JPS58131808A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To fix a piezoelectric resonator on a board at a position other than the vicinity of electrodes, by surrounding the vicinity of the electrodes on front and rear sides of the piezoelectric resonator with an elastic member and soldering leads of the electrodes on one side to the winding pattern on the board. CONSTITUTION:Elastic members 18, 23 are coated on the front side 9 and the rear side 12 of the piezoelectric plate 8 by printing, for example, to a prescribed thickness. Cream solder is applied to metallic patterns 29, 30 of the board and metallic patterns 21, 22 of the rear side 12 of the piezoelectric plate. Further, the plate 8 is mounted on the board 36 and an upper plate 24 is on the rear side 12 of the plate 8 sequentially. The cream solder is melted through heating for soldering. Then, the lead terminal 20 and the wiring patter 31 are conected with a conductive paste 34.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a recess 2 on the surface of a substrate 1 of an integrated circuit, as shown in a hybrid in which a filter using an energy trap type piezoelectric resonator is integrally formed. The piezoelectric plate 3 is fixed to the substrate 1 with an adhesive, with the electrode 4 located in the recess 2 and the electrode 5 on the surface covered with a cap 6 made of ceramic or synthetic resin, and the whole is covered with an exterior material such as phenol resin. The piezoelectric resonator was attached to the integrated circuit by sealing with resin at 37. A gap is formed by the recess 2 and the cap 6 near the electrodes on the front and back surfaces, so that the piezoelectric plate 3 can perform energy-confined vibration. Note that 7 is a wiring pattern provided on the surface of the substrate 10.

However, in such a conventional structure, it is necessary to precisely align the four parts 2, the electrodes of the piezoelectric plate 6, and the cap 6.
Furthermore, since the recess 2 must be provided in the substrate 1, the manufacturing process becomes complicated.

An object of the present invention is to provide a structure for attaching an energy trapping type piezoelectric co-photograph to a hybrid integrated circuit, which is easy to align to form a gap near the electrode, and does not require the provision of a recess in the substrate. The invention relates to a hybrid integrated circuit incorporating an energy trapping type piezoelectric resonator, in which the vicinity of the electrodes on both the front and back sides of the piezoelectric resonator is surrounded by an elastic material, and the lead terminal of the electrode on at least one side is soldered to the wiring pattern on the substrate. By doing so, the piezoelectric resonator is fixed on the substrate at a position other than the vicinity of the electrode, and the remaining surface is fixed on an upper plate separate from the substrate at a position other than the vicinity of the electrode.

Embodiments of the present invention will be described below with reference to FIGS. 2 and 3, which show embodiments of the present invention. Figure 2 is an exploded plan view of the hybrid integrated circuit where the piezoelectric resonator is attached.
a) is the upper plate, (b) and (○) are the back and front surfaces of the piezoelectric resonator, respectively (the slope indicates the substrate, and Figure 3 is the cross section of the hybrid integrated circuit where the piezoelectric resonator is attached). The figure (3) is slightly exaggerated to make it easier to understand.

In FIGS. 2 and 3, a pair of input electrodes 10 and an output electrode 11 are formed by baking silver on the front surface [9] of a rectangular piezoelectric plate 80 constituting a piezoelectric resonator, and on the back surface 12. A ground electrode 16 is formed at a position facing the input electrode 10 and the output electrode 11. Lead terminals 14 and 15 of the input electrode 10 and the output electrode 11 are partially formed along two opposing sides of the surface 9, and a U-shaped metal pattern 16 is formed along the entire remaining two opposing sides. .17 is formed separately from the vL pole 10°11 and the lead terminals 14 and 15.

The elastic material 18 is positioned in a circle surrounding the vicinity of the electrode 10.11 where the i-motion occurs. The elastic material 18 is, for example, a silicone adhesive [Toray Silicone 811j-17
It is recommended to use 00J (product name).

Further, lead terminals 19 and 20 of the ground electrode 13 are widely formed on the back surface 12 at positions substantially opposite to the metal patterns 16 and 17 on the front surface. Along two other opposing sides, metal patterns 21, 22 (4) are formed separately from the electrodes 13 and lead terminals 19, 20. Furthermore, an elastic material 23 is placed on the electrode 1 opposite to the elastic material 18.
It is located surrounding the vicinity of 3.

