JP4433687B2 - Piezoelectric oscillator and manufacturing method thereof - Google Patents

Piezoelectric oscillator and manufacturing method thereof Download PDF

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Publication number
JP4433687B2
JP4433687B2 JP2003111244A JP2003111244A JP4433687B2 JP 4433687 B2 JP4433687 B2 JP 4433687B2 JP 2003111244 A JP2003111244 A JP 2003111244A JP 2003111244 A JP2003111244 A JP 2003111244A JP 4433687 B2 JP4433687 B2 JP 4433687B2
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recess
piezoelectric
recessed
recessed portion
vibration element
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JP2004320420A (en
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洋二 永野
浩輝 平野
敏幸 平
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Miyazaki Epson Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は小型化に対応するための圧電発振器とその製造方法に関する。
【０００２】
【従来の技術】
携帯電話機等の移動体通信機器の普及に伴う低価格化および小型化の急激な進展により、これらの通信機器に使用される圧電振動子や圧電発振器に対しても低価格化、小型化の要求が高まっている。
【０００３】
従来の圧電発振器としては、例えば特開２００２−１００９３２号公報で提案されたようなものがあり、図５（ａ）はそのパッケージの構成を示す縦断面図、図５（ｂ）は充填樹脂、ＩＣチップを省略した状態の下面、即ちＩＣチップ実装面図である。
同図に示すように、従来の圧電発振器１００は、上部キャビティー部１０５と下部キャビティー部１０６とが隔壁１０８で隔てられた略直方体状の容器体１０１と、上部キャビティー部１０４に収容される矩形状の圧電振動素子１０２と、下部キャビティー部１０５に収容される発振回路を構成するＩＣチップ１０３と、金属製の蓋体１０６と、充填樹脂１０７と、を備えている。
上部キャビティー部１０４の内底面に形成したパッド電極１１１に導電性接着剤１１０を介して圧電振動素子１０２の一方端部で片持ち支持すると共に電気的な接続をした上で上部キャビティー部１０４を蓋体１０６により気密封止すると共に、下部キャビティー部１０５の内底面にＩＣチップ１０３をワイヤボンディングし該ＩＣチップ１０３を収容した下部キャビティー部１０５を充填樹脂１０７により封止する構造となっている。
【０００４】
前記圧電発振器１００の製造方法は、前記上部キャビティー部１０４の内底面に形成する前記パッド電極１１１に前記導電性接着剤１１０を介して圧電振動素子１０２を実装する。パッド電極１１１は前記容器体１０１が備える配線パターン（不図示）を介して下部キャビティー部１０５の底面に形成するモニタ電極パッド１１２、１１３夫々と導通しており、該モニタ電極パッド１１２、１１３夫々に周波数測定装置の測定用端子（プローブ）を接触し圧電振動素子１０２の周波数を測定する。その測定結果に基づいて、蒸着等により該圧電振動素子１０２の発振周波数の調整を行う。
【０００５】
以後は、前記圧電振動素子１０２を収容した前記上部キャビティー部１０４を前記蓋体１０６により気密封止する。前記ＩＣチップ１０３を前記下部キャビティー部１０５の内底面にワイヤボンディングする。ＩＣチップ１０３を収容した前記下部キャビティー部１０５を前記充填樹脂１０７により封止する。
以上により前記圧電発振器１００の組立が完了し、その後は所定の電気試験を実施する。
【０００６】
【特許文献】
特開２００２−１００９３２号公報。
【０００７】
【発明が解決しようとする課題】
前述する圧電発振器の更なる小型化の要求を満足させるために、前記容器体１０１の小型化、即ち該容器体１０１が備える前記配線パターンの微細化及び配線パターン同志の間隙の微細化が必要不可欠となる。
また、前記モニタ電極パッド１１２、１１３夫々の極小化も不可避であり、場合によってはモニタ電極パッド１１２、１１３夫々が前記配線パターンと同一のパターン幅となる、換言すれば、モニタ電極パッド１１２、１１３夫々を配設することが不可能となる。
【０００８】
一般的に測定用端子によって導通をとる方法はその繰返し精度等を考慮して、広い面積を備える電極パッドを先端が針状の測定用端子でほぼ点接触する方法であって、極小化（微細化）された前記モニタ電極パッド１１２、１１３夫々、即ち該モニタ電極パッド１１２、１１３夫々が配設されていた位置に引き回された配線パターンと前記周波数測定装置の測定用端子との接触が極めて困難となり接触不良、即ち周波数測定不良による前記圧電振動素子１０２の発振周波数調整不良若しくは良品の（発振する）圧電振動素子１０２を不良（発振しない）品と誤判断により歩留りが悪化する虞がある。
