JPS59119911A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPS59119911A JPS59119911A JP23261782A JP23261782A JPS59119911A JP S59119911 A JPS59119911 A JP S59119911A JP 23261782 A JP23261782 A JP 23261782A JP 23261782 A JP23261782 A JP 23261782A JP S59119911 A JPS59119911 A JP S59119911A
- Authority
- JP
- Japan
- Prior art keywords
- vibrating
- substrate
- piezoelectric
- pair
- piezoelectric vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000005284 excitation Effects 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 230000005684 electric field Effects 0.000 abstract description 6
- 230000010355 oscillation Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000011324 bead Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000005074 turgor pressure Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（ａ） 発明の技術分野
本発明は圧電振動子、特にス｝ ＩＪアップ形電振動子
の小形化と特性のばらつき幅を狭めて信頼性を高める構
造的改善に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a structural improvement of a piezoelectric vibrator, particularly a piezoelectric vibrator, which improves reliability by reducing the size and narrowing the width of variation in characteristics of a piezoelectric vibrator.
（ｂ） 技術の背景
水晶やＬ ｉ Ｔ ａ Ｑ ３等の圧電体に適当な電極
パターンを被着し、その電極に交流電界を印加すると圧
電体は印加電界に等しい周波数の応力を生じ、かつ、印
加電界の周波数が圧電体の固有振動数に一致すると共振
して強勢な振動が得られる。このよう々現象を利用した
振動子は小型高性能であるため、通信装置等の発振回路
やフィルタとして広く用いられている。(b) Background of the technology When a suitable electrode pattern is applied to a piezoelectric material such as quartz crystal or LiTaQ3, and an alternating current electric field is applied to the electrode, the piezoelectric material generates stress with a frequency equal to the applied electric field, and When the frequency of the applied electric field matches the natural frequency of the piezoelectric material, resonance occurs and strong vibrations are obtained. Since vibrators that utilize these phenomena are small and have high performance, they are widely used as oscillation circuits and filters in communication devices and the like.
第１図はス） ＩＪツブ形圧電振動素子の斜視図（イ）
とその厚みすべり振動を説明するための図（ロ）である
。Figure 1 is (S) A perspective view of the IJ knob type piezoelectric vibrating element (A)
FIG. 3 is a diagram (b) for explaining the thickness shear vibration.
第１図において、振動素子１はＬｉ’ｌ’ａＱ３単結晶
のＸ板より切出した圧電基板２０対向主面それぞれに電
極パターン３を被着し、電極パターン３は非調和振動を
無くするため主面中央部で圧電板２０幅全体に形成され
ている。そこで、１対の電極パターン３に高周波電界を
印加すると、素子１ば（イ）図の矢印方向へ厚みすべり
振動を生じ、その大きさは（ロ）図に示す如く中央部で
最も大きく両端へ行くほど小さくなる。In FIG. 1, a vibrating element 1 has an electrode pattern 3 adhered to each of the opposing principal surfaces of a piezoelectric substrate 20 cut out from an X-plate of Li'l'aQ3 single crystal. It is formed over the entire width of the piezoelectric plate 20 at the center of the surface. Therefore, when a high-frequency electric field is applied to a pair of electrode patterns 3, thickness shear vibrations occur in the element 1 (a) in the direction of the arrow in the figure. The further you go, the smaller it becomes.
そして素子１は、その振動特性を安定化させるだめのパ
ッケージに収納して使用される。The element 1 is used while being housed in a package that stabilizes its vibration characteristics.
