TW200919615A - Substrate cooling method and substrate cooling apparatus - Google Patents

Substrate cooling method and substrate cooling apparatus Download PDF

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Publication number
TW200919615A
TW200919615A TW097131017A TW97131017A TW200919615A TW 200919615 A TW200919615 A TW 200919615A TW 097131017 A TW097131017 A TW 097131017A TW 97131017 A TW97131017 A TW 97131017A TW 200919615 A TW200919615 A TW 200919615A
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Taiwan
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substrate
cooling
liquid
roller
transfer roller
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TW097131017A
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Chinese (zh)
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TWI387041B (en
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Takashi Kakimura
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Dainippon Screen Mfg
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

This invention relates to a substrate cooling method and a substrate cooling apparatus. A transportation roller is used for conveying the substrate to cool the substrate with high efficiency and low cost. A cooling processing part (1C) is provided to equip the transportation roller (14) to convey the heat-processed substrate (S) and also cool the substrate (S) by the transportation roller (14). In another word, a nozzle is used for spraying cooling water with the room temperature on the inner of the transportation roller (14) while the transportation roller (14) conveys the substrate (S). The cooling water is gasified (evaporated) and discharged to the outer due to the heat of the transportation roller (14) so that the substrate (S) is then cooled down while the transportation roller (14) is cooled down.

Description

200919615 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種對已實施加熱處理之LCD(Liquid Crystal Display ’ 液晶顯不器）、PDP(Plasma Display Panel， 電漿顯示面板）用玻璃基板等之基板實施冷卻處理之基板 冷卻方法及基板冷卻裝置。 【先前技術】 先前，於製造玻璃基板等之光微影製程中，作為於基板 上形成光阻覆膜之前階段之處理，依序對基板進行如下處 理：對清洗後之基板實施加熱處理而除去水分之處理（脫 水烘培處理）以及對加熱後之基板進行冷卻之冷卻處理。 先前，此種處理係按照加熱板以及冷卻板之順序藉由機械 手移動替換基板而進行，但近年來，為了提高產量，如專 利文獻1所揭示之裝置般’一面利用輥來搬送基板，一面 藉由沿著搬送輥而配置之加熱器對基板進行加熱之後，於 下游側喷射已冷卻至特定溫度之冷卻氣體，藉此冷卻基 板。再者，於該文獻1中揭示有如下内容：將冷卻氣體喷 射至搬送輥上，輥本身亦會受到冷卻，因此可利用自基板 至輥之熱傳導而高效率地冷卻基板；又，藉由使冷卻水於 搬送輥内循環，亦能夠獲得同樣之效果。 [專利文獻1]曰本專利特開2006-245110號公報。 【發明内容】 [發明所欲解決之問題] 如專利文獻1所述，藉由搬送輥來冷卻基板係有效之基 133835.doc 200919615 板冷卻手段。然而，於喷射冷卻氣體以冷卻搬送輕之情形 =，由於需要大量之製冷劑’故而存在運行成本增大之問 題。又，即使於使冷卻水在搬送輥内循環之情形時，亦需 要具有冷卻功能之冷卻水之循環設備，又，需要用以防止 液體自搬送輥曳漏之特殊之密封構造#，因此存在裝置成 本或運行成本增大之問題。 本發明係鑒於上述問題開發而成者，其目的在於藉由搬 送輥來搬送基板’並且以價格更低廉之構成來冷卻基板。 [解決問題之技術手段] 為了解決上述問題’本發明之基板冷卻方法係對加熱處 理後之基板進行冷卻者，於藉由搬送輥來搬送上述基板之 同夺將冷卻用之液體導入至該搬送親之内部，使該液體 伴隨上述搬送輥之旋轉而氣化，將該蒸氣排出至該搬送棍 之外部，藉此經由上述㈣輥㈣上述基板進行冷卻。 亦即，將液體導入至搬送輥之内部，伴隨搬送輥之旋 轉’使上述液體沿著該輥内周面移動，藉此使該液體液膜 化或者液滴化’從而增大該液體之表面積（氣液界面之面 積)以促進液體之氣化，藉此促進搬送輥所具有之氣化熱 之消耗以冷卻搬送輕。而且’由於藉由以上述方式經冷卻 之搬送輥來搬送基板’故而藉由自基板至搬送輥 之熱傳導 來冷卻基板。根據此種方法，能夠以較少之液體之量而有 效地冷卻搬送輥’ X ’由於在搬送輥内使液體氣化並將其 直接排出’故而無需用於防止自搬送輥茂漏液體之嚴密之 密封構造等。因此，能夠以簡單之構成來冷卻基板。 133835.doc 200919615 再者，能夠使用各種各樣之液體作為上述液體，但考慮 到處理之便利性或運行成本’較好的是將常溫之水作為上 述液體而導入至搬送輥内。200919615 IX. Description of the Invention: [Technical Field] The present invention relates to a glass substrate for a liquid crystal display (Liquid Crystal Display) and a PDP (Plasma Display Panel) The substrate cooling method and the substrate cooling device in which the substrate is subjected to cooling treatment. [Prior Art] Conventionally, in the photolithography process for producing a glass substrate or the like, as a process before the formation of the photoresist film on the substrate, the substrate is sequentially processed as follows: the substrate after the cleaning is subjected to heat treatment to remove The treatment of moisture (dehydration baking treatment) and the cooling treatment of cooling the heated substrate. In the prior art, the substrate is replaced by a robot in the order of the heating plate and the cooling plate. In recent years, in order to increase the yield, the substrate is conveyed by a roller as in the device disclosed in Patent Document 1. After the substrate is heated by the heater disposed along the conveying roller, the cooling gas cooled to a specific temperature is sprayed on the downstream side, thereby cooling the substrate. Further, in the document 1, it is disclosed that the cooling gas is sprayed onto the conveying roller, and the roller itself is also cooled, so that the substrate can be efficiently cooled by heat conduction from the substrate to the roller; The same effect can be obtained by circulating cooling water in the transfer roller. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2006-245110. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] As described in Patent Document 1, a substrate is effectively cooled by a transfer roller 133835.doc 200919615 plate cooling means. However, in the case where the cooling gas is sprayed to cool the conveyance light, there is a problem that the running cost increases due to the large amount of refrigerant required. Further, even in the case where the cooling water is circulated in the conveying roller, a cooling water circulation device having a cooling function is required, and a special sealing structure # for preventing the liquid from leaking from the conveying roller is required, and thus there is a device. The problem of increased cost or operating costs. The present invention has been developed in view of the above problems, and an object thereof is to convey a substrate by a transfer roller and to cool the substrate at a lower cost. [Means for Solving the Problems] In order to solve the above problem, the substrate cooling method of the present invention cools the substrate after the heat treatment, and transports the liquid for cooling to the transfer by transporting the substrate by the transfer roller. In the interior, the liquid is vaporized by the rotation of the transfer roller, and the vapor is discharged to the outside of the transfer roller, thereby cooling the substrate via the (four) roller (four). That is, the liquid is introduced into the inside of the transfer roller, and the liquid is moved or dropletized along the inner peripheral surface of the roll by the rotation of the transfer roller, thereby increasing the surface area of the liquid. (The area of the gas-liquid interface) promotes the vaporization of the liquid, thereby promoting the consumption of the vaporization heat of the conveying roller to be lightly cooled and conveyed. Further, the substrate is cooled by the heat conduction from the substrate to the transfer roller because the substrate is transferred by the transport roller that has been cooled in the above manner. According to this method, the conveying roller 'X' can be efficiently cooled with a small amount of liquid, since the liquid is vaporized in the conveying roller and directly discharged, so that it is not necessary to prevent the liquid from leaking from the conveying roller. Sealing structure, etc. Therefore, the substrate can be cooled with a simple configuration. 133835.doc 200919615 Further, various liquids can be used as the liquid, but in consideration of convenience of handling or running cost, it is preferable to introduce water of normal temperature into the conveying roller as the above liquid.

另一方面，本發明之基板冷卻裝置係對加熱處理後之基 板進行冷卻者，且具有：中空之搬送輥，其構成為於上述 基板之整個寬度方向上連續地支持上述基板；液體供給機 構，其於能夠保持空間比率較大之狀態的範圍内，將冷卻 用之液體供給至上述搬送輥之内部；以及換氣機構，其對 至少於旋轉中之上述搬送輥内進行換氣。 根據該裝置，藉由液體供給機構將液體導入至搬送輥 内，藉此使搬送輥之熱量作為液體之氣化熱而受到消耗， 以對搬送輥進行冷卻，利用以上述方式經冷卻之搬送輥來 搬送基板’藉此，利用朝向搬送報之熱傳導來冷卻基板。 藉由產生此種熱傳遞而冷卻基板。尤其是，以保持空間比 率較大之狀態的方式，將液體導人至搬送輥，並且對搬送 輥内進行換氣，因此於搬送輥内，液體會沿著輥内周面移 動而液膜化或者液滴化，藉此表面積（氣液界面之面積）增 大。因此’藉由液體表面積之增大與上述換氣之相互作用 而有效地促進液體之氣化。因此，順利地進行如上所述之 熱傳遞’藉此有效地對搬送中之基板進行冷卻。 ^亥構成中’較好的是上述液體供給機構包括插入至搬 至所=沿其轴方向延伸之喷嘴，該嘴嘴將上述液體供給 至所述搬送輥中至少支持基板之區域。 根據該構成’於搬送輥中尤其能夠集中地對與基板接觸 133835.doc 200919615 之部分進行冷卻’因此能夠以較少之液體量來有效地冷卻 基板。 又’較好的是上述喷嘴於上述搬送輥之長度方向上均句 地供給上述液體。 根據該構成’能夠有效地防止沿著搬送輥之長度方向產 生溫度梯度，從而能夠均勻地冷卻基板。 再者，作為上述液體，能夠使用各種各樣之液體’但考 慮到操作性或運行成本，採用水則較為有效。因此，較好 的疋上述液體供給機構供給水作為上述液體。 又，於上述構成中設置有冷卻機構，該冷卻機構於將上 述液體供給至上述搬送輥之前，對上述液體進行冷卻。 根據該構成，能夠利用少量之液體自搬送輥吸收更多之 氣化熱’因此能夠更有效地冷卻搬送輥，藉此基板之冷卻 效果提高。 [發明之效果] 、根據請求項i、之基板冷卻方法以及請求項3〜7之基板 ΉΡ裝置彳不βχ置具有冷卻機構之冷卻水之循環設備 等’而藉由搬送觀來有效地冷卻搬送中之基板。因此，與 先前之此種基板冷卻裝置相比，能夠以更低廉之構成來冷 卻基板。 【實施方式】 利用圖式對本發明夕私、, 之較佳實施形態加以說明。 圖1係概略性地表示έΒ壯士丄* 、且裝有本發明之基板冷卻裝置（使用 本發明之基板冷卻方半夕甘>、〇、 '之基板冷卻裝置）之基板處理裝置 I33835.doc 200919615 之主要部分的剖面圖。 該基板處理裝置按照光微影之製程而對LCD、PDP用之 玻璃基板S(以下稱作基板s)實施各種處理，因此自上游側 依序具有用於清洗基板S之清洗處理部1A、將基板s加熱 至特定溫度為止之加熱處理部1B以及將加熱後之基板s冷 卻至特定溫度為止之冷卻處理部1 C(相當於本發明之基板 冷卻裝置）。於該冷卻處理部1C之下游側，進而設置有用 於在基板S上形成抗蝕劑覆膜之抗蝕劑塗布部等。 各處理部1A〜1C具有經由基板搬送用之開口部而相互連 通之箱形之處理槽1〇〜12。於該等處理槽10〜12之内部，以 特定間隔設置有搬送輥14,於以水平姿勢搬送基板s之同 夺將基板S自清洗處理部1 a依序搬送至下游側之處理部 IB、1C。 於清洗處理部1A内’設置有用於依序對基板8實施例如 刷洗、吹洗以及淋洗等之各清洗機構（省略圖示），於清洗 處理部1A之最下游側，配備有用於在沖洗處理之後將附著 於基板8之淋洗液除去之上下一對氣刀16a、16b。 於加熱處理部1B内’在爽持搬送輥14之上下兩側之位置 處配置有平板式加熱器17a、17b。又，雖然省略圖示，但 配備有噴嘴等，該喷嘴用以朝加熱中之基板8呈霧狀地噴 射HMDS(Hexamethyldisilazane ’六甲基二矽胺烷）等抗触 劑覆膜之密著強化劑。 於冷卻處理部1C内設置有兼作為基板S之冷卻機構之上 述搬送輥14。亦即，冷卻處理部1 c構成為利用自基板s至 133835.doc 200919615 搬送輥14之熱傳導來冷卻基板s，因此，冷卻處理部1(：之 搬送輥14與其它處理部1A、1B之搬送輥14不同，以藉由 該熱傳導來有效地冷卻基板s之方式而構成該搬送輥14。 關於該點將於後文中詳述。On the other hand, the substrate cooling device of the present invention cools the substrate after the heat treatment, and has a hollow transfer roller configured to continuously support the substrate in the entire width direction of the substrate, and a liquid supply mechanism. The liquid for cooling is supplied to the inside of the transfer roller in a range in which the space ratio can be maintained, and the ventilation mechanism that ventilates the transfer roller at least during rotation. According to this apparatus, the liquid is introduced into the transfer roller by the liquid supply means, whereby the heat of the transfer roller is consumed as the vaporization heat of the liquid, and the transfer roller is cooled, and the transfer roller cooled in the above manner is used. By transferring the substrate, the substrate is cooled by heat conduction toward the transfer. The substrate is cooled by generating such heat transfer. In particular, the liquid is guided to the conveying roller so that the space is large, and the inside of the conveying roller is ventilated. Therefore, in the conveying roller, the liquid moves along the inner circumferential surface of the