JPH04116428U - Chip type piezoelectric resonator - Google Patents
Chip type piezoelectric resonatorInfo
- Publication number
- JPH04116428U JPH04116428U JP2836191U JP2836191U JPH04116428U JP H04116428 U JPH04116428 U JP H04116428U JP 2836191 U JP2836191 U JP 2836191U JP 2836191 U JP2836191 U JP 2836191U JP H04116428 U JPH04116428 U JP H04116428U
- Authority
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- Prior art keywords
- piezoelectric substrate
- substrate
- elastic member
- chip
- electrodes
- Prior art date
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000000853 adhesive Substances 0.000 claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 claims abstract description 27
- 125000006850 spacer group Chemical group 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】
【目的】圧電基板の振動電極上の空洞部を気密に保持で
き、さらに接着剤による振動電極への影響が発生ない、
特性の安定したチップ型圧電共振子を提供する。
【構成】振動電極を形成した圧電基板の両主面側から、
絶縁基板で挟持したチップ型圧電共振子において、前記
圧電基板と絶縁基板との間に、前記振動電極の周囲を取
り囲む弾性部材のスペーサーを設けたことである。
(57) [Summary] [Purpose] The cavity above the vibrating electrode of the piezoelectric substrate can be held airtight, and the vibrating electrode will not be affected by the adhesive.
A chip-type piezoelectric resonator with stable characteristics is provided. [Structure] From both main surfaces of the piezoelectric substrate on which the vibrating electrodes are formed,
In the chip-type piezoelectric resonator sandwiched between insulating substrates, a spacer made of an elastic member surrounding the vibrating electrode is provided between the piezoelectric substrate and the insulating substrate.
Description
【０００１】0001
本考案はプリント回路基板に表面実装可能なチップ型圧電共振子に関するもの である。 This invention relates to a chip-type piezoelectric resonator that can be surface mounted on a printed circuit board. It is.
【０００２】0002
圧電共振子は、電子機器、通信機器などに多用される発振回路の一部を構成す るものであり、特に、チップ型圧電共振子は、他の電子部品とプリント回路基板 にリフロー接合ができるという効果があった。 Piezoelectric resonators form part of oscillation circuits often used in electronic equipment, communication equipment, etc. In particular, chip-type piezoelectric resonators are compatible with other electronic components and printed circuit boards. This has the effect of allowing reflow bonding.
【０００３】 このようなチップ型圧電共振子としては、図４に示すように、振動電極４２、 ４３を形成した圧電基板４１の両主面側から、保護用の絶縁基板４４、４５を挟 持して構成されていた。（実開平２−１３３０１５号）0003 As shown in FIG. 4, such a chip-type piezoelectric resonator includes a vibrating electrode 42, Protective insulating substrates 44 and 45 are sandwiched between both main surfaces of the piezoelectric substrate 41 on which 43 is formed. It was made up of a lot of things. (Utility Model Publication No. 2-133015)
【０００４】 圧電基板４１の振動電極４２、４３部分には、振動に必要な空洞部Ａを形成す る必要があり、このため、上述のチップ型圧電共振子では、接着剤４６を振動電 極４２、４３の周囲に設け、圧電基板４１と絶縁基板４４、４５との接着作用と ともに、空洞形成していた。0004 A cavity A necessary for vibration is formed in the vibrating electrodes 42 and 43 of the piezoelectric substrate 41. For this reason, in the chip-type piezoelectric resonator described above, the adhesive 46 is It is provided around the poles 42 and 43, and has an adhesion effect between the piezoelectric substrate 41 and the insulating substrates 44 and 45. In both cases, cavities were formed.
【０００５】[0005]
上述のチップ型圧電共振子では、空洞部Ａを形成すべく、圧電基板４１上に接 着剤４６を塗布し、絶縁基板４４、４５とを押圧して、接着剤４６を硬化する。 In the chip-type piezoelectric resonator described above, in order to form the cavity A, the piezoelectric substrate 41 is The adhesive 46 is applied, and the insulating substrates 44 and 45 are pressed together to harden the adhesive 46.
