JP2009272795A - Piezoelectric vibration element, and piezoelectric device and method of manufacturing the same - Google Patents

Piezoelectric vibration element, and piezoelectric device and method of manufacturing the same Download PDF

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Publication number
JP2009272795A
JP2009272795A JP2008120241A JP2008120241A JP2009272795A JP 2009272795 A JP2009272795 A JP 2009272795A JP 2008120241 A JP2008120241 A JP 2008120241A JP 2008120241 A JP2008120241 A JP 2008120241A JP 2009272795 A JP2009272795 A JP 2009272795A
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Prior art keywords
electrode
piezoelectric
pad
conductive adhesive
vibration element
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JP2008120241A
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Japanese (ja)
Inventor
Ryoichi Yasuike
亮一 安池
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Miyazaki Epson Corp
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Miyazaki Epson Corp
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Priority to JP2008120241A priority Critical patent/JP2009272795A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibration element in which a connection state of a conductive adhesive is easily confirmed and its adhesive strength is enhanced. <P>SOLUTION: The piezoelectric vibration element has a crystal substrate 2, driven electrodes 3 and 4 formed on both principal surfaces of a crystal substrate 2, two pad electrodes 6 and 8 formed on one surface of the crystal substrate 2, and a through-hole 9 formed on the pad electrode 6, wherein the driven electrode 4 is disposed on the linear extension connecting the two pad electrodes 6 and 8, the through-hole 9 is formed on the pad electrode 6 disposed between the pad electrode 8 and driven electrode 4, the electrode pad 8 is connected to the driven electrode 4 through a lead electrode 7, the electrode pad 6 is connected to the driven electrode 4 through a lead electrode 5 and the through-hole 9. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、圧電振動素子、圧電デバイス、及びその製造方法に関わり、特に導電性接着
剤の接着強度の向上を図るのに好適なものである。
The present invention relates to a piezoelectric vibration element, a piezoelectric device, and a manufacturing method thereof, and is particularly suitable for improving the adhesive strength of a conductive adhesive.

携帯電話機等の移動体通信機器は、小型化、軽量化が進む一方で、高機能化についても
強く求められており、高機能化に伴う部品点数の増加と小型化という相反する2つの要求
を同時に満たす為に、電装部を構成するプリント基板の小面積化と、搭載部品等の高密度
化による基板面積の有効利用が重要視されるようになっている。移動体通信機器や伝送通
信機器において周波数制御デバイスとして用いられる水晶共振子(振動子、フィルタ)に
ついても小型化等が強く求められており、高密度実装化に対応するためにデバイスのパッ
ケージ構造としては、表面実装型が主流となっており、併せて高周波化の要求が強くなっ
ている。
図7は、特許文献1に開示されている従来のATカット水晶振動素子の斜視図である。
この図7に示す水晶振動素子110は、ATカット水晶基板の基本波厚みすべり振動波
を利用した振動子であって、水晶振動素子110を構成する水晶基板の一方の主面をエッ
チングによって凹陥せしめて凹陥部113とした構成を有する。従って、この水晶基板は
、凹陥部113の底面を超薄肉の振動部113aとすると共に、振動部113aの外周を
全周に亙って厚肉の環状囲繞部114により一体的に支持した構成となっている。
更に、マスクを用いて金を蒸着するか、又はフォトリソグラフィにより水晶基板の一方
の主面(振動部113a)上には、励振電極を構成する主面電極111と、これより延出
するリード電極115及びパッド電極116に加えて、パッド電極117を形成する。な
お、パッド電極117は、他方の主面上に同様に形成した励振電極を構成する裏面電極1
12から延出したリード電極118を水晶基板の側端面を通って表面側に引き出すことに
よりリード電極118と導通している。上記のように水晶振動素子110を構成すれば、
支持応力の影響が少ない振動デバイスを実現することができる。
なお、他の先行文献としては、水晶基板の接合強度を高めることを目的として、チップ
外周部に貫通穴を設け、表裏の導通を確保するようにした水晶振動子が開示されている(
特許文献2)。
また、支持部材との電極接続を確実するために、引き出し電極部分の水晶板には貫通孔
を設けるようにした圧電デバイスが開示されている(特許文献3)。
特開2002−246869公報 特開2004−173050公報 特開平8−018389号公報
While mobile communication devices such as mobile phones are becoming smaller and lighter, there is a strong demand for higher functionality, and there are two conflicting demands for increasing the number of parts and miniaturization associated with higher functionality. In order to satisfy them simultaneously, importance is attached to the effective use of the board area by reducing the area of the printed circuit board constituting the electrical component and increasing the density of mounted components. Quartz resonators (vibrators, filters) used as frequency control devices in mobile communication devices and transmission communication devices are also strongly required to be miniaturized. As a device package structure to support high-density mounting, The surface mount type has become the mainstream, and at the same time, there is an increasing demand for higher frequencies.
FIG. 7 is a perspective view of a conventional AT-cut quartz crystal vibrating element disclosed in Patent Document 1.
The crystal resonator element 110 shown in FIG. 7 is a vibrator using the fundamental thickness shear vibration wave of an AT-cut crystal substrate, and one main surface of the crystal substrate constituting the crystal resonator element 110 is recessed by etching. Thus, the recess 113 is formed. Therefore, this quartz substrate has a structure in which the bottom surface of the recessed portion 113 is an ultrathin vibrating portion 113a and the outer periphery of the vibrating portion 113a is integrally supported by the thick annular surrounding portion 114 over the entire circumference. It has become.
Further, gold is deposited using a mask, or a main surface electrode 111 constituting an excitation electrode is formed on one main surface (vibration portion 113a) of the quartz substrate by photolithography, and a lead electrode extending therefrom. In addition to 115 and the pad electrode 116, a pad electrode 117 is formed. The pad electrode 117 is a back electrode 1 constituting an excitation electrode formed in the same manner on the other main surface.
The lead electrode 118 extending from 12 is electrically connected to the lead electrode 118 by pulling out to the surface side through the side end face of the quartz substrate. If the crystal resonator element 110 is configured as described above,
A vibration device that is less affected by the supporting stress can be realized.
As another prior document, for the purpose of increasing the bonding strength of the quartz substrate, a crystal resonator is disclosed in which through holes are provided in the outer periphery of the chip to ensure conduction between the front and back sides (
Patent Document 2).
Moreover, in order to ensure the electrode connection with the support member, a piezoelectric device is disclosed in which a through hole is provided in the quartz plate of the lead electrode portion (Patent Document 3).
JP 2002-246869 A JP 2004-173050 A JP-A-8-018389