【０００９】
また、前述する前記容器体１０１の小型化、即ち前記隔壁１０８の薄型化も必要不可欠となる。従来の先端が針状の測定用端子では前記モニタ電極パッド１１２、１１３夫々に接触時（測定時）に加える荷重が１点に集中することにより隔壁１０８にヒビや破損を生じる虞がある。
【００１０】
本発明は、上記の課題を解決するためになされたものであり、小型化に対応する圧電発振器とその製造方法を提供することを目的とする。
【００１１】
【課題を解決するための手段】
上記課題を解決するために本発明は、外周形状が四角であり、その外周の内側に凹陥部を有する上部凹陥部材と、外周形状が四角であり、その外周の内側に凹陥部を有する下部凹陥部材とを隔壁にて隔てるよう前記隔壁の表裏に配置した外周形状が略直方体形状の容器体と、圧電振動素子と、発振回路を構成する電子回路素子と、蓋体と、を備え、前記上部凹陥部材の凹陥部内に前記圧電振動素子を収容し、該凹陥部を前記蓋体により気密封止すると共に、前記下部凹陥部材の凹陥部内に少なくとも前記電子回路素子を収容する構造を有する圧電発振器であって、前記容器体の４つの外周側面の一つの側面に一つの凹所を設け、前記表裏間の方向に延びる方向を厚み方向とし、前記一つの側面内であり前記厚みの方向と直交する方向を幅方向としたとき、前記凹所は、前記凹所の厚さ方向の長さが、前記一つの側面の厚さ方向の長さより短く、前記凹所の幅方向の長さが前記一つの側面の幅方向の長さよりも短い形状で前記隔壁の側面と前記下部凹陥部材の側面とを切り欠いた構成であって、前記凹所の内壁には、導体膜を配設し、該導体膜は、厚み方向よりも幅方向の長さが長く、該導体膜を前記圧電振動素子と電気的に導通接続したことを特徴とする。
【００１３】
更に本発明は、外周形状が四角であり、その外周の内側に凹陥部を有する上部凹陥部材と、
外周形状が四角であり、その外周の内側に凹陥部を有する下部凹陥部材とを隔壁にて隔てるよう前記隔壁の表裏に配置した外周形状が略直方体形状の容器体と、圧電振動素子と、発振回路を構成する電子回路素子と、蓋体と、を備え、前記上部凹陥部材の凹陥部内に前記圧電振動素子を収容し、該凹陥部を前記蓋体により気密封止すると共に、前記下部凹陥部材の凹陥部内に少なくとも前記電子回路素子を収容する構造を有し、前記容器体の４つの外周側面の一つの側面に一つの凹所を設け、前記表裏間の方向に延びる方向を厚み方向とし、前記一つの側面内であり前記厚みの方向と直交する方向を幅方向としたとき、前記凹所は、前記凹所の厚さ方向の長さが、前記一つの側面の厚さ方向のは長さより短く、前記凹所の幅方向の長さが前記一つの側面の幅方向の長さよりも短い形状で前記隔壁の側面と前記下部凹陥部材の側面とを切り欠いた構成であって、前記凹所の内壁には、導体膜を配設し、該導体膜は、厚み方向よりも幅方向の長さが長く、導体膜を前記圧電振動素子と電気的に導通接続した構成の圧電発振器の製造方法であって、前記上部凹陥部材の凹陥部内に前記圧電振動素子を実装する工程と、前記凹陥部に実装した前記圧電振動素子の周波数を測定する工程と、前記測定工程の測定結果に基づいて前記圧電振動素子の周波数を調整する工程と、前記下部凹陥部材の凹陥部内に前記電子回路素子を搭載する工程と、を少なくとも含み、前記周波数測定工程は、前記圧電振動素子と電気的に導通する前記容器体の側面に有する前記凹所の内壁に配設された導体膜に測定用端子を接触し、前記圧電振動素子の周波数を測定するものであることを特徴とする。
【００１４】
また本発明は、前記上部凹陥部材の凹陥部内に前記圧電振動素子を実装する工程と、前記凹陥部に実装した前記圧電振動素子の周波数を測定する工程と、前記測定工程の測定結果に基づいて前記圧電振動素子の周波数を調整する工程と、を少なくとも含み、前記周波数測定工程は、前記圧電振動素子と電気的に導通する前記容器体の側面に有する凹所の内壁に配設された導体膜に弾性を有する導電材を導通固定した測定用端子を押し当てるものであることを特徴とする。
【００１５】
更に加えて本発明は、前記測定用端子を構成する弾性を有する導電材が異方性導電シートであることを特徴とする。
【００１６】
【発明の実施の形態】
以下、図示した本発明の実施の形態に基づいて、本発明を詳細に説明する。
【００１７】
図１は本発明の実施の形態の水晶発振器の構成図で、図１（ａ）はそのパッケージの縦断面図、図１（ｂ）は充填樹脂、ＩＣチップを省略した状態の下面、即ちＩＣチップ実装面図である。ただし、後述するボンディングパッド１４夫々と該ボンディングパッド１４夫々から延在する後述する配線パターン１２、１３夫々及びその他の配線パターン（不指示）とを明確にするため、図１（ａ）ではボンディングパッド１４を白抜きで配線パターン１２、１３夫々とその他の配線パターンとは塗り潰しで図示している。
同図に示すように、本発明実施形態の水晶発振器２０は、
上部凹陥部４と下部凹陥部５とが隔壁８で隔てて対向配置する略直方体状の容器体、即ちセラミックパッケージ１と、
上部凹陥部４に収容される矩形状の水晶振動素子２と、
下部凹陥部５に収容される発振回路を構成するＩＣチップ（電子回路素子）３と、
金属製の蓋体６と、充填樹脂７と、を備えている。
上部凹陥部４の内底面に形成したパッド電極１１に導電性接着剤１０を介して水晶振動素子２の一方端部で片持ち支持すると共に電気的な接続をした上で上部凹陥部４を蓋体６により気密封止すると共に、下部凹陥部５の内底面にＩＣチップ３をフリップチップボンディングし該ＩＣチップ３を収容した下部凹陥部５を充填樹脂７により封止する構造となっている。
