TWI441117B - And a substrate processing apparatus and method for manufacturing a flat panel display - Google Patents
And a substrate processing apparatus and method for manufacturing a flat panel display Download PDFInfo
- Publication number
- TWI441117B TWI441117B TW098117018A TW98117018A TWI441117B TW I441117 B TWI441117 B TW I441117B TW 098117018 A TW098117018 A TW 098117018A TW 98117018 A TW98117018 A TW 98117018A TW I441117 B TWI441117 B TW I441117B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cooling
- flat panel
- panel display
- substrate processing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Description
本發明係有關用以進行基板處理之裝置,更詳細而言,係有關使用於平面顯示器(flat p anel display)之製造的基板處理裝置及方法。The present invention relates to an apparatus for performing substrate processing, and more particularly to a substrate processing apparatus and method for manufacturing a flat panel display.
近年來,為了持有種種形態的功能以及更快的資訊處理速度,資訊處理機器正急速發展。此種資訊處理裝置係為了顯示所處理的資訊而具有顯示裝置。現在,以顯示裝置而言,液晶顯示裝置、有機EL顯示裝置、電漿顯示裝置之類的平面顯示裝置受到矚目。In recent years, information processing machines are rapidly developing in order to hold various forms of functions and faster information processing speed. Such an information processing device has a display device for displaying the processed information. Now, in the display device, a flat display device such as a liquid crystal display device, an organic EL display device, or a plasma display device has been attracting attention.
此種平面顯示裝置係在基板上包含多層的薄膜及配線圖案。薄膜及配線的形成主要係利用光刻製程。在光刻製程中,包含加熱步驟及冷卻步驟之烘烤製程,一般而言至少進行兩次以上。而,隨著基板的尺寸大型化,不僅基板迅速的加熱及冷卻變難,而且有大型化的基板之處理性顯著變低的問題。Such a flat display device includes a plurality of thin films and wiring patterns on a substrate. The formation of thin films and wiring is mainly by a photolithography process. In the lithography process, the baking process including the heating step and the cooling step is generally performed at least twice or more. On the other hand, as the size of the substrate is increased, not only is the substrate heated and cooled rapidly, but also the size of the substrate is significantly reduced.
本發明係提供一種使用於平面顯示器之製造的基板處理裝置及方法,係可使基板的冷卻效率極大化。The present invention provides a substrate processing apparatus and method for use in the manufacture of a flat panel display, which maximizes the cooling efficiency of the substrate.
本發明係提供一種使用於平面顯示器之製造的基板處理裝置及方法,係可一邊精密地維持使基板間接冷卻的冷卻板與基板之間的間隔且一邊使基板冷卻。The present invention provides a substrate processing apparatus and method for manufacturing a flat panel display, which can cool a substrate while precisely maintaining a space between a cooling plate that indirectly cools a substrate and a substrate.
本發明所欲解決之課題不限定於此,未提到以及其他的課題,由以下的記載,該領域中具有通常知識者便可明確理解。The subject matter to be solved by the present invention is not limited thereto, and other problems that are not mentioned and other problems are clearly described by those having ordinary knowledge in the field.
本發明係提供一種使用於平面顯示器之製造的基板處理裝置及方法。依據本發明的一實施形態,基板處理裝置係包含:輸送帶構件,係具有用以進行基板搬運之複數個搬運軸心;冷卻構件,係以非接觸方式來冷卻利用前述輸送帶構件所搬運之基板;以及間隔維持構件,係維持前述基板與前述冷卻構件之間的間隔以使基板不與前述冷卻構件接觸。The present invention provides a substrate processing apparatus and method for use in the manufacture of a flat panel display. According to an embodiment of the present invention, a substrate processing apparatus includes: a conveyor belt member having a plurality of conveyance shafts for conveying a substrate; and a cooling member that is conveyed by the conveyor belt member in a non-contact manner And a spacer maintaining member that maintains a space between the substrate and the cooling member such that the substrate does not contact the cooling member.
依據本發明的實施形態,前述間隔維持構件包含:支撐台,係以可調解高度之方式設置在設備框架;以及圓型球輪(Ball caster),係設置在前述支撐台的上端,且在前述搬運軸心間支撐前述基板的底面。According to an embodiment of the present invention, the interval maintaining member includes: a support table disposed at an apparatus frame in a height adjustable manner; and a ball caster disposed at an upper end of the support table, and The bottom surface of the substrate is supported between the transport shafts.
依據本發明的實施形態,前述冷卻構件包含:冷卻流體供應源以及冷卻板,該冷卻板係位於前述搬運軸心間,而藉由從前述冷卻流體供應源所提供的冷卻流體進行冷卻。According to an embodiment of the present invention, the cooling member includes a cooling fluid supply source and a cooling plate disposed between the transfer shafts and cooled by a cooling fluid supplied from the cooling fluid supply source.
依據本發明之實施形態,前述冷卻構件復包含裝設孔,係形成在前述冷卻板,且於前述圓型球輪所在之處。According to an embodiment of the present invention, the cooling member includes a mounting hole formed in the cooling plate and at a position where the circular ball wheel is located.