ところで、特許文献1に開示された水晶振動素子110を用いて水晶振動子等の圧電デ
バイスを構成する場合は、水晶振動素子110のパッド電極116、117を、図示しな
い表面実装型パッケージの内底面上の導通パッドに導電性接着剤を用いて接続するように
していた。
しかしながら、図7に示した従来の水晶振動素子110では、振動部113aに近い側
のパッド電極116の接続状態は、パッド電極116の金属膜が邪魔になり、目視により
接続状態を確認することができないという問題点があった。
また、従来の水晶振動素子110を利用した圧電デバイスは、図示しない表面実装型パ
ッケージの導通パッドとパッド電極116、117との接続が平面であるため、接着強度
が弱いという問題点があった。
本発明は、上記したような点を鑑みてなされたものであり、導電性接着剤の接続状態の
確認が容易で、且つ、導電性接着剤の接着強度を高めることができる圧電振動素子、圧電
デバイスとその製造方法を提供することを目的とする。
By the way, when a piezoelectric device such as a crystal resonator is configured using the crystal resonator element 110 disclosed in Patent Document 1, the pad electrodes 116 and 117 of the crystal resonator element 110 are connected to the inner bottom surface of a surface mount package (not shown). The upper conductive pad was connected using a conductive adhesive.
However, in the conventional crystal resonator element 110 shown in FIG. 7, the connection state of the pad electrode 116 on the side close to the vibrating portion 113a is obstructed by the metal film of the pad electrode 116, and the connection state can be confirmed visually. There was a problem that it was not possible.
Further, the conventional piezoelectric device using the crystal resonator element 110 has a problem in that the bonding strength is weak because the connection between the conductive pads of the surface mount package (not shown) and the pad electrodes 116 and 117 is flat.
The present invention has been made in view of the above points, and it is easy to check the connection state of the conductive adhesive and can increase the adhesive strength of the conductive adhesive. An object is to provide a device and a manufacturing method thereof.

本発明は、上記の課題の少なくとも一部を解決するためになされたものであり、以下の
形態又は適用例として実現することが可能である。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[適用例1]圧電基板と、該圧電基板の両主面に形成された励振電極と、前記圧電基板
の片面側に形成された2つのパッド電極とを備え、前記2つのパッド電極を結んだ直線の
延長線上に前記励振電極が配置され、前記2つのパッド電極のうち、前記励振電極に近い
位置に設けられたパット電極に前記貫通孔を設け、該パッド電極を前記貫通孔とリード電
極を介して前記一方の励振電極に接続し、前記他方のパッド電極をリード電極を介して前
記他方の励振電極に接続した圧電振動素子を特徴とする。
[Application Example 1] A piezoelectric substrate, an excitation electrode formed on both main surfaces of the piezoelectric substrate, and two pad electrodes formed on one side of the piezoelectric substrate are connected to each other. The excitation electrode is disposed on a straight extension line, and the through-hole is provided in a pad electrode provided at a position close to the excitation electrode of the two pad electrodes, and the pad electrode is connected to the through-hole and the lead electrode. And a piezoelectric vibration element in which the other pad electrode is connected to the other excitation electrode via a lead electrode.

このように構成すれば、2つのパッド電極を導電性接着剤を用いて接続電極に接続した
際に、貫通孔内に充填された導電性接着剤に流入した導電性接着剤により投錨効果が得ら
れるので、導電性接着剤による接続電極とパッド電極との接着強度の向上を図ることがで
きる。
また一方のパッド電極と励振電極との間に位置にする他方のパッド電極に貫通孔を形成
したことで上方からの目視により導電性接着剤の接続状態を確認することが可能になると
いう利点がある。
If comprised in this way, when connecting two pad electrodes to a connection electrode using a conductive adhesive, a throwing effect will be acquired by the conductive adhesive which flowed into the conductive adhesive with which the through-hole was filled. Therefore, the adhesive strength between the connection electrode and the pad electrode by the conductive adhesive can be improved.
In addition, by forming a through hole in the other pad electrode located between the one pad electrode and the excitation electrode, it is possible to confirm the connection state of the conductive adhesive visually from above. is there.

[適用例2]前記圧電基板の両主面に形成された励振電極の面積が異なる適用例1に記
載の圧電振動素子を特徴とする。
Application Example 2 The piezoelectric vibration element according to Application Example 1 is characterized in that the excitation electrodes formed on both main surfaces of the piezoelectric substrate have different areas.

