JP2008205888A5 - - Google Patents

Download PDF

Info

Publication number
JP2008205888A5
JP2008205888A5 JP2007040432A JP2007040432A JP2008205888A5 JP 2008205888 A5 JP2008205888 A5 JP 2008205888A5 JP 2007040432 A JP2007040432 A JP 2007040432A JP 2007040432 A JP2007040432 A JP 2007040432A JP 2008205888 A5 JP2008205888 A5 JP 2008205888A5
Authority
JP
Japan
Prior art keywords
piezoelectric
substrate
etching
vibrating piece
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007040432A
Other languages
Japanese (ja)
Other versions
JP2008205888A (en
JP5023734B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007040432A priority Critical patent/JP5023734B2/en
Priority claimed from JP2007040432A external-priority patent/JP5023734B2/en
Publication of JP2008205888A publication Critical patent/JP2008205888A/en
Publication of JP2008205888A5 publication Critical patent/JP2008205888A5/ja
Application granted granted Critical
Publication of JP5023734B2 publication Critical patent/JP5023734B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (7)

圧電基板と、該圧電基板とはエッチングレートが異なるベース基板と、を貼り合わせる貼合工程と、
前記貼合工程の後に前記圧電基板を研磨する研磨工程と、
前記貼合工程の後に前記ベース基板をエッチングするベースエッチング工程と、
前記研磨工程の後に前記圧電基板をエッチングする圧電エッチング工程と、
を含むことを特徴とする圧電振動片の製造方法。
A bonding step of bonding a piezoelectric substrate and a base substrate having a different etching rate from the piezoelectric substrate;
A polishing step of polishing the piezoelectric substrate after the bonding step,
A base etching step of etching the base substrate after the bonding step ;
A piezoelectric etching step of etching the piezoelectric substrate after the polishing step ;
A method for manufacturing a piezoelectric vibrating piece, comprising:
前記ベースエッチング工程により前記ベース基板のエッチングを行った後、前記圧電エッチング工程により前記圧電基板のエッチングを行うことを特徴とする請求項1に記載の圧電振動片の製造方法。   2. The method of manufacturing a piezoelectric vibrating piece according to claim 1, wherein after the base substrate is etched by the base etching step, the piezoelectric substrate is etched by the piezoelectric etching step. 前記ベースエッチング工程は、平面視において、前記ベース基板のうち少なくとも前記圧電基板の振動腕が形成される領域に重なる前記ベース基板を除去し、前記ベース基板の一部を残してエッチングする工程を含み、  The base etching step includes a step of removing the base substrate that overlaps at least a region where the vibrating arm of the piezoelectric substrate is formed in the base substrate in plan view, and etching while leaving a part of the base substrate. ,
前記圧電エッチング工程は、前記ベース基板の前記一部が前記圧電基板に貼り合わされた状態で、前記圧電基板をエッチングする工程を含む  The piezoelectric etching step includes a step of etching the piezoelectric substrate in a state where the part of the base substrate is bonded to the piezoelectric substrate.
ことを特徴とする請求項2に記載の圧電振動片の製造方法。  The method of manufacturing a piezoelectric vibrating piece according to claim 2.
前記圧電エッチング工程により前記圧電基板のエッチングを行った後、前記ベースエッチング工程により前記ベース基板のエッチングを行うことを特徴とする請求項1に記載の圧電振動片の製造方法。   2. The method of manufacturing a piezoelectric vibrating piece according to claim 1, wherein after the piezoelectric substrate is etched by the piezoelectric etching step, the base substrate is etched by the base etching step. 前記ベースエッチング工程は、前記ベース基板に凹状の開口部を形成することを特徴とする請求項4に記載の圧電振動片の製造方法。  The method for manufacturing a piezoelectric vibrating piece according to claim 4, wherein the base etching step forms a concave opening in the base substrate. 請求項1乃至の何れか一項記載の圧電振動片の製造方法により製造され、且つ、厚み方向を電気軸に沿って形成した圧電振動片を用いて構成されることを特徴とする圧電振動素子。 A piezoelectric vibration manufactured by the method for manufacturing a piezoelectric vibrating piece according to any one of claims 1 to 5 , and configured using a piezoelectric vibrating piece having a thickness direction formed along an electric axis. element. 請求項1乃至の何れか一項記載の圧電振動片の製造方法により製造した圧電振動片と、
該圧電振動片の振動腕の表面の両側縁にそれぞれ形成され、互いに異極となるようにされた第1の電極と、
該第1の電極の表面に形成した圧電薄膜と、該圧電薄膜を挟んで前記第1の電極と対となるように前記圧電薄膜の表面に形成された第2の電極と、
を有することを特徴とする圧電振動素子。
A piezoelectric vibrating piece manufactured by the method of manufacturing a piezoelectric vibrating piece according to any one of claims 1 to 5 ,
A first electrode formed on each side edge of the surface of the vibrating arm of the piezoelectric vibrating piece and having a different polarity from each other;
A piezoelectric thin film formed on the surface of the first electrode, and a second electrode formed on the surface of the piezoelectric thin film so as to be paired with the first electrode across the piezoelectric thin film;
A piezoelectric vibration element comprising:
JP2007040432A 2007-02-21 2007-02-21 Method for manufacturing piezoelectric vibrating piece and piezoelectric vibrating element Expired - Fee Related JP5023734B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007040432A JP5023734B2 (en) 2007-02-21 2007-02-21 Method for manufacturing piezoelectric vibrating piece and piezoelectric vibrating element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007040432A JP5023734B2 (en) 2007-02-21 2007-02-21 Method for manufacturing piezoelectric vibrating piece and piezoelectric vibrating element