【００１８】
前記セラミックパッケージ１は、略矩形状のセラミック絶縁層１ａ（隔壁８）と該セラミック絶縁層１ａの下面に載置された略矩形状の枠状セラミック絶縁層１ｂとが積層されたパッケージ本体と、セラミック絶縁層１ａ上面に銀ろう付けされたコバール合金から成る略矩形状の枠状体１ｃと、枠状体１ｃの内側（上部凹陥部５）に露出するセラミック絶縁層１ａの上面に形成した前記水晶振動素子２実装用のパッド電極１１と、セラミック絶縁層１ｂの内側（下部凹陥部６）に露出するセラミック絶縁層１ａの下面に形成した前記ＩＣチップ３実装用のボンディングパッド１４と、該ボンディングパッド１４夫々から延在する配線パターン１２、１３とその他の配線パターン、例えば１５と、該セラミック絶縁層１ｂの下面に形成した外部端子電極と、を備え、配線パターン１２、１３夫々は内部パターン（不図示）を介してパッド電極１１と電気的接続する。
【００１９】
前記配線パターン、パッド電極、ボンディングパッド及び外部端子電極はタングステン或いはモリブデンを焼成しその上にニッケルメッキを施しさらにこのニッケルメッキ上に金めっきを施したものであって、前記配線パターン１２、１３夫々と該配線パターン１２、１３夫々に導通するボンディングパッド夫々の厚み（焼成後のタングステン或いはモリブデンの厚みとニッケルメッキ厚と金めっき厚とを合せた厚み）を、その他の配線パターン１５及び配線パターン１２、１３とは不通のボンディングパッドより厚く（高く）なっている。なお、前記配線パターン１２、１３は互いに同じ厚みとした。
【００２０】
前記配線パターン１２、１３と該配線パターン１２、１３夫々に導通するボンディングパッドとをその他のものより厚く（高く）する手段としては、公知技術であるセラミックパッケージ（セラミック多層回路基板）の製造方法のグリーンシート積層法でのセラミックパッケージを構成するセラミック絶縁層となるセラミックグリーンシートの表面に導体ペーストで配線パターンをスクリーン印刷する工程において、配線パターン１２、１３と該配線パターン１２、１３夫々に導通するボンディングパッドとを構成するための導体ペースト（タングステン或いはモリブデン）を所望の厚みになるまで印刷を繰り返す若しくは厚手のスクリーン印刷版での印刷を行なう。
【００２１】
図２は本発明の実施の形態に係る測定用端子（プローブ）の先端の構造を示す断面図である。
図２（ａ）に示すように本発明の実施の形態に係る測定用端子３０は、前記配線パターン１２、１３夫々のパターン幅より大きい直径を有する略円形の台座３１ａと、棒状の連結部３１ｂとが一体となった本体部３１と、前記台座３１ａと大きさが略一致する接触部３２と、を備え、台座３１ａと接触部３２とを導電性接着材により接着する構造を有する。
台座３１ａと連結部３１ｂとは、ベリリウム銅にロジウムメッキ処理したもの又は硬質燐青銅にロジウムメッキ処理したもの又はＳＫ−４にロジウムメッキ処理したもの又は銅合金に金メッキ処理したもの等である。
接触部３２は弾性を有する導電材、例えば膜厚方向には導電性の、且つ、面方向には絶縁性の電気的異方性を有する異方性導電シートであって、前記配線パターン１２、１３夫々と接触部３２とを接触、荷重を加えることで該接触部３２、即ち異方性導電シート内に混入された微小金属粒子を介して電気的に接続する。
前記測定用端子３０の先端のその他の構造として、図２（ｂ）に示すように接触部３２に凹陥を形成し該凹陥に台座３１ａに配設した突起を嵌入する方法と、図２（ｃ）に示すように台座３１ａに凹陥を形成し該凹陥に接触部３２を嵌入する方法と、等があり、いずれの方法でも構わない。
【００２２】
図３は本発明実施形態に係る測定用端子の効果作用を示す説明図である。
図３（ａ）に示すように、前述するように前記配線パターン１２、１３（不図示）と該配線パターン１２、１３と導通するボンディングパッド夫々（不図示）の厚みがその他の配線パターン１５や配線パターン１２、１３とは不通のボンディングパッド（不図示）より厚くなっているので、前記接触部３２が所定の配線パターン１２と配線パターン１５とを同時に接触しても接触部３２、即ち異方性導電シートには該異方性導電シートと配線パターン１２との接触面には荷重が加わり導通するのに対し、厚みの薄い配線パターン１５には荷重が加わらないので非導通となる。つまり、配線パターンの極小化（微細化）に合せて測定用端子の小面積化（尖鋭化）する必要がなく、むしろ本発明実施形態の測定用端子の先端は細幅の配線パターン１２、１３よりも十分に大きいので精密な位置合わせをしなくとも導通が確保できるのである。
前記セラミックパッケージ１の更なる小型化に伴い、前記セラミック絶縁層１ｂの内側に露出するのがほぼボンディングパッド１４のみになると想定されるが、前述と同様に、所定のボンディングパッドとその他のボンディングパッドとを同時に接触しても接触部３２、即ち異方性導電シートには該異方性導電シートと所定のボンディングパッドとの接触面のみに荷重が加わり導通するので、セラミックパッケージ１の更なる小型化に合せて測定用端子３０を極小化する必要がない。
また、前記台座３１ａに前記接触部３２を配設しない、即ち前記配線パターン１２、１３夫々と前記台座３１ａとが直接接触（導通）する場合、図３（ｂ）に示すように、経年変化によって台座３１ａに配線パターン１２、１３（不図示）夫々の断面形状（略半円状）略一致するような摩耗部３３が形成され、図３（ｃ）に示すように、配線パターン１２、１３夫々と台座３１ａとの接触をさらに繰り返すと摩耗部３３が拡大し該摩耗部３３が配線パターン１２を跨ぎ、即ち配線パターン１２とは接触せず該配線パターン１２近傍の絶縁層（前記セラミック絶縁層１ａの下面）と摩耗部３３の終端部（台座３１ａの先端面）とが接触することとなり測定が不可能となる。前記台座３１ａに前記接触部３２を配設することは接触部３２が有する弾性変形によって経年変化による摩耗を回避すると共に安定した接触（導通）が得られるという点でも有効である。