【０００６】 このとき、接着剤４６が絶縁基板４４、４５の押圧により、振動電極４２、４ ３部分にまで広がり、所望の共振特性がえられない。このため、製造歩留りが低 下してしまう。[0006] At this time, the adhesive 46 is applied to the vibrating electrodes 42 and 4 by pressing the insulating substrates 44 and 45. This spreads to three parts, making it impossible to obtain the desired resonance characteristics. Therefore, manufacturing yield is low. I'll put it down.
【０００７】 また、加熱・硬化時、接着剤によって囲まれた空洞部Ａの空気が膨張して、硬 化途中の接着材４６により形成された接着層に空洞部Ａと外部とを連通する孔が 発生してしまう。[0007] Also, during heating and curing, the air in cavity A surrounded by the adhesive expands and hardens. A hole communicating between the cavity A and the outside is formed in the adhesive layer formed by the adhesive material 46 in the process of forming. It will happen.
【０００８】 このように、接着層に孔が生じると、プリント回路基板に実装した時に、リフ ロー半田や、洗浄液のフラックスや水分が空洞部Ａ内部にまで、浸入してしまう 。[0008] In this way, holes in the adhesive layer can cause reflux when mounted on a printed circuit board. Raw solder, cleaning fluid flux, and moisture penetrate into the cavity A. .
【０００９】 その結果、共振子としての所望の特性が得られなかんたり、使用中に特性変化 を北氏、信頼性の低いものになってしまう。[0009] As a result, the desired characteristics of the resonator may not be obtained, or the characteristics may change during use. Mr. Kita, it becomes unreliable.
【００１０】 本考案は上述の問題点に鑑みて案出されたものであり、その目的は、振動電極 上の空洞部を気密に保持でき、さらに接着剤が振動電極に接触することが防止で きる、特性の安定したチップ型圧電共振子を提供することにある。0010 This invention was devised in view of the above-mentioned problems, and its purpose is to The upper cavity can be kept airtight, and the adhesive can be prevented from coming into contact with the vibrating electrode. The object of the present invention is to provide a chip-type piezoelectric resonator with stable characteristics.
【００１１】[0011]
本考案によれば、振動電極を形成した圧電基板の両主面側を、絶縁基板で挟持 して成るチップ型圧電共振子において、前記圧電基板と絶縁基板との間に、前記 振動電極の周囲を取り囲むようにして弾性部材を設けると共に、該弾性部材の外 側で接着材でもって圧電基板と絶縁基板とを固定したことを特徴とするチップ型 圧電共振子である。 According to the present invention, both principal surfaces of a piezoelectric substrate on which a vibrating electrode is formed are sandwiched between insulating substrates. In the chip-type piezoelectric resonator comprising: the piezoelectric substrate and the insulating substrate; An elastic member is provided to surround the vibrating electrode, and an elastic member is provided on the outside of the elastic member. A chip type characterized by fixing a piezoelectric substrate and an insulating substrate with an adhesive on the side. It is a piezoelectric resonator.
【００１２】0012
本考案の構造によれば、振動電極の空洞部が弾性部材で封止、構成されるため 、接着剤の加熱・硬化時やプリント回路基板の実装時のリフロー炉における加熱 により、空洞部の圧力変化が発生しても、その変化を弾性部材の封止圧により抑 えされる。このため、空洞部を気密状態で保持できることになる。 According to the structure of the present invention, the cavity of the vibrating electrode is sealed and constructed with an elastic member. , heating in reflow ovens when heating and curing adhesives and mounting printed circuit boards. Therefore, even if a pressure change occurs in the cavity, the change is suppressed by the sealing pressure of the elastic member. be fed. Therefore, the cavity can be maintained in an airtight state.
【００１３】 仮に、圧力変化が大きくすぎて、弾性部材の封止圧を越える場合には、絶縁基 板との間から内部の空気が抜け、封止圧と釣り合う圧力で止まる。温度を下げて フラックス洗浄や実使用状態では、弾性部材の封止圧により再び密封され、水や ガスが侵入することはない。[0013] If the pressure change is too large and exceeds the sealing pressure of the elastic member, the insulating base The internal air escapes between the plate and the sealing pressure and stops when the pressure balances with the sealing pressure. lower the temperature During flux cleaning and actual use, the sealing pressure of the elastic member seals the area again, preventing water and No gas can enter.