このように構成すれば、両主面に形成した励振電極の位置が多少ずれても、励振電極が
対向する面積は変化しないので特性にばらつきが生じるといったことがない。
According to this configuration, even if the positions of the excitation electrodes formed on both main surfaces are slightly shifted, the area where the excitation electrodes face does not change, so that there is no variation in characteristics.

[適用例3]前記リード電極のパターン幅は前記パッド電極のパターン幅より極力細く
、且つ、前記リード電極を、水晶基板の長手方向の端部に沿って形成した適用例1又は2
に記載の圧電振動素子を特徴とする。
Application Example 3 Application Example 1 or 2 in which the pattern width of the lead electrode is as narrow as possible than the pattern width of the pad electrode, and the lead electrode is formed along the longitudinal end of the quartz substrate.
The piezoelectric vibration element described in the above is characterized.

このように構成すれば、厚みすべり振動のエネルギー漏れを極力、抑制することができ
る。
If comprised in this way, the energy leak of thickness shear vibration can be suppressed as much as possible.

[適用例4]適用例1又は2に記載の圧電振動素子と、2つの接続電極が形成されたパ
ッケージ基板と、を備え、前記貫通孔の内部に導電性接着剤を充填した状態で、前記2つ
のパッド電極と前記2つの接続電極との間を夫々導電性接着剤により接続した圧電デバイ
スを特徴とする。
[Application Example 4] The piezoelectric vibration element according to Application Example 1 or 2 and a package substrate on which two connection electrodes are formed, and in the state in which a conductive adhesive is filled in the through hole, The piezoelectric device is characterized in that two pad electrodes and the two connection electrodes are connected by a conductive adhesive.

このように構成すれば、貫通孔の内部に導電性接着剤を確実に充填することが可能にな
り、貫通孔内に充填された導電性接着剤に流入した導電性接着剤により投錨効果が得られ
るので、接続電極とパッド電極との接着強度の向上を図ることができる。
With this configuration, it becomes possible to reliably fill the inside of the through hole with the conductive adhesive, and the anchoring effect is obtained by the conductive adhesive flowing into the conductive adhesive filled in the through hole. Therefore, the adhesive strength between the connection electrode and the pad electrode can be improved.

[適用例5]前記パッド電極が形成された前記圧電基板の下面側に形成した前記励振電
極の面積を、前記圧電基板の上面側に形成した前記励振電極の面積より小さく、且つ、前
記圧電基板の上面側の前記貫通孔上に塗布された前記導電性接着剤の径が、前記圧電基板
の下面側に塗布された前記導電性接着剤の径より小さい適用例3に記載の圧電デバイスを
特徴とする。
Application Example 5 The area of the excitation electrode formed on the lower surface side of the piezoelectric substrate on which the pad electrode is formed is smaller than the area of the excitation electrode formed on the upper surface side of the piezoelectric substrate, and the piezoelectric substrate The piezoelectric device according to Application Example 3, wherein a diameter of the conductive adhesive applied to the through hole on the upper surface side of the piezoelectric substrate is smaller than a diameter of the conductive adhesive applied to the lower surface side of the piezoelectric substrate. And

このように構成すれば、導電性接着剤が塗布された他方のパッド電極と、励振電極との
間が短絡するのを防止することができる。
If comprised in this way, it can prevent that the other pad electrode with which the conductive adhesive was apply | coated, and the excitation electrode are short-circuited.

[適用例6]適用例3又は4に記載の圧電デバイスの製造方法であって、前記圧電振動
素子が接続される接続電極に導電性接着剤を塗布する第1の塗布工程と、前記導電性接着
剤を塗布した前記接続電極に圧電振動素子を搭載する搭載工程と、前記圧電振動素子の貫
通孔に上面側から導電性接着剤を塗布する第2の塗布工程と、前記第1及び第2の塗布工
程後に、前記導電性接着剤を乾燥させる乾燥工程と、を含む圧電デバイスの製造方法を特
徴とする。
[Application Example 6] The method for manufacturing a piezoelectric device according to Application Example 3 or 4, wherein a first application step of applying a conductive adhesive to a connection electrode to which the piezoelectric vibration element is connected; A mounting step of mounting a piezoelectric vibration element on the connection electrode coated with an adhesive, a second application step of applying a conductive adhesive to the through hole of the piezoelectric vibration element from the upper surface side, and the first and second And a drying step of drying the conductive adhesive after the coating step.

このようにすれば、本発明の圧電デバイスを製造することができる。   In this way, the piezoelectric device of the present invention can be manufactured.

