JP2009130665A5 - - Google Patents

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Publication number
JP2009130665A5
JP2009130665A5 JP2007304037A JP2007304037A JP2009130665A5 JP 2009130665 A5 JP2009130665 A5 JP 2009130665A5 JP 2007304037 A JP2007304037 A JP 2007304037A JP 2007304037 A JP2007304037 A JP 2007304037A JP 2009130665 A5 JP2009130665 A5 JP 2009130665A5
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JP
Japan
Prior art keywords
piezoelectric vibrator
piezoelectric
connection terminal
active surface
semiconductor device
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Withdrawn
Application number
JP2007304037A
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Japanese (ja)
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JP2009130665A (en
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Priority to JP2007304037A priority Critical patent/JP2009130665A/en
Priority claimed from JP2007304037A external-priority patent/JP2009130665A/en
Publication of JP2009130665A publication Critical patent/JP2009130665A/en
Publication of JP2009130665A5 publication Critical patent/JP2009130665A5/ja
Withdrawn legal-status Critical Current

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Claims (6)

圧電振動子と、該圧電振動子を発振させる発振回路を備える半導体装置とを接合した圧電発振器において、
前記半導体装置は、能動面に実装端子を有し、かつ前記能動面と対向する非能動面に接続端子を有し、
前記圧電振動子は、前記接続端子と接続される電極パッドを有し、
前記接続端子が、前記非能動面の長手方向の中心線上であって、短手方向の中央部に形成され、該中央部において前記圧電振動子と接合されていること
を特徴とする圧電発振器。 In a piezoelectric oscillator in which a piezoelectric vibrator and a semiconductor device including an oscillation circuit that oscillates the piezoelectric vibrator are joined,
The semiconductor device has a mounting terminal on an active surface and a connection terminal on an inactive surface opposite to the active surface,
The piezoelectric vibrator has an electrode pad connected to the connection terminal,
The connection terminal is formed on the center line in the longitudinal direction of the non-active surface , and is formed in the center part in the short direction , and is joined to the piezoelectric vibrator in the center part.
A piezoelectric oscillator characterized by the following. 圧電振動子と、該圧電振動子を発振させる発振回路を備える半導体装置とを接合した圧電発振器において、
前記半導体装置は、能動面に実装端子を有し、かつ前記能動面と対向する非能動面に接続端子を有し、
前記圧電振動子は、前記接続端子と接続される電極パッドを有し、
前記接続端子が、前記非能動面の短手方向の中心線上であって、長手方向の中央部に形成され、該中央部において前記圧電振動子と接合されていること
を特徴とする圧電発振器。 In a piezoelectric oscillator in which a piezoelectric vibrator and a semiconductor device including an oscillation circuit that oscillates the piezoelectric vibrator are joined,
The semiconductor device has a mounting terminal on an active surface and a connection terminal on an inactive surface opposite to the active surface,
The piezoelectric vibrator has an electrode pad connected to the connection terminal,
The piezoelectric oscillator, wherein the connection terminal is formed on a center line in a short direction of the non-active surface and is formed in a center part in a longitudinal direction, and is joined to the piezoelectric vibrator in the center part . 圧電振動子と、該圧電振動子を発振させる発振回路を備える半導体装置とを接合した圧電発振器において、
前記半導体装置は、能動面に実装端子を有し、かつ前記能動面と対向する非能動面に接続端子を有し、
前記圧電振動子は、前記接続端子と接続される電極パッドを有し、
前記接続端子が、非能動面の中心点から対角方向にずれて２つ設けられ、圧電振動子と接合されていること
を特徴とする圧電発振器。 In a piezoelectric oscillator in which a piezoelectric vibrator and a semiconductor device including an oscillation circuit that oscillates the piezoelectric vibrator are joined,
The semiconductor device has a mounting terminal on an active surface and a connection terminal on an inactive surface opposite to the active surface,
The piezoelectric vibrator has an electrode pad connected to the connection terminal,
A piezoelectric oscillator, wherein two connection terminals are provided diagonally away from the center point of the inactive surface and are joined to a piezoelectric vibrator. 半導体装置と前記圧電振動子との間に弾性率の低い樹脂を充填したことを特徴とする請求項１ないし３のいずれかに記載の圧電発振器。 The piezoelectric oscillator according to any one of claims 1 to 3 having a low modulus of elasticity resin characterized by being filled between the semiconductor device and the piezoelectric vibrator. 前記圧電振動子は、パッケージと該パッケージ内に収容された振動片を有し、
前記振動片は前記パッケージ内で、片持ち式に固定されていることを特徴とする請求項１ないし４のいずれかに記載の圧電発振器。 The piezoelectric vibrator has a package and a vibrating piece accommodated in the package,
It said resonator element in the package, the piezoelectric oscillator according to any one of claims 1 to 4, characterized in that it is fixed to the cantilever. 前記圧電振動子は、水晶により形成した第１および第２の基板と、振動片ならびに前記第１および前記第２の基板に挟まれて固定された枠部を一体に結合した基板と、を有し、
前記振動片は、前記枠部から片持ち式に延出することを特徴とする請求項１乃至請求項４に記載の圧電発振器。
The piezoelectric vibrator includes first and second substrates made of quartz, and a substrate integrally joined with a vibrating piece and a frame portion sandwiched and fixed between the first and second substrates. And
The resonator element, a piezoelectric oscillator according to claim 1 to claim 4, characterized in that extending cantilevered from said frame portion.
JP2007304037A 2007-11-26 2007-11-26 Piezoelectric oscillator Withdrawn JP2009130665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007304037A JP2009130665A (en) 2007-11-26 2007-11-26 Piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007304037A JP2009130665A (en) 2007-11-26 2007-11-26 Piezoelectric oscillator

