating material such as glass, resin, or silicon impregnated on the outer peripheral surface of the porous ceramic plate 342. In this case, the substrate can be controlled arbitrarily by adjusting the penetration width and penetration depth distribution? The electric power around the outer peripheral portion can be adjusted arbitrarily to the thickness of the electric power in the vicinity of the outer peripheral portion fM, as in the embodiment shown in FIG. 45. It is also possible to control the current density by oxidizing a part of the soil material (for example, SiC). [Embodiment of using a sealing member] Staff consumption Porosity: The second figure is a schematic diagram of a part of the electrolytic plating device having the same structure as that shown in Figure 45: = around the part. However, in the + 35th insulating member 35G, which is not shown in the figure, the holding member 332 and the porous ceramic plate should not be included in the paper size 剌 312144.

I 1221862 A7 V. The description of the invention (65) The gap between the two is in an unsealed state, so as shown in the retaining member 332 and the porous ceramic plate 342 =, the electric mineral fluid will pass through the gap portion between 42 and from The anode plate 338 flows out, so that a current is prepared, and a circuit is formed. Since the current path does not pass through the inner ceramic plate 342, the resistance value is low, so that the current density may be increased, so that there is no control of the thickness of the nearby electric power to be thin. 'The outer plate of the soil plate W is actually due to: * As shown in Fig. 50A, a sealing member _ is provided between the porous ceramic 2 plate 342 and the holding member 332 to prevent leakage from this portion' It is possible to control the thickness of the electric slag film near the outer periphery of the substrate w to form a thin state. The word: Bu and :: The sealing member 36 ° in the application form is formed with a cross-section of one letter / shape, and is made of an insulator. Therefore, it also has the function of an insulating member shown in FIG. 45. In addition, as shown in the cross-sectional view of the sealing member, the annular sealing member portion 36〇a that seals the portion of the holding member 332 that is in contact with the bottom of the porous ceramic plate, and the figure 45 can be issued. The illustrated band-shaped insulating member 350 has the same function as the insulating member portion 360b, and is configured by separately installing different components. Of course, the sealing member 360 can also be applied to the second member shown in FIG. 45, that is, the sealing member that will prevent the plating solution from leaking between the outer peripheral side of the high-resistance structure 340 and the holding member 332. The electric field control device system can perform field control. Phantom tail ------------ ΛΨ γ Please read the notes on the back before filling out this page) —Order ---------. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs [An embodiment in which a portion having a high-resistance structure is provided in a portion where the current density between the anode and the substrate is to be increased] ^

This standard is applicable to Chinese standard 270x297.) 312144 1221862 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (66) Figure 51 is a schematic diagram of the electrolytic plating device in another embodiment. FIG. 51 is different from the embodiment shown in FIG. 45. The insulating member 35 is not installed on the outer periphery of the high-resistance structure 340, but the shape of the high-resistance structure 340 itself is changed to control the thickness of the plating film. . Figures 52A to 52D are top views of a high-resistance structure 340 used in the electrolytic plating apparatus shown in Figure 51. That is, the resistive structure 340 of this embodiment is, for example, a porous ceramic plate 342, and the outer peripheral shape of the porous ceramic plate 342 is formed into a polygon as shown in FIG. 52A, and at predetermined intervals as shown in FIG. 52B. Set the slit 365 to form a waveform (or gear shape) as shown in Figure 52c. In contrast, the anode plate 338 and the substrate w are formed in a circle as shown by a chain of dots. Therefore, near the periphery of the substrate w, there will be no porous ceramic plate 342 in the middle and only the plating solution 31 will be present. Compared with the portion where the porous ceramic plate is present in the middle, the resistance between the anode plate 338 and the substrate flf will be reduced, and the current density at the peripheral portion of the substrate will be higher. Therefore, in these embodiments, it is possible to use a case where the thickness of the plating film near the center of the substrate ff is to be thick and the thickness of the plating film near the center is thick. When it is desired to control the thickness of the plating film of the substrate ff, such as the central portion of the substrate, other than the peripheral portion of the substrate w, as shown in the figure, holes 366 are provided inside the hole plate 342 for the anode plate and the substrate. It is sufficient to provide a portion where the porous ceramic plate 342 does not exist. In addition, in the electrolytic electroplating device shown in FIG. 51, W can be rotated to perform uniform film thickness on the entire surface of the substrate W " w. ^ € 蠼 However, the rotation of the substrate can be rotated at the same time as the substrate is rotated. Keep the components moving. G's scale is applicable to China _ quasi (CNS) A4: ⑽χ Norwegian public hair) W 312144 ------------------- Order --------- ( Please read the precautions on the back before filling this page) 1221862 Α7 Β7 V. Description of the invention (67) The so-called rotating substrate W and / or holding member 332 is not limited to the embodiment shown in FIG. 51. [Implementation mode in which the thickness of the high-resistance structure has a distribution state as an electric field state control method] Fig. 53 is a schematic configuration diagram of an electrolytic plating apparatus according to still another embodiment of the present invention. Ρ The electrolytic plating shown in Fig. 53 The thickness of the high-resistance structure 340 in the device has a second-order distribution state, and the current density on the surface of the substrate W is controlled to form a desired distribution state, thereby controlling the thickness of the plating film. That is, in this embodiment, the high-resistance structure 340 is, for example, a porous ceramic plate 342, and the porous ceramic plate 342 is formed in a circular shape, and the thickness of the central portion is smaller than the thickness of the peripheral portion. With the above configuration, the resistance value between the% electrode plate 338 and the substrate W in the center portion can be reduced to a value lower than that in the peripheral portion. Therefore, as described above, the thickness of the plating film that is thinner toward the center can be controlled. Be uniform. Fig. 54 is a diagram showing a comparison result of measured values of electroplated film thicknesses when a porous ceramic plate 342 having a uniform thickness and a distribution state shown in Fig. 53 is used for plating on the substrate W. Figs. It can be seen from FIG. 54 that the use of the porous ceramic plate 342 shown in FIG. 53 makes it possible to uniformize the plating film thickness on the substrate. Further, as shown in Fig. 55, the same effect can be obtained even if the porous ceramic plate 342 shown in the 53rd circle is provided with an opposite structure. Similarly, as shown in FIG. 56, the thickness of the center of the porous ceramic plate 342 can be made thicker than the thickness of the peripheral portion, thereby making the plating film thickness at the peripheral portion thicker than the center portion, and as As shown in figure 57, the Chinese National Standard (CNS) A4 specification (210 x 297 public love) can also be applied to the porous ceramic plate ^ sheet scale. ------------ 9 C Please read the note on the back first (Please fill in this page for matters) Order --------- 0. Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs

1221862 V. Description of the invention (68) 342 is provided with a through hole 367, so that the plating film thickness of the portion provided with the through hole 367 is thicker than other portions. In addition, as shown in FIG. 58, the thickness of the peripheral portion can be reduced to reduce the resistance to be lower than other portions, so that the outer corner portion of the porous ceramic plate 342 can be formed into an oblique angle shape, thereby making the outer periphery of the substrate ff. The nearby plating film is thicker than the other parts. The most important thing is that the thickness of the high-resistance structure 340 (including the thickness = 0) is distributed to control the thickness of the electroplated film of each part to a desired thickness. [An embodiment in which the pore structure of the Yuxi pore material has a distributed state as a method for controlling an electric field state] Fig. 59 is a schematic configuration diagram of an electrolytic power mining device according to still another embodiment of the present invention. In the electrolytic plating apparatus shown in Fig. 59, a porous substance (for example, porous ceramic) 342a having a pore structure having a two-dimensional distribution state or a three-dimensional distribution state is used as the high-resistance structure body 34. The amount and holding state of the electric mineral liquid held in the porous substance 342a are different depending on the pore diameter, number, and arrangement state of the pores, so the resistance value is different. Therefore, in this embodiment, the stomata structure C1 near the center is different from the stomata structure C2 near the outer periphery, and the stomata structure ci near the center has a low resistance. With the above configuration, the current density near the center can be increased, and the plating of the portion can be easily formed. Of course, conversely, the pore structure C2 near the outer periphery can be formed with low resistance, and the thickness of the plating film near the outer periphery can be increased. In addition, more than three kinds of pore structures can be used for more complicated plating film thickness control. The method of having a distribution state in the stomata structure is as shown in Fig. 59. The method of having a distribution state in the forming of the porous material 342a as shown in Figure 59, and I ------------------ ^ «— — — — — 1 — C Please read the notes on the back before filling out this page) Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is printed in accordance with China National Standard (CNS) A4 (210 X 297 mm) ) 68 312144 1221862 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (69 As shown in Figure 60A and Figure 60B, the different parts Cl and C2 of the pore structure in the porous substance 342a are formed respectively, and then borrowed The method of integration by assembly. The elements of the stomata structure include the pore diameter (to change the diameter in the range of, for example, 50 to 400), the continuous porosity (the degree of connection between two bubbles ... the resistance value of the connector is small), Bending rate (the degree of bending in the thickness direction of the connected pores ... the smaller the resistance, the smaller the resistance value), etc. The method of making the pore structure different can also make the material itself different (such as resin-based materials and ceramic-based materials, etc.) ) The method for controlling the porosity distribution of the porous substance 342a also includes sealing the surface or at least a part of the porous substance 342a (here, porous ceramics) (using a resin and a silanol-based coating-type insulating film, and A method for Si (partial oxidation) of a part of a substrate. In addition, there is also a method of changing a pore distribution in the surface by opening a part of the sealing portion after performing sealing treatment on the entire surface. The porous material 342a The materials also include anisotropic structure materials as shown in Figure 61A and 61B. They are directional porous structure materials shown in Figure 6U and fibrous porous structure materials shown in Figure 61β. The materials that make up these anisotropic structural materials include resins and ceramics. The pores of these anisotropic structural materials are connected in a specific direction to make it easy for the current to flow in a specific direction (the current does not easily flow in other directions). Improve the controllability of current density. And use this anisotropic structure material to make the pore structure C1 near the center of the porous substance 342a and the pore structure near the periphery. Different from C2, the current density applied to the surface of the substrate ff can be formed into a desired distribution state. 312144 -------- Order --------- ^ _ wwi < Please read the precautions on the back first Fill out this page again) 1221862 A7 V. Description of the invention (70) The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, but is a technology that can be described in the scope of patent applications, specifications and drawings. Various modifications can be made within the scope of sexual thinking. In addition, even if it is any shape and material not directly described in the description and drawings, as long as the function and effect of the application of the present invention can be exerted, it is within the scope of the technical idea of the present application. Inside. For example, the above embodiment shows an example in which the present invention is applied to an electrolytic plating apparatus of a so-called face-up method, but it can also be applied to an electrolytic power ore apparatus of a so-called face-down method shown in FIG. 62. That is, the electrolytic power mining device is configured and provided with a cup-shaped power ore tank 312 for holding the power ore liquid 31 °, and a circular plate-shaped anode plate 314 ′ is provided at the bottom of the electroplating tank 312. A circular plate-shaped high-resistance structure 324 is provided on the anode plate 314, and a plating solution storage portion 316 for recovering the plating solution 310 overflowing from the upper part of the electron microscope tank is arranged around the plating tank 312, and then disposed on the upper part of the electric money tank 312 The substrate w is placed above the flange-shaped sealing material 318 so that the contacts 32 are in contact with the outer periphery of the lower surface of the substrate W. In addition, if the plating solution is circulated through the through hole 314a provided in the center of the anode plate 314 and the small hole 324a provided in the center of the high-resistance structure 340, a voltage may be applied between the anode plate 314 and the substrate to flow a current. A plating layer is formed under the substrate W. Furthermore, as in the foregoing embodiments, by providing an insulating member on the outer periphery of the high-resistance structure, or changing the thickness, or changing the pore structure, the plating film thickness formed on the substrate W can be formed into a desired distribution state. As shown in FIG. 63, the present invention can also be applied to closed electrolytic plating. The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 312144 ------------ ---------------- (Please read the precautions on the back before filling this page) 1221862 Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------------ B7___ V. Description of the Invention (71) ^ Device. That is, the electrolytic plating device has a box-shaped plating bath 35, and one open end of the plating bath 350 is closed by the anode plate 352, and the other open end is closed by a cover 354 that holds the substrate tf on the plating bath 350 side. And # can be opened and closed freely. Between the substrate W and the anode plate 352, a high-resistance electrolyte chamber 368 sandwiched by two separators 360a and 360b held by two meshes 362a and 362b is provided as a high-resistance structure 376. ^ If the plating solution 370 is introduced into the plating chamber 364, the electrolytic solution (electrical liquid) is introduced into the electrolytic solution chamber 366, and the circulation is performed, and a voltage is applied between the anode plate 352 and the substrate W to flow a current. A plating layer is gradually formed on the substrate w. In addition, as in the foregoing embodiments, an insulating member is provided on the surface of the high-resistance structure 376, or the surface of the mesh 362a, 362b is processed, and the shape of the thickness and the like of the electric resistance electrolyte chamber 368 can be formed on The plating film thickness on the substrate w is formed in a desired distribution state. In addition, the types of membranes 360a and 360b generally use strongly acidic cation exchange membranes, such as CMS manufactured by Tokuyama Corporation and n-350 manufactured by DuPont. However, the selectivity of cations can also be changed, and anion exchange membranes and non-ion exchange membranes can be used. . The electrolyte in the high-resistance electrolytic solution chamber 368 is generally (50 to 200 g / l) H2SO4 ', but of course, any concentration can be selected, and the electrolyte is not limited to sulfuric acid. Of course, the present invention can also be applied to other electroplating devices of various structures (including any method of face-up and face-down). In addition, the above embodiments show examples in which the present invention is applied to an electrolytic plating device, but it can also be applied to -------- ^ --------- f Read the precautions on the back before reading (Fill in this page) National paper standard (CNS) A4 specifications (210 X 297 public 7 7 312 144 1221862 printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives printed A7 B7 _ 5. Description of the invention as a substrate Electrolytic etching device for anode. In addition, each of the above embodiments shows that a circular substrate is used as the substrate to be processed, and all electric field cutting tools are concentric circles. However, the substrate to be processed may be various other than circular. Shape, and the electric field distribution can be non-concentric circular distribution according to the needs. For example, the substrate to be processed can also use a plate-like substrate (including shapes other than circular) such as LCD, and the cathode contact 336 can also be non-circular. Shape and contact the substrate to be processed from a certain direction. In addition, the cathode contact point 336 may also contact a position other than the outer periphery of the substrate to be processed. As described above, the state of the electric field on the surface of the member to be processed is actively controlled to a desired state. [Processing state in which the processing state caused by the electrolytic treatment of the member to be treated is distributed in the target surface.] [The embodiment of inserting the pipe body 445 into the electrolyte introduction hole (electrolytic solution introduction hole) 439 of the anode plate (electrode) 438] [64] FIG. 64 is a schematic configuration diagram of an electrolytic power smelting device according to another embodiment of the present invention. That is, the electrolytic plating device is an electrolytic plating device using a so-called face-up method, in which the substrate W is placed on the substrate. On the setting table 430, a ring-shaped flange-shaped sealing material 434 is formed on the periphery of the surface of the substrate W in contact with the front end of the flange-shaped sealing material 434. The flange-shaped sealing material 434 is provided outside the surface of the substrate W There is a conductive layer in contact with the surface of the substrate W to apply cathode electricity to a contact 436 on the substrate W. Above the substrate W, a disc-shaped porous body 440 and a disc-shaped anode plate 438 are held and arranged on a holding member at predetermined intervals. 432. Here, the anode plate 438 is provided with a plurality of plating solution through holes 439 penetrating in the thickness direction, and the anode plate 438 is provided with a plating solution introduction pipe 441 for distributing and supplying the plating solution. I— I — — — — — — II — — — — — — — Please read the notes on the reverse side before filling out this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 72 312144 1221862 A7 --- ^ ---- 5. Description of the invention (73) On the other hand, the porous body 440 is composed of a porous ceramic material or a porous tree material. The constitution of this example is, for example, a porosity of 20%. SiC with an average pore size of 50 // m (Of course, it can also be composed of various other materials, but it is better to have a pore size of 20 to 300 // m and a porosity of 10 to 95%). It is maintained, and although it is electrically conductive, it has a smaller electrical conductivity than the plating solution 410. The anode plate .438 is completely covered by the holding member 432 and the porous body 440. In this embodiment, a plating body 445 is provided on the plating solution introduction pipe 441 itself, and the pipe body 445 is inserted into the plating solution through hole 439 of the anode plate 438 so that the tip thereof abuts the porous body 440. surface. That is, in this embodiment, the plating solution 410 can be prevented from contacting the anode plate 438 at all, and the surface of the porous body 440 can be supplied. The plating solution introduction pipe 441 and the pipe body 445 are integrally formed of a synthetic resin made of a material that is not affected by the plating solution. In addition, the plating solution directly supplied to the surface of the porous body 440 from the plating solution introduction pipe 441 through the pipe body 445 diffuses only within the porous body 44 and reaches the surface of the substrate W, and a plurality is formed between the substrate w and the surface of the porous body 440 A plurality of circular liquid columns R, and a plurality of liquid columns r will be combined with each other on the substrate W to gradually fill the substrate W with a plating solution. And even if this electroplating process is repeated, the inner diameter of the front end of the tube 445 will not expand with time, so the ideal liquid column R will not be destroyed with time 'so it will not be caused by the confusion of the combination of the liquid column R Air is entrapped, and bubbles do not accumulate between the porous body 44 and the substrate W, which does not cause uneven plating film thickness. ------------ f ί Please read the precautions on the back before filling out this page) —Order --------- Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 73 312144 1221862

Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (74) Figure 65 is a schematic configuration diagram of an electrolytic plating device according to yet another embodiment of the present invention. The difference between this electrolytic plating device and the embodiment shown in FIG. 64 is that instead of forming a tube 445 integral with the plating solution introduction tube 441, it is inserted into the plating solution through hole 439 of the anode plate 438 Another tube body 447 is produced. At this time, the tube body 447 is also made of a material that is not affected by the plating solution, and its front end (lower end) is in contact with the porous body 440. When configured as described above, the plating solution does not directly contact the anode plate 438 in the same manner as in the zero embodiment shown in FIG. 64. Although the plating process is repeatedly performed, the inner diameter of the front end of the tube body 447 does not expand over time. Therefore, the liquid column R supplied from the porous body 440 is not destroyed as time elapses, and can be kept in an ideal state without air entrainment. [Embodiment in which electrolyte passage portion is provided in porous body 440] Fig. 66 is a schematic configuration diagram of an electrolytic plating apparatus according to another embodiment of the present invention. This electrolytic plating apparatus is not provided with the electrolyzed liquid introduction pipe 441 shown in Fig. 64, and the anode plate 438 and the porous body 440 are held by the holding member 432 (440a, 440b). A liquid storage portion 450 is provided between the anode plate 438 and the porous body 440. That is, the anode plate 438 is not provided with a plurality of fine plating solution vias 439 as shown in Fig. 64, and a thick plating solution supply portion 455 is provided at the center thereof. On the other hand, the porous body 440 is formed by overlapping two members (the upper porous body 440a and the lower porous body 440b). Further, the upper porous body 44Ga is provided with a plurality of fine electrolyte passage portions 457 which pass to the upper and lower surfaces. The electrolyte passage part 457 forms a pore structure with a low density (high porosity) --------- I — · 1111 丨 I c Please read the precautions on the back before filling this page) This paper size Applicable to China National Standard (CNS) A4 specification (210 X 297 public love) 74 312144 1221862

V. Description of the invention (75) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. It constitutes the part of the electrolyte passage part 457, and the other parts are constructed with a dense pore structure. In addition, the lower porous body 44ob has a low-density pore structure as a whole. As described above, when the plating solution is supplied from the plating solution supply section 455 of the anode plate 438, the plating solution 410 is first filled in the liquid storage section 45, and then mainly reaches the lower porous body 440b through the low-resistance electrolyte passage section 457. The surface 'then diffuses inside the lower porous body 44b and reaches the surface of the substrate W', and a plurality of circular liquid columns R are formed between the substrate w and the surface of the lower porous body 440b, and the plurality of liquid columns r will be combined with each other to The substrate w is combined with the air, and the substrate W is filled with a plating solution. Moreover, even if this plating process is repeated, the inner diameter of the front end of the electrolyte passage portion 457 does not expand with time, so the ideal liquid column R will not be destroyed with time, so no liquid column r will occur. The confusion of the combination leads to the situation that air is entrained, and bubbles do not accumulate between the lower porous body 44 Ob and the substrate W, which does not cause uneven thickness of the electric deposit film. Fig. 67 is a schematic configuration diagram of an electrolytic power mining device according to another embodiment of the present invention. This electrolytic plating apparatus differs from the embodiment shown in Fig. 66 only in the structure of the porous body 440. That is, the porous body 440 is provided with an electrolyte passage portion 459 including pores inside the porous body 440. The electrolyte passage portion 459 is formed by branching a plurality of main passages 461 provided in the center of the upper surface of the porous body 440 into a plurality of passages. The front end of each electrolyte passage portion 459 ends inside the porous body 440. In addition, when the plating solution is supplied from the plating solution supply section 455 of the anode plate 438, the plating solution 410 is first filled in the liquid storage section 450, and then from ------------------ ---------- (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 75 312144 1221862 Intellectual Property Bureau of the Ministry of Economic Affairs Printed by employee consumer cooperative A7 _B7__ V. Description of the invention (76) The main passage 461 of the hole body 440 is introduced into each electrolyte passage portion 459, and then diffuses from the lower end inside the porous body 440 and reaches the surface of the substrate W, and the substrate w and the porous surface A plurality of circular liquid columns r are formed between the surfaces of the body 440, and the plurality of liquid columns R are combined with each other, and are combined on the substrate W and gradually fill the substrate with a plating solution. In addition, even if the plating process is repeatedly performed, the inner diameter of the front end of the electrolyte passage portion 459 does not expand due to the passage of time. Therefore, the ideal liquid column R is not gradually destroyed due to the passage of time. The confusion of the combination of R causes air to be entangled, and bubbles do not accumulate between the porous body 440 and the substrate W, so that the plating film thickness is uneven. In addition, by adjusting the position of the front end (bottom surface) of the electrolyte passage portion 459, the distance from the front end of the electrolyte passage portion 459 to the bottom of the porous body 440 can be shortened, thereby reducing the resistance when the plating solution passes through the porous body 440. When a thicker porous body 44 or a denser porous body 440 is used, the resistance of the plating solution through the porous body 440 when the liquid diffuses can also be reduced, and as a result, it will flow out from the predetermined position of the porous body 44. The right amount of money. Therefore, from this point of view, there is no case where air is entangled due to the confusion of the liquid column R, and bubbles do not accumulate between the porous body 440 and the substrate w, so that the thickness of the plating film is not uniform. Furthermore, it is not easy to form an electrolyte passage portion 459 made of pores in the porous body 440. Therefore, it is also possible to make one divided into three parts above and below the line a and B shown in FIG. And the integration constitutes a porous body 440 丨 丨-丨 丨 丨 丨 丨 丨 I 丨 丨 --Order-! 丨!丨 —- ϋPlease read the precautions on the back before filling in this page) [In the plating solution introduction hole (electrolyte introduction hole) 439 of the anode plate 438