【００２３】
本発明実施形態の水晶発振器２０の製造方法は、前記上部凹陥部４の内底面に形成する前記パッド電極１１に前記導電性接着剤１０を介して水晶振動素子２を実装する。パッド電極１１は前記プリント配線基板１が備える配線パターンを介して下部凹陥部５の底面に形成する配線パターン１２、１３夫々と導通しており該配線パターン１２、１３夫々に周波数測定装置の測定用端子３０を接触し水晶振動素子２の周波数を測定する。その測定結果に基づいて、蒸着等により水晶振動素子２の発振周波数の調整を行う。
以後の工程は、従来と同様である。
【００２４】
図４は本発明による水晶発振器のその他の構造を示す図である。
図４（ａ）に示すように、その他の本発明実施形態の水晶発振器４０として該水晶発振器４０の対向する一対の側端面、例えば一方の短辺側端面に厚み方向に延びる溝状の側面電極、即ち前記配線パターン１２（不図示）と導通するモニタ電極パッド４２と、他方の短辺側端面に厚み方向に延びる溝状の側面電極、即ち前記配線パターン１３と導通するモニタ電極パッド４３（不図示）と、を備える以外は前記水晶発振器２０と同一であって、モニタ電極パッド４２、４３夫々は前記セラミック絶縁層１ａの短辺側端面の下部と前記セラミック絶縁層１ｂの短辺側端面の上部との同位置に配設された切り欠きを組み合わせて溝の内側に設けられたものであって、セラミック絶縁層１ａ、１ｂの切り欠きの内壁面に導体膜が被着されている。
図４（ｂ）に示すように、例えばモニタ電極パッド４２が有する溝に前記測定用端子３０の接触部３２が有する弾性変形を利用して該接触部３２を嵌入し導通を得る。
【００２５】
本発明実施形態に係る測定用端子は前記水晶発振器２０、４０夫々のみならず、従来の圧電発振器１００、即ち広い面積を有する前記モニタ電極パッド１１２、１１３であっても構わない。
【００２６】
前記下部凹陥部５には前記ＩＣチップ３の他に該ＩＣチップに供給される電源電圧に重畳される高周波ノイズを除去するためのコンデンサ等を収容しても構わない。
【００２７】
以上では水晶を用いて本発明を説明したが、本発明は水晶のみに限定するものではなくランガサイト、四方酸リチウム、タンタル酸リチウム、ニオブ酸リチウム等の圧電材料に適用できることは云うまでもない。
【００２８】
【発明の効果】
請求項１に記載の発明によれば、小型化に対応する圧電発振器が得られるという効果を有する。
【００２９】
請求項２又は３に記載の発明によれば、小型化に対応する圧電発振器と該圧電発振器が備える電極に確実にコンタクト（接触）する製造装置とを用いる圧電発振器の製造方法が得られるという効果を有する。
【００３０】
請求項４に記載の発明によれば、耐摩耗性が向上し且つ確実にコンタクト（接触）する製造装置が得られるという効果を有する。
【図面の簡単な説明】
【図１】本発明の実施の形態としての水晶発振器の構成図。
（ａ）縦断面図。
（ｂ）下面図。
【図２】本発明の実施の形態に係る測定用端子の先端構造を示す縦断面図。
【図３】本発明実施形態に係る測定用端子の効果作用を示す説明図。
【図４】その他の本発明実施形態としての水晶発振器の構成図。
（ａ）斜視図。
（ｂ）横断面図。
【図５】従来の水晶発振器の構成図。
（ａ）縦断面図。
（ｂ）下面図。
【符号の説明】
１…セラミックパッケージ ２…水晶振動素子 ３…ＩＣチップ
４…上部凹陥部 ５…下部凹陥部 ６…蓋体 ７…充填樹脂
８…隔壁 １０…導電性接着剤 １１…パッド電極
１２、１３、１５…配線パターン １４…ボンディングパッド
２０、４０…水晶発振器 ３０…測定用端子 ３１ａ…台座
３１ｂ…連結部 ３２…接触部 ３３…摩耗部
４２、４３、１１２、１１３…モニタ電極パッド
１００…圧電発振器 １０１…容器体 １０２…圧電振動素子
１０３…ＩＣチップ １０４…上部キャビティー部
１０５…下部キャビティー部 １０６…蓋体 １０７…充填樹脂
１０８…隔壁 １１０…導電性接着剤 １１１…パッド電極[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a piezoelectric oscillator and a method for manufacturing the same to cope with downsizing.
[0002]
[Prior art]
Due to the rapid progress in price reduction and miniaturization accompanying the popularization of mobile communication devices such as mobile phones, there is a demand for price reduction and miniaturization of piezoelectric vibrators and piezoelectric oscillators used in these communication devices. Is growing.
[0003]
