200949783 六、發明說明： 【發明所屬之技術領域】 f發明係有關用以進行基板處理之裝置，更詳 細而言，係有關使用於平面顯示器（f丄^ t p 3 Ω 6 1 di sPlay)之製造的基板處理裝 置及方法。 【先前技術】 ❹ ㉛年來’為了持有種種形態的功能以及更快的 資訊處理速度，資訊處理機ϋ正急速發展。此種資 訊處理裝置係為了顯示所處理的f訊而具有顯示裝 置。現在’以顯示裝置而言’液晶顯示裝置、有機 E L顯不裝置、電漿顯示裝置之類的平面顯示裝置 受到矚目。 此種平面顯示裝置係在基板上包含多層的薄膜 _ 及配線圖案。薄膜及配線的形成主要係利用光刻製 程。在光刻製程中，&含加熱步驟及冷卻步驟之供 烤製程’ -般而言至少進行兩次以上。而，隨著基 板的尺寸大型化，不僅基板迅速的加熱及冷卻變 難，而且有大型化的基板之處理性顯著變低的問題。 . 【發明内容】 本發明係提供一種使用於平面顯示器之製造的 基板處理裝置及方法，係可使基板的冷卻效率極大 3 200949783 化。 本發明係提供一種使用於平面顯示器之製造的 基板處理裝置及方法，係可一邊精密地維持使基板 間接冷卻的冷卻板與基板之間的間隔且一邊使基板 冷卻。 本發明所欲解決之課題不限定於此，未提到以 及其他的課題，由以下的記載，該領域中具有通常 知識者便可明確理解。 本發明係提供一種使用於平面顯示器之製造的 基板處理裝置及方法。依據本發明的一實施形態， 基板處理裝置係包含：輸送帶構件，係具有用以進 行基板搬運之複數個搬運軸心；冷卻構件，係以非 接觸方式來冷卻利用前述輸送帶構件所搬運之基 板；以及間隔轉構件，係維持前述基板與前述冷 卻構件之間的間隔以使基板不與前述冷卻構件接 依據本發明的實施形 含：支撐台，係以可調解 架，以及圓型球輪（B a 設置在前述支撐台的上端 撐前述基板的底面。 態’前述間隔維持構件包 高度之方式設置在設備框 11 c a s t e r )，係 ，且在别述搬運轴心間支 200949783 依據本發明的實施形態’前述冷卻構件包含： 冷卻流體供應源以及冷卻板’該冷卻板係位於前述 搬運軸心間，而藉由從前述冷卻流體供應源所提供 的冷卻流體進行冷卻。 依據本發明之實施形態，前述冷卻構件復包含 裝δ又孔’係形成在前述冷卻板’且於前述圓型球輪 所在之處。 響 依據本發明的實施形態，前述冷卻構件包含： 冷卻板，係位於前述搬運轴心間，且形成有前述圓 型球輪所在之處的裝設孔；以及複數個冷卻管，係 以前j裝設孔為中心而緊貼於前述冷卻板的底面兩 側而δ又置，且讓從冷卻流體供應源所提供冷、士 體流動者。 7 |机 =發明的實施形態’前述圓型球輪係從前 孔上部突出，且支撐藉由前述輸送 π構件搬運之基板的底面。 依據本發明之實施形態， 將基板與前述冷卻構侔夕„祕J間^維持構件係 mm。 fP構件之間維持隔離0·6至0.2 依據本發明的實施形態 滾輪’該滾輪係設置在二且 觸’而前述滾輪具備-流路’係讓從冷卻 5 200949783 流體供應源提供之冷卻流體流動者。 傳送施形態，前述滾輪係比與基板 土板之一邊的長度還長。 本發明之用以推/_ τ 裝置係包含：塗佈示器製造之基板處理 光單元，俾/ | 4 70係在基板塗佈感光液，·曝 ❹ 將基板予以顯与.圖案而曝先，顯影單元’係 熱處理且進行：卻=供烤；元，係對基板進行加 7構件具有心進行基板搬運 熱構件’係對利用前述輸送帶構件搬運： :=:丁：熱；冷卻構件，係以非接觸方式對藉由 二 :加熱構件加熱之基板予以冷卻；以及間隔維持 、,Μ轉^ ^基板與前述冷卻構件之間的間隔 以使基板不與前述冷卻構件接觸。 ❹ 人依據本發明的實施形態，前述間隔維持構件包 含：支撐台，係設置在設備框架而可調解高度；以 ^圓型球輪（B a i i C ast e r )，係設置在 則述支撐台的上端，而在前述搬運軸心間支撐前述 基板的底面。 依據本發明的實施形態，前述冷卻構件包含： 冷卻流體供應源以及冷卻板，該冷卻板係設置在前 述搬運軸心間，藉由從前述冷卻流體供應源所提供 之冷卻流體進行冷卻，而前述冷卻板包含裝設孔， 6 200949783 係以前述圓型球輪的—部分從上面突出而形成。 在本發明之用以進行平面顯 理方法中，基板係一邊藉由耠* 之基板處 蚀、、， # 猎由輸迗π構件的搬運軸心 =丄而-邊藉由位於前述搬運轴心間的冷卻構件 進仃冷部，而基板藉由位於前述搬運軸心間之間ρ 維持構件而在與前述冷卻構件 m 下、嘉i 再仵維持一疋間隔之狀態 下一邊傳送一邊進行冷卻。200949783 VI. Description of the Invention: [Technical Fields of the Invention] The f invention relates to a device for performing substrate processing, and more particularly to the manufacture of a flat panel display (f丄^tp 3 Ω 6 1 di sPlay). Substrate processing apparatus and method. [Prior Art] ❹ For 31 years, in order to hold various forms of functions and faster information processing speed, information processing machines are rapidly developing. Such a communication processing device has a display device for displaying the processed information. At present, a flat display device such as a liquid crystal display device, an organic EL display device, or a plasma display device has been attracting attention. Such a flat display device includes a plurality of layers of film and wiring patterns on a substrate. The formation of thin films and wiring is mainly by photolithography. In the photolithography process, & the heating step and the cooling step are generally performed at least twice or more. On the other hand, as the size of the substrate is increased, not only the rapid heating and cooling of the substrate but also the problem that the size of the substrate is significantly reduced is remarkably low. SUMMARY OF THE INVENTION The present invention provides a substrate processing apparatus and method for manufacturing a flat panel display, which can greatly reduce the cooling efficiency of the substrate. The present invention provides a substrate processing apparatus and method for manufacturing a flat panel display, which can cool a substrate while precisely maintaining a space between a cooling plate that indirectly cools a substrate and a substrate. The subject matter to be solved by the present invention is not limited thereto, and