JP4952076B2 - Electrical characteristic measuring apparatus and electrical characteristic measuring method - Google Patents

Description

The present invention relates to an adjustment probe device that eliminates the inconvenience of frequency adjustment work of a piezoelectric oscillator using a conventional probe device, and a method for adjusting a surface-mount piezoelectric oscillator.

In the mobile communications market, an increasing number of manufacturers are promoting modularization of parts groups for each function, taking into account the mounting properties, maintenance and handling characteristics of various electrical components, and the commonality of parts between devices. . Further, along with modularization, there is a strong demand for downsizing and cost reduction.
In particular, there is an increasing tendency toward modularization of circuit components that have established functions and hardware configurations, such as a reference oscillation circuit, a PLL circuit, and a synthesizer circuit, and that require high stability and high performance. Furthermore, there is an advantage that a shield structure can be easily established by packaging these parts as a module.

Examples of surface mounting electronic components constructed by modularizing and packaging a plurality of related components include piezoelectric vibrators, piezoelectric oscillators, SAW devices, etc., but these functions are maintained at a high level. However, in order to further reduce the size, for example, a two-story structure module as shown in FIG. 6 is employed.
6A is a plan view showing a conventional configuration of a surface-mount type piezoelectric device (quartz oscillator) as a two-story structure type (H type) module, and FIG. 6B is a schematic longitudinal sectional view. ) Is a bottom view thereof. This crystal oscillator A includes a ceramic container body 101 and a metal lid 1.
A crystal resonator 100 in which a crystal resonator element 103 is connected by a conductive adhesive 104a on an element mounting pad 104 provided in a void (upper side recess) 101a of a container made of 02, and both front and back surfaces of the crystal substrate 103a And the IC component mounting pad 105c provided on the ceiling surface in the space (bottom surface side recess) 105a of the container 105 to be joined to the bottom surface of the crystal resonator 100, respectively. IC components that make up oscillation circuits, temperature compensation circuits, etc. 1
And a bottom structure (IC component unit) 107 on which 06 is bare-chip mounted. When this crystal oscillator A is mounted on a printed circuit board, soldering is performed using mounting terminals 105b provided on the bottom surface of the container 105 (for example, Patent Document 1).

In this crystal oscillator A, two adjustment terminals 110 for adjusting the frequency of the crystal resonator element while checking the characteristics of the crystal resonator element 103 are empty as shown in FIGS. It is arranged at a position near one edge in the longitudinal direction of the ceiling surface of the place 105a and is concealed by the IC component when the IC component is mounted (Patent Documents 2 and 3). In the adjustment work, I
Before mounting the C component, the two probe pins (contact members) 120 are brought into contact with the adjustment terminal 110 and energized to check the frequency output by exciting the crystal resonator element. When there is an error between the frequency and the frequency, adjustment is made by a method such as increasing or decreasing the thickness of the excitation electrode on the crystal resonator element.

The procedure for assembling this crystal oscillator A is as follows. First, after the crystal resonator element 103 is mounted in the container body 101, the two adjustment terminals 110 in the space 105a of the container 105 are used.
Then, the probe pins 120 are brought into contact with each other, and the characteristics of the crystal resonator element 103 are checked to adjust the crystal resonator element. After the adjustment is completed, the upper surface side recess 101 a is sealed with the metal lid 102. Next, the IC component mounting pad 10 in the void 105a.
The IC component 106 is flip-chip mounted on 5c.
However, since the area of the adjustment terminal formed on a small oscillator having a vertical and horizontal dimension of about several tens of millimeters must be very small, the adjustment work with the contact of the flow pin is extremely complicated and inefficient. Become.
Thus, in the conventional crystal oscillator of the H-type structure, the IC component mounting pad 105c and the adjustment terminal 110 are juxtaposed on the ceiling surface of the IC component mounting space 105a.
With the progress of miniaturization of the container, it becomes difficult to secure the installation space for the adjustment terminal, the adjustment terminal has to be reduced in area, and the workability is lowered when the frequency is measured by contacting the probe pin. It has caused problems such as reduced reliability during measurement.