【００１４】 また、振動電極の周囲に弾性部材が介在されているので、組立時に接着剤を塗 布して、圧電基板の両主面側から絶縁基板を押圧したとしても、接着剤の広がり は振動電極に達することが一切なく、製造歩留が向上する。[0014] Also, since an elastic member is interposed around the vibrating electrode, adhesive must be applied during assembly. Even if you press the insulating substrate from both main surfaces of the piezoelectric substrate with a cloth, the adhesive will not spread. never reaches the vibrating electrode, improving manufacturing yield.
【００１５】[0015]
以下、本考案のチップ型圧電共振子を図面に基づいて詳説する。図１は本考案 のチップ型圧電共振子の分解斜視図であり、図２はその分解図、図３はその断面 図である。 Hereinafter, the chip type piezoelectric resonator of the present invention will be explained in detail based on the drawings. Figure 1 shows the present invention 2 is an exploded perspective view of a chip-type piezoelectric resonator, FIG. 2 is an exploded view, and FIG. 3 is a cross section thereof. It is a diagram.
【００１６】 図において、チップ型圧電共振子１０は、圧電基板１と、該圧電基板１の両主 面側から挟持される絶縁基板２、３とを備えている。[0016] In the figure, a chip-type piezoelectric resonator 10 includes a piezoelectric substrate 1 and both main parts of the piezoelectric substrate 1. It includes insulating substrates 2 and 3 that are sandwiched from the surface sides.
【００１７】 圧電基板１は、チタン酸ジルコン酸鉛（ＰＺＴ）などの圧電性セラミックから 構成され、厚み方向に分極処理された基板の両主面に夫々振動電極１１、１２が 形成されている。また、圧電基板１の対向しあう両端の両主面には、端部電極１ ３、１４、１５、１６が基板１の幅方向に渡って形成されている。さらに、圧電 基板１の一方主面には、前記振動電極１１と端部電極１３とを導通する電極１７ が、他方主面には、前記振動電極１２と端部電極１６とを導通する電極１８が夫 々形成されている。[0017] The piezoelectric substrate 1 is made of piezoelectric ceramic such as lead zirconate titanate (PZT). Vibrating electrodes 11 and 12 are provided on both main surfaces of the substrate, which is structured and polarized in the thickness direction. It is formed. Further, end electrodes 1 are provided on both principal surfaces of the opposite ends of the piezoelectric substrate 1. 3, 14, 15, and 16 are formed across the width direction of the substrate 1. Furthermore, piezoelectric An electrode 17 is provided on one main surface of the substrate 1 to connect the vibrating electrode 11 and the end electrode 13. However, on the other main surface, there is an electrode 18 that connects the vibrating electrode 12 and the end electrode 16. are formed.
【００１８】 尚、圧電基板１上に形成される振動電極１１、１２、端部電極１３、１４及び 電極１５、１６は、クロム、銅、銀などを蒸着し、パターンはエッチングなどに より形成されている。[0018] Note that the vibrating electrodes 11, 12, end electrodes 13, 14, and The electrodes 15 and 16 are made of chromium, copper, silver, etc. by vapor deposition, and the pattern is formed by etching, etc. It is more formed.
【００１９】 また、圧電基板１の端部電極１３、１４、１５、１６形成部分の一部には、切 り欠け部１９、２０が形成されている。この切り欠け部１９、２０によって、圧 電基板１を絶縁基板２、３で挟持した時、導電性接着剤が広がり、端部電極１３ 、と１５、１４と１６とを導通させるとともに、次に示す絶縁基板２、３の端子 電極と導通させることができる。切り欠け部１９、２０の形成方法は、圧電基板 １の端部を、例えばダイアモンドソーで削除して形成する。[0019] In addition, some of the end electrodes 13, 14, 15, and 16 forming portions of the piezoelectric substrate 1 are cut. Notches 19 and 20 are formed. These notches 19 and 20 allow pressure When the electric substrate 1 is sandwiched between the insulating substrates 2 and 3, the conductive adhesive spreads and the end electrode 13 , 15, 14 and 16, and the terminals of the insulating substrates 2 and 3 shown below. It can be electrically connected to the electrode. The method for forming the notches 19 and 20 is as follows: The end portion of 1 is removed using, for example, a diamond saw.
