JP2015179676A - Led lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp which can become lightweight while improving a heat radiation property.SOLUTION: An LED lamp 171 comprises plural LEDs 7, a mount board 173 comprising the plural LEDs 7 on the surface, a glass tube 3 housing the mount board 173 inside, and an adhesive 175 bonding the mount board 173 and the glass tube 3. Between the back side of the mount board 173 and the inner face of the glass tube 3, the adhesive 175 is provided in plural points putting gaps to the longer direction of the glass tube 3, and the adhesive 175 exists in each position corresponding to the backside of the mounting area of the plural LEDs on the mount board 173.

Description

  The present invention relates to an LED lamp including an LED element on a substrate.

An LED element, which is a kind of semiconductor light emitting element, is attracting attention as an energy-saving light source because it is more efficient than conventional incandescent bulbs and fluorescent lamps, and in recent years, LED lamps using LED elements have been developed ( Patent Documents 1 to 3).
As such an LED lamp, there is an LED lamp that can be mounted on a straight-tube fluorescent lamp fixture (see Patent Document 4). The LED lamp described in Patent Document 4 includes a mounting substrate (5) on which a plurality of LED elements (4) are mounted, a heat sink (3) on which the mounting substrate (5) is mounted and having high heat dissipation characteristics, and an LED element. (4) and a resin tube (2) that covers the mounting substrate (5) and is attached to the heat sink (3), and a part of the heat sink (3) is a groove (20 in the resin tube (2)). ) To the outside.

  And the heat | fever generate | occur | produced in the LED element (4) at the time of lighting is transmitted to a heat sink (3) from a mounting board | substrate (5), and is discharge | released from the part which exists outside the resin tube (2) in a heat sink (3).

JP 2009-43447 A JP 2009-170186 A JP 2009-266432 A JP 2009-105354 A

  An object of this invention is to provide the LED lamp which can achieve weight reduction, without deteriorating a thermal radiation characteristic.

  In order to achieve the above object, an LED lamp according to the present invention includes a plurality of LEDs, a mounting board having the plurality of LEDs on a surface thereof, a resin tube for storing the mounting board therein, the mounting board, and the mounting board. An adhesive for joining the resin tube, and the adhesive is provided at a plurality of locations spaced in the longitudinal direction of the resin tube between the back surface of the mounting substrate and the inner surface of the resin tube, and the mounting The adhesive is present at each position corresponding to the back side of the mounting area of the plurality of LEDs on the substrate.

  Thereby, the usage-amount of the adhesive material for joining a mounting board | substrate can be decreased, and weight reduction can be achieved, without reducing the heat conductive characteristic of LED so much.

It is a perspective view of the LED lamp which concerns on 1st Embodiment, and one part is notched so that the mode of an inside may be understood. It is the figure which looked at the LED lamp from the arrow A direction of FIG. 1, and one part is notched so that an internal state may be understood. It is the figure which looked at the BB line cross section of FIG. 2 from the arrow direction. It is an expanded sectional view of the one end part of an LED lamp. It is a circuit diagram concerning an LED lamp. It is a cross-sectional view of a conventional product. It is a figure which shows a simulation result. It is a figure which shows the width | variety of a board | substrate, and the thermal radiation effect. It is a figure which shows the width | variety and light distribution characteristic of a board | substrate. It is explanatory drawing of a light distribution angle. It is a cross-sectional view of an LED lamp according to Modification 1. It is a cross-sectional view of the LED lamp which concerns on the modification 2. It is a cross-sectional view of the LED lamp which concerns on the modification 3. It is a cross-sectional view of the LED lamp which concerns on the modification 4. It is a cross-sectional view of the LED lamp which concerns on the modification 5. It is a longitudinal cross-sectional view of the LED lamp which concerns on the modification 6.

Hereinafter, an embodiment which is an example of an LED lamp of the present invention will be described with reference to the drawings.
1. Configuration FIG. 1 is a perspective view of an LED lamp according to a first embodiment, with a part cut away so that the inside can be seen. FIG. 2 is a view of the LED lamp as seen from the direction of arrow A in FIG. 1, and is partially cut away so that the inside can be seen. 3 is a view of the cross section taken along the line B-B in FIG. 2 as viewed from the direction of the arrow, and FIG. 4 is an enlarged cross-sectional view of one end portion of the LED lamp.

