JP2000353829A - Thermoelectric module and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric module together with its manufacturing method, wherein, a P-type thermoelectric chip and an N-type thermoelectric chip are fixed to a prescribed positions with accuracy without increasing the electrical resistance. SOLUTION: There are provided a plurality of adjoining P-type thermoelectric chips 1a and N-type thermoelectric chips 1b, and a plurality of electrodes 2, which are with P-type thermoelectric chip 1a and N-type thermoelectric chip 1b mutually connected in series, connected to both ends of them, respectively, using a solder. Here, a partitioning protruding part 4a is provided at least at a part of the surface positioned between the P-type thermoelectric chip 1a and N-type thermoelectric chip 1b of each electrode 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric module for performing thermal control using the Peltier effect and a method of manufacturing the same, and more particularly, to fixing a P-type thermoelectric chip and an N-type thermoelectric chip at predetermined positions with high accuracy. And a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 9 is a perspective view showing an example of a conventional thermoelectric module. This thermoelectric module has a plurality of P-type thermoelectric chips 1a and N-type thermoelectric chips 1b adjacent to each other.
And the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are alternately connected in series, and the plurality of electrodes 2 and the plurality of electrodes 2 respectively connected to both ends of the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are formed. And a lower substrate 3a and an upper substrate 3b arranged so as to sandwich the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b therebetween. In this thermoelectric module, the electrode 2 and both ends of the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are connected by solder.

In FIG. 9, reference numerals 7a and 7b indicate lead wires. In the thermoelectric module shown in FIG. 9, by supplying current from the lead wires 7a and 7b to the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b connected in series by the electrode 2, the current flows in the direction in which the current flows due to the Peltier effect. Accordingly, from the lower substrate 3a to the upper substrate 3b,
Alternatively, heat is transferred from the upper substrate 3b to the lower substrate 3a due to the characteristics of the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b corresponding to the magnitude of the current.

Next, a method of manufacturing the thermoelectric module shown in FIG. 9 will be described. First, as shown in FIG. 10, a plurality of rectangular electrodes 2 are formed at predetermined positions on the surface of the lower substrate 3a. The lower substrate 3a is fixed with the surface on which the electrode 2 is provided facing upward, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are arranged at both ends of the electrode 2 and connected by a solder reflow method. And fix it.

The connection by the solder reflow method is performed, for example, as follows. As shown in FIG. 10, a P-type thermoelectric chip 1a and a N-type thermoelectric chip 1a are provided on the surface of the electrode 2 opposite to the lower substrate 3a.
A solder plating 6 for connecting and fixing the die thermoelectric chip 1b on the electrode 2 is applied in advance. Further, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1 connected and fixed to the electrode 2
Solder plating 5 is applied to both ends of b in advance. Then, as described above, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are arranged at predetermined positions on the electrode 2, and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are substantially above the lower substrate 3a. While holding down with a holding plate of the same dimensions as above, solder plating 5 applied to each joint
6 is connected and fixed by heating and joining using a hot plate or the like.

Subsequently, similarly to the lower substrate 1a, a plurality of rectangular electrodes 2 are provided at predetermined positions.
The upper substrate 1b plated with solder for connecting and fixing the type thermoelectric chip 1a and the N-type thermoelectric chip 1b is fixed on the lower substrate 1a with the electrode 2 side facing downward. It is installed on the thermoelectric chip 1a and the N-type thermoelectric chip 1b. At this time, the positioning is performed such that the ends of the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are positioned at both ends of the electrode 2 provided on the upper substrate 1b. Then, the electrode 2 on the upper substrate 1b side and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are connected and fixed by the solder reflow method in the same manner as in the lower substrate 1a side, as shown in FIG. A thermoelectric module is obtained.