（Ｃ） 従来技術と問題点
第２図はストリップ形振動素子を収納したチップ形振動
子の外観を示す斜視図、第３図は前記振動子の分解斜視
図であり、振動子５Ｆｉ対向主面それぞれに励振用電極
９をパターン形成した振動素子（第１図の素子１に相当
）６と、１対の外部電極１０をパターン形成したパッケ
ージ基板７と、キャップ８にて構成されている。ただし
、基板７の上に搭載された素子６は導電性接着剤にて電
極９と１０それぞれの一方及び他方を接続したのち基板
７の上に絶縁性接着Ｒ１１を介してキャップ８を封着し
、素子６はその端部に被着した前記導電性接着剤の硬化
層（又は接着剤に混入したビーズ玉）により基板７の上
面よりやや持上げられるようになっている。(C) Prior Art and Problems Fig. 2 is a perspective view showing the external appearance of a chip-type vibrator housing a strip-type vibrating element, and Fig. 3 is an exploded perspective view of the vibrator. It consists of a vibrating element 6 (corresponding to element 1 in FIG. 1) on which an excitation electrode 9 is patterned, a package substrate 7 on which a pair of external electrodes 10 are patterned, and a cap 8. However, for the element 6 mounted on the substrate 7, one and the other of the electrodes 9 and 10 are connected using a conductive adhesive, and then a cap 8 is sealed on the substrate 7 via an insulating adhesive R11. , the element 6 is lifted slightly above the upper surface of the substrate 7 by the cured layer of the conductive adhesive (or beads mixed in the adhesive) adhered to the ends thereof.
しかし、振動子５は基板７の上に搭載する位置のずれや
導電性接着剤の硬化層の状態（厚さ等〕に影響されて、
機械的Ｑ値や共振周波数のばらっきが発生し、かつ、さ
らに小型化することが困難であるという問題点があった
。However, the vibrator 5 is affected by the misalignment of the mounting position on the substrate 7 and the condition (thickness, etc.) of the hardened layer of conductive adhesive.
There are problems in that variations occur in the mechanical Q value and resonance frequency, and further miniaturization is difficult.
（ｄ） 発明の目的
本発明の目的は、上記問題点を除去し、かつ製造プロセ
スが単純化できる圧電振動子を提供することである。(d) Object of the Invention An object of the present invention is to provide a piezoelectric vibrator that can eliminate the above problems and simplify the manufacturing process.
（ｅ） 発明の構成
上記目的は、１対の透孔を圧電基板に穿設して該基板の
中央部に１対の該透孔が係わる短冊形状の振動部を形成
し、前記振動部の表面と裏面それぞれに励振用筒、極を
パターン形成した振動素子を具えて構成したことを特徴
とし、さらには前記振動素子を挾むように第１及び第２
の平板状パッケージを接着しその端面に、１対の前記電
極に接続された導体層を形成等してなるように構成した
本発明の圧電振動子により達成される。(e) Structure of the Invention The above object is to form a rectangular vibrating part in the center of the piezoelectric substrate by forming a pair of through holes in the piezoelectric substrate, and to form a rectangular vibrating part in which the pair of through holes engage. It is characterized by having a vibrating element having a pattern of excitation tubes and poles formed on each of the front and back surfaces, and further comprising a first and a second vibrating element sandwiching the vibrating element.
This is achieved by the piezoelectric vibrator of the present invention, which is constructed by bonding a flat package and forming a conductor layer connected to the pair of electrodes on the end face thereof.
（「）発明の実施例
以下、図面を用いて本発明になる圧電振動子の実施例を
説明する。(') Embodiments of the Invention Hereinafter, embodiments of the piezoelectric vibrator according to the present invention will be described with reference to the drawings.
第４図は本発明の一実施例になる圧電振動素子の斜視図
、第５図は前記素子の長さ方向中心線（Ｉ−Ｉ’）に沿
った断面図、第６図は本発明の一実施例になり前記素子
を用いた圧電振動子の斜視図、第７図は前記振動子の分
解斜視図である。FIG. 4 is a perspective view of a piezoelectric vibrating element according to an embodiment of the present invention, FIG. 5 is a sectional view taken along the longitudinal center line (I-I') of the element, and FIG. 6 is a perspective view of a piezoelectric vibrating element according to an embodiment of the present invention. FIG. 7 is a perspective view of a piezoelectric vibrator using the above-described element as an embodiment, and FIG. 7 is an exploded perspective view of the vibrator.
