CN101414546A - Substrate cooling method and substrate cooling apparatus - Google Patents
Substrate cooling method and substrate cooling apparatus Download PDFInfo
- Publication number
- CN101414546A CN101414546A CNA2008101490106A CN200810149010A CN101414546A CN 101414546 A CN101414546 A CN 101414546A CN A2008101490106 A CNA2008101490106 A CN A2008101490106A CN 200810149010 A CN200810149010 A CN 200810149010A CN 101414546 A CN101414546 A CN 101414546A
- Authority
- CN
- China
- Prior art keywords
- carrying roller
- substrate
- cooling
- liquid
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 239000000758 substrate Substances 0.000 title claims description 100
- 239000007788 liquid Substances 0.000 claims description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 230000008676 import Effects 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 abstract description 58
- 238000012545 processing Methods 0.000 description 25
- 230000008016 vaporization Effects 0.000 description 16
- 238000009834 vaporization Methods 0.000 description 15
- 239000007921 spray Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000009423 ventilation Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a foundation plate cooling method and a foundation plate cooling device which have a low cost to effectively cool a foundation plate when the foundation plate is conveyed by a conveying roller. A cooling part (1C) cools the foundation plate (S) through the conveying roller (14) while the conveying roller (14) conveys the heated foundation plate (S). Namely, while the conveying roller (14) conveys the heated foundation plate (S), cooling water at normal temperature is sprayed into the conveying roller (14) through a nozzle (26), and the cooling water is vaporized and discharged outwards because of heat of the conveying roller (14) so as to cool the conveying roller (14) to cool the foundation plate (S).
Description
Technical field
LCD), PDP (Plasma Display Panel: plasma display) implement the substrate cooling method and the substrate cooling apparatus of cooling processing with the substrate of glass substrate etc. the present invention relates to a kind of to the LCD that implements heat treated (Liquid Crystal Display:.
Background technology
In the past, in making the photoetching process of glass substrate etc., as the processing of the last stage that on substrate, forms the photoresist overlay film, successively substrate is carried out following processing: the substrate after cleaning is implemented heat treated and dewatered processing (processings baked and banked up with earth in dehydration) and cooling processing that the substrate after heating is cooled off.This in the past processing is moved by manipulator with the order of heating plate and coldplate and is replaced substrate and carry out, but in recent years, in order to improve production capacity, as the device that patent documentation 1 is put down in writing, utilizing the roller carrying substrate, and by after the heater of carrying the roller configuration heats substrate, one side in the downstream, the refrigerating gas that is cooled to set point of temperature by injection comes cooling base.In addition, in the document 1, record following content, promptly, therefore refrigerating gas is ejected on the carrying roller and roller itself also is cooled, utilize heat conduction cooling base expeditiously, in addition from substrate to roller, by cooling water is circulated, also can access same effect in the carrying roller.
Patent documentation 1:JP spy opens the 2006-245110 communique.
As described in patent documentation 1, very effective as the cooling way of substrate by this mode of carrying roller cooling base.But, thereby under the situation of spraying refrigerating gas cooling carrying roller, because need a large amount of cold-producing mediums, so the problem that exists operating cost to increase.And, even under the situation that cooling water is circulated in the carrying roller, also need to have the recycle unit of the cooling water of refrigerating function, and need be used to the special hermetically-sealed construction that prevents that liquid from leaking from the carrying roller, therefore the problem that exists installation cost and operating cost to increase.
Summary of the invention
The present invention makes in view of the above problems, and it is a kind of by carrying roller carrying substrate and with the substrate cooling method and the substrate cooling apparatus of the cheaper structure cooling base of price that its purpose is to provide.
In order to address the above problem, substrate cooling method of the present invention is that the substrate after the heat treated is cooled off, this method is the liquid that imports cooling usefulness when carrying described substrate by the carrying roller to the inside of this carrying roller, make this liquid follow the rotation of described carrying roller and vaporize and steam is discharged to the outside of this carrying roller, cool off described substrate by described carrying roller thus.