[0007]

However, in such a method of manufacturing a thermoelectric module, the electrode 2 on the lower substrate 3a side, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1
When the solder platings 5 and 6 applied to the respective joints are melted in order to connect the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b with the surface tension of the molten solder. There is a problem of moving in the direction of the arrow shown in FIG. That is, since the heights of the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b used in the thermoelectric module are not actually uniform, the P-type thermoelectric chip 1a having a low height when pressed by the pressing plate is reduced. The N-type thermoelectric chip 1b does not come into contact with the holding plate, and moves due to the surface tension of the molten solder.

Due to the surface tension of the molten solder, P
When the type thermoelectric chip 1a and the N-type thermoelectric chip 1b move, a part of the cross section of the obtained thermoelectric module is in a state as shown in FIG. 12, for example. Electrodes 21 and 22 are provided on the lower substrate 3a of the thermoelectric module, and electrodes 23, 24 and 25 are provided on the upper substrate 3b. The P-type thermoelectric chip 1 is attached to the electrode 21 on the lower substrate 3a side.
1a and the N-type thermoelectric chip 11b
Includes a P-type thermoelectric chip 10a and an N-type thermoelectric chip 10
b is connected. The position of the N-type thermoelectric chip 11b is
Due to the surface tension of the molten solder, it is fixed while being moved to the center of the electrode 21 from a predetermined position indicated by reference numeral 12b in FIG. Further, the position of the P-type thermoelectric chip 10a is fixed by being moved toward the center of the electrode 22 from a predetermined position indicated by reference numeral 12a in FIG. 12 due to the surface tension of the molten solder.

For this reason, there is an inconvenience that the end of the N-type thermoelectric chip 11b to be connected only to the electrode 24 on the upper substrate 3b contacts the electrode 23 on the upper substrate 3b. In addition, there is an inconvenience that a part of the end portion of the P-type thermoelectric chip 10a that is to be connected to the electrode 24 on the upper substrate 3b does not contact.

As a thermoelectric module that solves such a problem, there is, for example, a thermoelectric module disclosed in Japanese Patent Application Laid-Open No. 3-225973. This thermoelectric module is shown in FIG.
As shown in FIG. 3, the center of the electrode 2a is narrowed,
The surface tension of the molten solder acts toward the position where the P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b is to be joined, that is, in the direction of the arrow shown in FIG. This enables the chip 1a and the N-type thermoelectric chip 1b to be fixed at predetermined positions.

However, such a thermoelectric module has a problem that the electric resistance increases because the central portion of the electrode 2a is narrowed. Further, in this thermoelectric module, the accuracy of the position where the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are fixed increases as the central portion of the electrode 2a becomes narrower, but the electric resistance also increases accordingly. Therefore, it was difficult to obtain sufficient accuracy.

The present invention has been made in view of the above circumstances, and solves such a problem, and fixes a P-type thermoelectric chip and an N-type thermoelectric chip at predetermined positions accurately without increasing electric resistance. It is an object of the present invention to provide a thermoelectric module capable of performing the above. Another object of the present invention is to provide a method for manufacturing the above thermoelectric module.

[0013]

The object of the present invention is to provide a plurality of P-type and N-type thermoelectric chips adjacent to each other,
Type thermoelectric chip and the N-type thermoelectric chip are alternately connected in series, and a plurality of electrodes are respectively connected to both ends of the P-type thermoelectric chip and the N-type thermoelectric chip by soldering. The problem can be solved by a thermoelectric module characterized in that a partition convex portion is provided on at least a part of a surface located between the mold thermoelectric chip and the N-type thermoelectric chip.

In such a thermoelectric module, since at least a part of the surface of each of the electrodes located between the P-type thermoelectric chip and the N-type thermoelectric chip is provided with a partitioning convex portion, it can be soldered. When connecting the P-type thermoelectric chip and the N-type thermoelectric chip to the electrode, the surface tension of the molten solder acts toward a position where the P-type thermoelectric chip or the N-type thermoelectric chip is to be joined on the electrode. , Accurately P
The type thermoelectric chip and the N type thermoelectric chip can be fixed at predetermined positions. Moreover, such a thermoelectric module does not have a large electric resistance unlike the conventional thermoelectric module in which the center of the electrode is narrowed.