The LED lamp 1 will be described as a straight tube fluorescent lamp type for general illumination.
The LED lamp 1 is mounted on a long glass tube 3, a mounting substrate (corresponding to a “substrate” of the present invention) 5 disposed in the glass tube 3, and a main surface of the mounting substrate 5. A plurality of LEDs 7, an adhesive 9 (see FIG. 3) for bonding (fixing) the mounting substrate 5 in contact with the glass tube 3, a base 11 attached to both ends of the glass tube 3, and the base And a lighting circuit 13 (see FIG. 4) that receives power through 11 and causes the LED 7 to emit light.

The glass tube 3 is a straight tube here, and, for example, the cross-sectional shape thereof has an annular shape (see FIG. 3). The glass tube 3 may or may not be diffused on the outer surface or the inner surface. In addition, this glass tube 3 can be comprised with the glass tube utilized with a straight tubular fluorescent lamp.
The mounting substrate 5 has a long flat plate shape corresponding to the long glass tube 3. As shown in FIG. 1, the mounting substrate 5 includes an insulating substrate body 15 and a wiring pattern 17 formed on the main surface (front surface) of the substrate body 15. The wiring pattern 17 includes an LED connection portion that electrically connects the plurality of LEDs 7 and a terminal portion that is electrically connected to the lighting circuit 13.

The mounting substrate 5 is arranged in the glass tube 3 in a state where two inner surfaces of the glass tube 3 that are separated from each other are bridged, and while maintaining this state, the back surface of the mounting substrate 5 and the inner surface of the glass tube 3 Between them, the adhesive 9 is filled.
Here, the LEDs 7 are of a surface mount (SMD) type, and a predetermined number is mounted on the mounting substrate 5 at equal intervals in the longitudinal direction of the mounting substrate 5. ing.

The LED 7 includes one or a plurality of LED elements, an element mounting board for mounting the one or a plurality of LED elements, and a sealing body for sealing the one or a plurality of LED elements, The element mounting board is provided with a terminal portion connected to the wiring pattern 17 of the mounting board 5.
The sealing body is made of, for example, a translucent resin, and when it is necessary to convert the wavelength of light emitted from the LED element, a material having a wavelength conversion function such as a phosphor powder is used as the translucent resin. It is mixed in. In addition, when it is necessary to convert the wavelength of the light emitted from the LED element, for example, a phosphor film containing phosphor powder can be formed on the inner surface of the glass tube.

The adhesive 9 has a bonding function for bonding the mounting substrate 5 into the glass tube 3 and a heat transfer function for transferring heat generated during light emission of the LED 7 from the mounting substrate 5 to the glass tube 3. For this reason, it is preferable to use a material having a high heat transfer rate as the adhesive 9. Furthermore, it is preferable to use a material having a small specific gravity in consideration of weight reduction.
The heat transfer function is realized by bonding the mounting substrate 5 to the inner surface of the glass tube 3 via the adhesive 9 in a state where the mounting substrate 5 is in contact with the inner surface of the glass tube 3. In particular, an edge extending in the longitudinal direction of the mounting substrate 5 is in contact with the inner surface of the glass tube 3, and between the rear surface of the mounting substrate 5 (the main surface on which the LED 7 is not mounted) and the inner surface of the glass tube 3. The adhesive 9 exists.

The base 11 is a G-type base used in fluorescent lamps, but may be a base of another type, for example, a base such as G10q, GX10q, GY10q, or a P-type base. What is necessary is just to determine suitably according to the lighting fixture which mounts a lamp | ramp.
The base 11 includes a bottomed cylindrical base body 19 and a pair of base pins 21 extending outward from the outer surface of the bottom portion 19 a of the base body 19.