no other problems are mentioned, and the following description can be clearly understood by a person having ordinary knowledge in the field. The present invention provides a substrate processing apparatus and method for use in the manufacture of a flat panel display. According to an embodiment of the present invention, a substrate processing apparatus includes: a conveyor belt member having a plurality of conveyance shafts for conveying a substrate; and a cooling member that is conveyed by the conveyor belt member in a non-contact manner a substrate; and a spacer member for maintaining a space between the substrate and the cooling member such that the substrate is not connected to the cooling member according to the embodiment of the present invention: a support table, an adjustable frame, and a circular ball wheel (B a is provided at the upper end of the support table to support the bottom surface of the substrate. The state of the space is maintained in the device frame 11 caster, and the other is the transport shaft support 200949783 according to the present invention. Embodiment "The cooling member includes: a cooling fluid supply source and a cooling plate'. The cooling plate is located between the conveying shafts and is cooled by a cooling fluid supplied from the cooling fluid supply source. According to an embodiment of the present invention, the cooling member further includes a δ and a hole □ formed in the cooling plate ′ and located at the position of the circular ball. According to an embodiment of the present invention, the cooling member includes: a cooling plate disposed between the transport axis and having a mounting hole where the circular ball wheel is located; and a plurality of cooling tubes The hole is centered and closely adhered to both sides of the bottom surface of the cooling plate, and δ is set again, and the cold and the body flow are supplied from the cooling fluid supply source. 7: Machine = Embodiment of the Invention The circular round ball train protrudes from the upper portion of the front hole and supports the bottom surface of the substrate conveyed by the π member. According to an embodiment of the present invention, the substrate and the cooling structure are maintained. The maintaining member is mm. The isolation between the fP members is maintained from 0.6 to 0.2. According to the embodiment of the present invention, the roller is disposed in two. And the above-mentioned roller has a -flow path for allowing the cooling fluid to be supplied from the fluid supply source of the cooling 5 200949783. In the transfer mode, the roller is longer than the length of one side of the substrate soil plate. The push/_ τ device includes: a substrate processing light unit manufactured by a coating device, and a 感光/| 4 70 system is coated with a photosensitive liquid on a substrate, and the substrate is exposed and patterned to expose the developing unit. Heat treatment and proceeding: but = for baking; element, adding 7 members to the substrate to carry out the substrate transporting the heat member 'to the conveyance belt member using the conveyor belt member: :=: D: heat; cooling member, non-contact The method is to cool the substrate heated by the heating member; and to maintain the interval between the substrate and the cooling member so that the substrate does not contact the cooling member. In the embodiment, the interval maintaining member includes: a support base that is disposed on the equipment frame to adjust the height; and a round ball wheel (B aii C ast er) that is disposed at an upper end of the support table, and According to an embodiment of the present