Promptly, import liquid by inside to the carrying roller, follow the rotation of carrying roller to make described liquid move and make this liquid become liquid film or drop along this roller inner peripheral surface, increase the surface area (area of gas-liquid interface) of this liquid thus thus promote the vaporization of liquid, promote the consumption of the carrying heat of vaporization that roller had to cool off the carrying roller thus.And, because come carrying substrate, so by coming cooling base from substrate to the heat conduction of carrying roller by the carrying roller of cooling like this.According to such method, can cool off the carrying roller effectively with the amount of less liquid, and, because make vaporizing liquid in the roller and with its direct discharge in carrying, so do not need to be used to prevent from the tight hermetically-sealed construction of carrying roller leakage liquid etc.Therefore, can be with simple structure cooling base.
In addition, can use various liquid, but consider the convenience and the operating cost of processing, preferably in the carrying roller, import the water of normal temperature as described liquid as described liquid.
On the other hand, substrate cooling apparatus of the present invention is that the substrate after the heat treated is cooled off, and this device has: the carrying roller of hollow, and it constitutes on the whole Width of described substrate and supports described substrate continuously; Fluid Supplying apparatus, it supplies with the liquid of cooling usefulness to the inside of described carrying roller in the scope that can keep the big state of space ratio; Air interchanger, it makes in the described carrying roller in the rotation at least takes a breath.
According to this device, thereby make the heat of vaporization consumption cooling carrying roller of the heat of carrying roller as liquid by in the carrying roller, import liquid by fluid Supplying apparatus, and the carrying roller by such cooling comes carrying substrate, thus by coming cooling base to the heat conduction of carrying roller.Come cooling base by producing this heat transmission.Especially, import liquid with respect to the carrying roller in the mode that keeps the big state of space ratio, and make in the carrying roller and take a breath, therefore in the carrying roller, liquid moves and becomes liquid film or drop along the roller inner peripheral surface, and surface area (area of gas-liquid interface) increases thus.Therefore, the vaporization that promotes liquid effectively of increase and the interaction between the above-mentioned ventilation by liquid surface area.Therefore, successfully carry out aforesaid heat and transmit, the substrate during cooling is carried effectively thus.
In this structure, preferred described fluid Supplying apparatus comprise be inserted into the carrying roller in and along its axially extended nozzle, this nozzle in described carrying roller at least the zone of supporting substrate supply with described liquid
By this structure because especially can the concentrated area in the carrying roller part of cooling and substrate contacts, so can be with few amount of liquid cooling base effectively.
And preferred described nozzle is supplied with described liquid equably on the length direction of described carrying roller.
By this structure, can prevent effectively along the length direction occurrence temperature gradient of carrying roller, thus cooling base equably.
In addition, can be suitable for various liquid as aforesaid liquid, but consider operability and operating cost, it is effectively adopting water.Therefore, preferred described fluid Supplying apparatus is supplied with water as described liquid.
And, in said structure, having cooling device, described cooling device was cooling off described liquid with described liquid before described carrying roller is supplied with.
By this structure, can absorb more heat of vaporization from the carrying roller by enough a spot of liquid, therefore can more effectively cool off the carrying roller, improved the cooling effect of substrate therefrom.
According to substrate cooling method of the present invention and substrate cooling apparatus of the present invention, under the situations such as recycle unit that the cooling water with cooling body is not set, can cool off substrate in the carrying effectively by the carrying roller.Therefore, compare with existing this substrate cooling apparatus, can enough more low-cost structure cooling bases.
Description of drawings
Fig. 1 is the schematic cross-section of major part that expression is equipped with the substrate board treatment of substrate cooling apparatus of the present invention (using the substrate cooling apparatus of substrate cooling method of the present invention).
Fig. 2 is the cutaway view (the A-A cutaway view of Fig. 1) of the structure of expression cooling processing portion (substrate cooling apparatus of the present invention).
Fig. 3 is the cutaway view of carrying roller.
Fig. 4 is the cutaway view of other structure of expression carrying roller.
Embodiment
Utilize description of drawings preferred implementation of the present invention.
Fig. 1 is the schematic cross-section of major part that expression is equipped with the substrate board treatment of substrate cooling apparatus of the present invention (using the substrate cooling apparatus of substrate cooling method of the present invention).
