JP2009081356A5 - - Google Patents

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JP2009081356A5
JP2009081356A5 JP2007250805A JP2007250805A JP2009081356A5 JP 2009081356 A5 JP2009081356 A5 JP 2009081356A5 JP 2007250805 A JP2007250805 A JP 2007250805A JP 2007250805 A JP2007250805 A JP 2007250805A JP 2009081356 A5 JP2009081356 A5 JP 2009081356A5
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Japan
Prior art keywords
wiring
reinforcing
wiring member
conductive material
layer
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JP2007250805A
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Japanese (ja)
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JP5096855B2 (en
JP2009081356A (en
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Priority to JP2007250805A priority Critical patent/JP5096855B2/en
Priority claimed from JP2007250805A external-priority patent/JP5096855B2/en
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Publication of JP2009081356A5 publication Critical patent/JP2009081356A5/ja
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Claims (10)

支持体上に配線層と絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持基板を除去する工程と、
接着部材を用いて前記配線部材の表面に前記配線部材と同一形状を有すると共に中央部に開口が形成された金属製の第１の補強部材を配設すると共に、前記配線部材の裏面に前記配線部材と同一形状を有すると共に接続端子に対応する位置に貫通孔が形成された金属製の第２の補強部材を配設する工程とを有する配線基板の製造方法。 Forming a wiring member by laminating a wiring layer and an insulating layer on a support;
Removing the support substrate from the wiring member;
Co When disposing the first reinforcing member made of metal having an opening at a central portion and having the wiring member having the same shape on the surface of the wiring member by using an adhesive member, wherein the back surface of the wiring member And a step of disposing a second reinforcing member made of metal having the same shape as the wiring member and having a through hole formed at a position corresponding to the connection terminal . 前記配線部材を形成する際、前記配線部材にグランド電位とされた前記配線層に接続される接続用電極を形成し、
前記第１及び第２の補強部材を配設する際、前記第１又は第２の補強部材の少なくとも一方を導電材により形成すると共に、該導電材よりなる補強部材に前記接続用電極を接続する請求項１記載の配線基板の製造方法。 When forming the wiring member, forming a connection electrode connected to the wiring layer at a ground potential on the wiring member,
When disposing the first and second reinforcing members, at least one of the first or second reinforcing members is formed of a conductive material, and the connection electrode is connected to the reinforcing member made of the conductive material. The manufacturing method of the wiring board of Claim 1. 前記絶縁層及び前記接着部材の材料を同一の樹脂材料とした請求項１又は２記載の配線基板の製造方法。   The method for manufacturing a wiring board according to claim 1, wherein the insulating layer and the adhesive member are made of the same resin material. 前記補強部材の前記接着部材と対向する面を粗面化処理する請求項１乃至３のいずれか一項に記載の配線基板の製造方法。   The method for manufacturing a wiring board according to claim 1, wherein a surface of the reinforcing member facing the adhesive member is roughened. 支持体上に配線層と絶縁層を積層して配線部材を形成する工程と、
前記配線部材から前記支持基板を除去する工程と、
前記配線部材の裏面に対応するよう形成された第１の補強部と、前記配線部材の表面に対応するよう形成された第２の補強部と、前記配線部材の側面に対応するよう形成された第３の補強部とが一体的に形成された補強部材を、前記配線部材を内包するよう折り曲げ加工する工程とを有する配線基板の製造方法。 Forming a wiring member by laminating a wiring layer and an insulating layer on a support;
Removing the support substrate from the wiring member;
A first reinforcing portion formed to correspond to the back surface of the wiring member, a second reinforcing portion formed to correspond to the front surface of the wiring member, and a side surface of the wiring member. A method of manufacturing a wiring board, comprising: bending a reinforcing member integrally formed with a third reinforcing portion so as to enclose the wiring member. 前記配線部材を形成する際、前記配線部材にグランド電位とされた前記配線層に接続される接続用電極を形成し、
前記補強部材を導電材により形成すると共に、前記補強部材を配設する際、該導電材よりなる補強部材に前記接続用電極を接続する請求項５記載の配線基板の製造方法。 When forming the wiring member, forming a connection electrode connected to the wiring layer at a ground potential on the wiring member,
6. The method of manufacturing a wiring board according to claim 5, wherein the reinforcing member is formed of a conductive material, and the connecting electrode is connected to the reinforcing member made of the conductive material when the reinforcing member is disposed. 配線層と絶縁層が積層された配線部材と、
前記配線部材と同一形状を有すると共に中央部に開口が形成されており、前記配線部材の表面に第１の接着部材を用いて接着される金属製の第１の補強部材と、
前記配線部材と同一形状を有すると共に接続端子に対応する位置に貫通孔が形成されており、前記配線部材の裏面に第２の接着部材を用いて接着される金属製の第２の補強部材とを有する配線基板。 A wiring member in which a wiring layer and an insulating layer are laminated;
And the opening is formed, a first adhesive first member made of metal that will be bonded using the reinforcing member to the surface of the wiring member in the central portion and having the wiring member having the same shape,
The through hole at a position corresponding to the connecting terminal is formed and has a wiring member having the same shape, and the second adhesive member made of metal second that will be bonded with the reinforcing member to the back surface of the wiring member A wiring board having: 前記配線部材にグランド電位とされた前記配線層に接続された接続用電極を設け、
前記第１又は第２の補強部材の少なくとも一方を導電材により形成すると共に、該導電材よりなる補強部材と前記接続用電極とを接続してなる請求項７記載の配線基板。 A connection electrode connected to the wiring layer having a ground potential is provided on the wiring member,
8. The wiring board according to claim 7, wherein at least one of the first or second reinforcing member is formed of a conductive material, and the reinforcing member made of the conductive material is connected to the connection electrode. 配線層と絶縁層が積層された配線部材と、
前記配線部材の裏面に対応するよう形成されると共に接続端子に対応する位置に貫通孔が形成された第１の補強部と、前記配線部材の表面に対応するよう形成された第２の補強部と、前記配線部材の側面に対応するよう形成された第３の補強部とが一体的に形成された補強部材とを有し、
前記補強部材は、前記配線部材を内包するように前記第２及び第３の補強部が前記第１の補強部に対し折り曲げ形成されてなる配線基板。 A wiring member in which a wiring layer and an insulating layer are laminated;
A first reinforcing portion a through hole at a position corresponding to the Rutotomoni connection terminal is formed so as to correspond to the back surface of the wiring member is formed, a second reinforcing portion which is formed so as to correspond to the surface of the wiring member And a reinforcing member formed integrally with a third reinforcing portion formed so as to correspond to the side surface of the wiring member,
The reinforcing member is a wiring board in which the second and third reinforcing portions are bent with respect to the first reinforcing portion so as to enclose the wiring member. 前記補強部材を導電材により形成すると共に前記配線部材にグランド電位とされた前記配線層に接続された接続用電極を設け、
該補強部材と前記接続用電極とを接続してなる請求項９記載の配線基板。 The reinforcing member is formed of a conductive material, and a connection electrode connected to the wiring layer having a ground potential is provided on the wiring member,
The wiring board according to claim 9, wherein the reinforcing member and the connection electrode are connected.
JP2007250805A 2007-09-27 2007-09-27 Wiring board manufacturing method and wiring board Active JP5096855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007250805A JP5096855B2 (en) 2007-09-27 2007-09-27 Wiring board manufacturing method and wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007250805A JP5096855B2 (en) 2007-09-27 2007-09-27 Wiring board manufacturing method and wiring board