invention, the cooling member includes: a cooling fluid supply source and a cooling plate, wherein the cooling plate is disposed between the conveying shafts, and is supplied from the cooling fluid source The cooling fluid provided is cooled, and the cooling plate includes a mounting hole, and 6200949783 is formed by protruding a portion of the circular ball wheel from above. In the method for performing planar display of the present invention, the substrate is While the substrate is etched by 耠*, the shovel is transported by the cooling member located between the transport shafts, and the substrate is placed in the front by the cooling member located between the transport shafts. The ρ holding member is transported between the shafts, and is cooled while being conveyed while being kept at a distance from the cooling member m.
依據本發明的實施形能，I ^ BB ^ 心土板與如述冷卻構件 之間隔的維持係利用圓型球輪來進行。 依據本發明的實施形態，前述間隔維持構件， t將基板與前述冷卻構件之間維持關0.6至0 2mm。 · 依據本發明，可使基板的冷卻效率極大化。 邊精密地維持對基板 之間的間隔且一邊對 此外，依據本發明，可— 進行間接冷卻的冷卻板與基板 基板進行冷卻。 【實施方式】 . 以下’參照附加的第-圖至第八圖更詳細地說 月f發明的實施形態。本發明的實施形態，係可替 代為種種形態，而不得解釋為本發明的範圍限定在 下歹J實知开场。本實施形態係為了更完整說明本發 7 200949783 明而提供給本業界之具有通常知識者。因此，圖示 之疋件的形狀，I了強調更明確的說明而有誇大之 處。 此外，在本發明的實施形態中舉使用在光刻設 備之烘烤裝置為例加以說明。 在本實施形態中，基板係用以製造平面顯示器 ：1 3 t p a n e 1 disPiay，以下 簡稱FPD」）元件者，而FPd可為Lcd(l 1 q U 1 d C r y s t a 1 Display, 液晶顯示器）、PDP (Plasma Displ …電漿顯示器）、VFD(Vacuum Fi escent Dispiay，真空螢光 顯示器)、FED(Fi e i d Emi s; 土。n D i s p ! a y，場發射顯示器）、e l β ( E ^ e ° Luminescence Disp 1a y ’電激發光顯示器）。 本發明之基板處理裝置（a p p a r a t u s ° treating substrat e )’係在光刻製程中用以對基板進行加熱冷卻所使 用之烘烤裝置。 如第八圖所示，用以進行光刻製程之設備工， 、:二下列順序在基板形成預定的電路圖案，即利 用光刻技術在基板塗佈光阻膜的塗佈單元2、將此 200949783 進行乾燥熱處理後進行曝光處理的單元3、進行顯 影處理的單元4之順序。在此種光刻製程中，:需 有一種進行下列熱處理之烘烤裝置i 〇，該等熱^ 理包含：在塗佈光阻膜於基板前提高基板的溫度均 等性之熱處理；塗佈光阻膜後對光阻膜進行加=來 去除不必要的溶劑之熱處理（預烤）；用以促進^光 處理後因曝光引起之光阻膜的化學變化之曝光後饵 烤處理；以及顯影處理後兼具顯影圖案的固定與基 板的乾燥之熱處理（後烘烤），而本發明之烘烤裝2 可適用於此種熱處理。 弟一圖係本發明的實施形態之烘烤裝置的方塊 圖。第二圖係顯示第一圖所圖示之加熱區之概略性 構造之侧視圖，第三圖係顯示第一圖所圖示之冷卻 區之概略性構造之側視圖。 參照第一圖，本發明的實施形態之烘烤裝置工 0，係區分為對基板進行加熱處理之加熱區A、以 及進行冷卻處理之冷卻區B。 參照第一圖及第二圖，加熱區A由預熱部丄〇 0與主加熱部2 ◦◦所構成，而在預熱部i 〇 〇鱼 主加熱部2 0 〇，設置第一輸送帶構件3 〇 〇，係 以幾近於水平狀態於水平方向搬運基板。於預熱部 1 0 0係提供用以對基板進行加熱之加熱機構，而 此加熱機構係由個別設置在第一輸送帶構件3 〇 〇 9 200949783 之基板搬運路徑丨的上部與下部之上部加献 0與下部加熱器12〇所構成。然後，亦在主加熱 部2 0 Q提供對基板進行加熱之加熱機構，而提供' 到主加熱部2 ◦◦之加熱機構，係由僅設置在第一 輸送帶構件3 〇 〇之基板搬運路徑上的下部之下 所構成：上部加熱器11〇與下部： 用、 、2 2 0係平板形態的加熱器，使用活 用有 M.I Cable(Mine …… ❹ 1 a ted Cabl e，礦物絕緣電纜）之工 2熱器。另一方面，預熱部1 〇 〇與主加熱部2 心 *、、'态丄J 0、2 2 0 ’配置在第一輸 ==件3 0 0的搬運軸心31〇之間，而位於基 板的底面之附近。 參照第-圖及第三圖’冷卻區β係由預冷部4 與主冷卻部5 0 〇所構成，而與加熱區A類 ❹ 似幹、=冷部4 0 0與主冷卻部5〇 ◦，設置第 :::讀件6 0 0，其係以大致為水平狀態將基 板搬運於水平方向。 如第二圖及第四圖所示，於設置在冷卻區B之 支搬=▼構件6 ◦ ◦，隔著—^的間隔具備複數 心610。搬運袖心6 10係直接或間接 的驅Z馬達等之驅動源（未圖示）且藉由驅動源 的驅動而旋轉。藉此方式，朝搬運軸心6 i 〇上之 200949783 基板搬運方向搬運基板。搬運轴心6 1 〇係包含具 有比基板的一邊還大的一邊之滾輪62〇，而作為 使基板冷卻之冷卻媒體而運作。更具體說明時，搬 運軸心6 1 0的滾輪6 2 〇 ,具有從第一冷卻流體 供應源6 3 0提供之冷卻流體流動之流路6 2 2， 且在搬運軸心6 1 〇的一端設置與第一冷卻流體供 應源6 3 0的供應線6 3 2連結之埠。藉此方式， ，搬運軸〜6 1 〇的滾輪6 2 〇 —邊藉*冷卻流體冷 卻到一定溫度以下且一邊作為與基板直接接觸而冷 卻的冷卻機構而運作。如此，在藉由搬運軸心6丄 0搬運之過程’基板s透過與滾輪6 2 Q接觸來進 行冷卻處理。通過搬運軸心6丄〇之冷卻流體，介 由回收線6 3 4而回收到第—冷卻流體供應源6 3 〇 ’且利用冷卻器（Q i i i e r )冷卻後，又 μ由供應線6 3 2供應給搬運軸心6丄〇。 > 再者參照第三圖’在預冷部4〇〇中，藉由喷 侏：卻空氣之空氣冷卻，以及以前述第二輸送帶構 ◦的搬運軸心6 1 ◦作為冷卻媒體之軸心接 卻方式來使基板冷卻。_，在主冷卻部5〇 Ί ^ ’糟由以第二輸送帶構件6 0 0的搬運軸心6 、彳#為冷㈣體之搬運軸心6 1 〇接觸冷卻方 ::以及冷卻構件7〇〇之間接冷卻方式使基板冷 11 200949783 在預冷部40〇中，將用以使基板急速 射冷部空氣於基板之空氣冷卻構件41〇::: f反搬運路徑的上部。空氣冷卻構件41〇::在 :::嘴412，係為了喷射冷卻空氣到 面而並列設置在與基板搬運方向正交的方向板= 冷部工乳供應源4 1 4，係供應冷卻空氣到喷嘴4 \2 °雖未圖示’而於預冷部與主冷卻部的腔室全 長5又置風機過濾器單元（FFU)。