依據本發明的實施形態,前述冷卻構件包含:冷卻板,係位於前述搬運軸心間,且形成有前述圓型球輪所在之處的裝設孔;以及複數個冷卻管,係以前述裝設孔為中心而緊貼於前述冷卻板的底面兩側而設置,且讓從冷卻流體供應源所提供之冷卻流體流動者。According to an embodiment of the present invention, the cooling member includes: a cooling plate disposed between the conveyance axis and having a mounting hole where the circular ball wheel is located; and a plurality of cooling pipes connected by the foregoing The holes are centered and are placed in close contact with the sides of the bottom surface of the aforementioned cooling plate, and allow the cooling fluid supplied from the cooling fluid supply source to flow.
依據本發明的實施形態,前述圓型球輪係從前述冷卻板的裝設孔上部突出,且支撐藉由前述輸送帶構件搬運之基板的底面。According to an embodiment of the present invention, the circular spherical wheel train protrudes from an upper portion of the mounting hole of the cooling plate and supports a bottom surface of the substrate conveyed by the conveying belt member.
依據本發明之實施形態,前述間隔維持構件係將基板與前述冷卻構件之間維持隔離0.6至0.2mm。According to an embodiment of the present invention, the interval maintaining member maintains a separation between the substrate and the cooling member by 0.6 to 0.2 mm.
依據本發明的實施形態,前述搬運軸心包含:搬運軸以及滾輪,該滾輪係設置在前述搬運軸,且與基板接觸,而前述滾輪具備一流路,係讓從冷卻流體供應源提供之冷卻流體流動者。According to an embodiment of the present invention, the transport axis includes a transport shaft and a roller, the roller is disposed on the transport shaft and is in contact with the substrate, and the roller has a first-class path for cooling fluid supplied from a cooling fluid supply source Migrants.
依據本發明的實施形態,前述滾輪係比與基板傳送方向正交的基板之一邊的長度還長。According to an embodiment of the present invention, the roller is longer than a length of one side of the substrate orthogonal to the substrate transport direction.
本發明之用以進行平面顯示器製造之基板處理裝置係包含:塗佈單元,係在基板塗佈感光液;曝光單元,係在基板照射圖案而曝光;顯影單元,係將基板予以顯影;以及烘烤單元,係對基板進行加熱處理且進行冷卻處理。而前述烘烤單元包含:輸送帶構件,係具有用以進行基板搬運之複數個搬運軸心;加熱構件,係對利用前述輸送帶構件搬運的基板進行加熱;冷卻構件,係以非接觸方式對藉由前述加熱構件加熱之基板予以冷卻;以及間隔維持構件,係維持前述基板與前述冷卻構件之間的間隔以使基板不與前述冷卻構件接觸。The substrate processing apparatus for manufacturing a flat panel display according to the present invention comprises: a coating unit for applying a photosensitive liquid on a substrate; an exposure unit for exposing the pattern to the substrate; a developing unit for developing the substrate; and baking The baking unit heats the substrate and performs cooling treatment. The baking unit includes: a conveyor belt member having a plurality of conveying shafts for conveying the substrate; a heating member for heating the substrate conveyed by the conveyor belt member; and a cooling member in a non-contact manner The substrate heated by the heating member is cooled; and the interval maintaining member maintains a space between the substrate and the cooling member so that the substrate does not come into contact with the cooling member.
依據本發明的實施形態,前述間隔維持構件包含:支撐台,係設置在設備框架而可調解高度;以及圓型球輪(Ball caster),係設置在前述支撐台的上端,而在前述搬運軸心間支撐前述基板的底面。According to an embodiment of the present invention, the interval maintaining member includes: a support table that is disposed in the equipment frame to adjust a height; and a ball caster that is disposed at an upper end of the support table and on the transport shaft The bottom surface of the aforementioned substrate is supported between the cores.
依據本發明的實施形態,前述冷卻構件包含:冷卻流體供應源以及冷卻板,該冷卻板係設置在前述搬運軸心間,藉由從前述冷卻流體供應源所提供之冷卻流體進行冷卻,而前述冷卻板包含裝設孔,係以前述圓型球輪的一部分從上面突出而形成。According to an embodiment of the present invention, the cooling member includes a cooling fluid supply source and a cooling plate disposed between the transfer shafts and cooled by a cooling fluid supplied from the cooling fluid supply source. The cooling plate includes a mounting hole formed by projecting a part of the circular round wheel from above.
在本發明之用以進行平面顯示器製造之基板處理方法中,基板係一邊藉由輸送帶構件的搬運軸心傳送,而一邊藉由位於前述搬運軸心間的冷卻構件進行冷卻,而基板藉由位於前述搬運軸心間之間隔維持構件而在與前述冷卻構件維持一定間隔之狀態下一邊傳送一邊進行冷卻。In the substrate processing method for manufacturing a flat panel display according to the present invention, the substrate is cooled by a cooling member located between the conveyance axes while being conveyed by the conveyance axis of the conveyance belt member, and the substrate is cooled by the substrate. The space maintaining member located between the conveyance shafts is cooled while being conveyed while maintaining a predetermined interval with the cooling member.
