JP2009097005A5 - - Google Patents
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- Publication number
- JP2009097005A5 JP2009097005A5 JP2008245774A JP2008245774A JP2009097005A5 JP 2009097005 A5 JP2009097005 A5 JP 2009097005A5 JP 2008245774 A JP2008245774 A JP 2008245774A JP 2008245774 A JP2008245774 A JP 2008245774A JP 2009097005 A5 JP2009097005 A5 JP 2009097005A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- light reflecting
- group
- thermosetting light
- reflecting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 18
- 229920001187 thermosetting polymer Polymers 0.000 claims 18
- 230000003287 optical effect Effects 0.000 claims 10
- 239000004065 semiconductor Substances 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- 239000012463 white pigment Substances 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 239000011256 inorganic filler Substances 0.000 claims 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims 4
- 125000000962 organic group Chemical group 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000006082 mold release agent Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 229920000098 polyolefin Polymers 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920000428 triblock copolymer Polymers 0.000 claims 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 238000013329 compounding Methods 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 125000001033 ether group Chemical group 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000001095 magnesium carbonate Substances 0.000 claims 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims 1
- 239000000347 magnesium hydroxide Substances 0.000 claims 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- 229920000570 polyether Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008245774A JP5540487B2 (ja) | 2007-09-25 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007247027 | 2007-09-25 | ||
| JP2007247027 | 2007-09-25 | ||
| JP2008245774A JP5540487B2 (ja) | 2007-09-25 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009097005A JP2009097005A (ja) | 2009-05-07 |
| JP2009097005A5 true JP2009097005A5 (enExample) | 2011-12-08 |
| JP5540487B2 JP5540487B2 (ja) | 2014-07-02 |
Family
ID=40700292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008245774A Active JP5540487B2 (ja) | 2007-09-25 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5540487B2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2540776B1 (en) | 2007-09-25 | 2017-08-09 | Hitachi Chemical Co., Ltd. | Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| JP5572936B2 (ja) * | 2007-11-26 | 2014-08-20 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2011074355A (ja) * | 2009-09-07 | 2011-04-14 | Nitto Denko Corp | 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
| JP5671812B2 (ja) * | 2010-03-01 | 2015-02-18 | 日立化成株式会社 | ウレタン樹脂組成物、硬化体及び硬化体を用いた光半導体装置 |
| JP2012092309A (ja) * | 2010-09-29 | 2012-05-17 | Shikoku Chem Corp | エポキシ樹脂組成物 |
| KR101242725B1 (ko) | 2010-11-23 | 2013-03-12 | (주)네오빛 | 광반사용 열경화성 수지 조성물 |
| JP2012172012A (ja) * | 2011-02-18 | 2012-09-10 | Shin-Etsu Chemical Co Ltd | 熱硬化性エポキシ樹脂組成物及び光半導体装置 |
| JP2014517110A (ja) * | 2011-05-18 | 2014-07-17 | 株式會社ネペスエーエムシー | 熱硬化型光反射用樹脂組成物及びその製造方法、熱硬化型光反射用樹脂組成物によって製造された光半導体素子搭載用反射板及びそれを含む光半導体装置 |
| JP5834560B2 (ja) * | 2011-07-12 | 2015-12-24 | 日立化成株式会社 | エポキシ樹脂硬化剤、エポキシ樹脂組成物及び光半導体装置 |
| JP5917137B2 (ja) * | 2011-12-27 | 2016-05-11 | 株式会社カネカ | 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置 |
| JP2013135119A (ja) * | 2011-12-27 | 2013-07-08 | Kaneka Corp | 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置 |
| JP2012162729A (ja) * | 2012-04-11 | 2012-08-30 | Hitachi Chemical Co Ltd | 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP2015211112A (ja) * | 2014-04-25 | 2015-11-24 | 株式会社カネカ | 発光ダイオード用硬化性樹脂組成物、発光ダイオードのパッケージ |
| JP5899281B2 (ja) * | 2014-07-16 | 2016-04-06 | 積水化学工業株式会社 | 光半導体装置用白色硬化性組成物、光半導体装置用白色硬化性組成物の製造方法、光半導体装置用成型体及び光半導体装置 |
| GB201416670D0 (en) * | 2014-09-22 | 2014-11-05 | Hexcel Composites Ltd | Fast curing compositions |
| KR102309169B1 (ko) * | 2014-09-25 | 2021-10-08 | 디아이씨 가부시끼가이샤 | 에폭시 수지 조성물, 경화물, 섬유 강화 복합 재료, 섬유 강화 수지 성형품, 및 섬유 강화 수지 성형품의 제조 방법 |
| JP6724634B2 (ja) * | 2016-07-28 | 2020-07-15 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| JP3334998B2 (ja) * | 1994-03-30 | 2002-10-15 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| JP2000281750A (ja) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP3870825B2 (ja) * | 2002-02-27 | 2007-01-24 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP5060707B2 (ja) * | 2004-11-10 | 2012-10-31 | 日立化成工業株式会社 | 光反射用熱硬化性樹脂組成物 |
| EP2768031B1 (en) * | 2005-08-04 | 2021-02-17 | Nichia Corporation | Light-emitting device |
| JP5303097B2 (ja) * | 2005-10-07 | 2013-10-02 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
| JP4968258B2 (ja) * | 2006-06-02 | 2012-07-04 | 日立化成工業株式会社 | 光半導体素子搭載用パッケージおよびこれを用いた光半導体装置 |
| JP5239688B2 (ja) * | 2007-11-13 | 2013-07-17 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
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2008
- 2008-09-25 JP JP2008245774A patent/JP5540487B2/ja active Active
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