According to the embodiment of the present invention, the maintenance of the spacing of the I ^ BB ^ core plate and the cooling member is carried out using a circular ball. According to an embodiment of the present invention, the interval maintaining member t maintains a distance between the substrate and the cooling member of 0.6 to 0.2 mm. According to the present invention, the cooling efficiency of the substrate can be maximized. Further, while maintaining the interval between the substrates, the cooling plate and the substrate substrate which are indirectly cooled can be cooled according to the present invention. [Embodiment] Hereinafter, an embodiment of the invention will be described in more detail with reference to the additional FIGS. The embodiments of the present invention are exemplified by various forms, and are not to be construed as limiting the scope of the invention to the following. This embodiment is intended to provide a more complete description of the present invention to those skilled in the art. Therefore, the shape of the element shown in the figure is emphasized by a more explicit explanation and exaggeration. Further, in the embodiment of the present invention, a baking apparatus used in a lithographic apparatus will be described as an example. In this embodiment, the substrate is used to manufacture a flat panel display: 1 3 tpane 1 disPiay, hereinafter referred to as FPD"), and the FPd may be Lcd (l 1 q U 1 d C rysta 1 Display, liquid crystal display), PDP (Plasma Displ ... plasma display), VFD (Vacuum Fiescent Dispiay), FED (Fi eid Emi s; soil. n D isp ! ay, field emission display), el β ( E ^ e ° Luminescence Disp 1a y 'Electrically Excited Light Display'. The substrate processing apparatus (a p p a r a t u s ° treating substrat e ) of the present invention is a baking apparatus used for heating and cooling a substrate in a photolithography process. As shown in the eighth figure, the apparatus for performing the photolithography process, in the following sequence, forms a predetermined circuit pattern on the substrate, that is, the coating unit 2 that coats the photoresist film on the substrate by photolithography 200949783 The order of the unit 3 subjected to the exposure treatment after the drying heat treatment and the unit 4 subjected to the development processing. In such a photolithography process, there is a need for a baking apparatus that performs the following heat treatment, the heat treatment comprising: heat treatment for increasing the temperature uniformity of the substrate before coating the photoresist film on the substrate; coating light After the film is blocked, the photoresist film is subjected to heat treatment (pre-bake) to remove unnecessary solvent; post-exposure bait baking treatment for promoting chemical change of the photoresist film caused by exposure after photo-treatment; and development treatment The heat treatment (post-baking) of the fixing of the developing pattern and the drying of the substrate is followed, and the baking device 2 of the present invention can be applied to such heat treatment. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a baking apparatus of an embodiment of the present invention. The second drawing shows a side view of a schematic configuration of the heating zone illustrated in the first figure, and the third figure shows a side view of the schematic configuration of the cooling zone illustrated in the first figure. Referring to the first drawing, the baking apparatus 0 of the embodiment of the present invention is divided into a heating zone A for heat-treating the substrate and a cooling zone B for performing cooling treatment. Referring to the first and second figures, the heating zone A is composed of the preheating section 丄〇0 and the main heating section 2 ,, and in the preheating section i the squid main heating section 20 〇, the first conveyor belt is provided. The member 