JP2009081356A5 - - Google Patents

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Publication number
JP2009081356A5
JP2009081356A5 JP2007250805A JP2007250805A JP2009081356A5 JP 2009081356 A5 JP2009081356 A5 JP 2009081356A5 JP 2007250805 A JP2007250805 A JP 2007250805A JP 2007250805 A JP2007250805 A JP 2007250805A JP 2009081356 A5 JP2009081356 A5 JP 2009081356A5
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JP
Japan
Prior art keywords
wiring
reinforcing
wiring member
conductive material
layer
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Granted
Application number
JP2007250805A
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English (en)
Japanese (ja)
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JP5096855B2 (ja
JP2009081356A (ja
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Priority to JP2007250805A priority Critical patent/JP5096855B2/ja
Priority claimed from JP2007250805A external-priority patent/JP5096855B2/ja
Publication of JP2009081356A publication Critical patent/JP2009081356A/ja
Publication of JP2009081356A5 publication Critical patent/JP2009081356A5/ja
Application granted granted Critical
Publication of JP5096855B2 publication Critical patent/JP5096855B2/ja
Active legal-status Critical Current
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JP2007250805A 2007-09-27 2007-09-27 配線基板の製造方法及び配線基板 Active JP5096855B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007250805A JP5096855B2 (ja) 2007-09-27 2007-09-27 配線基板の製造方法及び配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007250805A JP5096855B2 (ja) 2007-09-27 2007-09-27 配線基板の製造方法及び配線基板

Publications (3)

Publication Number Publication Date
JP2009081356A JP2009081356A (ja) 2009-04-16
JP2009081356A5 true JP2009081356A5 (zh) 2010-05-13
JP5096855B2 JP5096855B2 (ja) 2012-12-12

Family

ID=40655867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007250805A Active JP5096855B2 (ja) 2007-09-27 2007-09-27 配線基板の製造方法及び配線基板

Country Status (1)

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JP (1) JP5096855B2 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2472702A (en) * 2008-04-10 2011-02-16 World Properties Inc Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
KR101678052B1 (ko) * 2010-02-25 2016-11-22 삼성전자 주식회사 단층 배선 패턴을 포함한 인쇄회로기판(ｐｃｂ), ｐｃｂ를 포함한 반도체 패키지, 반도체 패키지를 포함한 전기전자장치, ｐｃｂ제조방법, 및 반도체 패키지 제조방법
JP5444136B2 (ja) * 2010-06-18 2014-03-19 新光電気工業株式会社 配線基板
JP5578962B2 (ja) * 2010-06-24 2014-08-27 新光電気工業株式会社 配線基板
JP2012069739A (ja) * 2010-09-24 2012-04-05 Shinko Electric Ind Co Ltd 配線基板の製造方法
KR101119306B1 (ko) * 2010-11-04 2012-03-16 삼성전기주식회사 회로기판의 제조방법
WO2013065287A1 (ja) * 2011-11-01 2013-05-10 住友ベークライト株式会社 半導体パッケージの製造方法
US9440135B2 (en) * 2012-05-29 2016-09-13 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with integral vias extending in in-plane direction
KR101842079B1 (ko) * 2016-06-23 2018-05-15 (주)심텍 박형의 인쇄회로기판 및 이의 제조 방법
CN111213435B (zh) * 2017-10-12 2023-07-14 大日本印刷株式会社 配线基板和配线基板的制造方法
JP2019179831A (ja) * 2018-03-30 2019-10-17 新光電気工業株式会社 配線基板、配線基板の製造方法
CN111755409A (zh) * 2019-03-27 2020-10-09 恒劲科技股份有限公司 半导体封装基板及其制法与电子封装件及其制法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3100949B2 (ja) * 1998-12-07 2000-10-23 日本特殊陶業株式会社 配線基板の製造方法
JP2000232260A (ja) * 1999-02-09 2000-08-22 Ngk Spark Plug Co Ltd 配線基板、スティフナ及びこれらの製造方法
JP3615727B2 (ja) * 2001-10-31 2005-02-02 新光電気工業株式会社 半導体装置用パッケージ
JP3983146B2 (ja) * 2002-09-17 2007-09-26 Ｎｅｃエレクトロニクス株式会社 多層配線基板の製造方法
JP4731919B2 (ja) * 2004-01-23 2011-07-27 株式会社半導体エネルギー研究所 フィルム状物品
JP2005268404A (ja) * 2004-03-17 2005-09-29 Sanyo Electric Co Ltd 回路モジュール
JP2007059821A (ja) * 2005-08-26 2007-03-08 Shinko Electric Ind Co Ltd 配線基板の製造方法

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