依據本發明的實施形態,基板與前述冷卻構件之間隔的維持係利用圓型球輪來進行。According to the embodiment of the present invention, the maintenance of the interval between the substrate and the cooling member is performed by a round ball.
依據本發明的實施形態,前述間隔維持構件,係將基板與前述冷卻構件之間維持隔離0.6至0.2mm。According to an embodiment of the present invention, the interval maintaining member maintains a separation between the substrate and the cooling member by 0.6 to 0.2 mm.
依據本發明,可使基板的冷卻效率極大化。According to the present invention, the cooling efficiency of the substrate can be maximized.
此外,依據本發明,可一邊精密地維持對基板進行間接冷卻的冷卻板與基板之間的間隔且一邊對基板進行冷卻。Further, according to the present invention, it is possible to cool the substrate while precisely maintaining the interval between the cooling plate and the substrate which indirectly cool the substrate.
以下,參照附加的第一圖至第八圖更詳細地說明本發明的實施形態。本發明的實施形態,係可替代為種種形態,而不得解釋為本發明的範圍限定在下列實施形態。本實施形態係為了更完整說明本發明而提供給本業界之具有通常知識者。因此,圖示之元件的形狀,為了強調更明確的說明而有誇大之處。Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying first to eighth drawings. The embodiments of the present invention are not limited to the embodiments, and the scope of the present invention is not limited to the following embodiments. This embodiment is intended to provide a more complete description of the present invention to those of ordinary skill in the art. Therefore, the shape of the elements shown is exaggerated in order to emphasize a more explicit description.
此外,在本發明的實施形態中舉使用在光刻設備之烘烤裝置為例加以說明。Further, in the embodiment of the present invention, a baking apparatus used in a lithographic apparatus will be described as an example.
在本實施形態中,基板係用以製造平面顯示器(flat panel display,以下簡稱「FPD」)元件者,而FPD可為LCD(L iquid Crystal Display,液晶顯示器)、PDP(Plasma Displ ay,電漿顯示器)、VFD(Vacuum Fl uorescent Display,真空螢光顯示器)、FED(Field Emission Display,場發射顯示器)、ELD(Ele ctro Luminescence Disp lay,電激發光顯示器)。In this embodiment, the substrate is used to manufacture a flat panel display (hereinafter referred to as "FPD") component, and the FPD may be an LCD (Liquid Crystal Display), a PDP (Plasma Displ ay, plasma). Display), VFD (Vacuum Fl uorescent Display), FED (Field Emission Display), ELD (Ele ctro Luminescence Disp, electroluminescent display).
本發明之基板處理裝置(apparatus for treating substrat e),係在光刻製程中用以對基板進行加熱冷卻所使用之烘烤裝置。The substrate processing apparatus (apparatus for treating substrate) of the present invention is a baking apparatus used for heating and cooling a substrate in a photolithography process.
如第八圖所示,用以進行光刻製程之設備1,係歷經下列順序在基板形成預定的電路圖案,即利用光刻技術在基板塗佈光阻膜的塗佈單元2、將此進行乾燥熱處理後進行曝光處理的單元3、進行顯影處理的單元4之順序。在此種光刻製程中,必需有一種進行下列熱處理之烘烤裝置10,該等熱處理包含:在塗佈光阻膜於基板前提高基板的溫度均等性之熱處理;塗佈光阻膜後對光阻膜進行加熱來去除不必要的溶劑之熱處理(預烤);用以促進曝光處理後因曝光引起之光阻膜的化學變化之曝光後烘烤處理;以及顯影處理後兼具顯影圖案的固定與基板的乾燥之熱處理(後烘烤),而本發明之烘烤裝置可適用於此種熱處理。As shown in FIG. 8 , the apparatus 1 for performing a photolithography process forms a predetermined circuit pattern on a substrate in the following sequence, that is, a coating unit 2 that coats a photoresist film on a substrate by photolithography; The order of the unit 3 subjected to the exposure treatment after the drying heat treatment and the unit 4 subjected to the development processing. In such a photolithography process, there is a need for a baking apparatus 10 for performing the following heat treatment, which comprises: heat treatment for increasing the temperature uniformity of the substrate before coating the photoresist film on the substrate; coating the photoresist film after the coating Heat treatment (pre-bake) of the photoresist film to remove unnecessary solvent; post-exposure bake treatment for promoting chemical change of the photoresist film caused by exposure after exposure treatment; and development pattern after developing treatment The heat treatment (post-baking) of the drying of the substrate is fixed, and the baking apparatus of the present invention can be applied to such heat treatment.
第一圖係本發明的實施形態之烘烤裝置的方塊圖。第二圖係顯示第一圖所圖示之加熱區之概略性構造之側視圖,第三圖係顯示第一圖所圖示之冷卻區之概略性構造之側視圖。The first figure is a block diagram of a baking apparatus according to an embodiment of the present invention. The second drawing shows a side view of a schematic configuration of the heating zone illustrated in the first figure, and the third figure shows a side view of the schematic configuration of the cooling zone illustrated in the first figure.