The glass substrate S that this substrate board treatment is used LCD, PDP according to the technology of photoetching (below be called substrate S) implements various processing, thus from upper reaches one side have the 1A of clean portion that is used for cleaning base plate S successively, substrate S is heated to the 1B of heat treated portion of set point of temperature and will heat after substrate S be cooled to the 1C of cooling processing portion (being equivalent to substrate cooling apparatus of the present invention) of set point of temperature.In downstream one side of the 1C of this cooling processing portion, also be provided with the resist coating portion that is used on substrate S forming the resist overlay film etc.
Each handling part 1A～1C has the treatment trough 10～12 of the box-shaped that the peristome used via board carrying is interconnected.In the inside of these treatment troughs 10～12, be provided with carrying roller 14 with predetermined distance, with substrate S with in the flat-hand position carrying from the 1A of the clean portion handling part 1B of a side, 1C carrying substrate S downstream successively.
In the 1A of clean portion, be provided be used for successively to substrate S for example scrub, each cleaning devices (omitting diagram) of purge and flushing etc., and in the downstream of the 1A of clean portion one side, be equipped be used for after flushing is handled will attached to the flushing liquor on the substrate S remove about a pair of air knife (air knife) 16a, 16b.
In the 1B of heat treated portion, on the position of the both sides up and down of carrying roller 14, disposing flat heater (panel heater) 17a, 17b.And, HMDS) though omit diagram, be equipped with to be used for being atomized spray HMDS (Hexamethyldisilazane: the nozzle of the bonding hardening agent of resist overlay film etc. such as to adding the substrate S that pines for.
In the 1C of cooling processing portion, be provided with the above-mentioned carrying roller 14 of the cooling device function that has substrate S concurrently.Promptly, the 1C of cooling processing portion utilizes and comes cooling base S from substrate S to the heat conduction of carrying roller 14, therefore, the carrying roller 14 of the 1C of cooling processing portion is different with the carrying roller 14 of other handling part 1A, 1B, and with by heat conduction effectively the mode of cooling base S constitute this carrying roller 14.Describe in detail more in the back about this point.
By above-mentioned structure, in this substrate board treatment, by driving carrying roller 14 carrying substrate S, simultaneously in the 1A of clean portion, by substrate S is scrubbed, purge and flushing wait cleaning base plate S, in the 1B of heat treated portion, substrate S is heated to the moisture that set point of temperature (100 ℃～130 ℃) is removed substrate S, in the 1C of cooling processing portion, substrate S is cooled to set point of temperature (normal temperature).After this, successively substrate S is carried out the remaining processing of the coating etc. of photoresist based on photoetching process.
Fig. 2 is a structure of roughly representing the carrying roller 14 of the 1C of cooling processing portion with cutaway view.As shown in the figure, carrying roller 14 is the rollers in its hollow shape that axially connects, and integral body is made of the strong metal material of heat conductivity (aluminium etc.).
The rear and front end of carrying roller 14 (being two ends, the left and right sides in Fig. 2) exports to the outside of treatment trough 12 via the peristome 18a, the 19a that form on the front and back of treatment trough 12 side plate 18,19, and is inserted in the Machine Room 20 that is connected respectively with the outside of front and back side plate 18,19.In each Machine Room 20, be provided with supporting member 22, and the both ends of described carrying roller 14 are supported on these supporting members 22 via bearing 24, it is rotatably supported to carry roller 14 thus.And, being fixed with belt wheel 15 at the rear end part of carrying roller 14, and on this belt wheel 15, setting up rotating band 2, rotation drives carrying roller 14 thus.
In the inside of carrying roller 14, be inserted with the nozzle 26 of the axle shape that is used for supply cooling water in this roller.This nozzle 26 runs through carrying roller 14, and both ends are supported on the sidewall of each Machine Room 20, is configured in thus on the approximate centre axle of carrying roller 14.
On nozzle 26, be disposed with a plurality of jet hole 26a along its length direction with predetermined distance, as shown in Figure 3, the privileged site (being downward in illustrated embodiment) on the circumferencial direction of the inner peripheral surface of carrying roller sprays from the cooling water of a distolateral importing of nozzle 26.Jet hole 26a is arranged on the whole zone (being the zone of supporting substrate S at least) of carrying between the front and back sidewall that comprises treatment trough 12 in the roller 14.