Publications (2)

Publication Number Publication Date
JP2009130665A JP2009130665A (en) 2009-06-11
JP2009130665A5 true JP2009130665A5 (en) 2010-12-09

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Family Applications (1)

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JP2007304037A Withdrawn JP2009130665A (en) 2007-11-26 2007-11-26 Piezoelectric oscillator

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049992A (en) * 2009-08-28 2011-03-10 Seiko Instruments Inc Piezoelectric device and method of manufacturing the piezoelectric device
JP2011107055A (en) * 2009-11-20 2011-06-02 Seiko Epson Corp Pressure sensor and temperature-compensated pressure sensor
JP6334192B2 (en) * 2014-02-21 2018-05-30 京セラ株式会社 Piezoelectric device and mounting structure thereof
JP6547825B2 (en) * 2015-03-27 2019-07-24 株式会社大真空 Piezoelectric vibration device
JPWO2023074615A1 (en) * 2021-10-26 2023-05-04

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046216A (en) * 2001-07-30 2003-02-14 Kyocera Corp Surface-mounted electronic component, circuit board, and surface-mounted electronic component mounting structure
JP2003133857A (en) * 2001-10-22 2003-05-09 Citizen Watch Co Ltd Oscillator
JP2004260598A (en) * 2003-02-26 2004-09-16 Kyocera Corp Surface mount temperature compensation crystal oscillator
JP4091868B2 (en) * 2003-03-27 2008-05-28 京セラ株式会社 Surface mount temperature compensated crystal oscillator
JP2005039791A (en) * 2003-05-29 2005-02-10 Kyocera Corp Temperature compensated crystal oscillator
JP2005020546A (en) * 2003-06-27 2005-01-20 Kyocera Corp Surface mount crystal oscillator
JP4273910B2 (en) * 2003-10-03 2009-06-03 エプソントヨコム株式会社 Surface-mount type piezoelectric oscillator and manufacturing method thereof
JP2005151537A (en) * 2003-10-24 2005-06-09 Seiko Epson Corp Piezoelectric oscillator, electronic equipment, and method of manufacturing piezoelectric oscillator
JP2007019310A (en) * 2005-07-08 2007-01-25 Seiko Epson Corp Piezoelectric device, method for manufacturing the same, and electronic device
JP2007067173A (en) * 2005-08-31 2007-03-15 Kyocera Kinseki Corp Electronic component
JP2007124590A (en) * 2005-10-31 2007-05-17 Kyocera Kinseki Corp Piezoelectric oscillator container
JP2007180900A (en) * 2005-12-28 2007-07-12 Seiko Epson Corp Crystal oscillator and manufacturing method thereof
JP2007228009A (en) * 2006-02-21 2007-09-06 Epson Toyocom Corp Package and piezoelectric oscillator
JP4635917B2 (en) * 2006-03-09 2011-02-23 株式会社大真空 Surface mount type piezoelectric vibration device
JP5061496B2 (en) * 2006-04-19 2012-10-31 セイコーエプソン株式会社 Piezoelectric substrate, piezoelectric vibration element, piezoelectric vibrator and piezoelectric oscillator
JP2007306434A (en) * 2006-05-12 2007-11-22 Epson Toyocom Corp Piezoelectric vibrator, and manufacturing method therefor

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