參照第一圖,本發明的實施形態之烘烤裝置10,係區分為對基板進行加熱處理之加熱區A、以及進行冷卻處理之冷卻區B。Referring to the first drawing, the baking apparatus 10 according to the embodiment of the present invention is divided into a heating zone A for heat-treating the substrate and a cooling zone B for performing cooling treatment.
參照第一圖及第二圖,加熱區A由預熱部100與主加熱部200所構成,而在預熱部100與主加熱部200,設置第一輸送帶構件300,係以幾近於水平狀態於水平方向搬運基板。於預熱部100係提供用以對基板進行加熱之加熱機構,而此加熱機構係由個別設置在第一輸送帶構件300之基板搬運路徑上的上部與下部之上部加熱器110與下部加熱器120所構成。然後,亦在主加熱部200提供對基板進行加熱之加熱機構,而提供到主加熱部200之加熱機構,係由僅設置在第一輸送帶構件300之基板搬運路徑上的下部之下部加熱器220所構成。上部加熱器110與下部加熱器120、220係平板形態的加熱器,使用活用有M. I Cable(Mineral Ins ulated Cable,礦物絕緣電纜)之I R加熱器。另一方面,預熱部100與主加熱部200之下部加熱器120、220,配置在第一輸送帶構件300的搬運軸心310之間,而位於基板的底面之附近。Referring to the first and second figures, the heating zone A is composed of the preheating section 100 and the main heating section 200, and in the preheating section 100 and the main heating section 200, the first conveyor belt member 300 is disposed, which is close to The substrate is transported horizontally in a horizontal state. The preheating unit 100 is provided with a heating mechanism for heating the substrate, and the heating mechanism is provided by upper and lower upper heaters 110 and lower heaters individually disposed on the substrate conveying path of the first conveyor belt member 300. 120 constitutes. Then, a heating mechanism for heating the substrate is also provided in the main heating portion 200, and a heating mechanism provided to the main heating portion 200 is provided by a lower lower heater provided only on the substrate conveyance path of the first conveyor member 300. 220 is composed. The upper heater 110 and the lower heaters 120 and 220 are heaters in the form of a flat plate, and an I R heater using an M. I Cable (Mineral Insulated Cable) is used. On the other hand, the preheating unit 100 and the lower heaters 120 and 220 of the main heating unit 200 are disposed between the conveyance axis 310 of the first conveyor belt member 300 and are located in the vicinity of the bottom surface of the substrate.
參照第一圖及第三圖,冷卻區B係由預冷部400與主冷卻部500所構成,而與加熱區A類似,而在預冷部400與主冷卻部500,設置第二輸送帶構件600,其係以大致為水平狀態將基板搬運於水平方向。Referring to the first and third figures, the cooling zone B is composed of the pre-cooling section 400 and the main cooling section 500, and is similar to the heating zone A, and the second conveyor zone is provided in the pre-cooling section 400 and the main cooling section 500. The member 600 transports the substrate in a horizontal direction in a substantially horizontal state.
如第三圖及第四圖所示,於設置在冷卻區B之第二輸送帶構件600,隔著一定的間隔具備複數支搬運軸心610。搬運軸心610係直接或間接地連結在馬達等之驅動源(未圖示)且藉由驅動源的驅動而旋轉。藉此方式,朝搬運軸心610上之基板搬運方向搬運基板。搬運軸心610係包含具有比基板的一邊還大的一邊之滾輪620,而作為使基板冷卻之冷卻媒體而運作。更具體說明時,搬運軸心610的滾輪620,具有從第一冷卻流體供應源630提供之冷卻流體流動之流路622,且在搬運軸心610的一端設置與第一冷卻流體供應源630的供應線632連結之埠。藉此方式,搬運軸心610的滾輪620一邊藉由冷卻流體冷卻到一定溫度以下且一邊作為與基板直接接觸而冷卻的冷卻機構而運作。如此,在藉由搬運軸心610搬運之過程,基板S透過與滾輪620接觸來進行冷卻處理。通過搬運軸心610之冷卻流體,介由回收線634而回收到第一冷卻流體供應源630,且利用冷卻器(Chiller)冷卻後,又介由供應線632供應給搬運軸心610。As shown in the third and fourth figures, the second conveyor belt member 600 provided in the cooling zone B is provided with a plurality of conveying shaft cores 610 at regular intervals. The conveyance shaft 610 is directly or indirectly coupled to a drive source (not shown) such as a motor and is rotated by driving of a drive source. In this way, the substrate is transported in the substrate transport direction on the transport axis 610. The transport axis 610 includes a roller 620 having a larger side than one side of the substrate, and operates as a cooling medium for cooling the substrate. More specifically, the roller 620 of the transport shaft 610 has a flow path 622 through which the cooling fluid supplied from the first cooling fluid supply source 630 flows, and is disposed at one end of the transport shaft 610 with the first cooling fluid supply source 630. The supply line 632 is connected. In this manner, the roller 620 of the conveyance shaft 610 is operated by being cooled by a cooling fluid to a temperature lower than a certain temperature and cooling as a direct contact with the substrate. As described above, the substrate S is brought into contact with the roller 620 to perform cooling processing while being conveyed by the conveyance axis 610. The cooling fluid passing through the shaft 610 is recovered to the first cooling fluid supply source 630 via the recovery line 634, and is cooled by a cooler and supplied to the conveying shaft 610 via the supply line 632.