Adopt the water of normal temperature as cooling water.This cooling water is supplied with to nozzle 26 from water storing tank 30 by pump 28 is driven as shown in Figure 2.In addition, in the feed system of this cooling water, be provided with the volume control device that comprises the electromagnetically operated valve of controlling its flow etc., in carrying roller 14, control is to the quantity delivered of the cooling water of described nozzle 26 supplies, so that supply with cooling water in carrying roller 14 in the big scope of space ratio change.That is, in the present embodiment, this feed system and described nozzle 26 etc. is equivalent to fluid Supplying apparatus of the present invention.
The jet hole 26a of nozzle 26 for example forms more importing side (being the left side in Fig. 2) away from cooling water, and then bore is big more, thus with the spray volume that on whole length direction, makes cooling water roughly uniformly mode constitute nozzle 26.
In addition, the inside of Machine Room 20 is via the exhaust outlet 20a and the exhaust channel that are formed on its underpart, attract by not shown vacuum pump equal vacuum, prevent that thus particle etc. from 20 invading treatment troughs 12 via peristome 18a, 19a from the Machine Room, and can make the 14 inner ventilations of carrying roller.That is, in the present embodiment, Machine Room 20 and vacuum pump etc. are equivalent to air interchanger of the present invention.
By above-mentioned structure, in the 1C of cooling processing portion, in the process of carrying substrate S, carry out cooling processing by 14 couples of substrate S of carrying roller.That is, in the process of carrying substrate S, supply with cooling waters by the action of pump 28 is next to nozzle 26, the inner peripheral surface to carrying roller 14 sprays cooling water thus.Therefore, if on carrying roller 14, move at this state infrabasal plate S, then by from substrate S to the heat conduction cooling base S that carries roller 14, water absorbs cooling carrying roller 14 thereby the heat of carrying roller 14 is cooled.That is, the result who carries out such heat transmission is that substrate S is cooled.
At this moment, the substrate S that moves in the 1C of cooling processing portion is in 100 ℃～130 ℃ high temperature, and therefore carrying roller 14 also approaches this temperature.Therefore, as mentioned above, if supply with the cooling water of normal temperature to carrying roller 14 in space ratio becomes big scope, then this cooling water is vaporized rapidly, carries roller 14 thereby the heat by so will carry roller 14 consumes to cool off effectively as the vaporization heat of cooling water.Especially in the case, thereby cooling water moves to circumferencial direction and becomes liquid film or drop along the inner peripheral surface of carrying roller 14, and the surface area of cooling water (area of gas-liquid interface) increases thus.Therefore, promote the vaporization (evaporation) of cooling water, thereby can cool off carrying roller 14 effectively.
In addition, the vacuum attraction of 20 inside, steam tracing Machine Room that in carrying roller 14, produce (ventilation in the carrying roller 14) and move to the outside of carrying roller 14 like this, and be discharged to the outside via described exhaust outlet 20a.Therefore, preventing to carry roller 14 inside becomes saturation condition because of steam, promotes the vaporization of the cooling water in the carrying roller 14 thus.And the result who promotes the vaporization of cooling water like this is that above-mentioned heat transmission is successfully carried out, and well the substrate S in the conveyance is cooled off thus.
In addition, in the above-mentioned 1C of cooling processing portion,, also drive carrying roller 14 and import cooling water, also carry roller 14 by the 14 inner ventilations of carrying roller are cooled off effectively to its inside even before moving into substrate S.Promptly, in the case, because become liquid film or drop the surface area of cooling water increased by cooling water is moved along the roller inner peripheral surface, so the surface area by this cooling water increases and above-mentioned ventilation between interaction promote the vaporization of cooling water, as a result, roller 14 is carried in cooling effectively.Therefore, can cool off carrying roller 14 effectively.