3 is transported in a horizontal direction in a nearly horizontal state. The heating means for heating the substrate is provided in the preheating section 100, and the heating mechanism is provided by the upper part and the lower part of the substrate carrying path 个别 which are separately disposed on the first conveyor belt member 3 〇〇9 200949783 It consists of 0 and a lower heater 12〇. Then, a heating mechanism for heating the substrate is also provided in the main heating portion 200, and a heating mechanism to the main heating portion 2 is provided, which is provided only by the substrate conveying path of the first conveyor member 3 It is composed of the lower part of the upper part: the upper heater 11〇 and the lower part: the heater in the form of a plate and a 2 2 0 plate, which uses the MI Cable (Mine ...... ❹ 1 a ted Cabl e, mineral insulated cable) Work 2 heat exchangers. On the other hand, the preheating unit 1 〇〇 is in contact with the main heating unit 2, and the 'state 丄 J 0, 2 2 0 ' is disposed between the conveyance axis 31〇 of the first transmission==3 0 0, and Located near the bottom surface of the substrate. Referring to the first and third figures, the cooling zone β is composed of the pre-cooling section 4 and the main cooling section 50 〇, and is similar to the heating zone A type, the cold section 400 and the main cooling section 5〇. ◦, the first ::: reading 60 0 is set, which transports the substrate in the horizontal direction in a substantially horizontal state. As shown in the second and fourth figures, the plurality of cores 610 are provided at intervals of -^ in the cooling zone B. The transport sleeve 6 10 is a drive source (not shown) that directly or indirectly drives a Z motor or the like and is rotated by driving of a drive source. In this way, the substrate is transported toward the 200949783 substrate transport direction on the transport axis 6 i . The transport axis 6 1 includes a roller 62 that has a larger side than one side of the substrate, and operates as a cooling medium for cooling the substrate. More specifically, the roller 6 2 搬运 of the transport shaft 6 1 0 has a flow path 6 2 2 from which the cooling fluid supplied from the first cooling fluid supply source 630 flows, and is at one end of the transport shaft 6 1 〇 A crucible is coupled to the supply line 633 of the first cooling fluid supply source 630. In this way, the roller 6 2 〇 of the transport shaft ～ 6 1 〇 is operated by cooling the cooling fluid to a temperature lower than a certain temperature and cooling as a direct contact with the substrate. In this manner, the substrate s is transported by the transfer shaft 6 丄 0. The substrate s is brought into contact with the roller 6 2 Q to perform cooling treatment. The cooling fluid is transferred to the first cooling fluid supply source 6 3 〇' via the recovery line 634 and is cooled by the cooler (Q iiier ) and then supplied by the supply line 6 3 2 It is supplied to the handling shaft 6丄〇. > Referring to the third diagram, in the pre-cooling section 4, the air is cooled by air squirting, and the transporting axis 6 1 ◦ of the second conveyor belt is used as the axis of the cooling medium. The heart is connected to cool the substrate. _, in the main cooling unit 5 〇Ί ^ 'Dry by the transport axis 6 of the second conveyor belt member 60, 彳 # is the cold (four) body of the transport axis 6 1 〇 contact cooling side:: and the cooling member 7 〇〇 Interconnecting cooling method to cool the substrate 11 200949783 In the pre-cooling portion 40, the upper portion of the air cooling member 41 〇::: f reverse conveying path for rapidly cooling the substrate to the substrate. The air cooling member 41〇::::: The nozzle 412 is arranged side by side in the direction of the substrate conveyance direction in order to inject the cooling air to the surface = the cold part of the milk supply source 4 1 4 is supplied with cooling air to Although the nozzle 4 \2 ° is not shown, the fan filter unit (FFU) is placed in the chamber 5 of the pre-cooling portion and the main cooling portion.