In the above thermoelectric module,
It is preferable that the partition convex portion extends from one side to the other side of each of the electrodes along a direction connecting the P-type thermoelectric chip and the N-type thermoelectric chip. With such a thermoelectric module, it is possible to completely partition at the center of the electrode by the partitioning convex portion, and the surface tension of the molten solder is further increased, so that the P-type thermoelectric chip or the N-type thermoelectric chip on the electrode is further improved. Since the P-type thermoelectric chip and the N-type thermoelectric chip can be fixed at predetermined positions with higher precision because they are directed to the position to be joined.

In the above thermoelectric module,
It is preferable that a surrounding protrusion formed to surround each of the electrodes is provided, and the surrounding protrusion is made of a material having an insulating property. With such a thermoelectric module, a material having an insulating property is interposed between the electrodes, and when connecting the P-type thermoelectric chip and the N-type thermoelectric chip to the electrodes by soldering, It is possible to prevent the occurrence of a short circuit due to contact between the electrodes. In addition, a state in which a material having an insulating property is interposed between the electrodes is provided, so that occurrence of a short circuit due to migration can be prevented.

In the above thermoelectric module,
It is preferable that the partitioning protrusion and the surrounding protrusion are made of solder resist. Since the solder resist has an insulating property and has a property of repelling solder, by forming the surrounding convex portion of the solder resist, the occurrence of a short circuit caused by the contact between the electrodes, The occurrence of a short circuit due to migration can be prevented. Furthermore, since the solder resist has heat resistance, the partition convex portion and the surrounding convex portion are not adversely affected by heating for melting the solder.

Further, the object is to provide a plurality of electrodes for alternately connecting a P-type thermoelectric chip and an N-type thermoelectric chip in series on respective surfaces of a pair of substrates, and to provide the plurality of electrodes on one of the pair of substrates. A partition convex portion is provided at least at a part of the center portion of the formed electrode, and the P-type thermoelectric chip and the N-type thermoelectric chip are arranged at both ends, and the P-type thermoelectric chip and the N-type thermoelectric chip are arranged by a solder reflow method. Connecting the N-type thermoelectric chip and the electrode, and then disposing the other substrate so as to sandwich the P-type thermoelectric chip and the N-type thermoelectric chip through the electrode provided on the other substrate; Connecting the electrodes provided on the other substrate to the P-type thermoelectric chip and the N-type thermoelectric chip by soldering. .

In this case, when the thermoelectric module obtained by the method for manufacturing a thermoelectric module is used, the "pair of substrates" may be used as a structural member of the thermoelectric module as it is. Temporary substrates used only at times and removed after manufacturing are also included.

Further, the object is to provide a plurality of electrodes for alternately connecting a P-type thermoelectric chip and an N-type thermoelectric chip in series on respective surfaces of a pair of substrates, and to provide the plurality of electrodes on one of the pair of substrates. A partition projection is provided at least at a part of a center portion of the formed electrode, and the P-type thermoelectric chip and the N-type thermoelectric chip are arranged at both ends, respectively. Then, the electrode provided on the other substrate is provided. Through the P
The other substrate is disposed so as to sandwich the type thermoelectric chip and the N-type thermoelectric chip, and the P-type thermoelectric chip and the N-type thermoelectric chip are disposed on the one substrate and the other substrate by a solder reflow method. The problem can be solved by a method for manufacturing a thermoelectric module, which is characterized by connecting the provided electrodes.

The method for manufacturing such a thermoelectric module is as follows.
A method is provided in which at least a part of the central portion of the electrode is provided with a partitioning convex portion, and the P-type thermoelectric chip and the N-type thermoelectric chip are arranged at both ends and connected by a solder reflow method. The surface tension of the solder can be made to work toward the position where the P-type thermoelectric chip or the N-type thermoelectric chip is to be joined on the electrode, and the P-type thermoelectric chip and the N-type thermoelectric chip are fixed at predetermined positions. be able to.