【００２０】 絶縁基板２、３は、夫々セラミックなどの耐熱性材料から成り、圧電基板１の 両側を挟持するように配置される。[0020] The insulating substrates 2 and 3 are each made of a heat-resistant material such as ceramic, and are similar to the piezoelectric substrate 1. It is arranged so as to sandwich both sides.
【００２１】 絶縁基板２の対向する一対の端部には端子電極２２、２３が形成され、また絶 縁基板３の対向する一対の端部には端子電極２４、２５が形成されている。[0021] Terminal electrodes 22 and 23 are formed on a pair of opposing ends of the insulating substrate 2, and Terminal electrodes 24 and 25 are formed at a pair of opposing ends of the edge substrate 3.
【００２２】 端子電極２２、２３は絶縁基板２の端部を片側ずつＡｇペースト浴に浸漬（デ ィップ）し、乾燥したあとで焼成することにより形成され、絶縁基板２の外面側 、端面、圧電基板の挟持側に容易な方法で形成される。これにより、端子電極２ ２、２４と圧電基板１の端部電極１３、１５との接続が導電性接着剤を介して行 われる尚、基板３の端子電極２３、２５についても、端部電極１４、１６に同様 に接続される。[0022] The terminal electrodes 22 and 23 are made by dipping one end of the insulating substrate 2 in an Ag paste bath (dead). The outer surface of the insulating substrate 2 is , formed on the end face or the sandwiching side of the piezoelectric substrate by an easy method. As a result, the terminal electrode 2 2 and 24 and the end electrodes 13 and 15 of the piezoelectric substrate 1 are connected through a conductive adhesive. Note that the same applies to the terminal electrodes 23 and 25 of the substrate 3 as to the end electrodes 14 and 16. connected to.
【００２３】 上述の圧電基板１と絶縁基板２、３との組立は、圧電基板１の端部電極１３、 １５と絶縁基板２、３の端子電極２２、２６とが対応するように、圧電基板１の 両側から挟持される。端部電極１４、１６と端子電極２３、２５との間には、導 電性接着剤２６、２７を介在させている。導電性接着剤２６、２７はエポキシな どの樹脂接着剤にＡｇなどの導電性材料を混合したものが使用され、絶縁基板２ 、３の端子電極２２、２４又は圧電基板１の端部電極１３、１５上に所定量を塗 布して、圧電基板１の両側から絶縁基板２、３を加圧しながら加熱硬化する。[0023] The above-described assembly of the piezoelectric substrate 1 and the insulating substrates 2 and 3 includes the end electrodes 13 of the piezoelectric substrate 1, 15 of the piezoelectric substrate 1 so that the terminal electrodes 22 and 26 of the insulating substrates 2 and 3 correspond to each other. It is held from both sides. There is a conductor between the end electrodes 14, 16 and the terminal electrodes 23, 25. Electrical adhesives 26 and 27 are interposed. The conductive adhesives 26 and 27 are epoxy Which resin adhesive is used mixed with a conductive material such as Ag? , 3 on the terminal electrodes 22, 24 or on the end electrodes 13, 15 of the piezoelectric substrate 1. The piezoelectric substrate 1 is then heated and cured while applying pressure to the insulating substrates 2 and 3 from both sides of the piezoelectric substrate 1.