主冷卻部5 0 〇包含：冷卻構件7 〇 〇，係以 非接觸方式使洲第二輸送帶構件6 Q _運之基 板冷卻；以及間隔維持構件8 〇 0，係以基板與ς 卻構件7 0 〇不接觸之方式來維持基板與冷卻構^ 7 0 0之間的間隔。 第四圖及第五圖係用以說明設置在主冷卻部之 冷卻構件的構造之平面圖及側剖面圖。第六圖係顯 示設置在搬運轴心間之冷卻板以及間隔維持構件之 ❹ 立體圖。 參照第四圖至第六圖時，冷卻構件7 〇 〇包 含：冷卻板7 1 0，係位於搬運軸心6 1 〇間；冷 卻管7 2 0，係設置在冷卻板7 1 0的底面；以及 第二冷卻流體供應源7 3 0，係供應冷卻流體給冷 卻管7 2 0。 12 200949783 冷卻板7 1 0位於搬運軸心6 i 〇之間。冷卻 板7 1 〇的長度最好比基板s的長度還長。冷卻板 7 1 0持有上面7 1 2以及從上面7 1 2的兩端朝 下方向折彎之兩側面7丄4，而於上面7丄2以一 定間隔形成間隔維持構件8 〇 〇的圓型球輪8丄〇 所處之裝設孔7 1 6。於冷卻板7 i 〇的上面之 :，隔著裝設孔7 1 6在之間而並列設置兩個冷卻 管7 2 0。冷卻管7 2 0係以擴大與冷卻板7工〇 的接觸面積之形態，而由直方體所構成。在冷卻管 7 2 0的一端，係連結由第二冷卻流體供應源7 3 0供應冷卻流體之供應線7 3 2，而在另一端連結 回收線7 3 4 H線7 3 4與第二冷卻流體供應 源7 3 0連結’而介由回收線7 3 4回收到第二冷 卻流體供應源7 3 0之冷卻流體，係藉由冷卻器（c h 1 1 1 e ]：)進行冷卻處理後，又介由供應線7 參 3 2提供給冷卻管7 2 0。於第六圖以將冷卻板7 1 0與冷卻管7 2 Q個別構成加以圖示及說明，而 亦可適用第七圖所示之方式，係於冷卻板7丄〇 a 形成冷卻流體可通過之流路7丄8 ’而直接供應冷 卻流體到冷卻板7 i 〇 a的流路7 1 8。 7 冷卻構件7 0 用使冷卻板71Q冷卻來 對基板進行間接冷卻（對流冷卻）之方式，故使冷 卻板71Q離由搬運軸心61◦搬運的基板8之^ 離最近乃從冷卻效率的角度而言為有利。但是，冷 13 200949783 卻板7 1 0過於接近基板S時，基板s因本身重量 而下垂’而可能與冷卻板7 1 〇接觸。若搬運之基 板與冷卻板710接觸可能會在基板S的底面產生 刮痕，因此，就算冷卻效率低亦考量到基板刮痕而 將冷卻板7 1 〇的高度設定較高來予以設置，以使 之從基板維持充分的間隔。另外，在本發明中，係 以下述方式構成冷卻板7工0，即設置冷卻板7工 〇使之與基板隔離0.6至〇.2mm，且使用間隔 維持構件8 〇 〇而事先遮斷基板s與冷卻板了丄〇 的接觸。 為了提高冷卻構件700的冷卻效率而為非常 重要的構成之間隔維持構件8 〇 〇，係包含. 二”〇,係設置在設備框架12,可進行高心 ^即；以及圓型球輪（Ball ，係設置在支撐台82〇的上端 軸心610間支樓基板s的底面。支撑台 = 垂直地設置在設備框架工2，且於支擇 ’、 上端旋轉自如地設置圓型 σ 的 '、以螺栓8 3 0缔結方式設置在 ： 而可藉由鬆開或拾緊螺栓8 s n 2， 〇的焉度。亦即’間隔維持構件牙口 8 2 緊支撐台8 2 0的螺检8 3 ◦ 可鬆開或拾 〇的高度，此音味可㈣圓型球輪81 反此忍啄可調節支撐 丄 搬運之基板的高度。 用搬運軸心Θ工〇 200949783 圓里球輪8 1 Q係以其—部分從冷卻板7 1 〇 =上面突出之形態位於冷卻板7丄〇的裝設孔7工 。圓型球輪81Q最好以從冷卻板71Q的上面 1 2犬出Q . 6至Q . 2 mm之形態位於裝設孔7 。6。亦即’基板s在通過搬運軸心6丄◦間之過 程中可藉本身重量而下垂，且藉由圓型球輪8 位於搬運軸心6 1 Q間來支撐基板的底面，而可防 • 止基板與冷卻板7 1 0之接觸。如此，間隔維持構 件8 0 Q可將基板8與冷卻板7 i Q之間維持在隔 離 〇·6 至 〇.2mm。 在本發明之實施形態中，適用使間隔維持構件 8 0 0的圓型球輪8丄〇直接接觸基板來予以支撐 之方式，亦可適用喷射空氣到基板底面來防止基板 下垂之間接支撐方式。 以上所述僅為本發明之較佳可行實施例，非因 此侷限本發明之專利保護範圍，故舉凡運用本發明 說明書及圖式内容所為之等效技術變化，均包含於 本發明之權利保護範圍内，合予陳明。 【圖式簡單說明】 第一圖係本發明的實施形態之烘烤裝置的方塊 圖〇 第二圖係顯示第一圖所圖示的加熱區之概略性 的構造之側視圖。 15 200949783 第三圖係顯示第一圖所圖示的冷卻區之概略性 的構造之侧視圖。 第四圖係用以說明设置在主冷卻部之冷卻構件 的構造之平面圖。 第五圖係用以說明设置在主冷卻部之冷卻構件 的構造之側剖面圖。 第六圖係顯示設置在搬運軸心間之冷卻板與間 隔維持構件之立體圖。 第七圖係顯示冷卻板的替代例之圖示。 ❹ 第八圖係用以進行光刻製程的設備之構成圖。 【主要元件符號說明】 $ 基板 2 3 4 1 0 1 2 1 0 0 110 12〇 2〇〇 22〇 3〇〇The main cooling portion 50 includes: a cooling member 7 〇〇 cooling the substrate of the second conveyor belt member 6 Q in a non-contact manner; and a spacing maintaining member 8 〇 0, which is a substrate and a member 7 0 〇 The method of non-contact is to maintain the interval between the substrate and the cooling structure. The fourth and fifth figures are a plan view and a side cross-sectional view for explaining the structure of the cooling member provided in the main cooling portion. The sixth drawing shows a perspective view of the cooling plate and the spacing maintaining member disposed between the conveying shafts. Referring to the fourth to sixth figures, the cooling member 7 〇〇 includes: a cooling plate 7 1 0 , which is located between the conveying shafts 6 1 , and a cooling pipe 7 20 , which is disposed on the bottom surface of the cooling plate 7 10 ; And a second cooling fluid supply source 730, which supplies cooling fluid to the cooling tube 720. 