In the method of manufacturing a thermoelectric module, the method may be characterized in that the partitioning protrusion and the surrounding protrusion formed so as to surround each of the electrodes are provided at the same time. Since the method for manufacturing such a thermoelectric module is a method in which the partitioning convex portion and the surrounding convex portion are provided at the same time, a thermoelectric module having the partitioning convex portion and the surrounding convex portion can be easily manufactured in a small number of steps.

[0023]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. [First Embodiment] FIG. 1 is a schematic view of a part of an example of a thermoelectric module of the present invention as viewed from above, and FIG.
FIG. 3 is a sectional view of the thermoelectric module shown in FIG. The difference between this thermoelectric module and the conventional thermoelectric module is that the thermoelectric module has a partitioning projection 4a provided at the center of the electrode 2 and a surrounding projection 4b provided at the periphery. The partition convex portion 4a is composed of a P-type thermoelectric chip 1a and an N-type thermoelectric chip 1.
b, the P-type thermoelectric chip 1
The electrode 2 has a belt-like shape extending from one side to the other side of the electrode 2 along a direction connecting the N-type thermoelectric chip 1b to the N-type thermoelectric chip 1b. The surrounding convex portion 4b is formed so as to surround the periphery of the electrode 2.

As a material for forming the partitioning convex portion 4a and the surrounding convex portion 4b, a solder resist which can repel solder and has insulation and heat resistance is used.

Next, a method of manufacturing the thermoelectric module shown in FIGS. 1 and 2 will be described in detail. First, as shown in FIG. 2, a rectangular electrode 2 is formed at a predetermined position on the surface of the lower substrate 3a. Next, the central part and the periphery of the electrode 2 are screen-printed or photolithographically processed by using FIG.
And the partition convex part 4a and the surrounding convex part 4b shown in FIG. 2 are provided simultaneously. Thereafter, the lower substrate 3a is fixed with the surface on which the electrode 2 is provided facing upward, and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are arranged at both ends of the electrode 2, respectively, and connected by a solder reflow method. And fix it.

The connection by the solder reflow method can be performed by a method similar to the conventional method, for example, as follows. In other words, each of the joints where the electrode 2 is connected to the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b is subjected to solder plating in advance, so that the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are almost completely covered from above. The solder plating applied to each joint is heated and melted using a hot plate or the like while being pressed by a pressing plate having the same dimensions as the side substrate 3a.

At this time, the molten solder is directed in the direction indicated by the arrow shown in FIG. 1, that is, toward the position on the electrode 2 where the P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b is to be joined. Surface tension works. Due to this surface tension,
The low P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b included in the plurality of P-type thermoelectric chips 1a and the N-type thermoelectric chips 1b connected on the electrode 2 and not pressed by the pressing plate has a predetermined height. At the position of. Then, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1 are cured by curing the molten solder.
The electrode b and the electrode 2 are joined at predetermined positions, and are connected and fixed.

Subsequently, a rectangular electrode 2 is provided at a predetermined position in the same manner as the lower substrate 1a, and solder plating for connecting and fixing the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b is performed. The resulting upper substrate is placed on the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b fixed on the lower substrate 1a with the electrode 2 side facing downward. At this time, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are provided at both ends of the electrode 2 provided on the upper substrate.
Are positioned so that the ends of the. 1 and 2 by connecting and fixing the electrode 2 on the upper substrate side and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b by the solder reflow method in the same manner as the lower substrate 1a side. Is obtained.

Such a thermoelectric module has a structure in which the P
Since the partitioning protrusions 4a are provided on the surface located between the die-type thermoelectric chip 1a and the N-type thermoelectric chip 1b, when the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are connected to the electrodes 2 by soldering, In the direction indicated by the arrow shown in FIG. 1, that is, toward the position on the electrode 2 where the P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b is to be joined, the surface tension of the molten solder acts. The P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b can be accurately fixed at predetermined positions.