roller to form a liquid film. Or dropletization, whereby the surface area (area of the gas-liquid interface) increases. Therefore, the vaporization of the liquid is effectively promoted by the interaction of the increase in the surface area of the liquid with the above-described ventilation. Therefore, the heat transfer as described above is smoothly performed, thereby effectively cooling the substrate during transportation. Preferably, the liquid supply mechanism includes a nozzle that is inserted into the moving direction and extends in the axial direction thereof, and the nozzle supplies the liquid to a region of the conveying roller that supports at least the substrate. According to this configuration, it is particularly possible to collectively cool the portion in contact with the substrate 133835.doc 200919615 in the conveying roller. Therefore, the substrate can be efficiently cooled with a small amount of liquid. Further, it is preferable that the nozzles supply the liquid in a sentence in the longitudinal direction of the conveying roller. According to this configuration, it is possible to effectively prevent the temperature gradient from being generated along the longitudinal direction of the transport roller, and it is possible to uniformly cool the substrate. Further, as the liquid, various liquids can be used', but water is more effective in view of operability or running cost. Therefore, it is preferred that the liquid supply means supplies water as the liquid. Further, in the above configuration, a cooling mechanism for cooling the liquid before the liquid is supplied to the transfer roller is provided. According to this configuration, it is possible to absorb a larger amount of vaporization heat from the conveying roller by a small amount of liquid. Therefore, the conveying roller can be cooled more efficiently, whereby the cooling effect of the substrate is improved. [Effects of the Invention] According to the substrate cooling method of the request item i, and the substrate ΉΡ device of the claims 3 to 7, the circulation device of the cooling water having the cooling mechanism is not placed, and the transfer is effectively cooled and transported. The substrate in the middle. Therefore, the substrate can be cooled in a lower cost than the prior art substrate cooling device. [Embodiment] A preferred embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a substrate processing apparatus I33835.doc which schematically shows a substrate cooling device (substrate cooling device using the substrate cooling method of the present invention) Sectional view of the main part of 200919615. The substrate processing apparatus performs various processes on the glass substrate S (hereinafter referred to as a substrate s) for LCD and PDP in accordance with the process of photolithography. Therefore, the cleaning processing unit 1A for cleaning the substrate S is sequentially provided from the upstream side. The heat treatment unit 1B for heating the substrate s to a specific temperature and the cooling treatment unit 1 C (corresponding to the substrate cooling device of the present invention) for cooling the heated substrate s to a specific temperature. On the downstream side of the cooling treatment portion 1C, a resist coating portion or the like for forming a resist film on the substrate S is further provided. Each of the processing units 1A to 1C has a box-shaped processing tank 1 to 12 that communicates with each other via an opening for substrate transfer. In the inside of the processing tanks 10 to 12, the conveying roller 14 is provided at a predetermined interval, and the substrate S is conveyed in a horizontal posture, and the substrate S is sequentially transported from the cleaning processing unit 1a to the processing unit IB on the downstream side. 1C. In the cleaning processing unit 1A, a cleaning mechanism (not shown) for sequentially performing, for example, brushing, purging, and rinsing on the substrate 8 is provided, and is provided on the most downstream side of the cleaning processing unit 1A for rinsing. After the treatment, the eluent adhering to the substrate 8 is removed from the upper pair of air knives 16a, 16b. In the heat treatment portion 1B, the plate heaters 17a and 17b are disposed at the upper and lower sides of the cooling conveyance roller 14. Further, although not shown, a nozzle or the like is provided for ejecting the adhesion of the anti-contact agent film such as HMDS (Hexamethyldisilazane 'hexamethyldioxane) to the substrate 8 being heated. Agent. The conveying roller 14 is provided in the cooling processing unit 1C in a cooling mechanism that also serves as the substrate S. In other words, the cooling processing unit 1c is configured to cool the substrate s by heat conduction from the substrate s to the 133835.doc 200919615 transport roller 14, and therefore, the cooling processing unit 1 (the transport roller 14 and the other processing units 1A, 1B are transported) The roller 14 is different, and the transfer roller 14 is configured to effectively cool the substrate s by the heat conduction. This point will be described later in detail.