12 200949783 The cooling plate 7 1 0 is located between the transport shafts 6 i 。. The length of the cooling plate 7 1 〇 is preferably longer than the length of the substrate s. The cooling plate 710 holds the upper surface 7 1 2 and the two side surfaces 7丄4 bent downward from the upper ends of the upper surface of the upper surface, and the left side of the upper surface 7丄2 is formed with a space at which the spacing maintaining member 8 The mounting wheel 7 is provided with a hole 7 1 6 . On the upper surface of the cooling plate 7 i : , two cooling tubes 720 are arranged side by side with the mounting holes 7 16 interposed therebetween. The cooling pipe 720 is formed by a rectangular parallelepiped in such a manner as to enlarge the contact area with the work of the cooling plate 7. At one end of the cooling pipe 720, a supply line 723 that supplies the cooling fluid from the second cooling fluid supply source 703 is connected, and at the other end, a recovery line 7 3 4 H line 734 and a second cooling are connected. The fluid supply source 730 is connected to the cooling fluid recovered by the recovery line 734 to the second cooling fluid supply source 730, and is cooled by the cooler (ch 1 1 1 e ): It is also supplied to the cooling pipe 7 2 0 via the supply line 7 参3 2 . In the sixth figure, the cooling plate 7 10 and the cooling pipe 7 2 Q are individually illustrated and described, and the method shown in the seventh figure can also be applied to form a cooling fluid through the cooling plate 7丄〇a. The flow path 7丄8' directly supplies the cooling fluid to the flow path 7 1 8 of the cooling plate 7 i 〇a. 7 Cooling member 70 The method in which the cooling plate 71Q is cooled to indirectly cool the substrate (convection cooling), so that the cooling plate 71Q is moved from the transport axis 61◦ to the nearest substrate from the viewpoint of cooling efficiency. In terms of benefits. However, when the cold plate 13 200949783 is too close to the substrate S, the substrate s sag due to its own weight, and may come into contact with the cooling plate 7 1 。. If the substrate to be transported is in contact with the cooling plate 710, scratches may occur on the bottom surface of the substrate S. Therefore, even if the cooling efficiency is low, the substrate scratches are considered and the height of the cooling plate 7 1 设定 is set to be high, so that A sufficient interval is maintained from the substrate. Further, in the present invention, the cooling plate 7 is configured in such a manner that the cooling plate 7 is disposed so as to be separated from the substrate by 0.6 to 0.2 mm, and the substrate s is previously blocked by using the interval maintaining member 8 Awkward contact with the cooling plate. The interval maintaining member 8 为, which is a very important configuration for improving the cooling efficiency of the cooling member 700, includes a second 〇, which is disposed in the equipment frame 12, and can be high-centered; and a round ball (Ball) The bottom surface of the support base plate s is disposed between the upper end pivots 610 of the support table 82. The support table is vertically disposed in the equipment frame 2, and is provided with a circular shape σ at the upper end and freely rotated at the upper end. It is set in the way of bolt 8 3 0: and can be loosened or picked up by the bolt 8 sn 2, the twist of the weir. That is, the interval maintaining member mouth 8 2 is close to the screw 8 8 of the support table 8 3 ◦ The height that can be loosened or picked up, the sound can be (4) round ball wheel 81. This can adjust the height of the substrate that is supported and transported. The shaft is loaded with the shaft. 