1221862 Printed A7 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A ------- B7 V. Description of the invention (77) Implementation of inserting the tube body and providing the electrolyte passage part in the porous body 44 °] 68th FIG. Is a schematic configuration diagram of an electrolytic plating apparatus according to another embodiment of the present invention. This electrolytic plating device is the same as the embodiment shown in FIG. 64. A plating solution introduction pipe 441 made of synthetic resin (made of a material that cannot be penetrated by the plating solution) is provided with a pipe body 445 connected to the plating solution. The electroplating solution through hole 439 of the plate 438 is inserted into the tube body 445 so that the front end thereof abuts the surface of the porous body 440, and at the same time, an electrolysis composed of non-penetrating elongated holes is provided at the portion of the porous body 44 abutting the tube body 445液槽 部 459。 Liquid passage portion 459. Furthermore, the plating solution supplied directly from the plating solution introduction pipe 441 to the electrolytic solution passage portion 459 of the porous body 440 through the pipe body 445 diffuses slowly from the bottom surface of the electrolytic solution passage portion 459 and penetrates into the porous body 44. Reaching the surface of the substrate W, a plurality of circular liquid columns R are formed between the substrate W and the surface of the porous body 440, and the plurality of liquid columns R are combined with each other on the substrate w, and the air is pushed out from the substrate W to fill the electricity. Mineral fluid. In addition, even if the plating process is repeatedly performed, the inner diameter of the front end of the tube 445 and the inner diameter of the bottom surface of the electrolyte passage portion 459 will not expand due to the passage of time, so the ideal liquid column R will not be damaged by the passage of time. Therefore, there is no case where air is entangled due to the disorder of the combination of the liquid column R, and bubbles do not accumulate between the porous body 440 and the substrate w, and uneven plating film thickness is not caused. At the same time, the passage resistance of the plating solution through the porous body 440 is reduced only by the length of the electrolyte passage portion 459. Therefore, even if a thick porous body 440 or a porous paper with a high density (low porosity) is used, Dimensions are applicable to China National Standard (CNS) A4 (210 X 297 mm) ^ ------ 77 312144 -III I ----- I — — — — — — — II ^ · — I --- -ί Please read the precautions on the back before filling this page) 1221862 V. Description of the invention (π ί Please read the precautions on the back before filling this page) 440, when the liquid is diffused, you can also make the appropriate amount of plating solution from porous The pre-position of the body 44 is discharged, and from this point of view, the air is not caused by the confusion of the combination of the liquid column {^, and the air bubbles do not accumulate between the porous body 440 and the substrate ff. , Will not cause uneven plating film thickness. Fig. 69 is a schematic configuration diagram of an electrolytic plating apparatus according to another embodiment of the present invention. This electrolytic plating apparatus is different from the embodiment shown in FIG. 68 in that the plating solution introduction pipe 441 is not provided with a pipe body 445 integrally formed with it, but the plating solution through-holes 439 and A separately prepared pipe body 447 is inserted into the electrolytic solution passage portion 459 of the porous body 440. In this case, it is also made of a material that does not cause the pipe body 447 to be affected by the plating solution. When printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as described above, it can also be the same as the embodiment shown in Figure 68. Even if the plating process is repeated, the inner diameter of the front end of the tube 447 will not expand due to the passage of time. Therefore, the ideal liquid column R will not be destroyed by the passage of time, so the air will not be entangled due to the chaos of the combination of the liquid column r, and the air bubbles will not accumulate between the porous body 440 and the substrate W. It will cause uneven plating thickness. At the same time, the tube body 447 is inserted into the porous body 440, so the resistance of the plating solution when passing through the porous body 440 will be reduced. Even if a thicker porous body 440 or a higher density (low porosity) porous body 440 is used, it can be made porous. An appropriate amount of liquid electrolyte is supplied at a predetermined position of the body 440, so that air is not caused by the chaos of the combination of the liquid column R, and bubbles do not accumulate between the porous body 440 and the substrate W, which does not cause The plating film thickness is uneven. [In accordance with the position of the porous body 440, the electroplating solution passes through the porous body 440. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 78 312144 1221862 A7 V. Description of the invention (79) Different over resistance [Embodiment] Fig. 70 is a schematic configuration diagram of an electrolytic plating apparatus according to another embodiment of the present invention. This electrolytic plating device is the same as the embodiment shown in FIG. 64. The electroplating solution introduction pipe 441 made of synthetic resin is provided with a pipe body 445 communicating with it. However, unlike FIG. 64, this device uses an anode. The plate 438 side protrudes from the center of the joint surface between the anode plate 438 and the porous body 44 and forms a concave shape on the porous body 440 side. With the above configuration, the plating solution supplied from the pipe body 445 near the center is supplied from below the porous body 440 with a small amount of resistance, so the supply amount is larger than that of the other parts. In other words, when the desired plating solution cannot flow out due to the different installation locations, the plating solution of the porous body 440 in the portion is reduced through the resistance, so that the desired plating solution can flow out of the portion (the appropriate amount of plating solution) There are also cases depending on the position of the porous body 440), thereby preventing the disorder of the combination of the liquid column R to prevent air from being entangled, and air bubbles will not be accumulated between the porous body 44 and the substrate W, which can prevent The plating film thickness is uneven. Such adjustments can be performed even if the bottoms of the electrolytic solution passage portions 459 shown in Figs. 68 and 69 are located in the electrolyte passage portion 459, respectively. That is, the passage of the electric key liquid through the porous body 44 is different depending on the location, and the supply amount of the electric shovel liquid supplied from each part of the porous body 44 may be changed, and the most appropriate liquid diffusion of the plating solution may be selected. . In addition, each of the above embodiments shows examples of application to an electrolytic key device. It can also be applied to a customized electrolytic etching device using a substrate as an anode. The details are as described above. The electrolyte is supplied to the electrolyte impregnated material. Paper f degree ^ Chinese National Standard (CNS) A4 specification (210 X 297 public love)

Iy 312144 -------- Order --------- (Please read the precautions on the back before filling out this page) 1221862 A7 _B7 5. In the description of the invention (8G), and immerse it from the electrolyte The electrolytic solution is supplied on the opposite side of the broken material, and even if the electrolytic processing device 'bubble is filled between the electrolytic solution impregnated material and the substrate to be processed, air bubbles will not be caught and accumulated between the electrolytic impregnated material and the substrate '' The ideal liquid diffusion can be performed, so it has the excellent effect of obtaining the desired electrolytic treatment. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 80 312144

Claims (1)