以下、図面を用いて本発明の実施形態を詳細に説明する。
図1は本発明の実施形態に係る圧電振動素子の構成を示した図であり、(a)は平面図
、(b)は(a)に示すA−A断面図である。
この図1に示す圧電振動素子1は、矩形状の水晶基板2の表裏両主面にそれぞれ励振電
極3、4が形成されている。上面(表面)側の励振電極3は、リード電極5と貫通孔9を
介して裏面側に形成されているパッド電極6と電気的に接続されている。また下面(裏面
)側の励振電極4は、リード電極7を介してパッド電極8と電気的に接続されている。こ
れら励振電極3、4、リード電極5、7、及びパッド電極6、8は、電極材料のスパッタ
リング又は蒸着により水晶基板2の表面に電極膜を形成した後、フォトリソグラフィ技術
を用いてパターニングすることにより形成することができる。
一方のパッド電極8は、水晶基板2の短手方向の端部近傍に形成されている。また他方
のパッド電極6は、パッド電極8と励振電極4との間に形成されている。つまり、本実施
形態の圧電振動素子1は、2つのパッド電極6、8を結んだ直線の延長戦上に励振電極4
が配置するようにしている。
パッド電極6には導通を有する貫通孔9が形成されており、励振電極3は、水晶基板2
の表面側の励振電極3から延出したリード電極5と貫通孔9とを介して裏面側のパッド電
極6に接続されている。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1A and 1B are diagrams showing a configuration of a piezoelectric vibration element according to an embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view taken along line AA shown in FIG.
In the piezoelectric vibration element 1 shown in FIG. 1, excitation electrodes 3 and 4 are formed on both front and back main surfaces of a rectangular crystal substrate 2. The excitation electrode 3 on the upper surface (front surface) side is electrically connected to the pad electrode 6 formed on the rear surface side through the lead electrode 5 and the through hole 9. The excitation electrode 4 on the lower surface (back surface) side is electrically connected to the pad electrode 8 via the lead electrode 7. The excitation electrodes 3 and 4, the lead electrodes 5 and 7, and the pad electrodes 6 and 8 are patterned using a photolithographic technique after forming an electrode film on the surface of the quartz substrate 2 by sputtering or vapor deposition of an electrode material. Can be formed.
One pad electrode 8 is formed near the end of the quartz substrate 2 in the short direction. The other pad electrode 6 is formed between the pad electrode 8 and the excitation electrode 4. In other words, the piezoelectric vibration element 1 of the present embodiment has the excitation electrode 4 on the straight extended game connecting the two pad electrodes 6 and 8.
Is trying to place.
The pad electrode 6 is formed with a through-hole 9 having conductivity, and the excitation electrode 3 is formed on the quartz substrate 2.
Are connected to the pad electrode 6 on the back surface side through a lead electrode 5 and a through hole 9 extending from the excitation electrode 3 on the front surface side.

図2は、図1に示した本実施形態の圧電振動素子を用いて構成した圧電振動子の断面図
である。
この図2に示す圧電振動子10では、例えばセラミックを積層して凹状に形成したパッ
ケージ基板11の上部に金属蓋20が接合されている。またパッケージ基板11の外部底
面には外部端子14、14が設けられている。この外部端子14、14はパッケージ基板
11内の図示しない内部導体を介してパッケージ基板11の内底面に設けた導通パッド(
接続電極)12等に接続されている。
導通パッド12、12は、導電性接着剤13を介して圧電振動素子1のパッド電極6、
8と電気的、機械的に接続される。更に、本実施形態では、貫通孔9を形成したパッド電
極6に関しては、圧電振動素子1の上面側にも導電性接着剤13を塗布するようにしてい
る。
このように構成すると、圧電振動素子1の下面側から貫通孔9内に流入した導電性接着
剤13と、圧電振動素子1の上面側から貫通孔9内に流入した導電性接着剤13とが貫通
孔9内で結合して硬化する。これにより、貫通孔9内の導電性接着剤13が釘或いは楔の
ように働く、投錨効果(アンカー効果)が得られるので、パッケージ基板11の導通パッ
ド12とパッド電極6、8との接着強度の向上を図ることができる。
また、従来、一方のパッド電極8と励振電極4との間に他方のパッド電極6を形成した
場合は、他方のパッド電極6の金属膜が邪魔になり、パッド電極6の接続状態を、上方か
らの目視により確認することが困難であったが、本実施形態では、パッド電極6に貫通孔
9を形成したことで、上方からの目視により、導電性接着剤13の接続状態を確認するこ
とが可能になるという利点がある。
FIG. 2 is a cross-sectional view of a piezoelectric vibrator configured using the piezoelectric vibration element of the present embodiment shown in FIG.
In the piezoelectric vibrator 10 shown in FIG. 2, for example, a metal lid 20 is joined to an upper portion of a package substrate 11 formed in a concave shape by laminating ceramics. External terminals 14 and 14 are provided on the outer bottom surface of the package substrate 11. The external terminals 14 and 14 are conductive pads (on the inner bottom surface of the package substrate 11 via internal conductors (not shown) in the package substrate 11).
Connection electrode) 12 and the like.
The conductive pads 12 and 12 are connected to the pad electrode 6 of the piezoelectric vibration element 1 via the conductive adhesive 13.
8 is electrically and mechanically connected. Further, in the present embodiment, the conductive adhesive 13 is also applied to the upper surface side of the piezoelectric vibration element 1 with respect to the pad electrode 6 in which the through hole 9 is formed.
With this configuration, the conductive adhesive 13 that flows into the through-hole 9 from the lower surface side of the piezoelectric vibration element 1 and the conductive adhesive 13 that flows into the through-hole 9 from the upper surface side of the piezoelectric vibration element 1 are formed. It combines and hardens in the through hole 9. As a result, a throwing effect (anchor effect) is obtained in which the conductive adhesive 13 in the through hole 9 acts like a nail or wedge, so that the adhesive strength between the conductive pad 12 of the package substrate 11 and the pad electrodes 6 and 8 is obtained. Can be improved.
Conventionally, when the other pad electrode 6 is formed between the one pad electrode 8 and the excitation electrode 4, the metal film of the other pad electrode 6 becomes an obstacle, and the connection state of the pad electrode 6 is changed to the upper side. In this embodiment, the through hole 9 is formed in the pad electrode 6 so that the connection state of the conductive adhesive 13 is confirmed by visual observation from above. There is an advantage that becomes possible.