根據上述構成，於該基板處理裝置中，藉由驅動搬送輥 14而搬送基板s，同時於清洗處理部〗八中，藉由對基板$ 實施刷洗、吹洗以及淋洗等而清洗基板8，於加熱處理部 1B中，將基板S加熱至特定溫度（1〇〇t：〜13(rc)為止以除去 基板s之水分，於冷卻處理部1(：中，將基板8冷卻至特定溫 度（常溫）為止。此後，依序對基板s實施光致抗蝕劑之塗 布等基於光微影製程之剩餘處理。 圖2係概略地表示冷卻處理部lc之搬送輥14之構造之剖 面圖。如該圖所示，搬送輥14係貫通於其軸方向之中空形 狀之輥，且整體藉由熱傳導性優異之金屬材料⑽等）所構 成0 搬送輥14之前後兩端（圖2中為左右兩 理槽u之前後側板18、19上之開口⑴8 1Q 成處 上之開口部18a、而導出至處 理槽12的外部’且插入至分別與前後側㈣、19之外側連 接之機械室20中。於各機械室2〇内設置有支持構件22,上 述搬送㈣之兩端部經由軸承2杨支持於該等支持構件 22，藉此，搬送輥14以可旋轉之方式受到支持。繼而，於 搬送輥之後端部分固定有滑㈣，於該滑輪^架設有 驅動帶2，藉此旋轉驅動搬送輥14。 於搬送輥14之内部，插入右田、 播入有用以將冷卻水供給至該輥内 133835.doc -10· 200919615 上 之轴狀之噴嘴26。該喷嘴26貫穿搬送輥14，且兩端部支持 於各機械室2〇之侧壁，藉此配置於搬送㈣之大致中心轴 於噴嘴26中’沿著其長度方向以特定間隔排列設置有複 數個噴嘴口 26a，如圖3所示，構成為朝搬送輥内周面之圓 周方向上之特定部位（於圖示之示例中為朝下）噴灑自喷嘴 %之-端料人的冷卻水。噴嘴口施遍布設置於搬送親According to the above configuration, in the substrate processing apparatus, the substrate s is transported by driving the transport roller 14, and the substrate 8 is cleaned by brushing, purging, rinsing, or the like in the cleaning processing unit. In the heat treatment unit 1B, the substrate S is heated to a specific temperature (1 〇〇 t: 13 (rc) to remove moisture of the substrate s, and in the cooling treatment unit 1 (:, the substrate 8 is cooled to a specific temperature ( After that, the remaining processing by the photolithography process, such as application of a photoresist, to the substrate s is sequentially performed. Fig. 2 is a cross-sectional view schematically showing the structure of the transport roller 14 of the cooling processing unit 1c. As shown in the figure, the conveyance roller 14 is a hollow-shaped roller that penetrates in the axial direction, and is entirely composed of a metal material (10) or the like having excellent thermal conductivity. The front and rear ends of the 0 conveyance roller 14 (the left and right sides in Fig. 2) The opening (18) 8 1Q on the rear side panels 18, 19 before the treatment tank u is led out to the outside of the treatment tank 12 and inserted into the machine room 20 which is connected to the outer sides of the front and rear sides (4) and 19, respectively. Support structure is provided in each machine room 2〇 In the member 22, both end portions of the transport (4) are supported by the support members 22 via the bearing 2, whereby the transport roller 14 is rotatably supported. Then, the slide portion (four) is fixed to the rear end portion of the transport roller. The pulley frame is provided with a driving belt 2, whereby the conveying roller 14 is rotationally driven. Inside the conveying roller 14, a right field is inserted, and a shaft is inserted to supply cooling water to the shaft in the roller 133835.doc -10· 200919615 The nozzle 26 penetrates the conveying roller 14, and both end portions are supported by the side walls of the respective machine chambers 2, and are disposed at a substantially central axis of the conveying (4) in the nozzle 26 at a certain interval along the longitudinal direction thereof. A plurality of nozzle openings 26a are arranged in a row, and as shown in FIG. 3, a specific portion (downward in the illustrated example) in the circumferential direction of the inner circumferential surface of the conveying roller is sprayed from the nozzle-end-end person Cooling water. The nozzles are spread all over the place.