FIG. 5 is a circuit diagram relating to an LED lamp.
The lighting circuit 13 includes a rectifier circuit unit 23 as shown in FIG. Here, a diode bridge using four Zener diodes 25 is used as the rectifier circuit unit 23.
The rectifier circuit portion 23 has a pair of base pins 21 of the base 11 short-circuited at the input end thereof, and wiring 27 and 29 connected to the base pin 21, and an output end thereof connected to the terminal portion of the mounting substrate 5 by wirings 31 and 33, respectively. It is connected. The wirings 29 and 33 are arranged on the back surface of the mounting substrate 5 as shown in FIGS.

The rectifier circuit unit 23 is mounted on a circuit board 35. The circuit board 35 is attached to the glass tube 3 by adhering the base 11 covering the end of the glass tube 3 to the glass tube 3 in a state where the opening on one end side of the glass tube 3 having both ends opened is closed. Installed.
2. Example An example of the LED lamp 1 will be specifically described.

The LED lamp 1 according to one embodiment described here has an overall length of 580 [mm], and is an alternative to the straight tubular fluorescent lamp 20W.
The glass tube 3 has a diameter of 28 [mm], a total length of 565 [mm], and a wall thickness of 0.8 [mm]. The material is soda glass, and its thermal conductivity is 0.75 [W / m · K].

The mounting substrate 5 has a width (dimension in the short direction) of 14 [mm], a length of 560 [mm], and a wall thickness of 1.6 [mm]. The material is glass epoxy, and its thermal conductivity is 0.36 [W / m · K].
The wiring pattern 17 is made of copper foil, has a thickness of 35 [μm], and a thermal conductivity of 390 [W / m · K].

The LEDs 7 are of a so-called surface mounting type, and are mounted on the mounting substrate 5 at equal intervals in the longitudinal direction. The LED 7 has a rectangular parallelepiped shape with a thickness (height) of 1.5 [mm] and a 4.5 [mm] square, and a plurality of LED elements are mounted on the element mounting substrate. The LED element has a rectangular parallelepiped shape with a thickness (height) of 0.3 [mm] and a square of 0.4 [mm], and a GaN system is used.
The sealing body has a columnar shape with a thickness (height) of 1 [mm] and a diameter of 1.5 [mm], and a silicone resin is used as the translucent resin. As the phosphor powder, a yellow-green phosphor powder of (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ and a Sr ₂ Si ₅ N ₈ : Eu ²⁺ red phosphor powder are used.

The adhesive 9 is made of cement and has a thermal conductivity of 1 [W / m · K], and the base 11 is a G13 type base.
3. Heat Dissipation Characteristics A simulation was performed on the effect of heat dissipation of the LED lamp 1 according to the embodiment.
The simulated model is an LED lamp according to an embodiment (hereinafter referred to as an invention product), an LED lamp described in the background art (hereinafter referred to as a conventional product), and two types of LED lamps (referred to as a conventional product) ( Hereinafter, it is referred to as improved product 1 and improved product 2).

FIG. 6 is a cross-sectional view of a conventional product.
A conventional LED lamp 900 includes a resin tube (corresponding to a “glass tube” of an invention product) 903, an LED 7 having the same specifications as the invention product, and a mounting substrate having the same specifications (size, material, etc.) as the invention product. 5 and a heat sink 905 having the mounting substrate 5 mounted on the surface and having a heat dissipation function.

The resin tube 903 has a groove 907 extending in the central axis (longitudinal) direction. The heat sink 905 has a rectangular cross-sectional shape and includes grooves 909 on a pair of side surfaces. The edge portions 903 a located on both sides of the groove 907 of the resin tube 903 are fitted into the grooves 909 of the heat sink 905, so that the heat sink 905 is attached to the resin tube 903.
The material of the resin tube 903 is polycarbonate, its thermal conductivity is 0.19 [W · m / K], and the outer diameter and wall thickness are the same as those of the glass tube 3 of the invention. The material of the heat sink 905 is aluminum, the thickness is 2 [mm], and the thermal conductivity is 200 [W · m / K].

The improved product 1 does not have the heat sink 905 in the conventional product of FIG. 6, and the mounting substrate 5 is directly joined to the inner surface of the resin tube 903 with an adhesive (having the same specifications as the invention product). The improved product 2 is obtained by replacing the resin tube 903 in the conventional product with a glass tube 3 having the same specifications as the present invention.
FIG. 7 is a diagram illustrating a simulation result.