According in carrying roller 14, importing the cooling water of normal temperature and make its vaporization as described above, thereby, can under the situation of not using cold-producing medium in advance cooling water to be cooled off, use the less water yield to cool off carrying roller 14 effectively by absorbing the structure that heat of vaporization cools off the aforesaid cooling processing 1C of portion of carrying roller 14.And, directly discharge the steam of vaporization (evaporation) in carrying roller 14, therefore do not need to carry relatively the equipment that roller 14 makes the cooling water circulation to the outside, and, though in carrying roller 14, import cooling water, do not need to be used to prevent from carrying the tight hermetically-sealed construction that roller leaks.
Therefore, though utilize from substrate S to the heat conduction of carrying roller 14 cooling base S effectively, but with this device in the past, promptly, in the carrying roller, cooling water is circulated cool off this roller to seal without leakage state, perhaps spray the device in the past that cold air cools off this roller to the carrying roller and compare, having can be with the cheaper structure of the price effect of cooling base S expeditiously.
In addition, above the illustrated 1C of cooling processing portion be an example preferred embodiment of substrate cooling apparatus of the present invention (carrying out the substrate cooling apparatus of substrate cooling method of the present invention), its concrete structure can suitably change in the scope that does not break away from aim of the present invention.For example, also can be suitable for following structure.
For example, in the above-described embodiment, in order on the whole length direction of nozzle 26, to make the spray volume of cooling water roughly even, adopt more away from the importing side (being the left side in Fig. 2) of the cooling water big more structure of bore of jet hole 26a then, but in addition, also can adopt the bore of jet hole 26a for example even, as shown in Figure 4, and more away from the importing side of the cooling water more little nozzle arrangements of diameter dimension then.Under the situation that adopts this structure, can make the spray volume of cooling water even on the whole length direction of nozzle 26.In a word, as long as can make the spray volume of cooling water even in the longitudinal direction, which type of structure is the structure of nozzle 26 adopt can.In addition, in the above-described embodiment, the example that length direction one side from nozzle 26 is imported cooling water is illustrated, but import under the situation of cooling water at two ends from nozzle 26, as long as the structure with Fig. 2 and Fig. 3 is a standard, adopt the spray volume uniform nozzle arrangements on the whole length direction of nozzle 26 that makes cooling water to get final product.
And, in the above-described embodiment, to the water of nozzle 26 supplies as the normal temperature of cooling water, as long as but the structure that might as well be in the way and earlier cooling water be cooled off, also can be in the feed system of cooling water, the cooling device that the water that installation is supplied with water storing tank 30 cools off.Even cool off the structure of cooling water so in advance, as mentioned above, because the structure of the 1C of cooling processing portion is to supply with the structure of cooling water in the big scope of space ratio change in carrying roller 14, so compare with the general structure that cooling water is circulated in the carrying roller, promptly, cool off the existing apparatus of this roller and compare to seal without leakage cycle of states in the carrying roller with making cooling water, the water yield of the cooling water of supplying with to carrying roller 14 is few, and it is also few that cooling water is cooled off the amount of required cold-producing medium.Therefore, compare the operating cost that is used to cool off cooling water with device in the past low, therefrom can be with low-cost cooling base S.
And in the above-described embodiment, the structure of air interchanger of the present invention is to promote the steam that produces in carrying roller 14 to discharge to the outside by attraction exhaust in Machine Room 20, but the structure of air interchanger is not limited to this.For example, also can by further carrying roller 14 one distolateral air blast etc. is set and in carrying roller 14 the mandatory air that is blown into promote steam to discharge to the outside.
And, in the above-described embodiment, substrate S with flat-hand position carrying and cool off, certainly, also can be carried substrate S and cool off with inclination attitude (posture that tilts from one side direction opposite side in the direction vertical with the carrying direction).In the case, the nozzle that cooling water is supplied with in the end that can be arranged on a upper side of carrying roller 14 replaces for example running through the such nozzle 26 of execution mode of carry roller 14, and along the inner bottom surface of carrying roller 14 cooling water under the effluent from it.According to this structure, thereby absorbing heat of vaporization from carrying roller 14 when flowing down in carrying roller 14 inside, cooling water vaporizes, therefore can cool off carrying roller 14 in the same manner with the situation of horizontal carrying substrate S.In addition, under the situation that cooling water is flowed down along carrying roller 14, the end that also can be arranged on carrying roller 14 accepts do not have vaporization and cooling water that flows down and the discharger of discharging to the outside as mentioned above.This structure also can be used in the structure of above-mentioned execution mode.