As a conventional piezoelectric oscillator, for example, there is one proposed in Japanese Patent Application Laid-Open No. 2002-1000093. FIG. 5A is a longitudinal sectional view showing the structure of the package, FIG. 5B is a filled resin, It is a lower surface in a state where an IC chip is omitted, that is, an IC chip mounting surface view.
As shown in the drawing, a conventional piezoelectric oscillator 100 is accommodated in a substantially rectangular parallelepiped container body 101 in which an upper cavity portion 105 and a lower cavity portion 106 are separated by a partition wall 108, and an upper cavity portion 104. A rectangular piezoelectric vibration element 102, an IC chip 103 constituting an oscillation circuit housed in the lower cavity portion 105, a metal lid 106, and a filling resin 107.
The upper cavity portion 104 is cantilever-supported at one end of the piezoelectric vibration element 102 via the conductive adhesive 110 and electrically connected to the pad electrode 111 formed on the inner bottom surface of the upper cavity portion 104 and then electrically connected. The lid 106 is hermetically sealed, and the IC chip 103 is wire-bonded to the inner bottom surface of the lower cavity portion 105, and the lower cavity portion 105 containing the IC chip 103 is sealed with the filling resin 107. ing.
[0004]
In the method of manufacturing the piezoelectric oscillator 100, the piezoelectric vibration element 102 is mounted on the pad electrode 111 formed on the inner bottom surface of the upper cavity portion 104 via the conductive adhesive 110. The pad electrode 111 is electrically connected to the monitor electrode pads 112 and 113 formed on the bottom surface of the lower cavity portion 105 via a wiring pattern (not shown) provided in the container body 101, and the monitor electrode pads 112 and 113 are respectively connected. The measurement terminal (probe) of the frequency measuring device is brought into contact with the piezoelectric vibration element 102 to measure the frequency. Based on the measurement result, the oscillation frequency of the piezoelectric vibration element 102 is adjusted by vapor deposition or the like.
[0005]
Thereafter, the upper cavity portion 104 accommodating the piezoelectric vibration element 102 is hermetically sealed by the lid body 106. The IC chip 103 is wire bonded to the inner bottom surface of the lower cavity portion 105. The lower cavity portion 105 containing the IC chip 103 is sealed with the filling resin 107.