Ο Μ中包含處理槽12之前後側壁間之區域（至少支持基板8之 區域）上。 作為冷卻水係採用常溫之水。該冷卻水如圖2所示，藉 由泵28之驅動而自貯水罐3〇供給至噴嘴％。再者，於該冷 卻水之供給系統中，設置有包含控制其流量之電磁閥等之 仙量控制機構，於搬送輥1 4内，控制向所述噴嘴26供給之 冷部水之供給量，以於空間比率變大之範圍内將冷卻水供 給至搬送輥14内。亦即’於本實施形態中，該供給系統以 及所述噴嘴26等相當於本發明之液體供給機構。 噴嘴26之喷嘴口 26a例如形成為越遠離冷卻水之導入側 (圖2中為左側）則口徑變得越大，藉此，以於整個長度方向 上使冷卻水之噴出量大致均勻之方式而構成喷嘴26。 再者’機械室20之内部經由形成於其下部之排氣口 2〇a 以及排氣通路，藉由未圖示之負壓泵等而受到負壓抽吸， 藉此防止顆粒等經由開口部丨8a、i 9a自機械室2〇侵入至處 理槽12，並且能夠對搬送輥14内部進行換氣。亦即，於本 實施形態中，機械室20或負壓泵等相當於本發明之換氣機 I33835.doc 200919615 構。 藉由上述之構成，於冷卻處理部1C中，在搬送基板s之 過程中’藉由搬送輥14而對基板S進行冷卻處理。亦即， 於搬送基板S之過程中，藉由泵28之動作來將冷卻水供給 至噴嘴26 ’藉此向搬送輥14的内周面喷灑冷卻水。因此， 若於該狀態下，基板S於搬送輥14上移動，則藉由自基板s 至搬送輕14之熱傳導而對基板s進行冷卻，冷卻水吸收搬 送輥14之熱量，藉此對搬送輥14進行冷卻。亦即，進行此 種熱傳遞之結果為基板S受到冷卻。 此時’搬入至冷卻處理部1(：内之基板S處於i〇(rc〜13(rc 之高溫’因此搬送輥14亦成為接近於此之溫度。因此，如 上所述，若於空間比率變大之範圍内，將常溫之冷卻水供 給至搬送輥14，則該冷卻水會迅速地氣化，搬送輥14 量以此方式作為冷卻水之氣化熱量而受到消耗，藉此可有 效地對搬送輥14進行冷卻。尤其於該情形時，冷卻水會沿 者搬送輥14之内周面而於圓周方向上移動，從而液膜化或 者液滴化，藉此冷卻水之表面積（氣液界面之面積）增大。 因此，促進冷卻水之氣化（蒸發），從而能夠有效地對搬送 輥14進行冷卻。 、 再者，以上述方式於搬送輥14内產生之蒸氣伴隨機械室 内部之負壓㈣（雜送輥14内進行換氣）而朝搬送概u 之外部移冑，並且經由所述排氣口加而排出至外部。因 此，防止搬送親14内部因蒸氣而成為飽和狀態，藉此促進 搬送輥14内之冷卻水之氣化。繼而，以上述方式促進 133835.doc 200919615 水之氣化之結果為如上所述之熱傳遞順利地進行，藉此良 好地對搬送中之基板s進行冷卻。 再者，於如上所述之冷卻處理部丨c中，即使於搬入基板 S之前，亦驅動搬送輥14並將冷卻水導入至其内部，進而 藉由對搬送輥14内進行換氣而有效地冷卻搬送輥14。亦 即，於該情形時，由於冷卻水沿著輥内周面移動而液膜化 或者液滴化’藉此冷卻水之表面積增大，因此，藉由此種 冷卻水之表面積增大與上述換氣之相互作用而促進冷卻水 之氣化，其結果，有效地對搬送輥1 4進行冷卻。因此，能 夠有效地冷卻搬送輥14。 如上所述，上所述冷卻處理部1(：之構成係將常溫之冷卻 水導入至搬送輥14内並使其氣化，從而藉由吸收氣化熱來 冷卻搬送輥14，根據該構成，能夠以較少之水量來有效地 冷卻搬送輥14 ,而無需使用製冷劑事先對冷卻水進行冷 卻。而且，由於構成為直接將在搬送親14内氣化（蒸發）之 蒸氣排出至外部，因此無需使冷卻水相對於搬送輥14循環 之設備，進而，雖然將冷卻水導入至搬送輥14内，但是無 需用於防止液體自搬送輥洩漏之嚴密之密封構造。 因此，雖然利用自基板S至搬送輥14之熱傳導而有效地 冷卻基板S，但與先前之此種裝置相比，具有能夠以價格 更低廉之構成來高效率地冷卻基板S之效果，先前之此種 裝置係使冷卻水以密封不漏液之狀態於搬送輥内循環來冷 卻該輥，或者將冷氣噴射至搬送輥來冷卻該輥。 再者’以上所說明之冷卻處理部1C係本發明之基板冷卻 133835.doc -13- 200919615 、（實鉍本發明之基板冷卻方法之基板冷卻裝置）之較佳 實&形態的-例’其具體構成於不脫離本發明之宗旨之範 圍内可適當地變更。例如，亦可適用以下之構成。 例如，於上述實施形態中，採用越遠離冷卻水之導入側 (圖2中為左側）則噴嘴口 26a之口徑變得越大之構造，以使 冷卻水於噴嘴26之整個長度方向上之喷出量大致均句，但 除此之外如圖4所示’亦能夠採用例如噴嘴口 26a之口徑 均勻，且越遠離冷卻水之導入側則直徑尺寸越小之噴嘴構 ^於該構成之情形時，能夠使冷卻水之喷出量於噴嘴26 之整個長度方向上均勻。總之’只要能夠於長度方向上使 冷部水之噴出量均勻，則喷嘴26的構造可採用任何構造。 再者，於上述實施形態中，對自噴嘴26之長度方向一方側 導入冷卻水之示例進行了說明，但於自喷嘴26之兩端導入 冷卻水之情形時，可依照圖2或圖3之構造，採用使冷卻水 之喷出I於喷嘴26之整個長度方向上均勻之噴嘴構造。 又’於上述實施形態中’將作為冷卻水之常溫之水供給 至噴嘴26 ’但只要不妨礙事先對冷卻水進行冷卻之構成， 亦可於冷卻水之供給系統中，組裝對自貯水罐3〇供給之水 進行冷卻的冷卻裝置。即使為如此地事先對冷卻水進行冷 卻之構成’如上所述，由於冷卻處理部丨〇係於空間比率變 大之範圍内，將冷卻水供給至搬送輥14内之構成，故而與 使冷卻水於搬送輥内循環之一般之構成相比，亦即，與使 冷卻水以密封不漏液之狀態於搬送輥内循環來冷卻該輥的 先前裝置相比，供給至搬送輥14之冷卻水之水量少，且對 I33835.doc *14- 200919615 冷卻水進行冷卻所需之製冷劑 τ劑的量較少即可。因此，與先 前之裝置相比，用於對冷彻k 卩水進行冷卻之運行成本低，藉 此能夠以低成本來對基板s進行冷卻。 又於上述實施办態中，藉由對機械室内進行抽吸排 氣，而促進於搬送輥14内產生之蒸氣排^外部’以此方 式來構成本發明之換氣機構，但換氣機構之構成並不限定 於此。例如’亦可構成為如下-步於搬送報U之一端 側設置送風機等，強制性地將空氣吹入至搬送報14内，藉 此促進蒸氣排出至外部。 又，於上述實施形態中1基板8以水平姿勢搬送並進 行冷卻，當然，亦可將基板s以傾斜姿勢（於與搬送方向正 交之方向上’自其_方側朝3 —側傾斜之姿勢）搬送並進 行冷卻。於該情形時，可構成為如下：設置將冷卻水供給 至搬送輥14的上位側之端部之噴嘴，以代替例如貫穿搬送 輥14之如實施形態般之喷嘴26，使冷卻水沿著搬送輥“之 内底面自其上位側流下。根據該構成，冷卻水於搬送輥14 内部流下時，會自搬送輥14吸收氣化熱而氣化，因此能夠 與水平地搬送基板S之情形相同地對搬送輥14進行冷卻。 再者’如上所述’於使冷卻水沿著搬送輥14流下之情形 時’亦可設置排出機構，排出機構於搬送輥丨4的端部接受 未氣化而流下之冷卻水，並將該冷卻水排出至外部。此構 成亦能夠用於上述實施形態之構成中。 【圖式簡單說明】 圖1係表示組裝有本發明之基板冷卻裝置（使用本發明之 133835.doc 200919615 基板冷卻方法之基板冷卻裝置）之基板處理裝置之主要部 分的剖面示意圖。 圖2係表示冷卻處理部（本發明之基板冷卻裝置）之構成 的剖面圖（圖1之A-A線剖面圖）。 圖3係搬送輥之剖面圖。 圖4係表示搬送報之其它構成之剖面圖。 【主要元件符號說明】 1A 清洗處理部 1B 加熱處理部 ic 冷卻處理部 10〜12 處理槽 14 搬送輥 26 喷嘴 30 貯水罐 S 基板 133835.doc -16-The Ο 包含 includes an area between the rear side walls (at least the area supporting the substrate 8) before the processing tank 12. As the cooling water system, water of normal temperature is used. This cooling water is supplied from the water storage tank 3 to the nozzle % as shown in Fig. 2 by the pump 28. Further, in the cooling water supply system, a control unit including a solenoid valve that controls the flow rate thereof is provided, and the supply amount of the cold water supplied to the nozzle 26 is controlled in the transfer roller 14. The cooling water is supplied into the conveying roller 14 in a range in which the space ratio is increased. That is, in the present embodiment, the supply system and the nozzles 26 and the like correspond to the liquid supply mechanism of the present invention. The nozzle opening 26a of the nozzle 26 is formed, for example, so as to be larger in diameter from the introduction side (the left side in FIG. 2) of the cooling water, thereby making the discharge amount of the cooling water substantially uniform throughout the longitudinal direction. The nozzle 26 is formed. Further, the inside of the machine room 20 is suctioned by a negative pressure