For example, as shown in FIG. 7, when the measurement is performed with two probe pins (contact members) 120 in contact with the respective adjustment terminals 110 at the same time, the contact position of the probe pins is slightly displaced. If the contact angle is tilted or the contact angle is tilted even slightly, the probe pin interferes with and contacts the outer wall 107a of the adjacent bottom structure 107, resulting in frequent damage. Exterior wall 1
This is because 07a is extremely brittle and is easily damaged by contact with the probe pin.
Alternatively, as shown in FIG. 7, the tip of the probe pin 120 is connected to one end in the longitudinal direction of the bottom structure 107 in a state where the crystal oscillator A as a measurement object is mounted in the housing recess 101 a provided on the jig 130. When abutting (pressing) on the adjustment terminal 110 arranged so as to be displaced at the edge, the other end portion in the longitudinal direction of the crystal oscillator is likely to be lifted as indicated by a broken line. If one end of the oscillator is lifted, the orientation of the accommodated crystal resonator element becomes non-horizontal, and accurate frequency measurement becomes impossible.
JP 2000-278047 A Japanese Patent No. 3406845 Japanese Patent No. 3451018

The present invention has been made in view of the above, and surface mounting as a two-story structure type (H type) module in which an IC component is mounted on a ceiling surface of a recess of a lower structure continuous to a lower surface of a piezoelectric vibrator. In the type piezoelectric oscillator, when the tip of the probe pin (contact member) is brought into contact with the adjustment terminal for frequency measurement of the piezoelectric vibration element formed on the ceiling surface of the lower structure, the probe pin is inclined or displaced As a result of contact with the adjustment terminal in a state of being damaged, the outer wall of the lower structure is buffered and damaged, or the probe with respect to the adjustment terminal disposed near the longitudinal end in the recess of the lower structure The purpose is to solve the problem that the other end of the container is lifted when the pin comes into contact, or the whole container is wobbled and frequency measurement becomes impossible.

In order to solve the above-described problems, an adjustment probe device according to the present invention includes two contact members connected to the measurement apparatus main body and at least one support disposed at a position spaced apart from the two contact members. And a member.
When two contact members are brought into contact with the adjustment terminal provided on the object to be measured, the contact member contacts the peripheral member of the adjustment terminal unless contact stability and contact angle are secured. Problems with touching are likely to occur. Therefore, a support member is also provided so as to ensure contact stability between the contact member and the adjustment terminal. In addition, when the adjustment terminal is provided to be deviated closer to one edge of the lightweight measurement object, the other end of the measurement object is caused by the contact pressure when the contact member contacts the adjustment terminal. A problem arises in which the floats up. In the present invention, a support member is provided, and this support member is brought into contact with an appropriate position near the other end of the adjustment terminal.
This lifting can be prevented.

For this reason, it becomes possible to improve the productivity in the measurement and adjustment work using the contact member. In particular, it is possible to improve the measurement accuracy by avoiding contact with surrounding parts by the contact member and making the measurement and adjustment work more efficient, or preventing the measurement object from being lifted.
Further, when the tip of the contact member is attracted to the adjustment terminal, the measurement object is lifted together even if the contact member is separated after the measurement is completed. Since the support member is used in the present invention, such a problem can be solved.
Furthermore, the jig that supports the measurement object may be lifted by contact pressure when the contact member contacts the adjustment terminal. In the present invention, since the support member is used, such a problem can be solved.

In the invention, it is preferable that the support member is disposed at a position along a center line extending orthogonally from a center point of a straight line connecting the two contact members.
With the two contact members in contact with the adjustment terminal, the support member is brought into contact with another part of the measurement object, thereby preventing contact failure and tilting of the contact member as well as measurement. The object can be prevented from lifting.

Further, according to the present invention, the two contact members and the support member protrude from a support member, and the two contact members are in contact with two adjustment terminals provided near one end of the measurement object. The support member is configured to prevent the measurement object from floating due to the contact pressure from each contact member by contacting the support member near the other end of the measurement object. It is characterized by.

According to the present invention, the support member prevents the measurement object from being lifted by contacting the upper surface of a jig having an accommodation recess for accommodating the measurement object and a part of the measurement object. It is comprised so that it may do.
According to this, since the contact member and the adjustment terminal are brought into contact with each other while the jig and the measurement object are pressed by the support member, the measurement work is stabilized, and the measurement object is continuously held by the support member when the contact member is detached. Thus, the contact member can be removed in advance.

According to the present invention, when a part of the support member is in contact with the upper surface of the jig, the other part of the support member is opposed to a part of the measurement object with a small gap. It is comprised so that it may do.
According to this, an overload is not applied to a part of a fragile measurement object by the support member.