1221862 Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs The plating position of the H3 part and the pre-treatment and cleaning positions between the two are freely raised and lowered. 6. A method for plating a substrate, which is characterized by sealing the peripheral edge of the plated surface of the substrate facing upward and communicating with the cathode V in a water-tight state, and placing the anode close to the plated surface, and then plating The liquid is injected into the space sealed between the electroplated surface and the anode in a watertight state. 7. The method for electroplating a substrate according to item 6 of the scope of patent application, wherein after electroforging is performed, the residual liquid of the electric ore is recovered through the electroplating solution recovery nozzle. 8. If the method of electroplating a substrate according to item 6 of the patent application scope, in which the pre-coating / recovering arm is moved to a position opposed to the substrate while performing an electric key, and a pre-coating liquid is supplied from the pre-coating nozzle to perform pre-coating.涂 处理。 Coating treatment. 9. The method for electroplating a substrate according to item 6 of the patent application, wherein an electroplating solution made of a water-retaining material is impregnated in the space between the surface to be plated and the anode, and the member contains a plating solution. 1 0. A substrate plating device characterized in that the substrate is held by a substrate holding portion and has an anode disposed above a plated surface of the substrate and a cathode in contact with the substrate to energize the substrate. A plating solution-impregnated member made of a water-retaining material is arranged in the space between the plated surface and the printed anode of the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs for electroplating. 11 · The electroplating device for a substrate according to item 10 of the patent application scope, wherein the electro-mineral liquid immersion member is a high-resistance structure. 12. The electroplating device for a substrate according to item 10 of the application, wherein the electroplating solution impregnating member is made of ceramics. 13. If the substrate is applied to any one of the 10th to 12th scope of the patent application, the paper size of this paper is suitable for Zhongxin 7 Ghost Magic 2 312144 (revised version) 1221862. It is in a state where it is not in contact with the center of the substrate to be electroplated ', and the electric mineral liquid fills the gap between the electroplating solution-impregnated member and the substrate to be electrobonded, and the gap between p 卩 + day and day ^ electroplated surface is filled. Perform plating. 14. An electroplating device for a substrate, characterized in that: in a state in which the electroplated surface of the substrate is held upward by the wire holding portion, the electroplating processing, cleaning, and drying processing are raised and lowered corresponding to each operation position, and This is handled in a single-device. 15. For the electroplating device of the substrate of the scope of application for item No. 14, in which the electroplating device of the aforementioned substrate has 2 anodes arranged above the to-be-supplied surface of the aforementioned substrate, and a cathode contacting and energizing the aforementioned substrate, and A plating solution impregnating member made of a water-retaining material is disposed in a space between the electric ore surface and the anode. 16. A plating method for a substrate, characterized in that a substrate is taken out from a loading / unloading section for storing a substrate by a transport robot and transported to an inside of a plating device, and the substrate is held by a substrate holding portion in the device, and the substrate is held by the substrate. With the plated surface of the part holding substrate facing upward, the plating process, π washing, and drying process are raised and lowered in accordance with each operation, thereby performing processing in a single device. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China 17. A kind of electroplating device for substrates, which is characterized by: the mounting and disassembly of the storage substrate ' And a transfer robot that transfers and receives substrates between the loading unit and the plating unit. 1 8 · —A kind of substrate plating device, which holds the substrate by the substrate holding part, and has an anode arranged above the plated surface of the substrate, and contacts the substrate. This paper scales Seco® ® ^? TCNS) Α4 specification ( 210 X297), 312144 (revised version), 1221862, and cathodes for pure water supply and nozzles for pure water supply are characterized in that after the plating is completed, 'the pure water is supplied from the nozzles to clean the substrate and the substrate at the same time. The aforementioned cathode. 19. An electroplating device for a substrate, comprising: a substrate holding portion for holding the substrate with the surface to be plated upward; a cathode contacting the substrate held by the substrate holding portion to energize it; an anode, The plating solution injection mechanism injects the plating solution into the space between the plated surface of the substrate held by the substrate holding portion and the anode close to the plated surface, and the plating solution injection mechanism is arranged from the The plating solution injection path of one part of the anode or the outer periphery of the anode is constituted by injecting the plating solution between the anode and the plated surface of the substrate to diffuse on the plated surface of the substrate. 20 · The electroplating device for substrates as described in item 19 of the patent scope, which includes: a printed circuit board holding section of the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs to hold the substrate with the surface to be plated upward; the cathode section, A sealing material having a plating solution for holding a plated surface of a substrate held by the substrate holding portion, and a cathode contacting the substrate to energize the electrode; the electrode arm portion is close to the cathode portion and can be horizontally and vertically An anode that moves freely and linearly; and a plating solution injection mechanism that injects the plating solution into the substrate holding portion 312144 (revised version) 1221862 Two substrates held between the plated surface of the substrate held by H3 and the anode close to the plated surface of the meal, and the aforementioned plating solution injection mechanism is provided through a plating solution injection hole or arrangement provided in one of the foregoing anodes The nozzle on the outer periphery of the anode is filled with electric ore liquid between the anode and the electric ore surface of the substrate, and is diffused on the electric plated surface of the substrate. . For the electroplating device for substrates in the scope of application for patent No. 20, wherein the aforementioned plating solution injection mechanism is arranged on the opposite side of the substrate opposite surface of the anode, is arranged along the diameter direction of the anode, and has a supply for connecting to the plating solution. The two-electrode plating solution introduction path is provided with the aforementioned plating solution injection hole at a position opposite to the plating solution introduction hole provided on the anode side surface of the plating solution introduction path. 22. The electroplating device for substrates according to item 19 of the scope of patent application, wherein the aforementioned plating solution injection mechanism is arranged on the opposite side of the opposite surface of the substrate of the anode in a cross shape, a radial shape or a circumferential shape, and has a connection to The plating solution introduction path of the plating solution supply officer is provided with the aforementioned electro-mineral liquid injection hole at a position opposite to the plating solution introduction hole provided on the anode side surface of the plating solution introduction path. Printed by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs of the People's Republic of China on a substrate plating method, characterized in that the anode is arranged close to at least a part of the plated surface facing upwards of the substrate energized with the cathode, and is placed on the plated surface When the plating solution is injected between the anode and the anode, a plating solution column is formed to bridge between the plated surface of the substrate and the anode, and the electric key liquid is injected from the electric liquid column. 