JP2009212906A5 - - Google Patents
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- JP2009212906A5 JP2009212906A5 JP2008054746A JP2008054746A JP2009212906A5 JP 2009212906 A5 JP2009212906 A5 JP 2009212906A5 JP 2008054746 A JP2008054746 A JP 2008054746A JP 2008054746 A JP2008054746 A JP 2008054746A JP 2009212906 A5 JP2009212906 A5 JP 2009212906A5
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- conductive film
- electronic component
- connection electrode
- functional piece
- substrate
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Claims (23)
前記容器の一部を構成しており、第１接続電極を有する第１基板と、 A first substrate constituting a part of the container and having a first connection electrode;
前記第１基板に対向して前記容器の一部を構成しており、第２接続電極を有する第２基板と、 A second substrate having a second connection electrode, which forms part of the container facing the first substrate;
弾性を有する第１コア部、及び前記第１コア部の表面に設けられた第１導電膜を含み、前記第１接続電極に接続された第１バンプ電極と、 A first bump electrode including an elastic first core portion and a first conductive film provided on a surface of the first core portion and connected to the first connection electrode;
弾性を有する第２コア部、及び前記第２コア部の表面に設けられた第２導電膜を含み、前記第２接続電極に接続された第２バンプ電極と、 A second bump electrode connected to the second connection electrode, including a second core portion having elasticity, and a second conductive film provided on a surface of the second core portion;
前記第１基板と前記第２基板との間において前記第１バンプ電極及び前記第２バンプ電極に接続されており、前記第１バンプ電極に接続された第１励振電極、及び前記第２バンプ電極に接続された第２励振電極を有する水晶片と、 A first excitation electrode connected to the first bump electrode and the second bump electrode, connected to the first bump electrode and the second bump electrode between the first substrate and the second substrate, and the second bump electrode A crystal piece having a second excitation electrode connected to
を有することを特徴とする水晶振動子パッケージ。 A crystal unit package comprising:
前記電子部品は、所定の機能を有する機能片と、
前記機能片の一方の面に形成され弾性を有する第１コア部と、
前記第１コア部の表面に形成された導電膜と、
前記導電膜と前記接続電極との導電接触状態を保持する保持部とを有し、
前記機能片の他方の面側には、弾性を有する第２コア部が配置され、
前記第１コア部及び前記導電膜はバンプ電極を形成し、前記第１コア部の弾性変形により前記導電膜と前記接続電極とが導電接触することを特徴とする電子部品の実装構造。 A structure in which an electronic component connected to the connection electrode is mounted on a substrate having a connection electrode,
The electronic component is a functional piece having a predetermined function;
A first core portion formed on one surface of the functional piece and having elasticity;
A conductive film formed on a surface of the first core portion;
A holding portion for holding a conductive contact state between the conductive film and the connection electrode;
A second core portion having elasticity is arranged on the other surface side of the functional piece,
A mounting structure of an electronic component, wherein the first core part and the conductive film form a bump electrode, and the conductive film and the connection electrode are in conductive contact by elastic deformation of the first core part.
前記機能片は、前記第１コア部において前記導電膜及び前記接続電極を介して実装された前記基板と、前記第２コア部において前記第２導電膜及び前記第２接続電極を介して実装された前記第２基板との間で挟持されることを特徴とする請求項４に記載の電子部品の実装構造。 The second core part and the second conductive film form a second bump electrode, and the second conductive film and the second connection electrode of the second substrate are in conductive contact by elastic deformation of the second core part,
The functional piece is mounted on the first core portion via the conductive film and the connection electrode, and is mounted on the second core portion via the second conductive film and the second connection electrode. The electronic component mounting structure according to claim 4 , wherein the electronic component mounting structure is sandwiched between the second substrate and the second substrate.
前記第２基板の前記第２接続電極が設けられる面とは逆側の面には、前記第２接続電極と電気的に接続された第４接続電極が設けられ、
前記機能片には、前記導電膜と前記第２導電膜とを電気的に接続する接続部が設けられることを特徴とする請求項５に記載の電子部品の実装構造。 A third connection electrode electrically connected to the connection electrode is provided on a surface of the substrate opposite to the surface on which the connection electrode is provided;
A surface of the second substrate opposite to the surface on which the second connection electrode is provided is provided with a fourth connection electrode electrically connected to the second connection electrode;
The electronic component mounting structure according to claim 5 , wherein the functional piece is provided with a connection portion that electrically connects the conductive film and the second conductive film.