The “LED temperature difference” in FIG. 7 represents the LED temperature in each sample on the basis of the temperature of the conventional LED.
With regard to the heat dissipation characteristics, the improved product 1 without the heat sink has an LED temperature 29 [° C.] higher than that of the conventional product, but the improved product 2 in which the resin tube is replaced with a glass tube is compared with the conventional product. The LED temperature has increased by 23 [° C.]. However, the LED temperature of the improved product 2 is 6 [° C.] lower than that of the improved product 1. From this, it can be seen that the heat dissipation characteristics are improved by changing the resin tube to a glass tube.

On the other hand, although the invention product does not have the heat sink of the conventional product, the LED temperature is lowered by 2 [° C.] compared to the conventional product. For this reason, the inventive product can improve the heat dissipation characteristics compared to the conventional product without the heat sink, and the lamp weight is 85 [%] compared to the conventional product. It can be seen that
4). Mounting Board Position (1) Heat Dissipation Characteristics FIG. 8 is a diagram showing the width of the mounting board and the heat dissipation effect.

The horizontal axis in FIG. 8 indicates the ratio of the width of the mounting substrate (represented by “substrate” in the figure) to the inner diameter of the glass tube, and the vertical axis indicates the LED temperature when the temperature of the conventional product is the reference temperature. Is expressed as a temperature difference with respect to the reference temperature. This data is calculated by simulation.
As shown in the figure, the LED temperature becomes lower than the reference temperature (that is, the temperature difference becomes negative) when the substrate width is 0.44 with respect to the inner diameter of the glass tube. That is, when the substrate width is 0.44 or more with respect to the inner diameter of the glass tube, the heat dissipation characteristics are improved as compared with the conventional product.
(2) Light Distribution Characteristics FIG. 9 is a diagram showing the substrate width and light distribution characteristics, and FIG. 10 is an explanatory diagram of the light distribution angle.

The horizontal axis in FIG. 9 indicates the ratio of the width of the mounting substrate to the inner diameter of the glass tube, as in FIG. 8, and the vertical axis indicates the light distribution angle [°].
First, the light distribution angle on the vertical axis in FIG. 9 will be described with reference to FIG.
When the light distribution angle [°] is divided into two regions on the front and back of the mounting board in the cross section of the glass tube, the edges on the side where the LEDs are arranged on the mounting board (in FIG. 10, the left and right edges on the surface side). ) And the center of the glass tube, and the angle θ [°] on the side where the LED does not exist (so-called expectation from the center of the glass tube on the side where the LED of the mounting substrate is arranged) It is a horn.)

Since the light emitted from the LED does not travel to the side of the mounting substrate where the LED is not disposed, the light distribution angle shown in FIG. 10 is an angle at which the light from the LED lamp can be extracted. On the other hand, the light from the fluorescent lamp can be extracted from the entire circumference of the glass tube of the fluorescent lamp, and the light is emitted to the side and the back side of the fluorescent lamp.
Accordingly, when the LED lamp is used as a substitute for a fluorescent lamp, for example, the mounting substrate is disposed at a position passing through the center of the glass tube (the ratio of the width of the mounting substrate to the inner diameter of the glass tube is 1). No light is emitted to the back side of the mounting substrate, and the rear half of the glass tube (the region on the back side of the mounting substrate) becomes dark.

Therefore, in the LED lamp, the width of the mounting substrate is changed, that is, the ratio of the width of the mounting substrate to the inner diameter of the glass tube is changed, and the brightness of the side of the glass tube of the LED lamp is compared with the brightness of the side of the fluorescent lamp. A comparative test was conducted.
As a result, in the LED lamp, if the angle θ in FIG. 10, that is, the light distribution angle in FIG. 9 is 220 [°] or more, the side brightness is inferior to that of the fluorescent lamp, but it can be used as a substitute for the fluorescent lamp. It was found to have brightness. And it turns out that the ratio of the width | variety of the mounting board | substrate with respect to the internal diameter of a glass tube from which a light distribution angle becomes 220 [degrees] or more is 0.94 or less from FIG.

