JP2006080672A5 - - Google Patents
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- JP2006080672A5 JP2006080672A5 JP2004260145A JP2004260145A JP2006080672A5 JP 2006080672 A5 JP2006080672 A5 JP 2006080672A5 JP 2004260145 A JP2004260145 A JP 2004260145A JP 2004260145 A JP2004260145 A JP 2004260145A JP 2006080672 A5 JP2006080672 A5 JP 2006080672A5
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- Prior art keywords
- hole
- piezoelectric oscillator
- piezoelectric
- package
- oscillator according
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Claims (10)
前記パッケージには貫通孔が形成され、
前記貫通孔は導電性の封止材によって閉塞されており、
前記封止材と前記半導体素子とが電気的に接続されていることを特徴とする圧電発振器。 A piezoelectric oscillator in which a piezoelectric vibrating piece and a semiconductor element having a circuit for oscillating the piezoelectric vibrating piece are mounted in a package,
A through hole is formed in the package,
The through hole is closed by a conductive sealing material,
The piezoelectric oscillator, wherein the sealing material and the semiconductor element are electrically connected .
前記導電膜と前記半導体素子との間を電気的に接続する電気的接続手段が前記パッケージに形成されていることを特徴とする請求項１に記載の圧電発振器。 The sealing material is electrically connected to the conductive film formed in the through hole,
The piezoelectric oscillator according to claim 1, characterized in that electrical connecting means for electrically connecting between the semiconductor element and the conductive film is formed on the package.
前記貫通孔が前記封止材によって閉塞されることにより前記空間が気密に封止されていることを特徴とする請求項１または２に記載の圧電発振器。3. The piezoelectric oscillator according to claim 1, wherein the space is hermetically sealed by closing the through hole with the sealing material.
前記パッケージに形成された貫通孔を導電性の封止材で封止し、前記半導体素子と前記封止材とを電気的に接続する工程と、
封止後の前記貫通孔を用いて、発振周波数調整用データを前記半導体素子に書き込む書き込み工程と、
を備えたことを特徴とする圧電発振器の製造方法。 A method for manufacturing a piezoelectric oscillator in which a piezoelectric resonator element and a semiconductor element having a circuit for oscillating the piezoelectric resonator element are mounted in a package,
A step of sealingly and electrically connects the sealing member and the semiconductor element a through hole formed in the package by a conductive sealing material,
A writing step of writing oscillation frequency adjustment data into the semiconductor element using the through-hole after sealing;
A method for manufacturing a piezoelectric oscillator, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004260145A JP4692715B2 (en) | 2004-09-07 | 2004-09-07 | Piezoelectric oscillator, electronic device, and method for manufacturing piezoelectric oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004260145A JP4692715B2 (en) | 2004-09-07 | 2004-09-07 | Piezoelectric oscillator, electronic device, and method for manufacturing piezoelectric oscillator |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010049441A Division JP2010124494A (en) | 2010-03-05 | 2010-03-05 | Piezoelectric oscillator, electronic apparatus and method of manufacturing piezoelectric oscillator |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006080672A JP2006080672A (en) | 2006-03-23 |
| JP2006080672A5 true JP2006080672A5 (en) | 2007-11-01 |
| JP4692715B2 JP4692715B2 (en) | 2011-06-01 |
Family
ID=36159795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004260145A Expired - Fee Related JP4692715B2 (en) | 2004-09-07 | 2004-09-07 | Piezoelectric oscillator, electronic device, and method for manufacturing piezoelectric oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4692715B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4973290B2 (en) * | 2006-06-12 | 2012-07-11 | セイコーエプソン株式会社 | Probe contact electrode, package, and electronic device |
| JP4952076B2 (en) * | 2006-06-12 | 2012-06-13 | セイコーエプソン株式会社 | Electrical characteristic measuring apparatus and electrical characteristic measuring method |
| JP4973752B2 (en) * | 2006-06-12 | 2012-07-11 | セイコーエプソン株式会社 | Electronic device package manufacturing method and electronic device manufacturing method |
| JP5100211B2 (en) * | 2007-06-13 | 2012-12-19 | 日本電波工業株式会社 | Crystal oscillator for surface mounting |
| JP5122902B2 (en) * | 2007-10-05 | 2013-01-16 | 京セラクリスタルデバイス株式会社 | Piezoelectric oscillator |
| JP4851549B2 (en) * | 2009-02-10 | 2012-01-11 | 日本電波工業株式会社 | Piezoelectric device |
| JP6051577B2 (en) | 2012-04-20 | 2016-12-27 | セイコーエプソン株式会社 | Electronic devices and electronic equipment |
| JP6098224B2 (en) * | 2013-02-26 | 2017-03-22 | 株式会社大真空 | Surface mount type piezoelectric oscillator |
| JP2019220795A (en) * | 2018-06-18 | 2019-12-26 | 株式会社大真空 | Piezoelectric generator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104152A (en) * | 1996-06-17 | 1998-01-06 | Matsushita Electric Ind Co Ltd | Electronic component |
| JP2001094378A (en) * | 1999-09-22 | 2001-04-06 | Nippon Dempa Kogyo Co Ltd | Surface mounted container, piezoelectric device and temperature compensating quartz oscillator |
| JP2002190710A (en) * | 2000-12-20 | 2002-07-05 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator for surface mounting |
-
2004
- 2004-09-07 JP JP2004260145A patent/JP4692715B2/en not_active Expired - Fee Related
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