Publications (3)

Publication Number Publication Date
JP2008205888A JP2008205888A (en) 2008-09-04
JP2008205888A5 true JP2008205888A5 (en) 2010-04-02
JP5023734B2 JP5023734B2 (en) 2012-09-12

Family

ID=39782880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007040432A Expired - Fee Related JP5023734B2 (en) 2007-02-21 2007-02-21 Method for manufacturing piezoelectric vibrating piece and piezoelectric vibrating element

Country Status (1)

Country Link
JP (1) JP5023734B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010187195A (en) * 2009-02-12 2010-08-26 Epson Toyocom Corp Vibrating piece, method for manufacturing the same, and vibrator
JP5347546B2 (en) * 2009-02-12 2013-11-20 セイコーエプソン株式会社 Vibrating piece, vibrating piece manufacturing method, and vibrator
JP5786393B2 (en) * 2011-03-18 2015-09-30 株式会社村田製作所 Quartz device manufacturing method
JP6110663B2 (en) * 2012-12-28 2017-04-05 京セラクリスタルデバイス株式会社 Manufacturing method of crystal unit
JP6004957B2 (en) * 2013-01-31 2016-10-12 京セラクリスタルデバイス株式会社 Quartz crystal resonator and manufacturing method thereof
KR102256902B1 (en) * 2013-07-25 2021-05-28 엔지케이 인슐레이터 엘티디 Composite board and method for making same
JP6528878B2 (en) * 2018-03-22 2019-06-12 セイコーエプソン株式会社 Electronic device, electronic device and mobile

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5866410A (en) * 1981-10-16 1983-04-20 Seiko Instr & Electronics Ltd Tuning fork type flexion crystal oscillator
JPH06196963A (en) * 1992-10-20 1994-07-15 Matsushita Electric Ind Co Ltd Piezo-electric filter and its production
JPH0746072A (en) * 1993-08-03 1995-02-14 Matsushita Electric Ind Co Ltd Manufacture of crystal resonator
JPH0750438A (en) * 1993-08-04 1995-02-21 Matsushita Electric Ind Co Ltd Manufacture of thin plate material
JPH10308640A (en) * 1997-05-07 1998-11-17 Matsushita Electric Ind Co Ltd Manufacture of piezoelectric device
JP3972790B2 (en) * 2001-11-27 2007-09-05 松下電器産業株式会社 Thin film micromechanical resonator and thin film micromechanical resonator gyro
JP4316903B2 (en) * 2003-03-11 2009-08-19 リバーエレテック株式会社 Flexural vibrator
JP4515180B2 (en) * 2004-07-20 2010-07-28 Necトーキン株式会社 Tuning fork type piezoelectric vibration gyro device
US20060255691A1 (en) * 2005-03-30 2006-11-16 Takahiro Kuroda Piezoelectric resonator and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JP2008205888A5 (en)
JP2015088521A5 (en)
JP2013217794A5 (en)
JP2008516787A5 (en)
WO2009011148A1 (en) Piezoelectric thin film resonant element and circuit component using the same
JP2007121167A5 (en)
EP1788621A3 (en) Method for manufacturing bonded substrate and bonded substrate manufactured by the method
JP2008011348A5 (en)
JP2008294407A5 (en)
JP2012024564A5 (en)
JP2010087573A5 (en)
JP2007001004A5 (en)
JP2011004035A5 (en)
JP2009536108A5 (en)
JP2009060479A5 (en)
JP2010182958A5 (en)
WO2016093020A1 (en) Piezoelectric device and method for producing piezoelectric device
JP2011211672A5 (en)
JP2011223489A5 (en)
JP2017103953A5 (en)
JP2013070112A5 (en)
JP2007157787A5 (en)
JP2006278562A5 (en)
JP5627279B2 (en) Vibration power generation device and manufacturing method thereof
WO2010150351A1 (en) Electrode base