Further, in such a thermoelectric module, the partitioning convex portion 4a has a shape extending from one side of the electrode 2 along the direction connecting the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b to the other side. Therefore, the surface of the electrode 2 is completely partitioned at the center of the electrode 2, and the surface tension of the molten solder is
The P-type thermoelectric chip or the N-type thermoelectric chip on the electrode 2 is more accurately oriented to the position to be joined, and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are fixed at predetermined positions with higher accuracy. be able to.

Further, by providing a surrounding convex portion 4b formed so as to surround the electrode 2, and by forming the surrounding convex portion 4b of a material having an insulating property, between the electrode 2 and the electrode 2, Insulating material is interposed,
P-type thermoelectric chip 1a and N-type thermoelectric chip 1 by soldering
When the electrode b is connected to the electrode 2, it is possible to prevent a short circuit from occurring due to contact between the electrodes 2. Also,
A state in which an insulating material is interposed between the electrodes 2 results in a thermoelectric module that can prevent occurrence of short circuit due to migration.

Furthermore, by forming the surrounding convex portion 4b of a solder resist having an insulating property and a property of repelling solder, furthermore, the occurrence of short-circuit due to contact between electrodes and the occurrence of migration due to migration. The occurrence of a short circuit can be prevented. Furthermore, since the solder resist has heat resistance, the partition convex portion 4a and the surrounding convex portion 4b are
It is not adversely affected by heating for melting the solder.

In the method of manufacturing such a thermoelectric module, a partitioning convex portion 4a and an enclosing convex portion 4b are provided at the center of the electrode 2, and then a P-type thermoelectric chip 1a and an N-type thermoelectric chip 1b are provided at both ends. Are arranged and connected by the solder reflow method, so that the surface tension of the molten solder is directed toward the position on the electrode 2 where the P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b is to be joined. P-type thermoelectric chip 1a and N-type thermoelectric chip 1b
Can be fixed in place. Furthermore, since the partitioning projection 4a and the surrounding projection 4b are provided at the same time, a thermoelectric module having the partitioning projection and the surrounding projection can be easily manufactured in a small number of steps.

[Second Embodiment] FIG. 3 is a schematic view of a part of another example of the thermoelectric module of the present invention viewed from above, and FIG. 4 is a sectional view of the thermoelectric module shown in FIG. is there. This thermoelectric module differs from the thermoelectric module shown in FIGS. 1 and 2 in that the surrounding convex portion 41 b is formed to extend over the edge of the electrode 2.

Also in such a thermoelectric module, the surface of the electrode 2 located between the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b partitions the P-type thermoelectric chip 1a from the N-type thermoelectric chip 1b. Since the partitioning convex portion 41a is provided, when the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are connected to the electrode 2 by solder, the electrode 2 is oriented in the direction shown by the arrow in FIG. The surface tension of the molten solder acts toward the position where the upper P-type thermoelectric chip 1a or the N-type thermoelectric chip 1b is to be joined, and the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b are accurately positioned at predetermined positions. Can be fixed.

Third Embodiment FIG. 5 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above. The difference between this thermoelectric module and the thermoelectric module shown in FIGS. 1 and 2 is that the partitioning projections 42a, 42
a is a break at the center of the electrode 2.

Also in such a thermoelectric module, the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b can be fixed at predetermined positions with high accuracy, as in the first and second embodiments. .

In the thermoelectric module of the present invention, as shown in the above-mentioned example, it is preferable to use a solder resist as a material of the partition convex portion. However, the material is not limited to the solder resist alone. An electrical insulator with low solder wettability such as resin or ceramic may be used.

Further, in the thermoelectric module of the present invention, as shown in the above example, it is preferable to use a solder resist as a material of the surrounding convex portion 4b, but it is not limited to only the solder resist. For example, it is not limited to only solder resist,
For example, any electrical insulator having low solder wettability, such as epoxy resin or ceramic, may be used.