第４図及び第５図において、圧電振動素子２１はＬｉＴ
ａＯ３単結晶のＸ板より切出した圧電基板２２に、平面
視長方形をした１対の透孔２３を超音波加工手段（又は
エツチング等の手段〕で対向穿設して基板２２の中央に
短冊形状の振動部２４を形成し、振動部２４の表面と裏
面それぞれの中央部分にその幅全体にわたる励振用電極
２５をパターン形成し、基板２２の長さ方向端部それぞ
れに形成した端子電極（第１及び第２の端子電極）２６
が励振電極２５の何れか一方に接続されてい−る。従っ
て、１対の端子電極２６を介して１対の励振電極に所定
の高周波電界を印加すると、振動素子２１の振動部２４
＃′ｉ第１図（イ）に示す矢印と同じ方向（振動部２４
の長さ方向）の厚みすべり振動を生じ、その太きさは振
動部２４の中央部で最大になる。4 and 5, the piezoelectric vibrating element 21 is LiT
In a piezoelectric substrate 22 cut from an aO3 single crystal X-plate, a pair of through holes 23 which are rectangular in plan view are bored facing each other by ultrasonic machining means (or by means such as etching) to form a rectangular shape in the center of the substrate 22. A vibrating part 24 is formed, and excitation electrodes 25 are patterned in the center portions of the front and back surfaces of the vibrating part 24 over the entire width thereof, and terminal electrodes (first and second terminal electrode) 26
is connected to either one of the excitation electrodes 25. Therefore, when a predetermined high-frequency electric field is applied to a pair of excitation electrodes via a pair of terminal electrodes 26, the vibrating part 24 of the vibrating element 21
#'i Same direction as the arrow shown in Fig. 1 (a) (vibrating part 24
A thickness shear vibration is generated in the longitudinal direction of the vibrating section 24, and its thickness is maximum at the center of the vibrating section 24.
このように構成された振動素子２１は、それをパンケー
ジに搭載したとき機械的Ｑ値等の振動特性に影響する接
着剤が振動部２４に付着しないため、特性値のばらつき
が少くなる。When the vibrating element 21 configured in this manner is mounted on a pan cage, adhesive that affects vibration characteristics such as the mechanical Q value does not adhere to the vibrating section 24, so that variations in characteristic values are reduced.
なお、上記実施例において振動素子２１ｆｔ、長方形の
透孔２３を穿設して振動部２４が形成されているが、透
孔２３は基板２２の大きさが小さくてすむだめの配慮で
あり、例えば半円形の透孔部が対向するように１対の透
孔ｉｔを穿設し振動部２４が形成されても、その振動特
性は振動素子２１と同等になる。In the above embodiment, the vibration element 21 ft and the rectangular through hole 23 are formed to form the vibrating section 24, but the through hole 23 is designed to reduce the size of the substrate 22, for example. Even if the vibrating part 24 is formed by drilling a pair of through holes it so that the semicircular through holes face each other, its vibration characteristics will be the same as those of the vibrating element 21.
第６図において、チップ形圧電振動子３１は、振動素子
２１の上面に平面視角形のセラミックス板（笥１の平板
状パッケージ）３２を接着し、振動素子２１の下面に平
面視角形のセラミックス板（第２の平板状パッケージ）
３２′に接着し、１対の端子電極２６の一部分が接着さ
れた振動素子２１の端面を含む端面とその近傍それぞれ
に導体層３４を被着して構成される。In FIG. 6, a chip-type piezoelectric vibrator 31 is constructed by bonding a ceramic plate (a flat package of the box 1) 32 having a rectangular shape in plan view on the upper surface of the vibrating element 21, and a ceramic plate having a rectangular shape in plan view on the lower surface of the vibrating element 21. (Second flat package)
32', and a conductor layer 34 is applied to each end face including the end face of the vibrating element 21 to which a portion of the pair of terminal electrodes 26 is adhered, and the vicinity thereof.