Thus, the assembly of the piezoelectric oscillator 100 is completed, and then a predetermined electrical test is performed.
[0006]
[Patent Literature]
Japanese Patent Application Laid-Open No. 2002-100932.
[0007]
[Problems to be solved by the invention]
In order to satisfy the above-described demand for further miniaturization of the piezoelectric oscillator, it is indispensable to reduce the size of the container body 101, that is, the wiring pattern included in the container body 101 and the gap between the wiring patterns. It becomes.
Further, minimization of the monitor electrode pads 112 and 113 is inevitable, and in some cases, the monitor electrode pads 112 and 113 each have the same pattern width as the wiring pattern. In other words, the monitor electrode pads 112 and 113 It becomes impossible to arrange each of them.
[0008]
In general, the method of conducting by means of a measuring terminal is a method in which the electrode pad having a large area is substantially point-contacted with a measuring terminal having a needle shape in consideration of the repeatability and the like. The contact between the monitor electrode pads 112 and 113, that is, the wiring patterns routed to the positions where the monitor electrode pads 112 and 113 were disposed, and the measurement terminals of the frequency measuring device is extremely high. There is a risk that the yield may be deteriorated due to poor contact, that is, poor oscillation frequency adjustment of the piezoelectric vibration element 102 due to poor frequency measurement, or misjudging that a good (oscillating) piezoelectric vibration element 102 is defective (not oscillating).
[0009]
Further, it is indispensable to reduce the size of the container body 101 described above, that is, to reduce the thickness of the partition wall 108. In a conventional measuring terminal having a needle-like tip, the load applied when contacting (measuring) each of the monitor electrode pads 112 and 113 is concentrated at one point, and there is a possibility that the partition wall 108 may be cracked or damaged.
[0010]
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a piezoelectric oscillator corresponding to miniaturization and a manufacturing method thereof.
[0011]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides an upper concave member having a square outer peripheral shape and a concave portion inside the outer periphery, and a lower concave member having a square outer peripheral shape and having a concave portion inside the outer periphery. provided and the container body of substantially rectangular outer peripheral shape disposed on both sides of the partition wall to separate by partition wall member, and the piezoelectric vibrating element, and an electronic circuit elements constituting the oscillation circuit, a lid, a front Stories accommodating the piezoelectric vibrating element in the recess of the upper recessed member, the the recessed portion with hermetically sealed by the lid has a structure that houses at least the electronic circuit elements on the lower recessed member recessed in portion of the In the piezoelectric oscillator, one recess is provided on one side surface of the four outer peripheral side surfaces of the container body, a direction extending in a direction between the front and back surfaces is a thickness direction, and the thickness direction is within the one side surface and the direction of the thickness The direction perpendicular to the width direction The recess has a length in the thickness direction of the recess that is shorter than a length in the thickness direction of the one side surface, and a length in the width direction of the recess is in the width direction of the one side surface. The side face of the partition wall and the side face of the lower recessed member are cut out in a shape shorter than the length of the conductor, and a conductor film is disposed on the inner wall of the recess, and the conductor film has a thickness direction. The length in the width direction is longer than that of the conductive film , and the conductive film is electrically connected to the piezoelectric vibration element.
[0013]
Furthermore, the present invention has an upper concave member having a square outer peripheral shape and a concave portion inside the outer periphery,
The outer peripheral shape is a square, and the outer peripheral shape arranged on the front and back of the partition wall is separated from the lower recessed member having the recessed portion inside the outer periphery by the partition wall, the piezoelectric body, the piezoelectric vibration element, and the oscillation An electronic circuit element constituting a circuit, and a lid, wherein the piezoelectric vibration element is accommodated in a recessed portion of the upper recessed member, the recessed portion is hermetically sealed by the lid, and the lower recessed member Having a structure that accommodates at least the electronic circuit element in the recessed portion, providing one recess on one of the four outer peripheral side surfaces of the container body, and a direction extending in a direction between the front and back sides as a thickness direction, When the width direction is a direction within the one side surface and orthogonal to the thickness direction, the recess has a length in the thickness direction of the recess, and the length in the thickness direction of the one side surface is long. Shorter, the length of the recess in the width direction is The side surface of the partition wall and the side surface of the lower recessed member are cut out in a shape shorter than the length of one side surface in the width direction, and a conductor film is disposed on the inner wall of the recess, and the conductor The film is a method of manufacturing a piezoelectric oscillator having a structure in which a length in a width direction is longer than a thickness direction, and a conductive film is electrically connected to the piezoelectric vibration element, and the piezoelectric film is formed in the recessed portion of the upper recessed member. A step of mounting a vibration element, a step of measuring a frequency of the piezoelectric vibration element mounted in the recessed portion, a step of adjusting the frequency of the piezoelectric vibration element based on a measurement result of the measurement step, and the lower depression Mounting the electronic circuit element in the recessed portion of the member, and the frequency measurement step is disposed on the inner wall of the recess that is provided on a side surface of the container body that is electrically connected to the piezoelectric vibration element. Measured on a conductive film Contacting the terminals, characterized in that to measure the frequency of the piezoelectric vibrating element.