Further, the present invention is characterized in that the support member is configured to abut on an upper surface of a jig having a housing recess for housing the measurement object, thereby preventing the measurement object from being lifted. And
One end of the jig itself may be lifted when the contact member abuts against and presses against the adjustment terminal. However, in the present invention, the support member that holds down the jig is provided to prevent such problems. it can.

In the invention, it is preferable that the contact member is a probe pin or a tungsten probe.

The method for adjusting a surface-mounted piezoelectric oscillator according to the present invention is a method for measuring a frequency of a surface-mounted piezoelectric oscillator using the adjustment probe device, wherein the surface-mounted piezoelectric oscillator is provided on an upper surface and a lower surface, respectively. An insulating container having a recess and having a mounting terminal on the bottom surface, two element mounting pads provided in the recess on the top surface for electrically connecting each excitation electrode of the piezoelectric vibration element, and an oscillation circuit In order to mount the IC component to be configured, a predetermined wiring is provided between the IC component mounting pad disposed on the ceiling surface of the recess on the lower surface side, and the mounting terminals, the element mounting pad, and the IC component mounting pad. A wiring pattern to be applied, and two adjustment terminals connected to the respective element mounting pads and formed on the ceiling surface of the lower surface side recess, and the IC component is mounted on the IC component mounting pad. Without connecting to When the frequency measurement is performed by bringing the two contact members into contact with the two adjustment terminals, the support member is brought into contact with an appropriate position on the ceiling surface of the lower surface side recess. To do.

The present invention also relates to a method for measuring the frequency of a surface-mounted piezoelectric oscillator using an adjustment probe device, wherein the surface-mounted piezoelectric oscillator has a recess on each of an upper surface and a lower surface, and includes a mounting terminal on the bottom surface. Insulating container, two element mounting pads provided in the upper surface side recess for electrically connecting the respective excitation electrodes of the piezoelectric vibration element, and the lower surface side recess for mounting the IC components constituting the oscillation circuit. IC component mounting pads arranged on the ceiling surface of the location, wiring patterns for providing predetermined wiring between the mounting terminals, the element mounting pads, and the IC component mounting pads, and the above-mentioned element mounting Two adjusting terminals connected to the pads and formed on the ceiling surface of the lower surface side recess,
The surface mount type piezoelectric oscillator in a state in which the IC component is not connected to the IC component mounting pad is housed in a housing recess provided on the upper surface of the jig with the lower surface recess facing upward, When the frequency measurement is performed by bringing the two contact members into contact with two adjusting terminals, the support member is placed on the outer surface of the upper surface of the jig and the upper surface side recess of the surface-mounted piezoelectric oscillator. It is characterized in that it is in contact with or close to the upper surface.

Further, the present invention is characterized in that when the contact member is detached from the adjustment terminal, the contact with the upper surface of the outer peripheral wall by the support member is continued.
Even when the contact member and the adjustment terminal are adsorbed, the pressing of the measurement object by the support member is continued, so that the contact member can be easily separated from the adjustment terminal.

The present invention is also a method for measuring a frequency of a surface-mounted piezoelectric oscillator using the above-described adjustment probe device, wherein the surface-mounted piezoelectric oscillator has a recess on each of an upper surface and a lower surface, and a mounting terminal on the bottom surface. An insulating container, two element mounting pads provided in a recess on the upper surface for electrically connecting each excitation electrode of the piezoelectric vibration element, and a lower surface for mounting an IC component constituting the oscillation circuit IC component mounting pads arranged on the ceiling surface of the side recess, a wiring pattern for providing predetermined wiring between the mounting terminals, the element mounting pads, and the IC component mounting pads, and the respective elements Two adjustment terminals that are respectively connected to the mounting pads and formed on the ceiling surface of the recess on the lower surface side, and wherein the IC component is not connected to the IC component mounting pads. Piezoelectric oscillator on the bottom surface The support member is housed in a housing recess provided on the upper surface of the jig with the recess facing upward, and the two contact members are brought into contact with the two adjustment terminals to perform frequency measurement. Is brought into contact with the upper surface of the jig.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
1 (a), (b) and (c) are configurations of an adjustment probe device according to an embodiment of the present invention,
They are a front view which shows a use condition, a principal part top view, and a principal part bottom view. In addition, each component of the surface-mount type piezoelectric oscillator as the measurement object will be described with the same reference numerals as those in FIG.
The adjustment probe device 1 includes a support member (probe holder) 2 and probe pins for two contacts that are arranged adjacent to each other on the support surface of the support member 2 and are connected to the measuring device main body 10 via a harness 11, respectively. (Contact member) 3 and projecting from the support surface of the support member 2 corresponding to a position along the center line L2 extending orthogonally from the center point of the straight line L1 connecting the base ends of the two probe pins 3 And at least one support pin (support member) 4.
The frequency measuring device B comprising the adjusting probe device 1 and the measuring device main body 10 is in a state in which the probe pin 3 is brought into contact with the adjusting terminal 110 provided on the surface-mounted crystal oscillator A that is a measurement object. Is a means for exciting the quartz resonator element 103 in the quartz crystal resonator 100 and measuring its frequency characteristic, and between the actual frequency measured by the frequency measuring device B and the target frequency. If there is an error, adjustment work is performed.