ただし、平面視同じ外形に形成した振動素子２１をパッ
ケージ３２と３３の間に接着する前記接着は第７図に示
す如く、振動素子２１０１対の端子電極２６に対向する
パッケージ３２の下面周辺領域３５とパッケージ３３の
上面周辺領域３６に、封止用導電性接着剤を塗付し、前
記対向しないパッケージ３２の下面周辺領域３７とパッ
ケージ３３の上面周辺領域３８に、ビーズ玉入りの封止
用絶縁性接着剤を塗付して行なっである。従って、振動
素子２１の接動部２４は、パッケージ３２の下面及びパ
ッケージ３３の上面とビーズ玉の直径分だけ離れて対向
し外部とじゃへいされる。However, as shown in FIG. 7, the bonding of the vibrating elements 21 formed to have the same external shape in plan view between the packages 32 and 33 is performed on the lower surface peripheral area 3 of the package 32 facing the terminal electrodes 26 of the pair of vibrating elements 2101. A conductive sealing adhesive is applied to the top peripheral area 36 of the package 33, and a sealing insulator containing beads is applied to the bottom peripheral area 37 of the package 32 that does not face the package 32 and the top peripheral area 38 of the package 33. This is done by applying adhesive. Therefore, the contact portion 24 of the vibrating element 21 faces the lower surface of the package 32 and the upper surface of the package 33 at a distance equal to the diameter of the bead, and is shielded from the outside.
このように構成された振動子３１は、混成集積回路基板
や印刷配線板等に導電性接着剤やはんだ等で搭載される
が、振動素子２１は振動部２４とその側方を囲う枠状体
とが一体化しであるため、振動部２４の上方を覆うパッ
ケージ構成体が板状でよく、振動部２４の密閉空間を従
来のものより狭くすることができる等により小型化され
る。The vibrator 31 configured in this manner is mounted on a hybrid integrated circuit board, a printed wiring board, etc. using a conductive adhesive, solder, etc. Since these are integrated, the package structure that covers the upper part of the vibrating part 24 can be in the form of a plate, and the sealed space of the vibrating part 24 can be made narrower than that of the conventional one, resulting in miniaturization.
と共に、振動素子２１とパッケージとを同じ外形に揃え
ることができるため、製造プロセスが単純化することに
なる。At the same time, since the vibration element 21 and the package can be made to have the same external shape, the manufacturing process is simplified.
なお、振動子３１は振動素子２１とパッケージ３２及び
３３の外形を揃えであるが、これは振動子３１の小型化
及び製造プロセスを単純化するためであり、第２図に示
す振動子５と外観を揃える等のため、パッケージ３３を
振動素子２１及びパッケージ３２よシ大きくするが如く
、前記外形を違えて構成することもよい。また、振動子
３１の導体層３４は、振動子３１を混成集積回路等に搭
載するのに一般的、かつ最適な接続端子構成として形成
したものであり、例えばパッケージ３３の下面に１対の
電極をパターン形成し、その電極と振動素子２１の端子
電極２６とを接続させる等の細形状に構成することもよ
い。Note that in the vibrator 31, the external shapes of the vibrating element 21 and the packages 32 and 33 are the same, but this is to miniaturize the vibrator 31 and simplify the manufacturing process, and the vibrator 5 shown in FIG. In order to make the appearance uniform, for example, the package 33 may be made larger than the vibrating element 21 and the package 32, so that the external shapes may be different. Further, the conductor layer 34 of the vibrator 31 is formed with a common and optimal connection terminal configuration for mounting the vibrator 31 in a hybrid integrated circuit, etc. For example, a pair of electrodes is formed on the bottom surface of the package 33. It is also possible to configure it into a thin shape by forming a pattern and connecting the electrode to the terminal electrode 26 of the vibrating element 21.
（ｇ） 発明の詳細
な説明した如く本発明によれば、振動の機械的負荷とば
らつきになる接着剤が振動部に付着しないように構成し
、振動部の位置が一義的に決まるため、機械的Ｑ値と共
振周波数のばらつきが減少して振動子の品位を高め、か
つパッケージが単純化して小型化されると共に、製造プ
ロセスを単純化することができる等の効果が顕著である
。(g) As described in detail, according to the present invention, the adhesive which causes variations in the mechanical load of vibration is prevented from adhering to the vibrating part, and the position of the vibrating part is uniquely determined. It has remarkable effects such as reducing the variation in the target Q value and resonance frequency, improving the quality of the vibrator, simplifying the package and downsizing it, and simplifying the manufacturing process.