200949783 Round ball 8 1 Q It is located in the mounting hole 7 of the cooling plate 7丄〇 in a manner that it partially protrudes from the cooling plate 7 1 〇=. The round ball 81Q is preferably taken from the upper surface of the cooling plate 71Q. The form of 2 mm is located in the mounting hole 7 and 6. That is, the process of the substrate s passing through the transport shaft 6 It can be drooped by its own weight, and the bottom surface of the substrate is supported by the round ball 8 between the transport shafts 6 1 Q to prevent the substrate from coming into contact with the cooling plate 7 10 . Thus, the interval maintaining member 8 0 Q can maintain the insulation between the substrate 8 and the cooling plate 7 i Q at 〇·6 to 2.2 mm. In the embodiment of the present invention, the circular ball 8 使 of the interval maintaining member 800 is applied directly. The method of contacting the substrate for supporting may also be applied to the method of spraying the air to the bottom surface of the substrate to prevent the substrate from sagging. The above description is only a preferred embodiment of the present invention, and thus does not limit the scope of patent protection of the present invention. The equivalent technical changes of the present invention and the contents of the drawings are included in the scope of protection of the present invention and are combined with Chen Ming. [Simplified description of the drawings] The first figure is a baking of an embodiment of the present invention. The block diagram of the apparatus is a side view showing a schematic configuration of the heating zone illustrated in the first figure. 15 200949783 The third figure shows the schematic configuration of the cooling zone illustrated in the first figure. The fourth drawing is a plan view for explaining the structure of the cooling member provided in the main cooling portion. The fifth drawing is a side sectional view for explaining the configuration of the cooling member provided in the main cooling portion. A perspective view of a cooling plate and a spacing maintaining member disposed between the conveying shafts. Fig. 7 is a view showing an alternative example of the cooling plate. 第八 The eighth drawing is a configuration diagram of a device for performing a photolithography process. Explanation of Symbols] $ Substrate 2 3 4 1 0 1 2 1 0 0 110 12〇2〇〇22〇3〇〇
塗佈單元 曝光處理單元 顯影處理單元 烘烤裝置 設備框架 預熱部 上部加熱器 下部加熱器 主加熱部 下部加熱器 第一輸送帶構件 16 200949783 3 10 搬運軸心 4 0 0 預冷部 4 10 空氣冷卻構件 4 12 喷嘴 4 14 冷卻空氣供應源 5 0 0 主冷卻部 6 0 0 第二輸送帶構件 6 10 ® 6 2 0 搬運軸心 滚輪 6 2 2 流路 6 3 0 第一冷卻流體供應源 6 3 2 供應線 6 3 4 回收線 7 0 0 冷卻構件 7 10 冷卻板 φ 7 10a 7 12 冷卻板 冷卻板的上面 7 14 冷卻板的兩側面 7 16 裝設孔 7 18 流路 7 2 0 冷卻管 7 3 0 第二冷卻流體供應源 7 3 2 供應線 7 3 4 回收線 17 200949783 8 0 0 間隔維持構件 8 10 圓型球輪 8 2 0 支撐台 8 3 0 螺栓 A 加熱區 B 冷卻區Coating unit exposure processing unit development processing unit baking device equipment frame preheating section upper heater lower heater main heating section lower heater first conveyor belt member 16 200949783 3 10 handling axis 4 0 0 precooling section 4 10 air Cooling member 4 12 Nozzle 4 14 Cooling air supply source 5 0 0 Main cooling unit 6 0 0 Second conveyor belt member 6 10 ® 6 2 0 Handling shaft roller 6 2 2 Flow path 6 3 0 First cooling fluid supply source 6 3 2 Supply line 6 3 4 Recycling line 7 0 0 Cooling member 7 10 Cooling plate φ 7 10a 7 12 Upper surface of cooling plate cooling plate 7 14 Both sides of cooling plate 7 16 Mounting hole 7 18 Flow path 7 2 0 Cooling tube 7 3 0 Second cooling fluid supply source 7 3 2 Supply line 7 3 4 Recovery line 17 200949783 8 0 0 Interval maintenance member 8 10 Round ball 8 2 0 Support table 8 3 0 Bolt A Heating zone B Cooling zone
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