The probe pin 3 for contact shown in the figure is a spring probe pin, and as shown in the cross-sectional view of FIG. 2, is supported by a hollow rod-like base portion 3a and a rod-like base portion 3a that can be moved forward and backward in the axial direction and elastically. A conductive tip member 3b biased in the protruding direction by the member 3c, and the tip member 3b is electrically connected to the harness 11. While the crystal resonator element 103 is excited by energizing from the mounting terminal of the oscillator, the tip member 3b is adjusted to the adjustment terminal 110.
The output from the crystal resonator element is input to the measurement apparatus main body 10 by abutting on.
The support pin (support member) 4 is the ceiling surface of the space 105a of the container 105 when the tips of the two probe pins 3 are brought into contact with the two adjustment terminals 110, and the IC component mounting pad 105c. The support member 2 is protruded from an appropriate position so that the tip of the pattern can be brought into contact with a portion where the pattern does not exist and the contact stability of each probe pin 3 can be ensured.
The support pin 4 may be configured in the same manner as the spring probe pin 3 shown in FIG.
At least the tip member is made of a non-conductive material. The support pins 4 may be made of a nonconductive material such as resin.

When the tips of the two probe pins 3 are brought into contact with the adjustment terminals 110, the support pins 4
Is brought into contact with an appropriate position on the ceiling surface of the space 105a (where the wiring pattern is avoided) to prevent tilting and displacement of each probe pin, so that the adjustment terminal surface always has an appropriate contact angle and positional relationship. It is possible to abut.
As a result, the outer peripheral wall 107a of the void 105a is prevented from being damaged by the probe pin.
Further, even when the two adjustment terminals 110 are provided on the ceiling surface corresponding to one end portion in the longitudinal direction of the space 105a, the two probe pins are pressed while the ceiling surface near the other end portion is pressed by the support pins 4. 3 is brought into contact with each adjustment terminal 110, so that there is no possibility that the other end portion of the oscillator is lifted or wobbled. Therefore, the crystal vibrating element 103 is always held in a horizontal posture during measurement by the probe pin, and measurement failure is eliminated.

In particular, when a probe pin with a thin tip is used to avoid interference with the outer peripheral wall, the measurement accuracy is improved by increasing the stability of the contact part by the balance adjustment function of the support pin when contacting the probe pin and the adjustment terminal. Can be increased.
Since the spring probe pin 3 is made of a soft metal material such as beryllium copper, the sliding portion between the base portion 3a and the tip member 3b is likely to be worn out and needs to be replaced in a relatively short time. For this reason, recently, there is a tendency to use a tungsten probe that can ensure durability because it does not have a sliding portion.

FIG. 3 is a longitudinal sectional view showing a configuration example of the adjustment probe device 1 when the present invention is applied to a tungsten probe, and a usage state.
The tungsten probe (contact member) 20 has a configuration in which a contact 22 made of tungsten is supported at the tip of a main body 21 made of brass or the like, and is stable with the adjustment terminal 110 using the elasticity of the contact 22. The contact is ensured, and since there is no sliding part, the durability is higher than that of the spring probe pin. Each tungsten probe 20 is supported by a support member (probe holder) 2 and connected to the measurement apparatus main body 10 via a harness 11.