また、本実施形態のように圧電振動素子1の上面側と下面側に導電性接着剤13を塗布
した場合は、圧電振動素子1の自重などにより、圧電振動素子1の下面側の導電性接着剤
13の塗布径が、上面側の導電性接着剤13の塗布径よりも大きくなる。このため、本実
施形態では、圧電振動素子1の下面側に形成する励振電極4の面積を、上面側に形成する
励振電極3の面積より小さくした。これにより、パッド電極6とパッケージ基板11の導
通パッド12との間に塗布した導電性接着剤13と励振電極4との間の間隔を拡げてパッ
ド電極6と励振電極4とが短絡するのを防止することができる。もちろん上面側の導電性
接着剤の径より下面側の導電性接着剤の径が小さい場合、下面側に形成した励振電極の面
積より、上面側に形成した励振電極の面積を小さくした場合も同じ効果が得られる。
また、本実施形態のように圧電振動素子1の両主面にそれぞれ形成した励振電極3、4
の面積を変えておくことで、例えば、励振電極3、4を形成する際に、励振電極3、4の
位置が多少ずれても、励振電極3、4が対向する面積は変化しないので特性にばらつきが
生じることがないという利点もある。
また、本実施形態の圧電振動素子1は、結晶X軸方向については、厚みすべり振動のエ
ネルギー漏れが生じ易いので、励振電極3、4から延出したリード電極5、7のパターン
幅を極力細く、且つ、リード電極5、7を、水晶基板2の長手方向の端部に沿って形成し
たことで、厚みすべり振動のエネルギー漏れを極力、抑制することができる。
なお、本実施形態では、圧電振動素子1の一方のパッド電極6にのみ貫通孔9を形成し
た場合を例に挙げて説明したが、これはあくまでも一例であり、2つのパッド電極6、8
の両方に貫通孔9を形成してもよい。但し、2つのパッド電極6、8に貫通孔9を形成し
た場合は、水晶基板2の強度を確保するためにパッド電極6、8の間隔を開ける必要があ
るので、圧電振動素子1の小型化という観点からすれば、一方のパッド電極6にのみ貫通
孔9を形成するほうが好ましい。
Further, when the conductive adhesive 13 is applied to the upper surface side and the lower surface side of the piezoelectric vibration element 1 as in this embodiment, the conductive adhesion on the lower surface side of the piezoelectric vibration element 1 is caused by its own weight or the like. The application diameter of the agent 13 is larger than the application diameter of the conductive adhesive 13 on the upper surface side. For this reason, in this embodiment, the area of the excitation electrode 4 formed on the lower surface side of the piezoelectric vibration element 1 is made smaller than the area of the excitation electrode 3 formed on the upper surface side. As a result, the pad electrode 6 and the excitation electrode 4 are short-circuited by increasing the distance between the conductive adhesive 13 applied between the pad electrode 6 and the conductive pad 12 of the package substrate 11 and the excitation electrode 4. Can be prevented. Of course, when the diameter of the conductive adhesive on the lower surface side is smaller than the diameter of the conductive adhesive on the upper surface side, the same is true when the area of the excitation electrode formed on the upper surface side is smaller than the area of the excitation electrode formed on the lower surface side. An effect is obtained.
In addition, the excitation electrodes 3 and 4 formed on both main surfaces of the piezoelectric vibration element 1 as in the present embodiment.
For example, when the excitation electrodes 3 and 4 are formed, even if the positions of the excitation electrodes 3 and 4 are slightly shifted, the area where the excitation electrodes 3 and 4 are opposed does not change. There is also an advantage that no variation occurs.
Further, in the piezoelectric vibration element 1 of the present embodiment, energy leakage of thickness shear vibration is likely to occur in the crystal X-axis direction, so that the pattern width of the lead electrodes 5 and 7 extending from the excitation electrodes 3 and 4 is made as narrow as possible. In addition, since the lead electrodes 5 and 7 are formed along the longitudinal ends of the quartz substrate 2, energy leakage due to thickness-shear vibration can be suppressed as much as possible.
In the present embodiment, the case where the through hole 9 is formed only in one of the pad electrodes 6 of the piezoelectric vibration element 1 has been described as an example. However, this is only an example, and the two pad electrodes 6, 8 are described.
You may form the through-hole 9 in both. However, when the through holes 9 are formed in the two pad electrodes 6 and 8, it is necessary to increase the spacing between the pad electrodes 6 and 8 in order to ensure the strength of the crystal substrate 2. From this point of view, it is preferable to form the through hole 9 only in one of the pad electrodes 6.

図3は、本実施の形態に係る圧電振動素子の他の構成を示した図である。なお、図1と
同一部位には同一符号を付して詳細な説明は省略する。この図3に示す圧電振動素子1は
、励振電極3とパッド電極6とを接続するリード電極5を励振電極3の中央から引き出す
ように構成したものである。このように構成した場合も図1と同様の効果が得られる。但
し、厚みすべり振動エネルギーの閉じ込めという観点からすれば、図1に示した構成のほ
うが好ましい。
FIG. 3 is a diagram showing another configuration of the piezoelectric vibration element according to the present embodiment. In addition, the same code | symbol is attached | subjected to the same site | part as FIG. 1, and detailed description is abbreviate | omitted. The piezoelectric vibration element 1 shown in FIG. 3 is configured such that the lead electrode 5 connecting the excitation electrode 3 and the pad electrode 6 is drawn from the center of the excitation electrode 3. Even in such a configuration, the same effect as in FIG. 1 can be obtained. However, from the viewpoint of confining the thickness shear vibration energy, the configuration shown in FIG. 1 is preferable.

