JP2009088227A - 基板の処理装置及び処理方法 - Google Patents

基板の処理装置及び処理方法 Download PDF

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Publication number
JP2009088227A
JP2009088227A JP2007255777A JP2007255777A JP2009088227A JP 2009088227 A JP2009088227 A JP 2009088227A JP 2007255777 A JP2007255777 A JP 2007255777A JP 2007255777 A JP2007255777 A JP 2007255777A JP 2009088227 A JP2009088227 A JP 2009088227A
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Prior art keywords
substrate
processing
liquid
device surface
cleaning
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JP2007255777A
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English (en)
Japanese (ja)
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JP2009088227A5 (OSRAM
Inventor
Harumichi Hirose
治道 廣瀬
Masayasu Abe
正泰 安部
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2007255777A priority Critical patent/JP2009088227A/ja
Publication of JP2009088227A publication Critical patent/JP2009088227A/ja
Publication of JP2009088227A5 publication Critical patent/JP2009088227A5/ja
Pending legal-status Critical Current

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JP2007255777A 2007-09-28 2007-09-28 基板の処理装置及び処理方法 Pending JP2009088227A (ja)

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JP2007255777A JP2009088227A (ja) 2007-09-28 2007-09-28 基板の処理装置及び処理方法

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JP2007255777A JP2009088227A (ja) 2007-09-28 2007-09-28 基板の処理装置及び処理方法

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JP2009088227A true JP2009088227A (ja) 2009-04-23
JP2009088227A5 JP2009088227A5 (OSRAM) 2010-11-11

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011114675A1 (ja) * 2010-03-16 2011-09-22 三菱電機株式会社 シリコンウェハのエッチング方法、エッチング液、エッチング装置、および半導体装置
CN102210987A (zh) * 2010-04-12 2011-10-12 阿思普株式会社 气体溶解液生成装置及生成方法
JP2011238918A (ja) * 2010-05-04 2011-11-24 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
KR101377273B1 (ko) * 2011-11-17 2014-03-26 한국기계연구원 레이저를 이용한 연성 회로 기판의 제조 시스템 및 그 제조 방법
WO2022210088A1 (ja) * 2021-04-01 2022-10-06 東京エレクトロン株式会社 基板処理装置、および基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234923A (ja) * 1988-07-25 1990-02-05 Toshiba Corp 超音波洗浄装置
JPH0468524U (OSRAM) * 1990-10-24 1992-06-17
JPH06320124A (ja) * 1993-03-15 1994-11-22 Hitachi Ltd 超音波洗浄方法およびその洗浄装置
JP2002200586A (ja) * 2000-10-31 2002-07-16 Ebara Corp 基板の把持装置、処理装置、及び把持方法
JP2005093873A (ja) * 2003-09-19 2005-04-07 Ebara Corp 基板処理装置
JP2005245817A (ja) * 2004-03-05 2005-09-15 National Institute Of Advanced Industrial & Technology ナノバブルの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234923A (ja) * 1988-07-25 1990-02-05 Toshiba Corp 超音波洗浄装置
JPH0468524U (OSRAM) * 1990-10-24 1992-06-17
JPH06320124A (ja) * 1993-03-15 1994-11-22 Hitachi Ltd 超音波洗浄方法およびその洗浄装置
JP2002200586A (ja) * 2000-10-31 2002-07-16 Ebara Corp 基板の把持装置、処理装置、及び把持方法
JP2005093873A (ja) * 2003-09-19 2005-04-07 Ebara Corp 基板処理装置
JP2005245817A (ja) * 2004-03-05 2005-09-15 National Institute Of Advanced Industrial & Technology ナノバブルの製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011114675A1 (ja) * 2010-03-16 2011-09-22 三菱電機株式会社 シリコンウェハのエッチング方法、エッチング液、エッチング装置、および半導体装置
JP5447649B2 (ja) * 2010-03-16 2014-03-19 三菱電機株式会社 シリコンウェハのエッチング方法およびエッチング液
CN102210987A (zh) * 2010-04-12 2011-10-12 阿思普株式会社 气体溶解液生成装置及生成方法
JP2011218308A (ja) * 2010-04-12 2011-11-04 Asupu:Kk 気体溶解液生成装置及び生成方法
JP2011238918A (ja) * 2010-05-04 2011-11-24 Asml Netherlands Bv 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
US8711326B2 (en) 2010-05-04 2014-04-29 Asml Netherlands B.V. Fluid handling structure, a lithographic apparatus and a device manufacturing method
KR101377273B1 (ko) * 2011-11-17 2014-03-26 한국기계연구원 레이저를 이용한 연성 회로 기판의 제조 시스템 및 그 제조 방법
WO2022210088A1 (ja) * 2021-04-01 2022-10-06 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JPWO2022210088A1 (OSRAM) * 2021-04-01 2022-10-06
JP7592848B2 (ja) 2021-04-01 2024-12-02 東京エレクトロン株式会社 基板処理装置、および基板処理方法

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