In a state where the crystal oscillator (measurement object) A is mounted in the housing recess 130a of the jig 130, the contacts 22 of the two tungsten probes 20 are displaced to one end edge in the longitudinal direction of the bottom structure 107. When contacting (pressing) the adjustment terminal 110, the other end portion in the longitudinal direction of the crystal oscillator A is likely to be lifted up and cannot be measured. However, in the adjustment probe device 1 according to the present embodiment, A support tungsten probe (support member) 25 is provided as a support member, and the support tungsten probe 25 is brought into contact with a position closer to the end of the ceiling surface opposite to the contact position by the two tungsten probes 20. Is prevented from lifting.
As with the tungsten probe 20, the support tungsten probe 25 has a body 26,
The contact 27 is composed of at least the contact 27 made of a non-conductive material. Alternatively, the support member in this embodiment does not need to stick to the tungsten probe type, and may be a probe pin or a simple resin rod.
Further, by using the support tungsten probe 25 in combination, the contact angle and contact position of the tungsten probe 20 with respect to the adjustment terminal 110 can be adjusted with high accuracy, so that the tungsten probe pin comes into contact with the outer peripheral wall 107a of the void 105a. Damage to this is prevented.

By the way, since the wiring patterns such as the adjustment terminal 110 and the IC component mounting pad 105c are arranged close to the ceiling surface of the void 105a of the crystal oscillator A, the adjustment probe device according to each of the above embodiments. When the frequency of the crystal resonator element 103 is measured using 1, there is a possibility that it is not possible to secure a space in which the tip of the support pin 4 as a support member or the support tungsten probe 25 abuts.
In addition, since the tips of the probe pin 3 and the tungsten probe 20 are made of metal, a phenomenon may occur in which they are adsorbed when they are brought into contact with the adjustment terminal 110 in a vacuum.
When the metal tip such as the probe pin and the adjustment terminal 110 are attracted, the entire oscillator is lifted through the tip of the probe pin or the like when the probe pin or the like is separated after the measurement is finished, and the jig 130 Inconveniences such as detachment from the housing position occur. Such a problem is likely to occur particularly when a new probe is used.

FIG. 4A is a front view showing the configuration and use state of an adjustment probe device according to another embodiment of the present invention for the purpose of coping with such a problem, and FIG. It is a top view.
The adjustment probe device 1 according to this embodiment includes an outer peripheral wall 107a in addition to the two probe pins 3 (or the tungsten probe 20) extending from the support member (probe holder) 2.
A support member 30 that protrudes from the support member 2 to prevent the crystal oscillator (measurement object) A from being lifted up is brought into contact with (close to) the upper surface of the support member 2.

The support member 30 includes a hollow rod-like base 31 and a tip member 32 that is supported so as to protrude and retract from the tip opening of the base 31 and is always urged in the protruding direction by an elastic member (not shown). A press pad 32 a having a large area is provided at the tip of the tip member 32.
The crystal oscillator A on which no IC component is mounted is held in the housing recess 130a of the jig 130 with the crystal unit 100 facing downward.
Each support member 30 has a lower surface of the pressing pad 32a straddling between an upper surface 130b of the jig 130 and an upper surface of the outer peripheral wall 107a when each probe pin 3 is in contact with each adjustment terminal 110. It is attached to abut. Presser pad 32a is jig upper surface 130b.
By simultaneously suppressing the upper surface of the outer peripheral wall, even if the probe pin 3 presses two adjustment terminals 110 provided near one end in the longitudinal direction of the ceiling surface of the space 105a, the other end in the longitudinal direction of the crystal oscillator is lifted. Disappears.
In this example, the presser pad 32a is in contact with the intermediate position of the long side of the outer peripheral wall 107a, but may be in contact with the intermediate position of the short side.

Further, the relationship between the depth h1 of the jig housing recess 130a and the height h2 of the crystal oscillator is expressed as h1> h.
2 and the upper surface of the outer peripheral wall 107a may be positioned slightly below the upper surface 130b of the jig when the crystal oscillator is housed in the housing recess 130a. With this configuration, when a part of the lower surface of the presser pad 32a comes into contact with the jig upper surface 130b, the other part of the lower surface of the presser pad 32a can maintain a non-contact state with the upper surface of the outer peripheral wall 107a. Therefore, the load from the presser pad 32a is not easily applied to the upper surface of the outer peripheral wall, and the outer peripheral wall having low strength is less likely to be damaged. For example, by setting the depth h1 of the housing recess 130a to 1.0 mm and the height h2 of the crystal oscillator to about 0.97 mm, the above-described effects can be obtained.
When the depth h1 of the housing recess 130a is equal to the height h2 of the crystal oscillator, or when the height h2 of the crystal oscillator is larger than the height of the upper surface of the jig, the presser pad A step is provided on the lower surface of 32a so that a small gap is formed between the other surface of the lower surface of the press pad and the upper surface of the outer peripheral wall in a state where the upper surface of the jig is suppressed by a part of the lower surface of the press pad. That's fine.