Publications (3)

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JP2009081356A JP2009081356A (en) 2009-04-16
JP2009081356A5 true JP2009081356A5 (en) 2010-05-13
JP5096855B2 JP5096855B2 (en) 2012-12-12

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Families Citing this family (12)

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US8519273B2 (en) * 2008-04-10 2013-08-27 Sankar Paul Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
KR101678052B1 (en) * 2010-02-25 2016-11-22 삼성전자 주식회사 Printed circuit board(PCB) comprising one-layer wire pattern, semiconductor package comprising the PCB, electrical and electronic apparatus comprising the package, method for fabricating the PCB, and method for fabricating the package
JP5444136B2 (en) * 2010-06-18 2014-03-19 新光電気工業株式会社 Wiring board
JP5578962B2 (en) * 2010-06-24 2014-08-27 新光電気工業株式会社 Wiring board
JP2012069739A (en) * 2010-09-24 2012-04-05 Shinko Electric Ind Co Ltd Manufacturing method of wiring board
KR101119306B1 (en) * 2010-11-04 2012-03-16 삼성전기주식회사 Method of manufacturing a circuit board
WO2013065287A1 (en) * 2011-11-01 2013-05-10 住友ベークライト株式会社 Method for manufacturing semiconductor package
US9440135B2 (en) * 2012-05-29 2016-09-13 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with integral vias extending in in-plane direction
KR101842079B1 (en) * 2016-06-23 2018-05-15 (주)심텍 thin printed circuit board substrate and method of fabricating the same
EP3697180A4 (en) * 2017-10-12 2021-06-30 Dai Nippon Printing Co., Ltd. Wiring board and method for producing wiring board
JP2019179831A (en) * 2018-03-30 2019-10-17 新光電気工業株式会社 Wiring board and method for manufacturing wiring board
CN111755409A (en) * 2019-03-27 2020-10-09 恒劲科技股份有限公司 Semiconductor package substrate and manufacturing method thereof, and electronic package and manufacturing method thereof

Family Cites Families (7)

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JP3100949B2 (en) * 1998-12-07 2000-10-23 日本特殊陶業株式会社 Manufacturing method of wiring board
JP2000232260A (en) * 1999-02-09 2000-08-22 Ngk Spark Plug Co Ltd Wiring board, stiffener and manufacture thereof
JP3615727B2 (en) * 2001-10-31 2005-02-02 新光電気工業株式会社 Package for semiconductor devices
JP3983146B2 (en) * 2002-09-17 2007-09-26 Ｎｅｃエレクトロニクス株式会社 Manufacturing method of multilayer wiring board
JP4731919B2 (en) * 2004-01-23 2011-07-27 株式会社半導体エネルギー研究所 Film-like article
JP2005268404A (en) * 2004-03-17 2005-09-29 Sanyo Electric Co Ltd Circuit module
JP2007059821A (en) * 2005-08-26 2007-03-08 Shinko Electric Ind Co Ltd Method for manufacturing wiring board

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