pump (not shown) via an exhaust port 2〇a and an exhaust passage formed in a lower portion thereof, thereby preventing particles and the like from passing through the opening. The crucibles 8a and 9a intruded into the treatment tank 12 from the machine room 2, and the inside of the conveyance roller 14 can be ventilated. That is, in the present embodiment, the machine room 20, the negative pressure pump, and the like correspond to the ventilator I33835.doc 200919615 of the present invention. According to the above configuration, in the cooling processing unit 1C, the substrate S is cooled by the transfer roller 14 during the transfer of the substrate s. That is, during the transfer of the substrate S, the cooling water is supplied to the nozzle 26 by the operation of the pump 28, whereby the cooling water is sprayed onto the inner peripheral surface of the transfer roller 14. Therefore, when the substrate S moves on the conveying roller 14 in this state, the substrate s is cooled by the heat conduction from the substrate s to the conveying light 14, and the cooling water absorbs the heat of the conveying roller 14, thereby the conveying roller 14 is cooled. That is, as a result of performing such heat transfer, the substrate S is cooled. At this time, 'the substrate S is moved to the cooling processing unit 1 (the substrate S in the inside is i 〇 (rc 〜 13 (the high temperature of rc), so the conveying roller 14 also has a temperature close to this. Therefore, as described above, if the space ratio is changed In the large range, when the cooling water of normal temperature is supplied to the conveying roller 14, the cooling water is rapidly vaporized, and the conveying roller 14 is consumed as the vaporization heat of the cooling water in this manner, thereby effectively effectively The conveying roller 14 performs cooling. Especially in this case, the cooling water moves in the circumferential direction along the inner circumferential surface of the conveying roller 14, thereby liquid filming or dropletizing, whereby the surface area of the cooling water (gas-liquid interface) Therefore, the vaporization of the cooling water is promoted (evaporation), and the conveying roller 14 can be efficiently cooled. Further, the steam generated in the conveying roller 14 as described above is accompanied by the negative inside the machine chamber. The pressure (4) (air exchange in the misfeeding roller 14) is moved to the outside of the conveyance u, and is discharged to the outside through the exhaust port. Therefore, the inside of the transporting parent 14 is prevented from being saturated by the steam, and the borrowing is prevented. This promotes the conveying roller 14 The gasification of the cooling water is carried out. Then, as a result of promoting the gasification of 133835.doc 200919615 water in the above manner, the heat transfer as described above is smoothly performed, whereby the substrate s in the conveyance is cooled well. In the cooling processing unit 丨c as described above, the transfer roller 14 is driven to introduce the cooling water into the inside of the cooling processing unit 丨c, and the conveying roller is effectively cooled by ventilating the inside of the conveying roller 14. 14. In this case, since the cooling water moves along the inner circumferential surface of the roller to be liquid-filmed or dropletized, the surface area of the cooling water is increased, so that the surface area of the cooling water is increased. The vaporization of the cooling water is promoted by the interaction with the above-described ventilation, and as a result, the conveying roller 14 is effectively cooled. Therefore, the conveying roller 14 can be efficiently cooled. As described above, the cooling processing unit 1 described above In the configuration, the cooling water at normal temperature is introduced into the transfer roller 14 and vaporized, and the transfer roller 14 is cooled by absorbing heat of vaporization. According to this configuration, the transfer roller can be efficiently cooled with a small amount of water. 