再者參照第三圖,在預冷部400中,藉由噴射冷卻空氣之空氣冷卻,以及以前述第二輸送帶構件600的搬運軸心610作為冷卻媒體之軸心接觸冷卻方式來使基板冷卻。然後,在主冷卻部500中,藉由以第二輸送帶構件600的搬運軸心610作為冷卻媒體之搬運軸心610接觸冷卻方式、以及冷卻構件700之間接冷卻方式使基板冷卻。Referring to the third diagram, in the pre-cooling section 400, the substrate is cooled by air cooling by jetting cooling air, and by the transport axis 610 of the second conveyor belt member 600 as the axial contact cooling mode of the cooling medium. . Then, in the main cooling unit 500, the substrate is cooled by the contact cooling method in which the conveyance axis 610 of the second conveyor belt member 600 serves as the cooling medium, and the cooling method between the cooling members 700.
在預冷部400中,將用以使基板急速冷卻而噴射冷卻空氣於基板之空氣冷卻構件410設置在基板搬運路徑的上部。空氣冷卻構件410包含:多數噴嘴412,係為了噴射冷卻空氣到基板的表面而並列設置在與基板搬運方向正交的方向;以及冷卻空氣供應源414,係供應冷卻空氣到噴嘴412。雖未圖示,而於預冷部與主冷卻部的腔室全長設置風機過濾器單元(FFU)。In the pre-cooling unit 400, an air cooling member 410 for rapidly cooling the substrate to eject the cooling air to the substrate is provided on the upper portion of the substrate conveyance path. The air cooling member 410 includes a plurality of nozzles 412 that are juxtaposed in a direction orthogonal to the substrate conveyance direction for jetting cooling air to the surface of the substrate, and a cooling air supply source 414 that supplies cooling air to the nozzles 412. Although not shown, a fan filter unit (FFU) is provided over the entire length of the chamber of the pre-cooling unit and the main cooling unit.
主冷卻部500包含:冷卻構件700,係以非接觸方式使利用第二輸送帶構件600搬運之基板冷卻;以及間隔維持構件800,係以基板與冷卻構件700不接觸之方式來維持基板與冷卻構件700之間的間隔。The main cooling unit 500 includes a cooling member 700 that cools the substrate conveyed by the second conveyor member 600 in a non-contact manner, and a space maintaining member 800 that maintains the substrate and cooling in such a manner that the substrate does not contact the cooling member 700. The spacing between members 700.
第四圖及第五圖係用以說明設置在主冷卻部之冷卻構件的構造之平面圖及側剖面圖。第六圖係顯示設置在搬運軸心間之冷卻板以及間隔維持構件之立體圖。The fourth and fifth figures are a plan view and a side cross-sectional view for explaining the structure of the cooling member provided in the main cooling portion. The sixth drawing shows a perspective view of the cooling plate and the spacing maintaining member provided between the conveying shafts.
參照第四圖至第六圖時,冷卻構件700包含:冷卻板710,係位於搬運軸心610間;冷卻管720,係設置在冷卻板710的底面;以及第二冷卻流體供應源730,係供應冷卻流體給冷卻管720。Referring to the fourth to sixth figures, the cooling member 700 includes: a cooling plate 710 located between the conveying shafts 610; a cooling pipe 720 disposed at a bottom surface of the cooling plate 710; and a second cooling fluid supply source 730 Cooling fluid is supplied to the cooling tube 720.
冷卻板710位於搬運軸心610之間。冷卻板710的長度最好比基板S的長度還長。冷卻板710持有上面712以及從上面712的兩端朝下方向折彎之兩側面714,而於上面712以一定間隔形成間隔維持構件800的圓型球輪810所處之裝設孔716。於冷卻板710的上面之下,隔著裝設孔716在之間而並列設置兩個冷卻管720。冷卻管720係以擴大與冷卻板710的接觸面積之形態,而由直方體所構成。在冷卻管720的一端,係連結由第二冷卻流體供應源730供應冷卻流體之供應線732,而在另一端連結回收線734。回收線734與第二冷卻流體供應源730連結,而介由回收線734回收到第二冷卻流體供應源730之冷卻流體,係藉由冷卻器(C hiller)進行冷卻處理後,又介由供應線732提供給冷卻管720。於第六圖以將冷卻板710與冷卻管720個別構成加以圖示及說明,而亦可適用第七圖所示之方式,係於冷卻板710a形成冷卻流體可通過之流路718,而直接供應冷卻流體到冷卻板710a的流路718。The cooling plates 710 are located between the transport axes 610. The length of the cooling plate 710 is preferably longer than the length of the substrate S. The cooling plate 710 has an upper surface 714 and two side surfaces 714 which are bent downward from both ends of the upper surface 712, and the mounting holes 716 in which the circular spherical wheel 810 of the spacing maintaining member 800 is disposed are formed at intervals of the upper surface 712. Below the upper surface of the cooling plate 710, two cooling tubes 720 are arranged side by side with the mounting holes 716 therebetween. The cooling pipe 720 is formed by a rectangular parallelepiped in such a manner as to enlarge the contact area with the cooling plate 710. At one end of the cooling pipe 720, a supply line 732 that supplies cooling fluid from the second cooling fluid supply source 730 is connected, and a recovery line 734 is connected at the other end. The recovery line 734 is coupled to the second cooling fluid supply source 730, and the cooling fluid recovered to the second cooling fluid supply source 730 via the recovery line 734 is cooled by a cooler and then supplied. Line 732 is provided to cooling tube 720. In the sixth figure, the cooling plate 710 and the cooling pipe 720 are separately illustrated and described, and the method shown in the seventh figure can be applied to the cooling plate 710a to form a flow path 718 through which the cooling fluid can pass. A flow path 718 for supplying cooling fluid to the cooling plate 710a is supplied.