Therefore, when the LED lamp is used as a fluorescent lamp alternative, it is desirable that the light distribution angle is 220 [°] or more, that is, the ratio of the width of the mounting substrate to the inner diameter of the glass tube is 0.94 or less.
<Modification>
Although the present invention has been described based on the embodiments, the content of the present invention is not limited to the specific examples shown in the above embodiments. For example, the following modifications are possible. Can be implemented.
1. Glass Tube In the embodiment, the glass tube 3 has an annular cross-sectional shape, but may have another cross-sectional shape. The other shape may be a polygonal ring such as a triangle or an elliptical ring.
2. Mounting substrate (1) material In the embodiment, glass epoxy is used, but other materials can be used. However, in order to efficiently transmit the heat generated by the LED to the glass tube and the adhesive, It is preferable to use a material having high thermal properties, and for example, paper phenol may be used. Moreover, the thermal load to LED7 can further be reduced by using metal substrates with high heat conductivity, such as an aluminum substrate and a copper substrate.
(2) Number In the embodiment, a plurality of LEDs 7 are mounted on one mounting board 5, but a plurality of mounting boards may be provided. In this case, it can implement by joining with an adhesive material in the state which contacts the inner surface of a glass tube for every mounting board | substrate. When a plurality of mounting boards are used, depending on the number, the mounting board has a square shape in plan view.
(3) Shape of end surface In the embodiment, the side surface extending in the longitudinal direction of the mounting substrate is orthogonal to the main surface and linear in the cross section of the mounting substrate. It may be. As another configuration, the side surface of the mounting substrate is formed in an arc shape (coincidence with the inner diameter of the glass tube) so as to be in surface contact with the inner surface of the glass tube, or is in contact with the inner surface of the glass tube at two points on one side surface. The side surface of the mounting substrate can be inclined.
(4) Structure In the embodiment, the mounting substrate has a rectangular cross-sectional shape and a vertical cross-sectional shape. However, for example, the cross-sectional shape may be an arc shape.

Furthermore, you may provide a rib along the longitudinal direction (direction parallel to the axis | shaft of a glass tube) of a mounting board | substrate.
FIG. 11 is a cross-sectional view of an LED lamp according to Modification 1.
The LED lamp 101 according to the first modification differs from the LED lamp 1 according to the embodiment in the structure of the mounting substrate (to be exact, the shape of the adhesive 107 is also different).

As shown in FIG. 11, the mounting substrate 103 of the LED lamp 101 has an end portion extending in the longitudinal direction of the mounting substrate 103 (in other words, an end portion in the short direction, as shown in FIG. 11). The end portion of the direction is a rib portion 105. The rib portion 105 is configured such that the end portion is bent to the side opposite to the LED mounting side.
Also in Modification 1, the bottom surface 105a of the rib portion 105 of the mounting substrate 103 is in contact with the inner surface of the glass tube 3, and the shape of the bottom surface 105a corresponds to the inner surface of the glass tube 3 in order to increase the contact area. I am doing.

In order to improve the mechanical properties in the longitudinal direction of the mounting substrate, in addition to the first modification, for example, a rib portion extending in the longitudinal direction may be provided in the approximate center of the mounting substrate. In order to improve the mechanical characteristics of the mounting substrate in the short direction, for example, rib portions extending in the short direction may be provided at predetermined intervals in the long direction.
3. Adhesive In the embodiment, cement is used as the adhesive 9, but other adhesive may be used, for example, a silicone resin may be used. However, considering the heat transfer as a function of the adhesive, it is preferable to use a material having a high heat transfer rate. Specifically, the heat conductivity is preferably 1 [W / m · K] or more.

In order to increase the heat transfer rate of the adhesive, inorganic particles may be mixed in the adhesive. Examples of such inorganic particles include metal particles such as silver, copper, and aluminum, and nonmetal particles such as alumina, aluminum nitride, silicon carbide, and graphite.
In view of weight reduction, it is preferable to use a material having a low specific gravity. Specifically, the specific gravity is preferably 2 [Kg / m ³ ] or less. Examples of such a material include a silicone resin.
4). Bonding Structure In the embodiment, the back surface of the mounting substrate 5 and the inner surface of the glass tube 3 are bonded by the adhesive material 9, but may be bonded by another structure. A modification as a joining structure will be described.
(1) Through-hole FIG. 12 is a cross-sectional view of an LED lamp according to Modification 2.