【００２４】 この時、導電性接着剤２６、２７は、加圧により、端部電極１３、１５と端子 電極２２、２４で若干広がり、圧電基板１の端部電極１３、１４、１５、１６の 一部に形成した切り欠け部１９、２０にまで充填され、端部電極１３、と１５、 １４と１６とを導通させることができる。尚、導電性接着剤２６、２７の広がり が不充分の時には、外部から切り欠け部１９、２０に導電性接着剤２６、２７を 充填してもよい。[0024] At this time, the conductive adhesives 26 and 27 are connected to the end electrodes 13 and 15 and the terminals by applying pressure. The electrodes 22 and 24 widen slightly, and the end electrodes 13, 14, 15, 16 of the piezoelectric substrate 1 The notches 19, 20 formed in some parts are filled, and the end electrodes 13, 15, 14 and 16 can be electrically connected. In addition, the spread of the conductive adhesives 26 and 27 If the adhesive is insufficient, apply conductive adhesive 26, 27 to the notches 19, 20 from the outside. May be filled.
【００２５】 本考案の特徴的なことは、振動電極１１、１２を形成した圧電基板１の両主面 側から、絶縁基板２、３を挟持したチップ型圧電共振子において、前記圧電基板 １と絶縁基板２、３との間に、前記振動電極１１、１２の周囲を取り囲む弾性部 材４であるスペーサーを設けたことである。[0025] The characteristic feature of the present invention is that both main surfaces of the piezoelectric substrate 1 on which the vibrating electrodes 11 and 12 are formed In a chip type piezoelectric resonator sandwiching insulating substrates 2 and 3 from the side, the piezoelectric substrate 1 and the insulating substrates 2 and 3, an elastic part surrounding the vibrating electrodes 11 and 12 is provided. The reason is that a spacer, which is material 4, is provided.
【００２６】 弾性部材４は、圧電基板１上に、振動電極１１、１２の周囲を取り囲むように してシリコンゴムなどでチキソ性（流動性が低く、印刷した形状がそのまま呈す る性質）の高い弾性部材のペーストをスクリーン印刷などにより塗布し、乾燥・ 硬化させて形成する。また、弾性部材４の厚みは、基板２、３を圧電基板１に挟 持した時、振動電極１１、１２上に振動に必要な空洞部Ａが形成されることを考 慮して、５０〜１００μｍの厚みをもって形成される。尚、弾性部材４の硬度は １２〜５０度（硬さＪＩＳＡ）が好ましい。硬度が１２度未満であると弾性部材 ４の形成工程において圧電基板１にキズを与える可能性があり、また５０度を越 えると絶縁基板２、３を圧電基板１に挟持しても、弾性部材４が充分につぶれず 、弾性部材４を設けた効果が充分にえられない。[0026] The elastic member 4 is arranged on the piezoelectric substrate 1 so as to surround the vibrating electrodes 11 and 12. thixotropic properties (low fluidity, the printed shape remains unchanged) using silicone rubber etc. A paste of a highly elastic material with a high Form by curing. Moreover, the thickness of the elastic member 4 is such that the substrates 2 and 3 are sandwiched between the piezoelectric substrate 1. Consider that when held, a cavity A necessary for vibration is formed on the vibrating electrodes 11 and 12. In consideration of this, it is formed to have a thickness of 50 to 100 μm. In addition, the hardness of the elastic member 4 is 12 to 50 degrees (hardness JISA) is preferable. If the hardness is less than 12 degrees, it is an elastic member. There is a possibility of scratching the piezoelectric substrate 1 in the formation process of step 4, and In other words, even if the insulating substrates 2 and 3 are sandwiched between the piezoelectric substrate 1, the elastic member 4 will not be sufficiently crushed. , the effect of providing the elastic member 4 cannot be sufficiently obtained.
【００２７】 これにより、圧電基板１の両主面側から絶縁基板２、３を、導電性接着剤２６ 、２７を介して加圧しながら挟持・固定すれば、圧電基板１の振動電極１１、１ ２の上部の空間は、圧電基板１、絶縁基板２、３及び弾性部材４によって完全に 密封された状態となる。[0027] As a result, the insulating substrates 2 and 3 are attached to the conductive adhesive 26 from both main surfaces of the piezoelectric substrate 1. , 27, the vibrating electrodes 11, 1 of the piezoelectric substrate 1 can be The space above 2 is completely filled by the piezoelectric substrate 1, the insulating substrates 2 and 3, and the elastic member 4. It will be in a sealed state.