In the thermoelectric module of the present invention, the shape of the partitioning projection is provided if at least a part of the surface of the electrode 2 located between the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b is formed. Is not limited to the above example. For example, as shown in FIG. 6, the positions where the partitioning protrusions 42 a and 42 a shown in FIG. 5 are interrupted can be determined by the P-type thermoelectric chip 1 a and the N-type thermoelectric chip 1 b. Electrode 2 along the direction connecting
May be formed as an island-shaped partition convex portion 43a at the center of the electrode 2 or, as shown in FIG. 7, a position where the partition convex portions 42a, 42a are interrupted is defined as one edge portion. Only the partition convex portion 44a may be used. Further, as shown in FIG. 8, two triangular partitioning convex portions 45 each having the above-mentioned edges as bases and having vertices in the center direction are provided.
a and 45a.

In the method for manufacturing a thermoelectric module according to the present invention, as shown in the above-described example, after the electrodes provided on the lower substrate 3a are connected to the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b, The electrode provided on the upper substrate 3b may be connected to the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b, but the electrode provided on the lower substrate 3a and the electrode provided on the upper substrate 3b by a solder reflow method may be used. The electrodes may be connected to the P-type thermoelectric chip 1a and the N-type thermoelectric chip 1b at the same time.

In the method of manufacturing a thermoelectric module according to the present invention, as described in the above example, a method using solder plating is used. However, any method using a solder reflow method may be used. It is also possible to use a method of supplying solder paste or a method of supplying solder paste.

In the thermoelectric module of the present invention, FIG.
As shown in the figure, the lower substrate 3a and the upper substrate 3b can be provided, but it is also possible to have only one of the lower substrate 3a and the upper substrate 3b, or a skeleton without any substrate It may be a type element, and can be determined according to the use and the like, and is not particularly limited. The material for forming the substrate is not particularly limited, and examples thereof include ceramics such as Al ₂ O ₃ and AlN, and metal plates such as Al and Cu that have been subjected to insulation treatment.

[0044]

As described above, the thermoelectric module of the present invention has at least a part of the surface of each of the electrodes located between the P-type thermoelectric chip and the N-type thermoelectric chip.
Since the partitioning convex portion is provided, when connecting the P-type thermoelectric chip and the N-type thermoelectric chip to the electrode by solder, the position on the electrode where the P-type thermoelectric chip or the N-type thermoelectric chip is to be joined. , The surface tension of the molten solder acts to accurately fix the P-type thermoelectric chip and the N-type thermoelectric chip at predetermined positions. Moreover, such a thermoelectric module does not have a large electric resistance unlike the conventional thermoelectric module in which the center of the electrode is narrowed.

Further, the partition convex portion extends from one side to the other side of each of the electrodes along a direction connecting the P-type thermoelectric chip and the N-type thermoelectric chip. Since the partitioning protrusions can completely separate the electrode at the center of the electrode, the surface tension of the molten solder is more directed to the position where the P-type thermoelectric chip or the N-type thermoelectric chip should be joined on the electrode. Thus, the P-type thermoelectric chip and the N-type thermoelectric chip can be fixed at predetermined positions with higher accuracy.

Furthermore, an enclosing projection formed so as to surround each of the electrodes is provided, and the enclosing projection is made of an insulating material. When the P-type thermoelectric chip and the N-type thermoelectric chip are connected to the electrodes by soldering, it is possible to prevent a short circuit caused by contact between the electrodes. In addition, a state in which a material having an insulating property is interposed between the electrodes is provided, so that occurrence of a short circuit due to migration can be prevented.

Further, by forming the surrounding convex portion from a solder resist having an insulating property and a property of repelling solder, short-circuiting due to contact between electrodes and short-circuiting due to migration are further enhanced. Can be prevented from occurring. Furthermore, since the solder resist has heat resistance, the partition convex portion and the surrounding convex portion are not adversely affected by heating for melting the solder.