24. For the plating method of the substrate according to item 23 of the patent application scope, from 5 312144 (revised edition) 1221862 ____ H3 Electroplating disposed on one of the foregoing anodes or on the periphery of the anode> night injection \ path, inject the plating solution into the substrate Between the plated surface and the anode. 25. A method for electroplating a substrate, characterized in that the anode is placed close to at least a part of the plated surface facing upwards of the substrate energized with the dangerous electrode, and is placed in the space between the plated surface and the anode When the plating solution is injected, the plating solution is diffused on the plated surface of the substrate, and the substrate and the anode are relatively rotated and gradually approached. 26_ The method for electroplating a substrate according to item 25 of the patent application scope, wherein a plating solution impregnating material composed of a porous body having water retention is arranged below the substrate-opposing surface of the anode, and The opposite surface of the substrate is provided with a mechanism for relative rotation of the plating solution impregnating material and the substrate so that the plating solution therebetween diffuses radially outward. 27. An electrolytic treatment method, characterized in that at least a portion of an electrolyte is filled between a substrate to be processed having a contact with one of an anode and a cathode, and another electrode opposed to the substrate to be processed A high-resistance structure having a lower electrical conductivity than the electrolytic solution is provided to perform electrolytic treatment on the surface of the substrate to be processed. Printed by the Staff Welfare Committee of the Central Bureau of Standards of the Ministry of Economic Affairs on the electrolytic treatment method of 28. = Application for Patent No. 27, in which the aforementioned high-resistance structural system makes the resistance in its equivalent circuit more conductive than that formed on the surface of the soil plate The electrical resistance between the contact between the layer and the aforementioned electrode and the portion farthest away from the contact is high. 29. An electrolytic treatment method, characterized in that the electrolytic treatment in the patent scope is in progress in a state in which the substrate holding portion is held in the reverse direction. This standard 1 6 312144 (revised version) 1221862 H3 30. An electrolytic treatment device is a substrate to be processed having a contact with one of the anode and cathode electrodes, and the other electrode facing the substrate to be processed A person who fills an electrolytic solution to perform an electrolytic treatment on a substrate to be processed is characterized in that a high-resistance structure having an electric conductivity lower than that of the electrolytic solution is provided on at least a part of the electrolytic solution. 31. The electrolytic processing apparatus according to claim 30, further comprising a substrate holding section that performs electrolytic processing while holding the substrate upward with the substrate holding section. 32 · ^ The electrolytic treatment device of the 30th scope of the application for a patent, wherein the aforementioned high-resistance structural system makes the resistance in its equivalent circuit more than the contact between the conductive layer formed on the surface of the substrate to be processed and the aforementioned electrode, and The t-resistance in the material-effect circuit between the part that is most electrically away from the contact is high. 33 · ^ The electrolytic treatment device of item 3 () of the scope of patent application, in #, the aforementioned two resistance structure systems are composed of a porous substance containing an electrolytic solution inside. 34. If the electrolytic treatment device in the scope of application for item 33, # Porous material is porous ceramics. 35. For example, an electrolytic treatment device with a range of 30J members, wherein the aforementioned Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs printed the South Resistor Structure System to sandwich the high-resistance structure, and divided the electrolyte into a plurality of Part of the way. 3 6 · —A method for controlling the electric field state of an electrolytic processing device, which is characterized in that: it is filled between a substrate to be processed having a contact point with one of the anode and cathode electrodes and another square electrode facing the processed substrate. A full at least-part of the electrolyte 'sets a high-resistance structure with a lower electrical conductivity than the electrolyte. This paper is a foot of jade suitable for the country of China ^ 7 ^ 7 ^ 1 a (17〇X 297). --- 312144 (revised version) 1221862 And by adjusting the internal structure of the high-conductivity component, or the electric field on the surface of the substrate. At least one of the garments is used to control the adjustment, the high-resistance structure :: peripheral :: thickness of the high-resistance structure. At least 38 in the adjustment of the shape on the thousandth surface of the body. = Special: Γ43: Γ The electric field state of the electrolytic treatment device is controlled and porous. The resistance structure system is composed of porous materials. The distribution is adjusted. The internal structure is adjusted to be porous. Material pore size material 2. At least one of adjustment of milk porosity distribution, adjustment of tortuosity distribution, adjustment of material and science combination. 39.2 Control of electric field state of electrolytic treatment device in the 36th range of benefit ... Installation adjustment of components with different electrical conductivity Adjust the shielding area of the high-resistance structure by connecting components with different electrical conductivity. An electrolytic treatment device is attached to the employee welfare committee of the Central Standards Bureau of the Ministry of Economic Affairs, which has one of the anode and cathode electrodes. The printed substrate is filled with an electrolyte between the substrate to be processed and the other electrode facing the substrate to perform the electrolytic treatment of the substrate to be processed, and is characterized in that: The high-resistance structure having a lower conductivity than the electrolytic solution, At least one of the adjustment mechanisms in the fabrication or installation of components with different electrical conductivity, controls the electric field on the surface of the substrate to be processed with 312144 (revised version). 41. For example, the electrolytic treatment device in the scope of patent application No. 40, wherein the aforementioned shape The adjustment mechanism is at least one of thickness adjustment of the high-resistance structure and shape adjustment on the plane of the high-resistance structure. 