JP2009149845A5 - - Google Patents
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- Publication number
- JP2009149845A5 JP2009149845A5 JP2008246255A JP2008246255A JP2009149845A5 JP 2009149845 A5 JP2009149845 A5 JP 2009149845A5 JP 2008246255 A JP2008246255 A JP 2008246255A JP 2008246255 A JP2008246255 A JP 2008246255A JP 2009149845 A5 JP2009149845 A5 JP 2009149845A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- light reflecting
- thermosetting light
- reflecting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 24
- 229920001187 thermosetting polymer Polymers 0.000 claims 22
- 230000003287 optical effect Effects 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 11
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- 150000001875 compounds Chemical class 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 125000000962 organic group Chemical group 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000012463 white pigment Substances 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 3
- 125000003118 aryl group Chemical group 0.000 claims 3
- 125000003700 epoxy group Chemical group 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 125000001033 ether group Chemical group 0.000 claims 3
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- 229920001281 polyalkylene Polymers 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000006082 mold release agent Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000000344 soap Substances 0.000 claims 2
- 238000001721 transfer moulding Methods 0.000 claims 2
- 229920000428 triblock copolymer Polymers 0.000 claims 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 claims 1
- 229940063655 aluminum stearate Drugs 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 238000013329 compounding Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims 1
- 239000001095 magnesium carbonate Substances 0.000 claims 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims 1
- 239000000347 magnesium hydroxide Substances 0.000 claims 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008246255A JP5572936B2 (ja) | 2007-11-26 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007304255 | 2007-11-26 | ||
| JP2007304255 | 2007-11-26 | ||
| JP2008246255A JP5572936B2 (ja) | 2007-11-26 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009149845A JP2009149845A (ja) | 2009-07-09 |
| JP2009149845A5 true JP2009149845A5 (enExample) | 2011-12-08 |
| JP5572936B2 JP5572936B2 (ja) | 2014-08-20 |
Family
ID=40919355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008246255A Active JP5572936B2 (ja) | 2007-11-26 | 2008-09-25 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5572936B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2540776B1 (en) | 2007-09-25 | 2017-08-09 | Hitachi Chemical Co., Ltd. | Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device |
| JP5262644B2 (ja) * | 2007-12-04 | 2013-08-14 | 日立化成株式会社 | 成型体の離型性評価方法及び成型体の製造方法 |
| JP5401905B2 (ja) * | 2008-04-25 | 2014-01-29 | 日立化成株式会社 | 熱硬化性樹脂組成物 |
| JP5325560B2 (ja) * | 2008-12-18 | 2013-10-23 | スタンレー電気株式会社 | 発光装置、および、発光装置の製造方法 |
| US9975284B2 (en) | 2012-01-17 | 2018-05-22 | Dai Nipon Printing Co., Ltd. | Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body |
| JP2012162729A (ja) * | 2012-04-11 | 2012-08-30 | Hitachi Chemical Co Ltd | 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP6149457B2 (ja) * | 2013-03-28 | 2017-06-21 | 大日本印刷株式会社 | 光半導体実装用基板、半導体発光装置、及び光半導体実装用基板の製造方法 |
| JP7274245B1 (ja) * | 2023-01-31 | 2023-05-16 | 国立大学法人 名古屋工業大学 | 離型条件評価方法、離型条件評価システムおよびプログラム |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| JP3334998B2 (ja) * | 1994-03-30 | 2002-10-15 | 住友ベークライト株式会社 | エポキシ樹脂組成物 |
| JP2000281750A (ja) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP3870825B2 (ja) * | 2002-02-27 | 2007-01-24 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP5060707B2 (ja) * | 2004-11-10 | 2012-10-31 | 日立化成工業株式会社 | 光反射用熱硬化性樹脂組成物 |
| EP2768031B1 (en) * | 2005-08-04 | 2021-02-17 | Nichia Corporation | Light-emitting device |
| JP5303097B2 (ja) * | 2005-10-07 | 2013-10-02 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。 |
| JP4968258B2 (ja) * | 2006-06-02 | 2012-07-04 | 日立化成工業株式会社 | 光半導体素子搭載用パッケージおよびこれを用いた光半導体装置 |
| JP5540487B2 (ja) * | 2007-09-25 | 2014-07-02 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
| JP5239688B2 (ja) * | 2007-11-13 | 2013-07-17 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
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2008
- 2008-09-25 JP JP2008246255A patent/JP5572936B2/ja active Active
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