14 and The cooling water is cooled in advance without using a refrigerant. Further, since the vapor that is vaporized (evaporated) in the transfer parent 14 is directly discharged to the outside, there is no need to circulate the cooling water with respect to the transfer roller 14, and further, Although the cooling water is introduced into the conveying roller 14, there is no need for a tight sealing structure for preventing the liquid from leaking from the conveying roller. Therefore, although the substrate S is effectively cooled by heat conduction from the substrate S to the conveying roller 14, the same as before Compared with such a device, the device has the effect of efficiently cooling the substrate S at a lower cost, and the prior device cools the roller by circulating the cooling water in a state in which the cooling water is sealed and not leaking. Or cooling the roller by cooling air to the conveying roller. Further, the cooling processing unit 1C described above is the substrate cooling of the present invention 133835.doc -13- 200919615, (substrate cooling of the substrate cooling method of the present invention) The preferred embodiment of the present invention can be appropriately modified without departing from the spirit and scope of the invention. For example, the following constitution can also be applied. For example, in the above-described embodiment, the structure in which the diameter of the nozzle opening 26a becomes larger as the distance from the introduction side (the left side in FIG. 2) of the cooling water is increased, so that the cooling water is sprayed over the entire length of the nozzle 26. The amount of the discharge is substantially the same, but in addition to the above, as shown in FIG. 4, for example, the nozzle opening 26a has a uniform diameter, and the farther away from the introduction side of the cooling water, the smaller the diameter of the nozzle is constructed. At this time, the discharge amount of the cooling water can be made uniform over the entire length direction of the nozzle 26. In short, the configuration of the nozzle 26 can adopt any configuration as long as the discharge amount of the cold portion water can be made uniform in the longitudinal direction. In the above embodiment, an example in which the cooling water is introduced from one side in the longitudinal direction of the nozzle 26 has been described. However, when cooling water is introduced from both ends of the nozzle 26, it can be in accordance with FIG. 2 or FIG. The configuration is such that a nozzle structure in which the discharge of the cooling water I is uniform over the entire length of the nozzle 26 is employed. Further, in the above-described embodiment, 'the normal temperature water as the cooling water is supplied to the nozzle 26'. However, the self-storage tank 3 may be assembled in the cooling water supply system as long as it does not prevent the cooling water from being cooled in advance. A cooling device that supplies water for cooling. In the configuration in which the cooling water is cooled in advance as described above, since the cooling treatment unit is configured to supply the cooling water to the conveying roller 14 because the space ratio is increased, the cooling water is supplied. The cooling water supplied to the conveying roller 14 is compared with the conventional device that circulates in the conveying roller, that is, in comparison with the prior device that circulates the cooling water in a state in which the cooling water is circulated in the conveying roller to cool the roller. The amount of water required is small, and the amount of refrigerant tau required for cooling the cooling water of I33835.doc *14-200919615 is small. Therefore, the operation cost for cooling the cold k water is lower than that of the prior device, whereby the substrate s can be cooled at a low cost. Further, in the above-described embodiment, the ventilating mechanism of the present invention is configured in such a manner that the vapor venting generated in the conveying roller 14 is promoted by suctioning and exhausting the inside of the machine chamber, but the ventilating mechanism is The configuration is not limited to this. For example, it is also possible to provide a blower or the like on the one end side of the transport newspaper U, and to forcibly blow air into the transport newspaper 14, thereby promoting the discharge of the steam to the outside. Further, in the above-described embodiment, the substrate 1 is transported and cooled in a horizontal posture. Of course, the substrate s may be inclined in the oblique direction (in the direction orthogonal