The LED lamp 111 according to Modification 2 is different from the LED lamp 1 according to the embodiment in the shape of the mounting substrate and the bonding structure.
As shown in FIG. 12, the mounting substrate 113 of the LED lamp 111 has a plurality of through holes 117 penetrating the substrate body 115 in the cross-sectional shape. The through holes 117 here are formed in a plurality of rows (here, two rows) along the longitudinal direction of the mounting substrate 113. The through-holes 117 in each row are formed at substantially the same position in the longitudinal direction at regular intervals in the longitudinal direction. Here, the two rows are formed at both ends of the substrate body 115 in the short direction.

The adhesive 119 is used when the mounting substrate 113 is bonded to the inner surface of the glass tube 3 and when the peeling occurs between the mounting substrate 113 and the substrate bonding portion 121, the mounting substrate 113 is attached to the glass tube 3. And a disengagement prevention unit 123 for preventing disengagement (falling).
The substrate bonding portion 121 is filled in the gap and the through hole 117 between the mounting substrate 113 and the glass tube 3. The detachment prevention portion 123 is a portion that protrudes from the through hole 117 of the mounting substrate 113 to the surface of the mounting substrate 113. That is, the size of the detachment prevention portion 123 is larger than that of the through hole 117, and the detachment prevention portion 123 has a structure for locking the surface of the mounting substrate 113.

FIG. 13 is a cross-sectional view of an LED lamp according to Modification 3.
The LED lamp 131 according to the modification 3 is different from the LED lamp 111 according to the modification 2 in the shape of the through hole of the mounting board (to be exact, the shape of the adhesive 139 is also different).
The mounting substrate 133 of the LED lamp 131 has a through hole 137 in the substrate body 135 as shown in FIG. 13, similarly to the mounting substrate 113 according to the second modification.

The through-hole 137 is a tapered hole whose hole diameter increases from the back surface to the front surface. That is, the peripheral surface of the through-hole 137 is inclined so as to spread frontward.
The adhesive 139 has a substrate bonding portion 141 and a detachment preventing portion 143, and the detachment preventing portion 143 is a portion filled in the through hole 137 of the mounting substrate 133. Thereby, the size of the detachment preventing portion 143 is larger than the opening diameter on the back surface side of the through hole 137, and the detachment preventing portion 143 has a structure for locking the peripheral surface of the through hole 137 of the mounting substrate 133.

Note that the through holes 117 and 137 in the modified examples 2 and 3 may have a circular shape or a polygonal shape when viewed from the direction in which the central axes of the through holes 117 and 137 extend. May be. Furthermore, a long hole may be sufficient.
Furthermore, as shown in FIGS. 12 and 13, a plurality of (two) through-holes formed in a plurality of rows are formed in a direction orthogonal to the longitudinal direction of the mounting substrate. It may be formed alternately. Further, the approximate center in the short direction of the mounting substrate may be provided at a predetermined interval in the longitudinal direction of the mounting substrate, or may be provided near the virtual line.
(2) Joining location In the embodiment and the modification, the entire back surface of the mounting substrate is bonded to the inner surface of the glass tube by the adhesive, but the entire back surface of the mounting substrate may not be bonded.

FIG. 14 is a cross-sectional view of an LED lamp according to Modification 4, and FIG. 15 is a cross-sectional view of the LED lamp according to Modification 5.
The LED lamp 151 according to the modification 4 is different from the LED lamp 1 according to the embodiment in the bonding range and the number of bondings for bonding the mounting substrate to glass.
As shown in FIG. 14, the mounting substrate 153 of the LED lamp 151 has a width substantially equal to the inner diameter of the glass tube 3 in the cross-sectional shape, and an end portion parallel to the longitudinal direction of the mounting substrate 153 is an adhesive 155. Is joined to the glass tube 3.