[0014]
The present invention includes the steps of mounting the piezoelectric vibrating element in the upper recessed portion recessed portion of the member, and measuring the frequency of the piezoelectric vibrating element mounted on the recessed portion, based on a measurement result of said measuring step Adjusting the frequency of the piezoelectric vibrating element, and the frequency measuring step includes a conductor disposed on the inner wall of the recess in the side surface of the container body that is electrically connected to the piezoelectric vibrating element. It is characterized in that a measuring terminal having an electrically conductive material having elasticity fixed to the film is pressed against the film.
[0015]
In addition, the present invention is characterized in that the conductive material having elasticity constituting the measurement terminal is an anisotropic conductive sheet.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on illustrated embodiments of the present invention.
[0017]
FIG. 1 is a configuration diagram of a crystal oscillator according to an embodiment of the present invention. FIG. 1 (a) is a longitudinal sectional view of the package, FIG. 1 (b) is a bottom surface in a state where a filling resin and an IC chip are omitted, that is, an IC. It is a chip mounting surface view. However, in order to clarify each of the bonding pads 14 to be described later, wiring patterns 12 and 13 to be described later extending from each of the bonding pads 14 and other wiring patterns (not indicated), FIG. 14 is outlined and the wiring patterns 12 and 13 and the other wiring patterns are filled in.
As shown in the figure, the crystal oscillator 20 of the embodiment of the present invention includes:
A substantially rectangular parallelepiped container body in which the upper recessed portion 4 and the lower recessed portion 5 are arranged opposite to each other with a partition wall 8 therebetween, that is, the ceramic package 1;
A rectangular crystal resonator element 2 housed in the upper recessed portion 4;
An IC chip (electronic circuit element) 3 constituting an oscillation circuit housed in the lower recess 5;
A metal lid 6 and a filling resin 7 are provided.
The pad electrode 11 formed on the inner bottom surface of the upper recessed portion 4 is cantilevered at one end of the crystal vibrating element 2 via the conductive adhesive 10 and electrically connected, and then the upper recessed portion 4 is covered. The body 6 is hermetically sealed, and the IC chip 3 is flip-chip bonded to the inner bottom surface of the lower recessed portion 5, and the lower recessed portion 5 containing the IC chip 3 is sealed with the filling resin 7.
[0018]
The ceramic package 1 includes a package body in which a substantially rectangular ceramic insulating layer 1a (partition wall 8) and a substantially rectangular frame-shaped ceramic insulating layer 1b placed on the lower surface of the ceramic insulating layer 1a are laminated, The substantially rectangular frame-shaped body 1c made of Kovar alloy brazed with silver on the upper surface of the ceramic insulating layer 1a and the upper surface of the ceramic insulating layer 1a exposed on the inner side (upper recessed portion 5) of the frame-shaped body 1c. The pad electrode 11 for mounting the crystal resonator element 2, the bonding pad 14 for mounting the IC chip 3 formed on the lower surface of the ceramic insulating layer 1a exposed on the inner side (lower recessed portion 6) of the ceramic insulating layer 1b, and the bonding The wiring patterns 12 and 13 extending from the pads 14 and other wiring patterns, for example, 15 and the external formed on the lower surface of the ceramic insulating layer 1b Comprising a child electrodes, the wiring patterns 12 and 13 each are electrically connected with the pad electrode 11 through the internal pattern (not shown).
[0019]
The wiring patterns, pad electrodes, bonding pads, and external terminal electrodes are obtained by firing tungsten or molybdenum, applying nickel plating thereon, and then applying gold plating on the nickel plating. The thickness of each of the bonding pads that are electrically connected to each of the wiring patterns 12 and 13 (the combined thickness of the sintered tungsten or molybdenum, the nickel plating thickness, and the gold plating thickness) is set to the other wiring patterns 15 and 12. , 13 is thicker (higher) than the non-connected bonding pad. The wiring patterns 12 and 13 have the same thickness.
[0020]
As a means for making the wiring patterns 12 and 13 and the bonding pads conducting to each of the wiring patterns 12 and 13 thicker (higher) than the others, a method of manufacturing a known ceramic package (ceramic multilayer circuit board) is used. In the process of screen-printing a wiring pattern with a conductive paste on the surface of a ceramic green sheet that becomes a ceramic insulating layer constituting a ceramic package by the green sheet lamination method, the wiring patterns 12 and 13 and the wiring patterns 12 and 13 are electrically connected to each other. Printing is repeated on the conductive paste (tungsten or molybdenum) for forming the bonding pad until a desired thickness is obtained, or printing is performed with a thick screen printing plate.