to the transport direction) from the side to the side of the third side. Position) Transfer and cool. In this case, it is possible to provide a nozzle that supplies cooling water to the end portion of the upper side of the conveying roller 14 instead of, for example, the nozzle 26 that penetrates the conveying roller 14 as in the embodiment, and transports the cooling water along the cooling water. In the case where the cooling water flows down inside the conveying roller 14, the cooling water absorbs the heat of vaporization and vaporizes the cooling water. Therefore, the bottom surface of the roller can be vaporized by the conveying roller 14, so that the substrate S can be conveyed horizontally. The conveyance roller 14 is cooled. When the cooling water flows down the conveyance roller 14 as described above, a discharge mechanism may be provided, and the discharge mechanism may be discharged at the end of the conveyance roller 4 without being vaporized. Cooling water and discharging the cooling water to the outside. This configuration can also be used in the configuration of the above embodiment. [Schematic description of the drawings] Fig. 1 shows a substrate cooling device incorporating the present invention (using the 133835 of the present invention) .doc 200919615 A schematic diagram of a main part of a substrate processing apparatus for a substrate cooling device of the substrate cooling method. Fig. 2 shows a cooling processing unit (substrate cooling device of the present invention) Fig. 3 is a cross-sectional view showing a conveyance roller. Fig. 4 is a cross-sectional view showing another configuration of the conveyance report. [Description of main components] 1A Cleaning processing unit 1B Heating processing unit Ic cooling processing unit 10 to 12 processing tank 14 conveying roller 26 nozzle 30 water tank S substrate 133835.doc -16-

Claims (1)

200919615 十、申請專利範圍： 1. 一種基板冷卻方法，其特徵在於：其係對加熱處理後之 基板進行冷卻者， 於藉由搬送輥來搬送上述基板之同時，將冷卻用之液 體導入至該搬送輥之内部，使該液體伴隨上述搬送輥之 \ 旋轉而氣化，將該蒸氣排出至上述搬送輥之外部，藉此 . 經由上述搬送輥來冷卻上述基板。 2. 如明求項1之基板冷卻方法，其中將常溫之水作為上述 (} 液體而導入至上述搬送輥内。 3· —種基板冷卻裝置，其特徵在於：其係對加熱處理後之 基板進行冷卻者，且具有： 中空之搬达輥，其構成為於上述基板之整個寬度方向 上連續地支持上述基板； 液體供給機構，其於空間比率變大之範圍内，將冷卻 用之液體供給至上述搬送輥之内部；以及 換氣機構，其對至少於旋轉中之上述搬送輥内進行換 〇 氣。 4. 如請求項3之基板冷卻裝置，其中上述液體供給裝置包 含插入至搬送輥内且沿其軸方向延伸之噴嘴，該噴嘴將 上述液體供給至上述搬送輥中至少支持基板之區域。 5. 如請求項4之基板冷卻裝置，其中上述噴嘴於上述搬送 親之長度方向上均勾地供給上述液體。 6. 如請求項3至5中任一項之基板冷卻裝置，其中上述液體 供給機構供給水作為上述液體。 133835.doc 200919615 7.如請求項3至5中任一項之基板冷卻裝置，其中具有對朝 上述搬送輥供給之前之上述液體進行冷卻之冷卻裝置。200919615 X. Patent application scope: 1. A method for cooling a substrate, which is characterized in that, after cooling the substrate after the heat treatment, the substrate is transported by the transfer roller, and the liquid for cooling is introduced into the substrate. The inside of the transfer roller is vaporized by the rotation of the transfer roller, and the vapor is discharged to the outside of the transfer roller, whereby the substrate is cooled by the transfer roller. 2. The substrate cooling method according to claim 1, wherein the water of normal temperature is introduced into the transfer roller as the liquid (1). The substrate cooling device is characterized in that it is a substrate after heat treatment. The cooling device includes: a hollow transfer roller configured to continuously support the substrate in the entire width direction of the substrate; and a liquid supply mechanism that supplies the liquid for cooling within a range in which the space ratio is increased. And a ventilating mechanism that converts the argon gas into the transfer roller at least during rotation. The substrate cooling device of claim 3, wherein the liquid supply device is inserted into the transfer roller And a nozzle extending in an axial direction thereof, wherein the nozzle supplies the liquid to at least a region of the support roller. 5. The substrate cooling device of claim 4, wherein the nozzle is hooked in a length direction of the transporting parent The substrate cooling device according to any one of claims 3 to 5, wherein the liquid supply mechanism supplies water as the upper Liquid. 133835.doc 200919615 7. The substrate cooling device according to any one of items 3 to 5 requests, wherein said liquid prior to having the conveying roller toward the feeding of the cooling device that cools. 133835.doc133835.doc
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