前記機能片は、前記第１コア部において前記導電膜及び前記接続電極を介して実装された前記基板と、前記第２コア部において実装された前記第２基板との間で挟持されることを特徴とする請求項３に記載の電子部品の実装構造。 The second core part is formed on the other surface of the functional piece, and contacts the non-conductive part of the second substrate by elastic deformation,
The functional piece is sandwiched between the substrate mounted on the first core portion via the conductive film and the connection electrode and the second substrate mounted on the second core portion. The electronic component mounting structure according to claim 3 , wherein:
前記機能片は、前記第１コア部において前記導電膜及び前記接続電極を介して実装された前記基板と、前記第２コア部において実装された前記第２基板との間で挟持されることを特徴とする請求項３に記載の電子部品の実装構造。 The second core portion is formed on a second substrate disposed opposite to the other surface of the functional piece, and contacts the other surface of the functional piece by elastic deformation,
The functional piece is sandwiched between the substrate mounted on the first core portion via the conductive film and the connection electrode and the second substrate mounted on the second core portion. The electronic component mounting structure according to claim 3 , wherein:
前記機能片の前記他方の面には、前記第３導電膜と電気的に接続される第４導電膜が形成されることを特徴とする請求項８に記載の電子部品の実装構造。 A third conductive film is formed on the surface of the second core part,
9. The electronic component mounting structure according to claim 8 , wherein a fourth conductive film electrically connected to the third conductive film is formed on the other surface of the functional piece.
前記第２基板の前記第３導電膜が設けられる面とは逆側の面には、前記第３導電膜と電気的に接続された第５接続電極が設けられ、
前記機能片には、前記導電膜と前記第４導電膜とを電気的に接続する接続部が設けられることを特徴とする請求項９に記載の電子部品の実装構造。 A third connection electrode electrically connected to the connection electrode is provided on a surface of the substrate opposite to the surface on which the connection electrode is provided;
A surface of the second substrate opposite to the surface on which the third conductive film is provided is provided with a fifth connection electrode electrically connected to the third conductive film,
The electronic component mounting structure according to claim 9 , wherein the functional piece is provided with a connection portion that electrically connects the conductive film and the fourth conductive film.
前記電子部品は、所定の機能を有する機能片と、
前記機能片の一方の面に形成され弾性を有する第１コア部と、
前記第１コア部の表面に形成された導電膜と、
前記導電膜と前記接続電極との導電接触状態を保持する保持部とを有し、
前記機能片の他方の面側に、弾性を有する第２コア部を配置し、
前記第１コア部の弾性変形により前記導電膜と前記接続電極とを導電接触させる工程を有することを特徴とする電子部品の実装方法。 A method of mounting an electronic component connected to the connection electrode on a substrate having a connection electrode,
The electronic component includes a functional piece having a predetermined function;
A first core portion formed on one surface of the functional piece and having elasticity;
A conductive film formed on a surface of the first core portion;
A holding portion for holding a conductive contact state between the conductive film and the connection electrode;
A second core part having elasticity is arranged on the other surface side of the functional piece,
An electronic component mounting method comprising a step of bringing the conductive film into contact with the connection electrode by elastic deformation of the first core portion.