Claims (7)
1. a substrate cooling method cools off the substrate after the heat treated, it is characterized in that,
When carrying described substrate, import the liquid that cools off usefulness, make this liquid follow the rotation of described carrying roller and vaporize and steam is discharged to the outside of this carrying roller, cool off described substrate by described carrying roller thus to the inside of this carrying roller by the carrying roller.
2. substrate cooling method according to claim 1 is characterized in that, imports the water of normal temperature as described liquid in described carrying roller.
3. a substrate cooling apparatus cools off the substrate after the heat treated, it is characterized in that having:
The carrying roller of hollow, it constitutes on the whole Width of described substrate and supports described substrate continuously;
Fluid Supplying apparatus, it supplies with the liquid of cooling usefulness to the inside of described carrying roller in the big scope of space ratio change;
Air interchanger, it makes in the described carrying roller in the rotation at least takes a breath.
4. substrate cooling apparatus according to claim 3 is characterized in that, described fluid Supplying apparatus comprise be inserted into the carrying roller in and along its axially extended nozzle, this nozzle in described carrying roller at least the zone of supporting substrate supply with described liquid.
5. substrate cooling apparatus according to claim 4 is characterized in that, described nozzle is supplied with described liquid equably on the length direction of described carrying roller.
6. according to each described substrate cooling apparatus in the claim 3 to 5, it is characterized in that described fluid Supplying apparatus is supplied with water as described liquid.
7. according to each described substrate cooling apparatus in the claim 3 to 5, it is characterized in that having cooling device, this cooling device is used to make the described liquid cools before described carrying roller is supplied with.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-268946 | 2007-10-16 | ||
| JP2007268946A JP2009099721A (en) | 2007-10-16 | 2007-10-16 | Method of cooling substrate and apparatus of cooling substrate |
| JP2007268946 | 2007-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101414546A true CN101414546A (en) | 2009-04-22 |
| CN101414546B CN101414546B (en) | 2011-12-21 |
Family
ID=40595007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101490106A Expired - Fee Related CN101414546B (en) | 2007-10-16 | 2008-09-18 | Substrate cooling apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2009099721A (en) |
| KR (1) | KR101022089B1 (en) |
| CN (1) | CN101414546B (en) |
| TW (1) | TWI387041B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376530A (en) * | 2010-08-20 | 2012-03-14 | 东京毅力科创株式会社 | Substrate processing apparatus and temperature adjustment method |
| CN106041331A (en) * | 2016-06-21 | 2016-10-26 | 昆山国显光电有限公司 | OLED substrate cooling system |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011086713A1 (en) | 2010-01-15 | 2011-07-21 | 京進工業株式会社 | Heat exchanger manufacturing apparatus |
| JP5896549B2 (en) * | 2011-07-20 | 2016-03-30 | 株式会社ダイヘン | COOLING UNIT AND WORK CONVEYING DEVICE USING THE SAME |
| DE102011082334B4 (en) * | 2011-09-08 | 2017-01-26 | Von Ardenne Gmbh | Substrate treatment plant |
| CN103187340B (en) * | 2011-12-28 | 2016-08-03 | 斯克林集团公司 | Substrate board treatment and substrate processing method using same |
| KR101665763B1 (en) * | 2014-08-11 | 2016-10-13 | 주식회사 포스코 | Roller conveyor |
| KR20220098492A (en) * | 2021-01-04 | 2022-07-12 | 주식회사 엘지에너지솔루션 | Electrode rolling apparatus and electrode rolling method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0790354A (en) * | 1993-09-21 | 1995-04-04 | Kawasaki Steel Corp | Roll for transporting high-temperature steel products |
| JPH07133126A (en) * | 1993-11-01 | 1995-05-23 | Asahi Glass Co Ltd | Conveyor roll of glass heating furnace |