第１図はストリップ形圧電振動素子の斜視図（イ）とそ
の厚みすべり振動を説明するための図（ロ）、第２図は
圧電素子を収容したチップ形圧電振動子の一般的従来構
造を説明するための斜視図、第３図は第２図に示した振
動子の分解斜視図、第４図は本発明の一実施例になる圧
電振動素子の斜視図、第５図は第４図のＩ −Ｉ’断面
を示す拡大図、第６図は本発明の一実施例になるチップ
膨圧を撮動子の斜視図、第７図は第６図に示した振動子
の分解斜視図である。
図中において、２１は圧電振動素子、２２は圧電基板、
２３は透孔、２４は振動部、２５は励振用電極、２６は
端子電極、３１はチップ形圧電振動子、３２はセラミッ
クス板（第１の平板状パッケージ）、３３はセラミック
板（第２の平板状パッケージ）、３４は導体層、３５．
３６は封止用の導電性接着剤塗付領域、３７．３８は封
止用のビーズ玉入り絶縁性接着剤塗付領域を示す。
キ − 図
（イ） （Ｏ）
／
を２図 手３図
！Figure 1 is a perspective view of a strip type piezoelectric vibrator (A) and a diagram for explaining its thickness shear vibration (B), and Figure 2 is a general conventional structure of a chip type piezoelectric vibrator housing a piezoelectric element. FIG. 3 is an exploded perspective view of the vibrator shown in FIG. 2, FIG. 4 is a perspective view of a piezoelectric vibrating element according to an embodiment of the present invention, and FIG. 5 is a perspective view for explanation. FIG. 6 is a perspective view of a chip turgor pressure sensor according to an embodiment of the present invention, and FIG. 7 is an exploded perspective view of the vibrator shown in FIG. 6. It is. In the figure, 21 is a piezoelectric vibration element, 22 is a piezoelectric substrate,
23 is a through hole, 24 is a vibrating part, 25 is an excitation electrode, 26 is a terminal electrode, 31 is a chip type piezoelectric vibrator, 32 is a ceramic plate (first flat package), 33 is a ceramic plate (second flat package). 34 is a conductor layer; 35.
Reference numeral 36 indicates a region to which a conductive adhesive for sealing is applied, and 37 and 38 indicate regions to which an insulating adhesive containing beads for sealing is applied. Key - Diagram (A) (O)
/ 2 figures, 3 figures of hands!
Claims (6)
により該基板に該透孔で挾まれた短冊形状の振動部が形
成され、該振動部の表面と裏面それぞれには励振用電極
がパターン形成されて振動素子が構成されていることを
特徴とする圧電振動子。(1) By drilling at least one pair of through holes in a piezoelectric substrate, a rectangular vibrating section sandwiched by the through holes is formed in the substrate, and an excitation electrode is provided on each of the front and back surfaces of the vibrating section. A piezoelectric vibrator characterized in that a vibrating element is constructed by forming a pattern.
とする特許 圧電振動子。(2) A patented piezoelectric vibrator characterized in that the pair of through holes are rectangular in plan view.
一方の端面に被着した第１の端子電極に接続し、前記振
動部裏面に形成した前記電極が振動素子の他方の端面に
被着した第２の端子電極に接続されてなることを特徴と
する前記特許請求の範囲第（１）項に記載した圧電振動
子。(3) The electrode formed on the surface of the vibrating section is connected to a first terminal electrode attached to one end surface of the vibrating element, and the electrode formed on the back surface of the vibrating section is connected to the other end surface of the vibrating element. The piezoelectric vibrator according to claim 1, wherein the piezoelectric vibrator is connected to a second terminal electrode attached to the piezoelectric vibrator.