前記機能片を片持ちで支持することを特徴とする請求項２０または２１に記載の電子部品の実装方法。 The first core part and the second core part are arranged to face each other with the functional piece interposed therebetween,
The method of mounting an electronic component according to claim 20 or 21 , wherein the functional piece is supported in a cantilever manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008054746A JP5223383B2 (en) | 2008-03-05 | 2008-03-05 | Quartz crystal unit, crystal unit package, electronic component, electronic device, mounting method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008054746A JP5223383B2 (en) | 2008-03-05 | 2008-03-05 | Quartz crystal unit, crystal unit package, electronic component, electronic device, mounting method for electronic component |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009212906A JP2009212906A (en) | 2009-09-17 |
| JP2009212906A5 true JP2009212906A5 (en) | 2011-04-21 |
| JP5223383B2 JP5223383B2 (en) | 2013-06-26 |
Family
ID=41185616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008054746A Expired - Fee Related JP5223383B2 (en) | 2008-03-05 | 2008-03-05 | Quartz crystal unit, crystal unit package, electronic component, electronic device, mounting method for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5223383B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2952314B1 (en) * | 2009-11-12 | 2012-02-10 | Sagem Defense Securite | BRAZING METHOD, GYROSCOPE AND BRAZED PART |
| JP2011182155A (en) * | 2010-03-01 | 2011-09-15 | Seiko Epson Corp | Piezoelectric device and method of manufacturing the same |
| JP6551010B2 (en) * | 2015-07-28 | 2019-07-31 | セイコーエプソン株式会社 | Piezoelectric device, liquid jet head, and method of manufacturing piezoelectric device |
| CN109945852B (en) * | 2019-03-22 | 2021-05-28 | 中国科学院微电子研究所 | Packaging structure of gyroscope and manufacturing method |
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| JPS5985117A (en) * | 1982-11-05 | 1984-05-17 | Seikosha Co Ltd | Thickness shear piezoelectric oscillator |
| JPH04116428U (en) * | 1991-03-29 | 1992-10-19 | 京セラ株式会社 | Chip type piezoelectric resonator |
| JPH09172346A (en) * | 1995-12-21 | 1997-06-30 | Matsushita Electric Ind Co Ltd | Piezoelectric resonance parts and manufacture of the same |
| JPH11251863A (en) * | 1998-03-04 | 1999-09-17 | Toyo Commun Equip Co Ltd | Piezoelectric vibrator |
| US6628048B2 (en) * | 2000-11-29 | 2003-09-30 | Samsung Electro-Mechanics Co., Ltd. | Crystal oscillator with improved shock resistance |
| JP2002353766A (en) * | 2001-03-19 | 2002-12-06 | Seiko Epson Corp | Piezoelectric device |
| JP3894542B2 (en) * | 2002-02-28 | 2007-03-22 | 京セラキンセキ株式会社 | Airtight container for piezoelectric parts |
| JP2003347885A (en) * | 2002-05-29 | 2003-12-05 | Seiko Epson Corp | Piezoelectric resonance piece, manufacturing method of the piezoelectric resonance piece, and piezoelectric device |
| JP2005101527A (en) * | 2003-08-21 | 2005-04-14 | Seiko Epson Corp | Electronic component mounting structure, electrooptic device, electronic equipment, and method of mounting electronic component |
| JP2005143042A (en) * | 2003-11-10 | 2005-06-02 | Seiko Epson Corp | Piezoelectric device |
| JP2007013444A (en) * | 2005-06-29 | 2007-01-18 | Daishinku Corp | Piezo-electric oscillating device and method for manufacturing the same |
| JP2007019410A (en) * | 2005-07-11 | 2007-01-25 | Seiko Epson Corp | Semiconductor device, and method of manufacturing electronic module |
| JP4656311B2 (en) * | 2005-07-11 | 2011-03-23 | セイコーエプソン株式会社 | Electronic module |
| JP2007096528A (en) * | 2005-09-27 | 2007-04-12 | Epson Toyocom Corp | Supporting structure of piezoelectric vibration element, surface mounting piezoelectric vibrator, surface mounting type piezoelectric oscillator and method of mounting type piezoelectric vibration element |
| JP4815976B2 (en) * | 2005-09-29 | 2011-11-16 | 株式会社大真空 | Method for manufacturing crystal vibrating device |
| JP4784304B2 (en) * | 2005-12-27 | 2011-10-05 | セイコーエプソン株式会社 | Electronic component, method for manufacturing electronic component, circuit board, and electronic device |
| JP2007214164A (en) * | 2006-02-07 | 2007-08-23 | Epson Imaging Devices Corp | Electro-optical apparatus, method for manufacturing the same semiconductor device, and electronic apparatus |
| JP4453763B2 (en) * | 2007-10-19 | 2010-04-21 | セイコーエプソン株式会社 | Electronic component and its mounting structure and mounting method |
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2008
- 2008-03-05 JP JP2008054746A patent/JP5223383B2/en not_active Expired - Fee Related
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