図4は、第2の実施形態に係る圧電振動素子の構成を示した図であり、(a)は平面図
、(b)は(a)に示すB−B断面図である。なお、図1と同一部位には同一符号を付し
て詳細な説明は省略する。
この図4に示す圧電振動素子1は、振動周波数の高周波化を図るために、超肉薄部を有
する所謂逆メサ型の圧電振動素子である。つまり、水晶基板2の一方の主面をエッチング
によって凹陥部31を形成し、この凹陥部31の底面を超薄肉の振動部31aとした構成
を有する。つまり、この水晶基板2は、凹陥部31の底面を超肉薄の振動部31aとする
と共に、振動部31aの外周を全周に亙って肉厚の環状囲繞部32により一体的に支持し
た構成となっている。そして、この振動部31aに励振電極4を形成するようにしている
。このように構成した場合も、図1と同様の効果が得られる。また、高周波化を図ること
ができるという利点がある。
なお、本実施形態では、本発明の圧電振動素子の一例として、水晶振動素子を例に挙げ
て説明したが、これはあくまでも一例であり、水晶基板以外の圧電基板にも適用可能であ
る。
また、本実施形態では、本発明の圧電振動素子を適用した圧電デバイスの一例として圧
電振動子を例に挙げて説明したが、本発明の圧電振動素子は、MCF(Monolithic Cryst
al Filters)、圧電発振器、圧電モジュール等の各種圧電デバイスにも適用可能である。
また、本実施形態では、凹所を有するパッケージ基板11の上面に平板状の金属蓋20
を接合して圧電振動素子1を気密封止するようにしているが、パッケージ基板11の構造
はあくまでも一例であり、例えばフラットなパッケージ基板(絶縁基板)の上面に導通パ
ッド12、12を設け、この導通パッド12、12上に圧電振動素子1を搭載したうえで
、逆椀状(逆凹状)の金属蓋を接合して気密封止する場合にも適用可能である。
また、本実施形態では、貫通穴9の上面側と下面側ともパッド電極6を形成しているが
、これはあくまでも一例であり、励振電極3をリード電極5と貫通穴9を介して導通パッ
ド12と導通を取れれば、励振電極3と同一面側に設けられたパッド電極6を省略し、励
振電極4と同一面側のパッド電極6のみを設けてもいい。更に、水晶基板2の両面に設け
たパッド電極6を省略することも可能であるが、励振電極3と導通パッド12との導通を
よくするためには、少なくとも水晶基板2の下面側のパッド電極6は設けたほうが好まし
い。
4A and 4B are diagrams illustrating the configuration of the piezoelectric vibration element according to the second embodiment, in which FIG. 4A is a plan view and FIG. 4B is a cross-sectional view taken along line BB illustrated in FIG. In addition, the same code | symbol is attached | subjected to the same site | part as FIG. 1, and detailed description is abbreviate | omitted.
The piezoelectric vibration element 1 shown in FIG. 4 is a so-called reverse mesa type piezoelectric vibration element having an ultrathin portion in order to increase the vibration frequency. That is, the concave portion 31 is formed on one main surface of the quartz substrate 2 by etching, and the bottom surface of the concave portion 31 is an ultrathin vibrating portion 31a. That is, this quartz crystal substrate 2 has a configuration in which the bottom surface of the recessed portion 31 is an ultrathin vibrating portion 31a and the outer periphery of the vibrating portion 31a is integrally supported by a thick annular surrounding portion 32 over the entire circumference. It has become. And the excitation electrode 4 is formed in this vibration part 31a. Even in such a configuration, the same effect as in FIG. 1 can be obtained. Further, there is an advantage that high frequency can be achieved.
In the present embodiment, the quartz resonator element is described as an example of the piezoelectric resonator element of the present invention. However, this is only an example, and the present invention can be applied to a piezoelectric substrate other than the quartz substrate.
In this embodiment, a piezoelectric vibrator has been described as an example of a piezoelectric device to which the piezoelectric vibration element of the present invention is applied. However, the piezoelectric vibration element of the present invention is an MCF (Monolithic Cryst).
al Filters), piezoelectric oscillators, and piezoelectric modules.
In the present embodiment, a flat metal lid 20 is formed on the upper surface of the package substrate 11 having a recess.
The piezoelectric vibration element 1 is hermetically sealed by bonding, but the structure of the package substrate 11 is merely an example. For example, conductive pads 12 and 12 are provided on the upper surface of a flat package substrate (insulating substrate), The present invention can also be applied to the case where the piezoelectric vibrating element 1 is mounted on the conductive pads 12 and 12 and a metal lid having a reverse saddle shape (reverse concave shape) is joined and hermetically sealed.
In the present embodiment, the pad electrodes 6 are formed on the upper surface side and the lower surface side of the through hole 9. However, this is merely an example, and the excitation electrode 3 is connected to the conductive pad via the lead electrode 5 and the through hole 9. 12, the pad electrode 6 provided on the same side as the excitation electrode 3 may be omitted, and only the pad electrode 6 on the same side as the excitation electrode 4 may be provided. Further, the pad electrodes 6 provided on both surfaces of the quartz substrate 2 can be omitted. However, in order to improve the conduction between the excitation electrode 3 and the conduction pad 12, at least the pad electrode on the lower surface side of the quartz substrate 2 is used. 6 is preferably provided.