の平板状パッケージと、振動素子の裏面に対向する第２
の平板状パッケージを具え、前記振動素子と第１及び第
２の前記パッケージは接着層を介し、かつ接着層の厚さ
だけ前記振動部が第１及び第２の前記パッケージから離
れて接合されてがることを特徴とする前記特許請求の範
囲第（１）項に記載した圧電振動子。(4) The vibration element and a first
a flat package, and a second package facing the back surface of the vibration element.
The vibrating element and the first and second packages are bonded to each other via an adhesive layer, and the vibrating section is separated from the first and second packages by the thickness of the adhesive layer. A piezoelectric vibrator as set forth in claim (1).
が平面視同一外形であり、それらの外形をほぼ揃えて前
記接合されていることを特徴とする前記特許請求の範囲
第（４）項に記載した圧電振動子。(5) Claim (4) characterized in that the vibrating element and the first and second packages have the same external shape in a plan view, and are joined with their external shapes substantially aligned. Piezoelectric vibrator described in section.
それぞれを含む端面に導電層を被着してなること全特徴
とする前記特許請求の範囲第（５）項に記載した圧電振
動子。(6) The piezoelectric device according to claim (5), characterized in that after the bonding, a conductive layer is applied to the end face including each of the first and second terminal N poles. vibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23261782A JPS59119911A (en) | 1982-12-25 | 1982-12-25 | Piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23261782A JPS59119911A (en) | 1982-12-25 | 1982-12-25 | Piezoelectric oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119911A true JPS59119911A (en) | 1984-07-11 |
Family
ID=16942132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23261782A Pending JPS59119911A (en) | 1982-12-25 | 1982-12-25 | Piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119911A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5565163A (en) * | 1978-11-10 | 1980-05-16 | Usac Electronics Ind Co Ltd | Test system |
| JPH0265517A (en) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | Piezoelectric oscillator |
| JPH0257621U (en) * | 1988-10-20 | 1990-04-25 | ||
| JPH033838U (en) * | 1989-06-02 | 1991-01-16 | ||
| JPH033839U (en) * | 1989-06-02 | 1991-01-16 | ||
| JPH0335609A (en) * | 1989-06-30 | 1991-02-15 | Murata Mfg Co Ltd | Piezo-resonator and its manufacture |
| JPH07122966A (en) * | 1993-10-21 | 1995-05-12 | Murata Mfg Co Ltd | Energy confinement type piezoelectric resonator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129994A (en) * | 1978-03-31 | 1979-10-08 | Matsushima Kogyo Co Ltd | Crystal vibrator |
| JPS5568718A (en) * | 1978-11-16 | 1980-05-23 | Suisse Horlogerie | Piezooelectric bar resonator |
-
1982
- 1982-12-25 JP JP23261782A patent/JPS59119911A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129994A (en) * | 1978-03-31 | 1979-10-08 | Matsushima Kogyo Co Ltd | Crystal vibrator |
| JPS5568718A (en) * | 1978-11-16 | 1980-05-23 | Suisse Horlogerie | Piezooelectric bar resonator |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5565163A (en) * | 1978-11-10 | 1980-05-16 | Usac Electronics Ind Co Ltd | Test system |
| JPS6222102B2 (en) * | 1978-11-10 | 1987-05-15 | Yuuzatsuku Denshi Kogyo Kk | |
| JPH0265517A (en) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | Piezoelectric oscillator |
| JPH0257621U (en) * | 1988-10-20 | 1990-04-25 | ||
| JPH033838U (en) * | 1989-06-02 | 1991-01-16 | ||
| JPH033839U (en) * | 1989-06-02 | 1991-01-16 | ||
| JPH0335609A (en) * | 1989-06-30 | 1991-02-15 | Murata Mfg Co Ltd | Piezo-resonator and its manufacture |
| JPH07122966A (en) * | 1993-10-21 | 1995-05-12 | Murata Mfg Co Ltd | Energy confinement type piezoelectric resonator |
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