On the other hand, when the entire oscillator is urged in the lifting direction by the probe pin 3 coming into contact with the adjustment terminal 110, the presser pad 32a that is in contact with the jig upper surface 130b in advance is going to lift up. Since the upper surface of the outer peripheral wall to be pressed is pressed down, the floating can be prevented.
It should be noted that the timing at which the press pad 32a is brought into contact with (close to) the upper surface 130b and the upper surface of the outer peripheral wall and the timing at which the probe pin 3 is brought into contact with the adjustment terminal 110 may be the same. It is preferable to prioritize the contact (proximity) by and to make the probe pin 3 contact the adjustment terminal 110 at a different timing after the pressing by the press pad is completed.
As described above, when the tip of the probe pin 3 (same as in the case of the tungsten probe 20) is adsorbed to the adjustment terminal 110, an attempt is made to remove the probe pin 3 after the measurement is finished. In the present embodiment, when the probe pin 3 is separated from the adjustment terminal, the pressing by the press pad 32a is continued and the press pad 32a is released after the probe pin is completely detached. By configuring and controlling in this manner, adsorption between the probe pin 3 and the adjustment terminal 110 is easily eliminated, and the oscillator is prevented from being lifted.

Next, FIG. 5 is a configuration explanatory view of an adjustment probe device according to another embodiment of the present invention.
The adjustment probe device according to this embodiment has two rows of left and right housing recesses 13 on one base.
This is applied when the jig 130 provided with 1 and 132 is used. A plurality of the receiving recesses 131 and 132 are arranged at predetermined intervals in a direction perpendicular to the drawing sheet. In the frequency adjustment step, the crystal oscillator A is accommodated in each of the accommodating recesses 131 and 132 with the crystal unit 100 facing downward, and the crystal oscillators in one of the accommodating recesses 131 in this example are accommodated. Carry out the adjustment work in advance. However, when the probe pin 3 (tungsten probe 20) is brought into contact with the adjustment terminal 110 of the crystal oscillator in each housing recess 131, the opposite side (left side of the drawing) of the jig 130 is lifted, and accurate measurement is performed. It becomes difficult.

The adjustment probe device 1 according to the present embodiment includes the other receiving recess 1 in addition to the two probe pins 3 (or the tungsten probe 20) extending from the support member (probe holder) 2.
A support member 40 is provided so as to protrude from the support member 2 in contact with the upper surface 132a of the jig positioned at the periphery of 32 and prevent the crystal oscillator from lifting.
The support member 40 includes a hollow bar-like base 41 and a tip member 42 that is supported so as to protrude and retract from the tip opening of the base 41 and is always urged in a protruding direction by an elastic member (not shown). As the support member 40, a probe pin as a waste product that is no longer used may be diverted.
In each support member 40, when each probe pin 3 is in contact with each adjustment terminal 110 of the crystal oscillator in the accommodation recess 131, the end portion of the tip member 42 is the upper surface 132 of the jig 130.
It is attached so as to contact a. Even if the probe pin 3 presses the two adjustment terminals 110 of the crystal oscillator in the housing recess 131 by suppressing the jig upper surface 132a where the support member 40 is located on the housing recess 132 side, The end side will not lift.
In the above embodiment, a crystal oscillator is illustrated as an example of a surface-mount piezoelectric oscillator.
The adjustment probe device of the present invention can also be used for frequency adjustment in piezoelectric oscillators other than crystal oscillators, piezoelectric vibrators, SAW devices, and the like.