図5は、本実施形態に係る圧電振動素子を用いた圧電振動子の製造工程を示した図であ
る。
この場合は、先ず、第1の塗布工程として、パッケージ基板11の導通パッド12、1
2上に導電性接着剤13を塗布する(S1)。次に、搭載工程として、導電性接着剤13
を塗布した導通パッド12、12上に水晶基板2を搭載する(S2)。次いで、第2の塗
布工程として、貫通孔9が形成されている水晶基板2のパッド電極6の上側から導電性接
着剤13を塗布する(S3)。この後、乾燥工程として、導電性接着剤13を乾燥させる
(S4)。
このような製造工程によれば、水晶基板2の下側に塗布した導電性接着剤13と、上側
に塗布した導電性接着剤13を乾燥工程において同時に乾燥させることができるので、水
晶基板2の下面側から貫通孔9内に流入した導電性接着剤13と上面側から貫通孔9内に
流入した導電性接着剤13とが貫通孔9内で確実に結合させることができる。
FIG. 5 is a diagram illustrating a manufacturing process of a piezoelectric vibrator using the piezoelectric vibration element according to the present embodiment.
In this case, first, as the first coating process, the conductive pads 12, 1 of the package substrate 11.
A conductive adhesive 13 is applied on the substrate 2 (S1). Next, as a mounting process, the conductive adhesive 13
The quartz crystal substrate 2 is mounted on the conductive pads 12 and 12 coated with (S2). Next, as a second application step, the conductive adhesive 13 is applied from the upper side of the pad electrode 6 of the quartz substrate 2 in which the through hole 9 is formed (S3). Thereafter, as a drying step, the conductive adhesive 13 is dried (S4).
According to such a manufacturing process, the conductive adhesive 13 applied to the lower side of the quartz substrate 2 and the conductive adhesive 13 applied to the upper side can be simultaneously dried in the drying step. The conductive adhesive 13 that has flowed into the through hole 9 from the lower surface side and the conductive adhesive 13 that has flowed into the through hole 9 from the upper surface side can be reliably combined in the through hole 9.

図6は、図5に示した本実施形態の製造工程との比較として、従来の製造工程を利用し
て本実施形態の圧電振動子を製造する場合の製造工程を示した図である。
この場合は、先ず、第1の塗布工程として、パッケージ基板11の導通パッド12、1
2上に導電性接着剤13を塗布する(S1)。次に、搭載工程として、導電性接着剤13
を塗布した導通パッド12、12上に水晶基板2を搭載する(S2)。次いで、第1の乾
燥工程として、導電性接着剤13を乾燥させる(S4)。
次に、第2の塗布工程として、貫通孔9が形成されている水晶基板2のパッド電極6の
上側から導電性接着剤13を塗布する(S4)。この後、第2の乾燥工程として、導電性
接着剤13を乾燥させることになる(S5)。
この場合は、第1及び第2の乾燥工程において、水晶基板2の下側に塗布した導電性接
着剤13と、水晶基板2の上側に塗布した導電性接着剤13とを別々に乾燥させるように
しているので、貫通孔9内において導電性接着剤13を確実に接続できないおそれがある
ため、上記図5に示した本実施形態の製造工程のほうが好ましい。
FIG. 6 is a diagram showing a manufacturing process in the case of manufacturing the piezoelectric vibrator of the present embodiment using the conventional manufacturing process as a comparison with the manufacturing process of the present embodiment shown in FIG.
In this case, first, as the first coating process, the conductive pads 12, 1 of the package substrate 11.
A conductive adhesive 13 is applied on the substrate 2 (S1). Next, as a mounting process, the conductive adhesive 13
The quartz crystal substrate 2 is mounted on the conductive pads 12 and 12 coated with (S2). Next, as a first drying step, the conductive adhesive 13 is dried (S4).
Next, as a second application step, the conductive adhesive 13 is applied from the upper side of the pad electrode 6 of the quartz substrate 2 in which the through hole 9 is formed (S4). Thereafter, as a second drying step, the conductive adhesive 13 is dried (S5).
In this case, in the first and second drying steps, the conductive adhesive 13 applied to the lower side of the quartz substrate 2 and the conductive adhesive 13 applied to the upper side of the quartz substrate 2 are separately dried. Therefore, there is a possibility that the conductive adhesive 13 cannot be reliably connected in the through hole 9, and therefore the manufacturing process of the present embodiment shown in FIG. 5 is preferable.

本発明の実施形態に係る圧電振動素子の構成を示した図であり、(a)は平面図、(b)は(a)に示すA−A断面図である。It is the figure which showed the structure of the piezoelectric vibration element which concerns on embodiment of this invention, (a) is a top view, (b) is AA sectional drawing shown to (a). 本実施形態の圧電振動素子を適用した圧電振動子の断面図である。It is sectional drawing of the piezoelectric vibrator to which the piezoelectric vibration element of this embodiment is applied. 本実施の形態にかかる圧電振動素子の他の構成を示した図である。It is the figure which showed the other structure of the piezoelectric vibration element concerning this Embodiment. 第2の実施形態にかかる圧電振動素子の構成を示した図である。It is the figure which showed the structure of the piezoelectric vibration element concerning 2nd Embodiment. 本実施形態に係る圧電振動素子を用いた圧電振動子の製造工程を示した図である。It is the figure which showed the manufacturing process of the piezoelectric vibrator using the piezoelectric vibration element concerning this embodiment. 従来の製造工程を利用して本実施形態の圧電振動子を製造する場合の製造工程を示した図である。It is the figure which showed the manufacturing process in the case of manufacturing the piezoelectric vibrator of this embodiment using the conventional manufacturing process. 従来のATカット水晶振動素子の斜視図である。It is a perspective view of the conventional AT cut crystal resonator element.