冷卻構件700係利用使冷卻板710冷卻來對基板進行間接冷卻(對流冷卻)之方式,故使冷卻板710離由搬運軸心610搬運的基板S之距離最近乃從冷卻效率的角度而言為有利。但是,冷卻板710過於接近基板S時,基板S因本身重量而下垂,而可能與冷卻板710接觸。若搬運之基板與冷卻板710接觸可能會在基板S的底面產生刮痕,因此,就算冷卻效率低亦考量到基板刮痕而將冷卻板710的高度設定較高來予以設置,以使之從基板維持充分的間隔。另外,在本發明中,係以下述方式構成冷卻板710,即設置冷卻板710使之與基板隔離0.6至0.2mm,且使用間隔維持構件800而事先遮斷基板S與冷卻板710的接觸。The cooling member 700 is configured such that the cooling plate 710 is cooled to indirectly cool the substrate (convection cooling), so that the distance between the cooling plate 710 and the substrate S conveyed by the conveying axis 610 is the closest from the viewpoint of cooling efficiency. advantageous. However, when the cooling plate 710 is too close to the substrate S, the substrate S hangs due to its own weight and may come into contact with the cooling plate 710. If the substrate to be transported is in contact with the cooling plate 710, scratches may occur on the bottom surface of the substrate S. Therefore, even if the cooling efficiency is low, the substrate scratch is considered and the height of the cooling plate 710 is set to be high to make it The substrate is maintained at a sufficient interval. Further, in the present invention, the cooling plate 710 is formed in such a manner that the cooling plate 710 is provided to be separated from the substrate by 0.6 to 0.2 mm, and the contact between the substrate S and the cooling plate 710 is previously blocked by using the space maintaining member 800.
為了提高冷卻構件700的冷卻效率而為非常重要的構成之間隔維持構件800,係包含:支撐台820,係設置在設備框架12,可進行高度的調節;以及圓型球輪(Ball caster)810,係設置在支撐台820的上端,且於搬運軸心610間支撐基板S的底面。支撐台820係垂直地設置在設備框架12,且於支撐台820的上端旋轉自如地設置圓型球輪810。支撐台820係以螺栓830締結方式設置在設備框架12,而可藉由鬆開或拴緊螺栓830來調解支撐台820的高度。亦即,間隔維持構件800可鬆開或拴緊支撐台820的螺栓830來調節圓型球輪810的高度,此意味可調節支撐利用搬運軸心610搬運之基板的高度。The interval maintaining member 800, which is a very important configuration for improving the cooling efficiency of the cooling member 700, includes a support table 820 which is provided in the equipment frame 12 and which is height-adjustable, and a ball caster 810. The upper end of the support base 820 is disposed, and the bottom surface of the substrate S is supported between the transport shafts 610. The support table 820 is vertically disposed on the equipment frame 12, and a circular ball wheel 810 is rotatably provided at the upper end of the support table 820. The support table 820 is disposed in the equipment frame 12 in a manner that the bolts 830 are engaged, and the height of the support table 820 can be adjusted by loosening or tightening the bolts 830. That is, the spacing maintaining member 800 can loosen or tighten the bolts 830 of the support table 820 to adjust the height of the circular ball 810, which means that the height of the substrate carried by the handling axis 610 can be adjusted to be supported.
圓型球輪810係以其一部分從冷卻板710的上面突出之形態位於冷卻板710的裝設孔716。圓型球輪810最好以從冷卻板710的上面712突出0.6至0.2mm之形態位於裝設孔716。亦即,基板S在通過搬運軸心610間之過程中可藉本身重量而下垂,且藉由圓型球輪810位於搬運軸心610間來支撐基板的底面,而可防止基板與冷卻板710之接觸。如此,間隔維持構件800可將基板S與冷卻板710之間維持在隔離0.6至0.2mm。The circular ball wheel 810 is located at the mounting hole 716 of the cooling plate 710 in such a manner that a part thereof protrudes from the upper surface of the cooling plate 710. The circular ball wheel 810 is preferably located in the mounting hole 716 in a manner that protrudes from the upper surface 712 of the cooling plate 710 by 0.6 to 0.2 mm. That is, the substrate S can hang down by its own weight during the process of passing between the transport shafts 610, and the bottom surface of the substrate can be supported by the round ball 810 between the transport shafts 610, thereby preventing the substrate and the cooling plate 710 from being supported. Contact. As such, the spacing maintaining member 800 can maintain the isolation between the substrate S and the cooling plate 710 by 0.6 to 0.2 mm.