| TW502130B (en) * | 1997-06-17 | 2002-09-11 | Toshiba Corp | Cleaning method of substrate |
| JP2000302468A (en) | 1999-04-19 | 2000-10-31 | Asahi Glass Co Ltd | Glass pane-carrying roll structure in glass pane-heating furnace |
| TWI221862B (en) * | 1999-12-24 | 2004-10-11 | Ebara Corp | Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment |
| JP3899305B2 (en) | 2002-10-31 | 2007-03-28 | 松下電器産業株式会社 | Substrate cooling apparatus and method for PDP |
| JP3894104B2 (en) * | 2002-11-15 | 2007-03-14 | 東京エレクトロン株式会社 | Developing method, developing apparatus, and developer regenerating apparatus |
| JP2005201393A (en) * | 2004-01-16 | 2005-07-28 | Nippon Steel Chem Co Ltd | Heating press roll |
| JP2006264020A (en) * | 2005-03-23 | 2006-10-05 | Fuji Photo Film Co Ltd | Method and apparatus for manufacturing laminated substrate |
| JP4699235B2 (en) * | 2006-02-20 | 2011-06-08 | 株式会社サイアン | Plasma generating apparatus and work processing apparatus using the same |
-
2007
- 2007-10-16 JP JP2007268946A patent/JP2009099721A/en active Pending
-
2008
- 2008-08-14 TW TW097131017A patent/TWI387041B/en not_active IP Right Cessation
- 2008-09-18 CN CN2008101490106A patent/CN101414546B/en not_active Expired - Fee Related
- 2008-09-22 KR KR1020080092579A patent/KR101022089B1/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376530A (en) * | 2010-08-20 | 2012-03-14 | 东京毅力科创株式会社 | Substrate processing apparatus and temperature adjustment method |
| CN102376530B (en) * | 2010-08-20 | 2016-05-04 | 东京毅力科创株式会社 | Substrate board treatment and temperature control method |
| US10541158B2 (en) | 2010-08-20 | 2020-01-21 | Tokyo Electron Limited | Temperature adjustment method using wet surface in a processing chamber |
| CN106041331A (en) * | 2016-06-21 | 2016-10-26 | 昆山国显光电有限公司 | OLED substrate cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101414546B (en) | 2011-12-21 |
| TWI387041B (en) | 2013-02-21 |
| KR101022089B1 (en) | 2011-03-17 |
| JP2009099721A (en) | 2009-05-07 |
| TW200919615A (en) | 2009-05-01 |
| KR20090038807A (en) | 2009-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101414546B (en) | Substrate cooling apparatus | |
| CN102089610B (en) | Heat treatment apparatus | |
| CN103187340B (en) | Substrate board treatment and substrate processing method using same | |
| CN102194657B (en) | Device for cleaning and treating substrate | |
| CN100505156C (en) | Substrate processing apparatus and substrate processing method | |
| CN101989538A (en) | Liquid processing apparatus, liquid processing method, and storage medium | |
| KR20080084926A (en) | Apparatus and method for wet-chemical processing of flat, thin substrate in a continuous method | |
| KR102180040B1 (en) | Apparatus for drying substrate | |
| CN100547329C (en) | The drying device of large-area substrates and method | |
| KR101218449B1 (en) | Substrate processing apparatus | |
| CN101593673A (en) | Make employed substrate board treatment of flat-panel monitor and method | |
| CN110694287A (en) | Low-temperature evaporation crystallizer | |
| CN202072720U (en) | High-temperature direct reduced iron cooling system | |
| CN103094158A (en) | Substrate treating apparatus and chemical recycling method | |
| CN101661222A (en) | Substrate conveying device | |
| CN1810389B (en) | Device and method processing substrate | |
| CN114496731A (en) | Simple harmonic motion type wafer cleaning and drying method | |
| JP2006013339A (en) | Substrate cleaning equipment | |
| KR100675064B1 (en) | Substrate desiccator | |
| JPH06185131A (en) | Bubble scattered roof cooling system | |
| JPH06260412A (en) | Shower type single sheet processing developing device | |
| CN206292488U (en) | Substrate board treatment | |
| CN211133017U (en) | Low-temperature evaporation crystallizer | |
| KR20100078426A (en) | Cooling tower recoveragble evaporation | |
| KR20110063033A (en) | Sea water desalting apparatus using carrier gas for increasing efficiency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20180918 |