42. The electrolytic treatment device according to item 40 of the application for a patent, wherein the foregoing is the same as the structure of the resistance structure It is composed of porous material, and the adjustment mechanism of the internal structure of the porous material is at least any one of adjustment of the pore size distribution of the porous material, adjustment of the porosity distribution, adjustment of the curvature ratio, and adjustment of the material combination. The electrolytic treatment device according to item 40 of the patent, wherein the adjustment mechanism for installing the components with different electrical conductivity is used to adjust the shielding area of the high-resistance structure by the components with different electrical conductivity. 44. An electrolytic treatment The device is a substrate to be processed having a contact with one of an anode and a cathode, and (2) A person who fills the electrolyte between the other electrodes of the substrate to be processed to perform the electrolytic treatment of the substrate being processed is characterized by: 'The employee welfare committee of the Central Standards Bureau of the Ministry of Economic Affairs printed on at least a part of the foregoing electrolyte to provide electricity. A high-resistance structure having a lower conductivity than the electrolytic solution, and the aforementioned high-resistance structure system holds its outer periphery by a holding member, and a square, n-resistance structure and a holding member are provided between A sealing member that leaks so that an electric current flows. 45 · Electrolytic processing device, which is based on a substrate to be processed having a contact with one of the anode and the cathode, and the other electrode facing the substrate to be processed is filled with an electrolyte to perform the electrolytic treatment of the substrate to be processed The 9 312144 (revised version) 1221862 H3 is characterized by: 'Electrolyte impregnating material is disposed between the other electrode and the substrate to be processed, and at the same time, the other electrode is provided to supply the electrolyte to the electrolyte. The electrolyte through hole in the material is inserted into the tube through the electrolyte through hole to supply the electrolyte supplied to the electrolyte impregnated material through the tube from the reverse side of the electrolyte impregnated material. And filled between the electrolyte impregnated material and the substrate to be processed. 46. The electrolytic treatment device according to item 45 of the application, wherein an electrolytic solution passage is provided in the aforementioned electrolytic solution impregnating material so as to be continuous with the aforementioned electrolytic solution through hole. 47 · An electrolytic processing device is provided on a substrate to be processed having a contact with one of an anode and a cathode, and the other electrode facing the substrate to be processed is filled with an electrolyte to perform electrolytic treatment of the substrate to be processed. It is characterized in that: the employee welfare committee of the Central Bureau of Standards of the Ministry of Economic Affairs prints an electrolyte impregnating material provided between the other electrode and the substrate to be processed, and forms an electrolyte passage portion of a predetermined depth in the electrolyte impregnating material. So as to fill the space between the electrolyte impregnating material and the substrate to be processed so as to supply the electrolyte in the electrolyte impregnating material from the other electrode to the electrolyte impregnating material through the electrolyte passage portion. . 48. The electrolytic treatment device according to item 47 of the patent application scope, wherein a liquid storage section for storing the electrolytic solution is provided between the other electrode and the electrolyte impregnating material, and the electrolytic solution stored in the liquid storage section is provided. The liquid is supplied into the electrolyte impregnated material. 49 · Electrolytic treatment devices, which are provided with a square electrode with one of anode and cathode 10 312144 (revised edition) A person who handles the substrate of the contact between H3 and the other electrode facing the substrate to be filled with electrolyte to perform the electrolytic treatment of the substrate to be processed is characterized by being born in a different state An electrolyte-impregnated material is provided between the other electrode and the substrate to be processed, and the electrolyte-impregnated material is configured so that the passage resistance of the electrolyte that passes through the electrolyte-impregnated material is different depending on the installation location, so that On the other side, the electrolyte supplied to the electrolyte impregnated material is supplied from the opposite side of the electrolyte / text / shell material according to the supply amount of the installation site, and the electrolyte impregnated material and the substrate to be processed are filled. between. 50. The electroplating device for a substrate according to the scope of application for patent item (i), wherein the cathode portion is arranged coaxially with the substrate holding portion and is configured to rotate integrally with the substrate holding portion. 5 1 · The electroplating device for substrates as described in item No. 8 of Shenjing's patent, wherein the cathode electrode and the substrate are rotating while receiving pure water supplied from the nozzle for supplying pure water. 52 · —A substrate plating device comprising: a substrate holding portion that holds the substrate with the surface to be plated upward; the employee welfare committee of the Central Standards Bureau of the Ministry of Economic Affairs prints a cathode that is in contact with the substrate and energizes it; The anode above the plating surface; the plating solution held in the space between the substrate held by the substrate holding portion and the anode close to the substrate; and injecting a shovel liquid into the space, and stopping the injection when the space is filled with the key liquid A plating solution injection mechanism for the plating solution. 53. For the electric money device of the base plate of the scope of application for patent No. 52, which is printed on 11 312144 (revised edition) 1221862 by the Staff Welfare Committee of the Central Standards Bureau of the Ministry of Economic Affairs. Liquid immersion material. 54. The electroplating device for a substrate according to item 52 of the scope of patent application, which has a cathode 'and a tray for a plating solution is disposed on the side of the cathode part, and the anode is freely movable between the cathode and the tray for the plating solution. Way of constituting. 55. For the electroplating device for substrates as claimed in claim 52, including a cathode, a plurality of nozzles are arranged on the side of the cathode portion, so as to spray pretreatment on the plated surface of the substrate held by the substrate holding portion. Liquid, = lotion, gas, etc. π 56. For the electroplating device for substrates according to item 52 of the scope of patent application, which has a cathode, the substrate holding portion can be at the substrate receiving and receiving position below, and the peripheral edge portion of the plated surface of the substrate above can contact the cathode. The position of the Ministry 'and its intermediate pre-treatment / cleaning position are lifted from the ground composition. 57. The electroplating device for a substrate according to claim 52, further comprising a cathode portion which is arranged coaxially with the holding portion and is configured to rotate integrally with the substrate holding portion. This paper is a standard size ^ 12 312144 (revised edition)