(A), (b), and (c) are the front view, principal part top view, and principal part bottom view which show the structure of the adjustment probe apparatus which concerns on one Embodiment of this invention, and a use condition. It is sectional drawing which shows the structural example of a probe pin. It is the longitudinal cross-sectional view which shows the structural example of the probe apparatus for adjustment at the time of applying this invention to a tungsten probe, and a use condition. (A) is a front view which shows the structure of the probe apparatus for adjustment which concerns on other embodiment of this invention, and a use condition, (b) is a principal part top view. It is a structure explanatory view of the probe device for adjustment concerning other embodiments of the present invention. (A) is a top view which shows the conventional structure of the surface mount type piezoelectric device (crystal oscillator) as a two-story structure type (H type) module, (b) is a longitudinal cross-sectional schematic diagram, (c) is the bottom view. It is a figure explaining the fault of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Adjustment probe apparatus, 2 ... Support member, 3 ... Probe pin (contact member), 3a
... Rod base, 3b ... Tip member, 3c ... Elastic member, 4 ... Support pin (support member), 1
0 ... Measuring device body, 11 ... Harness, 20 ... Tungsten probe (contact member),
21 ... Main body, 22 ... Contact, 25 ... Support tungsten probe (support member), 2
6 ... main body, 27 ... contact, 30 ... support member, 31 ... base, 32 ... tip member, 32a ...
Pad, 40 ... support member, 41 ... base, 42 ... tip member, 100 ... crystal resonator, 10
DESCRIPTION OF SYMBOLS 1 ... Container main body, 101a ... Upper surface side recess, 102 ... Metal lid, 103 ... Quartz crystal vibration element, 1
03a ... accommodation recess, 103a ... quartz substrate, 103b ... excitation electrode, 104 ... element mounting pad, 104a ... conductive adhesive, 105 ... container, 105a ... vacant space, 105b ... mounting terminal, 1
05c: IC component mounting pad, 106: IC component, 107: bottom structure, 107a: outer peripheral wall, 110: adjustment terminal, 120: probe pin, 130: jig, 130a: receiving recess, 130b: jig Upper surface, 131... Receiving recess, 131, 132... Receiving recess, 132 a.

Claims (11)

A jig for placing electronic components;
Two contact members having end portions for contacting and conducting contact with two measurement terminals for measuring electrical characteristics of the electronic component disposed on one main surface of the electronic component; ,
A support member having an end for contacting the one main surface,
The end portion of the support member is disposed at a position along a straight line orthogonal to the line segment from the center point of the line segment connecting the end portions of the two contact members. Electrical characteristic measuring device. The electrical characteristic measuring device according to claim 1, wherein an end portion of the support member is disposed at a position on a straight line orthogonal to the line segment. The jig has a wall around the area where the electronic component is placed,
The electrical characteristic measuring device according to claim 1, wherein the support member includes a pad to be brought into contact with an end of the wall portion. Two support members,
In a plan view of a region where the electronic component of the jig is placed,
The electrical property measuring apparatus according to claim 3, wherein the region is between the pads of the two support members. 5. The electrical characteristic measuring apparatus according to claim 1, wherein the contact member has elasticity so as to be displaced according to a pressure applied to an end portion of the contact member. 6. . 6. The electrical property measuring apparatus according to claim 1, wherein the end portion of the support member is non-conductive. The electrical characteristic measuring apparatus according to claim 1, wherein the electronic component is a piezoelectric device. Preparing electronic components; and
A jig for placing the electronic component, and two contacts having end portions for contacting and conducting connection with two measurement terminals arranged on one main surface of the electronic component And a support member having an end portion to be brought into contact with the one main surface, and an end portion of the support member connects a line segment connecting the end portions of the two contact members Preparing an electrical property measuring device disposed at a position along a straight line orthogonal to the line segment from a center point;
Placing the electronic component on the jig;
Measuring the electrical characteristics of the electronic component by bringing the contact member into contact with the measurement terminal; and
Separating the contact member from the measurement terminal with the end of the support member overlaid on the electronic component;
A method for measuring electrical characteristics, comprising: In the step of separating the contact member from the measuring terminal, the one that is on a straight line that is orthogonal to a line segment that connects the two contact members and the contact positions of the electronic components. 9. The electrical characteristic measuring method according to claim 8, wherein the contact member is separated from the measurement terminal in a state where the end portion of the support member is overlapped on the position of the main surface. The jig has a wall around the area where the electronic component is placed,
The support member includes a pad for contacting the end of the wall portion,
9. The step of separating the contact member from the measurement terminal, wherein the contact member is separated from the measurement terminal in a state where the contact member is in contact with an end of the wall portion by the pad. Method for measuring electrical characteristics. Including the two support members and the wall portion disposed so as to sandwich the electronic component,
In the step of separating the contact member from the measurement terminal, the contact member is placed in a state in which two pads are in contact with an end of the wall portion arranged to sandwich the electronic component in a plan view. The method for measuring electrical characteristics according to claim 10, wherein the method is separated from a measurement terminal.

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