【００２８】 したがって、導電性接着剤２６、２７の加熱・硬化時やプリント回路基板の実 装時のリフロー炉における加熱により、空洞部Ａの圧力変化が発生しても、その 変化分が弾性部材４の封止圧で吸収される。このため、空洞部Ａを気密状態で保 持できることになる。これにより、従来のように空洞部Ａを形成する部材に穴が 開いたり、破壊したりするのを有効に抑えることができる。[0028] Therefore, when heating and curing the conductive adhesives 26 and 27, and during the actual production of printed circuit boards, Even if pressure changes occur in cavity A due to heating in the reflow oven during mounting, the The amount of change is absorbed by the sealing pressure of the elastic member 4. Therefore, the cavity A is kept airtight. You will be able to hold it. As a result, a hole is created in the member forming the cavity A as in the conventional case. It can effectively prevent opening or destruction.
【００２９】 また、本考案において、仮に、圧力変化が大きくすぎて、弾性部材の封止圧を 越える場合には、絶縁基板との間から内部の空気が抜け、封止圧と釣り合う圧力 で止まる。温度を下げてフラックス洗浄や実使用状態では、弾性部材の封止圧に より再び密封され、水やガスが侵入することはない。[0029] In addition, in the present invention, if the pressure change is too large and the sealing pressure of the elastic member is If the pressure exceeds the sealing pressure, the internal air will escape from between the insulating substrate and the pressure will balance with the sealing pressure. It stops at When lowering the temperature and cleaning flux, or during actual use, the sealing pressure of the elastic member It is sealed again and no water or gas can enter.
【００３０】 また、振動電極１１、１２の周囲に弾性部材４のスペーサーが形成されている ので、導電性接着剤２６、２７の広がりが発生したとしても、振動電極１１、１ ２に達することが一切なく、振動電極１１、１２と端子電極２３、２４、２５、 ２６との短絡を未然に防止ができ、製造歩留が大きく向上する。[0030] Further, a spacer of the elastic member 4 is formed around the vibrating electrodes 11 and 12. Therefore, even if the conductive adhesives 26 and 27 spread, the vibrating electrodes 11 and 1 2, the vibrating electrodes 11, 12 and the terminal electrodes 23, 24, 25, 26 can be prevented in advance, and the manufacturing yield can be greatly improved.
【００３１】 尚、上述の実施例では、弾性部材４のスペーサーが圧電基板１側に形成されて いるが、振動電極１１、１２の周囲に配置されるように絶縁基板２、３側に形成 しても構わない。また、その形状を、空洞部Ａの体積の膨張で発生する応力を均 一分散するために円形に形成したが、弾性部材４のスペーサーの幅などを考慮す れば、円形以外のあらゆる形状に設定できる。[0031] In the above embodiment, the spacer of the elastic member 4 is formed on the piezoelectric substrate 1 side. However, it is formed on the insulating substrates 2 and 3 side so as to be placed around the vibrating electrodes 11 and 12. I don't mind if you do. In addition, the shape is designed to even out the stress generated by the expansion of the volume of the cavity A. Although it was formed into a circular shape for uniform dispersion, considering the width of the spacer of the elastic member 4, etc. It can be set to any shape other than circular.
【００３２】[0032]
以上、詳述したように、本考案によれば、圧電基板の振動電極の空洞部を気密 に保持でき、さらに導電性接着剤の広がりによる振動電極への影響が一切発生し ない、特性の安定した、且つ製造歩留が向上するチップ型圧電共振子となる。 As detailed above, according to the present invention, the cavity of the vibrating electrode of the piezoelectric substrate is made airtight. Furthermore, the spread of the conductive adhesive does not affect the vibrating electrode at all. This results in a chip-type piezoelectric resonator with stable characteristics and improved manufacturing yield.
【図１】本考案のチップ型圧電共振子の分解斜視図であ
る。FIG. 1 is an exploded perspective view of a chip-type piezoelectric resonator of the present invention.