在本發明之實施形態中,適用使間隔維持構件800的圓型球輪810直接接觸基板來予以支撐之方式,亦可適用噴射空氣到基板底面來防止基板下垂之間接支撐方式。In the embodiment of the present invention, the circular ball 810 of the interval maintaining member 800 may be directly supported by the substrate to be supported, and the method of spraying the air to the bottom surface of the substrate to prevent the substrate from sagging between the substrates may be applied.
以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利保護範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術變化,均包含於本發明之權利保護範圍內,合予陳明。The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, and the equivalent technical changes of the present invention and the contents of the drawings are included in the scope of protection of the present invention. Within, combined with Chen Ming.
S...基板S. . . Substrate
2...塗佈單元2. . . Coating unit
3...曝光處理單元3. . . Exposure processing unit
4...顯影處理單元4. . . Development processing unit
10...烘烤裝置10. . . Baking device
12...設備框架12. . . Equipment framework
100...預熱部100. . . Preheating department
110...上部加熱器110. . . Upper heater
120...下部加熱器120. . . Lower heater
200...主加熱部200. . . Main heating unit
220...下部加熱器220. . . Lower heater
300...第一輸送帶構件300. . . First conveyor belt member
310...搬運軸心310. . . Handling shaft
400...預冷部400. . . Pre-cooling department
410...空氣冷卻構件410. . . Air cooling member
412...噴嘴412. . . nozzle
414...冷卻空氣供應源414. . . Cooling air supply
500...主冷卻部500. . . Main cooling unit
600...第二輸送帶構件600. . . Second conveyor belt member
610...搬運軸心610. . . Handling shaft
620...滾輪620. . . Wheel
622...流路622. . . Flow path
630...第一冷卻流體供應源630. . . First cooling fluid supply
632...供應線632. . . Supply line
634...回收線634. . . Recycling line
700...冷卻構件700. . . Cooling member
710...冷卻板710. . . Cooling plate
710a...冷卻板710a. . . Cooling plate
712...冷卻板的上面712. . . Above the cooling plate
714...冷卻板的兩側面714. . . Both sides of the cooling plate
716...裝設孔716. . . Mounting hole
718...流路718. . . Flow path
720...冷卻管720. . . Cooling tube
730...第二冷卻流體供應源730. . . Second cooling fluid supply
732...供應線732. . . Supply line
734...回收線734. . . Recycling line
800...間隔維持構件800. . . Interval maintenance member
810...圓型球輪810. . . Round ball wheel
820...支撐台820. . . Support table
830...螺栓830. . . bolt
A...加熱區A. . . Heating zone
B...冷卻區B. . . Cooling zone
第一圖係本發明的實施形態之烘烤裝置的方塊圖。The first figure is a block diagram of a baking apparatus according to an embodiment of the present invention.
第二圖係顯示第一圖所圖示的加熱區之概略性的構造之側視圖。The second drawing shows a side view of a schematic configuration of the heating zone illustrated in the first figure.
第三圖係顯示第一圖所圖示的冷卻區之概略性的構造之側視圖。The third figure is a side view showing a schematic configuration of the cooling zone illustrated in the first figure.
第四圖係用以說明設置在主冷卻部之冷卻構件的構造之平面圖。The fourth figure is a plan view for explaining the configuration of the cooling member provided in the main cooling portion.
第五圖係用以說明設置在主冷卻部之冷卻構件的構造之側剖面圖。The fifth drawing is a side sectional view for explaining the configuration of the cooling member provided in the main cooling portion.
第六圖係顯示設置在搬運軸心間之冷卻板與間隔維持構件之立體圖。The sixth drawing shows a perspective view of the cooling plate and the spacing maintaining member disposed between the conveying shafts.
第七圖係顯示冷卻板的替代例之圖示。The seventh figure is an illustration showing an alternative to a cooling plate.
第八圖係用以進行光刻製程的設備之構成圖。The eighth figure is a structural diagram of an apparatus for performing a photolithography process.