On one side of the upper plate 24, which is the same size as the piezoelectric plate 8 and is made of ceramic or synthetic resin, metal patterns 25 and 26 are partially formed along two opposing sides. The metal patterns 25 and 26 are located opposite to the metal patterns 21 and 22 on the back side of the piezoelectric plate, respectively.

On the surface of the integrated circuit substrate 36 are formed wiring patterns 27 and 28 corresponding to the lead terminals 14 and 15 on the surface of the piezoelectric plate, and metal patterns 29 and 30 corresponding to the metal patterns 16 and 17, respectively. is a wiring pattern to which one side of lead terminals 19 and 20 on the back surface of the piezoelectric plate are connected, and 32 and 36 are terminals for external connection of the integrated circuit.

The piezoelectric plate 8 is attached to the substrate 36 formed in this way, and the lead terminals 14 and 15 are connected to the wiring pattern 27, respectively.
．． Solder to 28 1-1 gold 11i pattern 16.17
The piezoelectric plate 8 is fixed to the substrate 36 with its surface 9 facing downward by soldering to the metal patterns 29 and 30, respectively. Further, the upper plate 24 is fixed to the back surface 12 of the piezoelectric plate 8 by soldering metal patterns 25 and 26 to the metal patterns 21 and 22 of the piezoelectric plate 8, respectively. Lead terminals 20 on the back surface 12 of the piezoelectric plate are connected to wiring patterns 51 by conductive paste 34. FIG. 3 shows the board 36
A- of the upper plate 24 with the piezoelectric plate 8 attached to the
It is a sectional view taken along the A'm plane, and 35 indicates solder. The upper plate 24 and the piezoelectric plate 8 are further entirely sealed with resin using an exterior material, but are omitted and not shown in FIG. 3. Also, the connecting portion between the upper plate 24 and the piezoelectric plate 8 is not shown in FIG.

In the mounting structure of the present invention configured as described above, all of the metal patterns are fixed by soldering the substrate 36, piezoelectric plate 8, and upper plate 24 to each other, and fix the periphery of the piezoelectric plate 8 to prevent unnecessary vibrations. 18. It has a suppressing role and is also an elastic material.
23 serves to prevent the exterior material from entering the vicinity of the electrode where vibrations occur, thereby forming a gap and absorbing unnecessary vibrations, and also serves to prevent solder from flowing into the gap during soldering. Although the planar shape of the elastic members 18 and 23 is circular, it may be rectangular or may have a partially chipped periphery. Further, the substrate 36 and the upper plate 24 may be in complete contact with each other, or there may be a slight gap. In short, it suffices if it is in a state that can fulfill the role described above. Furthermore, the upper plate 24 has the role of preventing exterior material from entering the vicinity of the electrodes from above, and does not necessarily have to be the same size as the piezoelectric plate 8.

The method for attaching the piezoelectric plate 8 is to first apply an elastic material 18.21t to the front surface 9 and back surface 12 of the piezoelectric plate 8 to a certain thickness by, for example, printing. Next, the metal pattern 29 on the board, ? ) Apply cream solder to the metal patterns 21 and 22 on the back surface 12 of the piezoelectric plate. Then, the piezoelectric plate 8 is placed on the substrate 36,
Further, the upper plate 24 is sequentially placed on the back surface 12 of the piezoelectric plate. Next, the cream solder is melted by heating and soldering is performed. Thereafter, the lead terminal 20 and the wiring pattern 31 are connected to the conductive paste 34.

By the way, in the plan view of FIG. 4, the electrode 1 on the surface of the piezoelectric plate 8 is shown superimposed on the substrate 36 when the piezoelectric plate 8 is placed on the substrate 36.
0.11 and the parts to be soldered, that is, the metal patterns 16 and 17 and the lead terminals 1415 are shown by broken lines.

FIG. 4 shows that the part of the surface 9 of the piezoelectric plate to be soldered is the substrate 3.
60 shows a misaligned cap that does not match the part to be soldered, but even with this kind of collar, cream solder is f! When understood, the piezoelectric plate 8 slides in the direction of the arrow due to the narrow surface tension, and soldering becomes possible with the piezoelectric plate 8 and the parts of the board 66 to be soldered completely aligned. This also applies to the IA section of the piezoelectric plate 8 and the upper plate 24. Furthermore, when piezoelectric plate 8 and upper plate 24 are placed on substrate 66 in sequence, bullet 1 raw materials 1B and 23 are dove plates! 16
It is a thermally necessary condition that the thickness is such that it will not be bonded even if it comes into contact with the upper plate 24.