[Brief description of the drawings]

FIG. 1 is a schematic view of a part of an example of a thermoelectric module of the present invention as viewed from above.

FIG. 2 is a cross-sectional view of the thermoelectric module shown in FIG.

FIG. 3 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above.

FIG. 4 is a sectional view of the thermoelectric module shown in FIG.

FIG. 5 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above.

FIG. 6 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above.

FIG. 7 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above.

FIG. 8 is a schematic view of a part of another example of the thermoelectric module of the present invention as viewed from above.

FIG. 9 is a perspective view showing an example of a conventional thermoelectric module.

FIG. 10 is a diagram for explaining a method of manufacturing the thermoelectric module shown in FIG.

FIG. 11 is a diagram for explaining a problem of a conventional thermoelectric module.

FIG. 12 is a diagram for explaining a problem of a conventional thermoelectric module.

FIG. 13 is a schematic view of an example of a conventional thermoelectric module as viewed from above.

[Explanation of symbols]

 1a P-type thermoelectric chip 1b N-type thermoelectric chip 2 electrode 3a Lower substrate 3b Upper substrate 4a, 41a, 42a Partition convex portion 4b, 41b Surround convex portion

Claims (7)

[Claims] 1. A plurality of P-type thermoelectric chips and an N-type thermoelectric chip adjacent to each other, the P-type thermoelectric chip and the N-type thermoelectric chip are connected alternately in series, and the P-type thermoelectric chip and the N-type thermoelectric chip are connected by soldering. N
A plurality of electrodes respectively connected to both ends of the type thermoelectric chip, and at least a part of the surface of each electrode located between the P-type thermoelectric chip and the N-type thermoelectric chip is provided with a partition convex portion. A thermoelectric module characterized in that: 2. The method according to claim 1, wherein the partitioning convex portion extends from one side to the other side of each of the electrodes along a direction connecting the P-type thermoelectric chip and the N-type thermoelectric chip. The thermoelectric module according to claim 1. 3. An enclosing projection formed to surround each of said electrodes, wherein said enclosing projection is made of an insulating material. A thermoelectric module according to item 1. 4. The partition convex portion and the surrounding convex portion,
The thermoelectric module according to claim 3, wherein the thermoelectric module is made of a solder resist. 5. A plurality of electrodes for connecting a P-type thermoelectric chip and an N-type thermoelectric chip alternately in series on respective surfaces of a pair of substrates, wherein the electrodes provided on one of the pair of substrates are provided. The P-type thermoelectric chip and the N-type thermoelectric chip are provided by providing a partition convex portion at least at a part of the central portion thereof, and arranging the P-type thermoelectric chip and the N-type thermoelectric chip at both ends, respectively, by a solder reflow method. And the electrode, and the other substrate is disposed so as to sandwich the P-type thermoelectric chip and the N-type thermoelectric chip through the electrode provided on the other substrate, A method for manufacturing a thermoelectric module, comprising connecting the electrode provided on the other substrate to the P-type thermoelectric chip and the N-type thermoelectric chip. 6. A plurality of electrodes for connecting a P-type thermoelectric chip and an N-type thermoelectric chip alternately in series on respective surfaces of a pair of substrates, wherein the electrodes provided on one of the pair of substrates are provided. A partition convex portion is provided in at least a part of the center of the P-type thermoelectric chip and the N-type thermoelectric chip are arranged at both ends, respectively. The other substrate is arranged so as to sandwich the P-type thermoelectric chip and the N-type thermoelectric chip, and the P-type thermoelectric chip and the N
A method of manufacturing a thermoelectric module, comprising: connecting a thermoelectric chip with the electrodes provided on the one substrate and the other substrate. 7. The method for manufacturing a thermoelectric module according to claim 5, wherein the partitioning projection and the surrounding projection formed to surround each of the electrodes are provided at the same time.