S...基板S. . . Substrate
12...設備框架12. . . Equipment framework
610...搬運軸心610. . . Handling shaft
622...流路622. . . Flow path
700...冷卻構件700. . . Cooling member
710...冷卻板710. . . Cooling plate
712...冷卻板上面712. . . Cooling plate above
714...冷卻板兩側面714. . . Cooling plate on both sides
716...裝設孔716. . . Mounting hole
720...冷卻管720. . . Cooling tube
800...間隔維持構件800. . . Interval maintenance member
810...圓型球輪810. . . Round ball wheel
820...支撐台820. . . Support table
830...螺栓830. . . bolt
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080050672A KR100921523B1 (en) | 2008-05-30 | 2008-05-30 | Method and apparatus for fabricating substrates used in manufacturing flat panel display |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200949783A TW200949783A (en) | 2009-12-01 |
TWI441117B true TWI441117B (en) | 2014-06-11 |
Family
ID=41408261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098117018A TWI441117B (en) | 2008-05-30 | 2009-05-22 | And a substrate processing apparatus and method for manufacturing a flat panel display |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009290207A (en) |
KR (1) | KR100921523B1 (en) |
CN (1) | CN101593673B (en) |
TW (1) | TWI441117B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101274716B1 (en) | 2009-12-23 | 2013-06-12 | 엘지디스플레이 주식회사 | Apparatus and method of fabricating flat display device |
JP5048810B2 (en) * | 2010-06-23 | 2012-10-17 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
KR101693739B1 (en) * | 2010-08-30 | 2017-01-06 | 주식회사 디엠에스 | substrate treatment apparatus |
JP5635378B2 (en) * | 2010-11-30 | 2014-12-03 | 日東電工株式会社 | Semiconductor wafer transfer method and semiconductor wafer transfer apparatus |
JP2012151258A (en) * | 2011-01-19 | 2012-08-09 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus, and substrate processing method |
KR101261012B1 (en) | 2011-02-11 | 2013-05-06 | 주식회사 엘피케이 | Waving prevention device of conveyor belt for linear robot feed system |
CN113287194A (en) * | 2019-01-16 | 2021-08-20 | 应用材料公司 | Substrate processing system, substrate chamber for vacuum processing system and method of cooling substrate |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3461434B2 (en) * | 1997-07-25 | 2003-10-27 | 東レエンジニアリング株式会社 | Glass substrate cooling device |
JP3316174B2 (en) | 1997-11-25 | 2002-08-19 | 株式会社ノリタケカンパニーリミテド | Glass panel cooling method and apparatus |
JP2000302468A (en) | 1999-04-19 | 2000-10-31 | Asahi Glass Co Ltd | Glass pane-carrying roll structure in glass pane-heating furnace |
JP3638119B2 (en) * | 2000-09-21 | 2005-04-13 | パイオニアプラズマディスプレイ株式会社 | Substrate cooling device |
JP3899305B2 (en) * | 2002-10-31 | 2007-03-28 | 松下電器産業株式会社 | Substrate cooling apparatus and method for PDP |
JP4417221B2 (en) * | 2004-10-18 | 2010-02-17 | 株式会社フューチャービジョン | Substrate cooling device |
JP4657991B2 (en) * | 2005-08-05 | 2011-03-23 | 東京エレクトロン株式会社 | Heating / cooling processing apparatus, substrate processing apparatus, and substrate processing method |
JP4537323B2 (en) * | 2006-01-24 | 2010-09-01 | 東京エレクトロン株式会社 | Substrate cooling device |
JP4537324B2 (en) * | 2006-01-24 | 2010-09-01 | 東京エレクトロン株式会社 | Substrate cooling device, substrate cooling method, control program, computer-readable storage medium |
-
2008
- 2008-05-30 KR KR1020080050672A patent/KR100921523B1/en active IP Right Grant
-
2009
- 2009-04-30 JP JP2009111200A patent/JP2009290207A/en active Pending
- 2009-05-22 TW TW098117018A patent/TWI441117B/en active
- 2009-05-22 CN CN2009102029249A patent/CN101593673B/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200949783A (en) | 2009-12-01 |
JP2009290207A (en) | 2009-12-10 |
CN101593673B (en) | 2011-12-07 |
CN101593673A (en) | 2009-12-02 |
KR100921523B1 (en) | 2009-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI441117B (en) | And a substrate processing apparatus and method for manufacturing a flat panel display | |
CN101625965B (en) | Device for processing substrate | |
JP4542577B2 (en) | Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method | |
JP4384685B2 (en) | Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method | |
JP4384686B2 (en) | Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method | |
TWI295415B (en) | Thermal processing unit | |
KR101407415B1 (en) | Glass cutting system | |
KR101848168B1 (en) | Cooling apparatus for heat treatment of metals | |
JP5048810B2 (en) | Heat treatment apparatus and heat treatment method | |
JP4813583B2 (en) | Substrate processing equipment | |
JP2008160011A (en) | Substrate treating equipment | |
JP4638931B2 (en) | Substrate processing equipment | |
JP2008053454A (en) | Baking apparatus and baking method | |
KR100955490B1 (en) | Method and apparatus for baking substrates used in manufacturing flat panel display | |
JP2009094281A (en) | Substrate cooling device | |
KR102256692B1 (en) | System and method for treating substrate | |
JP2010222103A (en) | Conveying device | |
KR100675064B1 (en) | Substrate desiccator | |
KR101053563B1 (en) | Apparatus of cooling substrate for flat panel display | |
JP2005134013A (en) | Device and method for manufacturing substrate | |
KR200414626Y1 (en) | Substrate Desiccator | |
KR101510996B1 (en) | Apparatus for drying film having air cushion function | |
JP2000286223A (en) | Transfer apparatus and treating apparatus of substrate | |
JP2007317724A (en) | Substrate heat treatment method, and substrate heat treatment apparatus | |
KR20100122273A (en) | Substrate processing apparatus |