Thus, in the hybrid integrated circuit of the present invention, it is often necessary to provide the recess 2 when attaching the piezoelectric resonator to the substrate 36. Elastic materials, electrodes, lead terminals, etc.
It can be easily formed using the jigging technique. Also, regarding the alignment of the substrate 36, piezoelectric plate 8, and upper plate 24, it is only necessary to place the parts to be soldered so that they match each other, and even if their positions are slightly shifted, it can be fixed using cream solder. High precision alignment is not required as the melting and temple alignment is automatically corrected. Therefore, compared to the structure of conventional piezoelectric resonator installation, the construction process is extremely simple, and for example, it is possible to solder the piezoelectric resonator at the same time as other chip-shaped circuit elements that are connected to the wiring pattern of the board 36 for 1 m. Therefore, it is efficient.

Note that the present invention is not limited to the embodiments and has a wide range of application. Gold g of piezoelectric plate 8 in the example I'-/1
6.17 and the metal patterns 29.30 on the board 66 can be removed by increasing the area of the lead terminals 14, 15 and the wiring patterns 27.33 and designing so that the soldering can be made strong with just these parts. be. [Metal patterns 21, 22 of 1, metal patterns 25, 26 of the top plate 24, and metal positions on the top plate 24 corresponding to the lead terminals 19, 20]
(This can be removed by changing the shape of the turn so that it can be soldered. Connect the lead terminals 19 and 20 to the wiring pattern 31 of the board 36 using conductive paste from between the thermal plate 24 and the piezoelectric plate 8. Furthermore, the substrate 36, piezoelectric plate 8, and upper plate 24 are all fixed by soldering, except for the parts that require soldering between the wiring pattern of the substrate 36 and the lead terminals of the piezoelectric plate 8. It is also possible to fix with adhesive. In this case, it is necessary to improve the accuracy of positioning slightly more than in the case of the embodiment using solder. Note that in the embodiment, a single element piezoelectric resonator will be explained. It goes without saying that the present invention can be applied to piezoelectric resonators having two or more elements.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a conventional hybrid integrated circuit.
Figure '42 is an exploded plan view of the mounting portion of the piezoelectric resonator of the hybrid integrated circuit of the present invention;
The figure is a sectional view of the integrated circuit of the present invention of the part where the piezoelectric resonator is attached, and FIG. 4 is a plan view when the piezoelectric resonator is placed on the substrate of the integrated circuit. 1.56: Substrate, 2: Recess, 3, 8: Piezoelectric plate,
4, 5: electrode, 6: cage. 9: Surface, 10: Input electrode, 11: Output electrode,
12; Back side, 13: Earth 1 smoke. 14.15, 19.20: Lead terminal. 16.17.2L 22, 25, 26, 29, 30
: Metal pattern, 1B, 23: Elastic material, 24: Top plate 7.27.2B, 31: Wiring pattern. 64 second lead turtle pace l-, 55: solder. 67: Exterior material patent use 1 daughter Toko Co., Ltd. (Ro)

Claims (3)

[Claims] (1) In a hybrid integrated circuit incorporating an energy-trapped piezoelectric resonator, the vicinity of the electrodes on both the front and back sides of the piezoelectric resonator is surrounded by an elastic material, and the lead terminal of the electrode on at least one side is soldered to the wiring pattern on the board. By doing so, the piezoelectric resonator is fixed on the substrate at a position other than the vicinity of the electrode at 1t, and the remaining surface is fixed to an upper plate other than the substrate at a position other than the vicinity of the electrode. integrated circuit. (2) Metal patterns for fixing the piezoelectric resonator are provided at mutually corresponding positions on both the front and back surfaces of the piezoelectric resonator, the substrate, and the top plate, and the piezoelectric resonator is soldered at the metal pattern portions. A hybrid integrated apposition according to claim 1, wherein the hybrid integrated apposition is secured to the substrate and the top plate by. (3) The hybrid integrated circuit according to claim 1, wherein the piezoelectric resonator is fixed to the substrate and the upper plate using an adhesive.