As described above, only the end portion of the mounting substrate 153 is joined, so that the amount of the adhesive 155 used can be reduced, and as a result, the LED lamp 151 can be reduced in weight.
Further, in the LED lamp 151 according to the modification example 4, only the back surface of the mounting substrate 153 is bonded. However, in the LED lamp 161 according to the modification example 5, as shown in FIG. It is joined to the glass tube 3 by an adhesive 165 at both ends. By bonding the surface of the mounting substrate 163 in this manner, the mounting substrate 163 can be prevented from coming off and the heat transfer function can be improved.

FIG. 16 is a longitudinal sectional view of an LED lamp according to Modification 6.
The LED lamp 171 according to the modified example 6 is different from the LED lamp 1 according to the embodiment in the bonding range and the number of bondings for bonding the mounting substrate to glass.
As shown in FIG. 16, the mounting substrate 173 of the LED lamp 171 is joined by adhesives 175 disposed at a plurality of locations with a predetermined interval in the longitudinal direction of the mounting substrate 173. Each adhesive 175 is provided at a position corresponding to the back side of the mounting region of the LED 7 on the mounting substrate 173.

Thus, since the mounting substrate 173 is bonded to the glass tube 3 via the adhesive 175 on the back surface of the LED 7 mounting region, the glass tube is connected via the adhesive 175 provided immediately below the heat generated by the LED 7. It is transmitted to 3.
Thereby, the usage-amount of the adhesive material for joining the mounting board | substrate 173 to the glass tube 3 can be decreased, and weight reduction can be achieved, without reducing the heat conductive characteristic of LED7 so much.
5. Mounting of LED Element In the embodiment, the form in which the surface mount (SMD) type LED is mounted on the mounting board has been described. However, the LED element may be directly mounted on the mounting board in the embodiment. Although LEDs and LED elements and their mounting have not been described in detail, conventional well-known techniques can be used as mounting methods (including electrical connection) of these LEDs and the like on the mounting substrate, Bumps, die bonds, solder, wires, etc. can be used.
6). Translucent resin Although translucent resin was comprised with the silicone resin in embodiment, you may utilize another material. Another material is glass or the like.

In the embodiment, the phosphor powder mixed in the translucent resin is yellow (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ or Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ³⁺ . Although green phosphor powder and red phosphor powder such as Sr ₂ Si ₅ N ₈ : Eu ²⁺ and (Ca, Sr) S: Eu ²⁺ are used, other phosphor powders can also be used. .
For example, when a blue light emitting LED element is used, a translucent resin of a mixture of a yellow phosphor powder and a green phosphor powder or a mixture of a red phosphor powder and a green phosphor powder may be used.
7). Lamp In the embodiment and the modification, the LED lamp is modeled on a straight tube fluorescent lamp. However, for example, an annular fluorescent lamp may be used as a model. In this case, for example, the LED lamp can be implemented as long as the cross-sectional structure of the LED lamp is as shown in FIG. 3 and the mounting substrate has an annular shape to enable insertion into an annular glass tube. Furthermore, when an annular fluorescent lamp is used as a model, the surface of the mounting substrate may be directed outwardly so as to be inclined at a predetermined angle or perpendicular to the annular radial direction that is the shape of the glass tube.

  The present invention can be used as a lamp for illumination.

1 LED lamp 3 Glass tube 5 Mounting board 7 LED
9 Adhesive 11 Base 13 Lighting circuit

Claims (3)

A plurality of LEDs;
A mounting substrate having the plurality of LEDs on its surface;
A resin tube for storing the mounting board therein;
An adhesive for joining the mounting substrate and the resin tube;
Between the back surface of the mounting substrate and the inner surface of the resin tube, the adhesive is provided at a plurality of locations spaced in the longitudinal direction of the resin tube, and on the back side of the mounting region of the plurality of LEDs on the mounting substrate. An LED lamp, wherein the adhesive is present at each corresponding position.   2. The mounting board according to claim 1, wherein the mounting substrate has one or a plurality of through holes, the adhesive is filled in the through holes, and the adhesive protrudes from the through holes to the surface. LED lamp of description.   2. The mounting board according to claim 1, wherein the mounting substrate has one or a plurality of through holes whose hole diameters increase from the back surface side to the front surface side, and the through holes are filled with an adhesive. LED lamp.

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