【図２】本考案のチップ型圧電共振子の分解図である。FIG. 2 is an exploded view of the chip-type piezoelectric resonator of the present invention.
【図３】本考案のチップ型圧電共振子の断面図である。FIG. 3 is a cross-sectional view of the chip-type piezoelectric resonator of the present invention.
【図４】従来のチップ型圧電共振子の断面図である。FIG. 4 is a cross-sectional view of a conventional chip-type piezoelectric resonator.
１・・・・・・・・・・圧電基板 ２、３・・・・・・・・絶縁基板 ４・・・・・・・・・・弾性部材 ２６、２７・・・・・・導電性接着材 1・・・・・・・・・Piezoelectric substrate 2, 3...Insulating substrate 4・・・・・・・・・Elastic member 26, 27... Conductive adhesive
Claims (1)
を、絶縁基板で挟持して成るチップ型圧電共振子におい
て、前記圧電基板と絶縁基板との間に、前記振動電極の
周囲を取り囲むようにして弾性部材を配すると共に、該
弾性部材の外側で接着材でもって圧電基板と絶縁基板と
を固定したことを特徴とするチップ型圧電共振子。1. A chip-type piezoelectric resonator in which both main surfaces of a piezoelectric substrate on which a vibrating electrode is formed are sandwiched between insulating substrates, wherein a periphery of the vibrating electrode is surrounded between the piezoelectric substrate and the insulating substrate. A chip-type piezoelectric resonator characterized in that an elastic member is disposed in this manner, and a piezoelectric substrate and an insulating substrate are fixed with an adhesive on the outside of the elastic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2836191U JPH04116428U (en) | 1991-03-29 | 1991-03-29 | Chip type piezoelectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2836191U JPH04116428U (en) | 1991-03-29 | 1991-03-29 | Chip type piezoelectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04116428U true JPH04116428U (en) | 1992-10-19 |
Family
ID=31912474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2836191U Pending JPH04116428U (en) | 1991-03-29 | 1991-03-29 | Chip type piezoelectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04116428U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677757A (en) * | 1992-08-26 | 1994-03-18 | Tdk Corp | Electronic parts |
| JP2009212906A (en) * | 2008-03-05 | 2009-09-17 | Seiko Epson Corp | Mounting structure for electronic component, and method of mounting the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57118419A (en) * | 1981-01-14 | 1982-07-23 | Fujitsu Ltd | Flat pack type oscillating circuit parts |
| JPS58131808A (en) * | 1982-01-29 | 1983-08-05 | Toko Inc | Hybrid integrated circuit |
| JPS61182312A (en) * | 1985-02-07 | 1986-08-15 | Murata Mfg Co Ltd | Piezoelectric resonator |
| JPS6374312A (en) * | 1986-09-18 | 1988-04-04 | Murata Mfg Co Ltd | Manufacture of electronic parts |
| JP3082924B2 (en) * | 1989-02-06 | 2000-09-04 | キヤノン株式会社 | Image recording device |
-
1991
- 1991-03-29 JP JP2836191U patent/JPH04116428U/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57118419A (en) * | 1981-01-14 | 1982-07-23 | Fujitsu Ltd | Flat pack type oscillating circuit parts |
| JPS58131808A (en) * | 1982-01-29 | 1983-08-05 | Toko Inc | Hybrid integrated circuit |
| JPS61182312A (en) * | 1985-02-07 | 1986-08-15 | Murata Mfg Co Ltd | Piezoelectric resonator |
| JPS6374312A (en) * | 1986-09-18 | 1988-04-04 | Murata Mfg Co Ltd | Manufacture of electronic parts |
| JP3082924B2 (en) * | 1989-02-06 | 2000-09-04 | キヤノン株式会社 | Image recording device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677757A (en) * | 1992-08-26 | 1994-03-18 | Tdk Corp | Electronic parts |
| JP2009212906A (en) * | 2008-03-05 | 2009-09-17 | Seiko Epson Corp | Mounting structure for electronic component, and method of mounting the same |
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