符号の説明Explanation of symbols

1…圧電振動素子、2…水晶基板、3、4…励振電極、5、7…リード電極、6、8…パ
ッド電極、9…貫通孔、10…圧電振動子、11…パッケージ基板、12…導通パッド、
13…導電性接着剤、14…外部端子、20…金属蓋、31…凹陥部、31a…振動部、
32…環状囲繞部
DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibration element, 2 ... Quartz substrate, 3, 4 ... Excitation electrode, 5, 7 ... Lead electrode, 6, 8 ... Pad electrode, 9 ... Through-hole, 10 ... Piezoelectric vibrator, 11 ... Package substrate, 12 ... Conductive pads,
13 ... conductive adhesive, 14 ... external terminal, 20 ... metal lid, 31 ... concave part, 31a ... vibrating part,
32 ... Annular Go

Claims (6)

圧電基板と、該圧電基板の両主面に形成された励振電極と、前記圧電基板の片面側に形
成された2つのパッド電極とを備え、前記2つのパッド電極を結んだ直線の延長線上に前
記励振電極が配置され、前記2つのパッド電極のうち、前記励振電極に近い位置に設けら
れたパット電極に前記貫通孔を設け、該パッド電極を前記貫通孔とリード電極を介して前
記一方の励振電極に接続し、前記他方のパッド電極をリード電極を介して前記他方の励振
電極に接続したことを特徴とする圧電振動素子。
A piezoelectric substrate, an excitation electrode formed on both main surfaces of the piezoelectric substrate, and two pad electrodes formed on one side of the piezoelectric substrate, on a straight extension line connecting the two pad electrodes The excitation electrode is disposed, and the through hole is provided in a pad electrode provided at a position close to the excitation electrode among the two pad electrodes, and the pad electrode is connected to the one of the one through the through hole and the lead electrode. A piezoelectric vibration element characterized in that it is connected to an excitation electrode and the other pad electrode is connected to the other excitation electrode via a lead electrode.
前記圧電基板の両主面に形成された励振電極の面積が異なることを特徴とする請求項1
に記載の圧電振動素子。
2. The areas of excitation electrodes formed on both main surfaces of the piezoelectric substrate are different.
The piezoelectric vibration element described in 1.
前記リード電極のパターン幅は前記パッド電極のパターン幅より極力細く、且つ、前記
リード電極を、水晶基板の長手方向の端部に沿って形成したことを特徴とする請求項1又
は2に記載の圧電振動素子。
The pattern width of the lead electrode is as narrow as possible than the pattern width of the pad electrode, and the lead electrode is formed along an end portion in the longitudinal direction of the quartz substrate. Piezoelectric vibration element.
請求項1又は2に記載の圧電振動素子と、2つの接続電極が形成されたパッケージ基板
と、を備え、前記貫通孔の内部に導電性接着剤を充填した状態で、前記2つのパッド電極
と前記2つの接続電極との間を夫々導電性接着剤により接続したことを特徴とする圧電デ
バイス。
The piezoelectric vibration element according to claim 1 or 2 and a package substrate on which two connection electrodes are formed, and the two pad electrodes are filled with a conductive adhesive inside the through hole. A piezoelectric device characterized in that the two connection electrodes are connected to each other by a conductive adhesive.
前記パッド電極が形成された前記圧電基板の下面側に形成した前記励振電極の面積を、
前記圧電基板の上面側に形成した前記励振電極の面積より小さく、且つ、前記圧電基板の
上面側の前記貫通孔上に塗布された前記導電性接着剤の径が、前記圧電基板の下面側に塗
布された前記導電性接着剤の径より小さいことを特徴する請求項4に記載の圧電デバイス
The area of the excitation electrode formed on the lower surface side of the piezoelectric substrate on which the pad electrode is formed,
The area of the excitation electrode formed on the upper surface side of the piezoelectric substrate is smaller, and the diameter of the conductive adhesive applied on the through hole on the upper surface side of the piezoelectric substrate is smaller than the lower surface side of the piezoelectric substrate. The piezoelectric device according to claim 4, wherein the piezoelectric device is smaller than a diameter of the applied conductive adhesive.
請求項4又は5に記載の圧電デバイスの製造方法であって、
前記圧電振動素子が接続される接続電極に導電性接着剤を塗布する第1の塗布工程と、
前記導電性接着剤を塗布した前記接続電極に圧電振動素子を搭載する搭載工程と、
前記圧電振動素子の貫通孔に上面側から導電性接着剤を塗布する第2の塗布工程と、
前記第1及び第2の塗布工程後に、前記導電性接着剤を乾燥させる乾燥工程と、
を含むことを特徴とする圧電デバイスの製造方法。
A method for manufacturing a piezoelectric device according to claim 4 or 5,
A first application step of applying a conductive adhesive to a connection electrode to which the piezoelectric vibration element is connected;
A mounting step of mounting a piezoelectric vibration element on the connection electrode coated with the conductive adhesive;
A second application step of applying a conductive adhesive from the upper surface side to the through hole of the piezoelectric vibration element;
A drying step of drying the conductive adhesive after the first and second coating steps;
A method for manufacturing a piezoelectric device comprising:
JP2008120241A 2008-05-02 2008-05-02 Piezoelectric vibration element, and piezoelectric device and method of manufacturing the same Withdrawn JP2009272795A (en)

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