[0021]
FIG. 2 is a cross-sectional view showing the structure of the tip of the measurement terminal (probe) according to the embodiment of the present invention.
As shown in FIG. 2A, the measurement terminal 30 according to the embodiment of the present invention includes a substantially circular pedestal 31a having a diameter larger than the pattern width of each of the wiring patterns 12 and 13, and a rod-like connecting portion 31b. And a contact portion 32 having a size substantially the same as that of the pedestal 31a, and has a structure in which the pedestal 31a and the contact portion 32 are bonded by a conductive adhesive.
The pedestal 31a and the connecting portion 31b are one obtained by rhodium plating on beryllium copper, one obtained by rhodium plating on hard phosphor bronze, one obtained by rhodium plating on SK-4, or one obtained by gold plating on a copper alloy.
The contact portion 32 is an electrically conductive material having elasticity, for example, an anisotropic conductive sheet having electrical anisotropy that is conductive in the film thickness direction and insulating in the surface direction, and the wiring pattern 12, Each of the 13 and the contact portion 32 is brought into contact and electrically connected through the contact portion 32, that is, the fine metal particles mixed in the anisotropic conductive sheet by applying a load.
As another structure of the tip of the measurement terminal 30, as shown in FIG. 2B, a recess is formed in the contact portion 32, and a protrusion disposed on the pedestal 31a is inserted into the recess, and FIG. ), A method of forming a recess in the pedestal 31a and inserting the contact portion 32 into the recess, etc., and any method may be used.
[0022]
FIG. 3 is an explanatory view showing the effect of the measuring terminal according to the embodiment of the present invention.
As shown in FIG. 3A, as described above, the wiring patterns 12 and 13 (not shown) and the bonding pads (not shown) connected to the wiring patterns 12 and 13 have thicknesses other than the wiring patterns 15 and Since it is thicker than the bonding pads (not shown) that do not communicate with the wiring patterns 12 and 13, even if the contact part 32 contacts the predetermined wiring pattern 12 and the wiring pattern 15 at the same time, the contact part 32, that is, anisotropic The conductive conductive sheet becomes conductive because a load is applied to the contact surface between the anisotropic conductive sheet and the wiring pattern 12 while the thin wiring pattern 15 is not applied with a load. That is, it is not necessary to reduce the area (sharpening) of the measurement terminal in accordance with the miniaturization (miniaturization) of the wiring pattern. Rather, the wiring terminals 12 and 13 having the narrow width at the tip of the measurement terminal according to the embodiment of the present invention are used. It is sufficiently larger than this, so that conduction can be ensured without precise positioning.
As the ceramic package 1 is further reduced in size, it is assumed that only the bonding pads 14 are exposed inside the ceramic insulating layer 1b. However, as described above, predetermined bonding pads and other bonding pads are used. Since the load is applied only to the contact portion 32, that is, the contact surface between the anisotropic conductive sheet and a predetermined bonding pad, even if they are in contact with each other at the same time, the ceramic package 1 is further reduced in size. It is not necessary to minimize the measurement terminal 30 in accordance with the trend.
Further, when the contact portion 32 is not provided on the pedestal 31a, that is, when the wiring patterns 12 and 13 and the pedestal 31a are in direct contact (conduction), as shown in FIG. Wear portions 33 are formed on the pedestal 31a so as to substantially match the cross-sectional shapes (substantially semicircular shapes) of the wiring patterns 12, 13 (not shown). As shown in FIG. 3C, the wiring patterns 12, 13 respectively. If the contact between the pedestal 31a and the pedestal 31a is further repeated, the wear part 33 expands and the wear part 33 straddles the wiring pattern 12, that is, does not contact the wiring pattern 12, and the insulating layer (the ceramic insulating layer 1a) in the vicinity of the wiring pattern 12 ) And the end portion of the wear portion 33 (the tip surface of the pedestal 31a) are in contact with each other, making measurement impossible. Providing the contact portion 32 on the pedestal 31a is also effective in that the elastic deformation of the contact portion 32 avoids wear due to secular change and provides stable contact (conduction).
[0023]
In the manufacturing method of the crystal oscillator 20 according to the embodiment of the present invention, the crystal resonator element 2 is mounted on the pad electrode 11 formed on the inner bottom surface of the upper recessed portion 4 via the conductive adhesive 10. The pad electrode 11 is electrically connected to the wiring patterns 12 and 13 formed on the bottom surface of the lower recessed portion 5 through the wiring pattern provided in the printed wiring board 1, and each of the wiring patterns 12 and 13 is used for measurement by a frequency measuring device. The terminal 30 is contacted to measure the frequency of the crystal resonator element 2. Based on the measurement result, the oscillation frequency of the crystal resonator element 2 is adjusted by vapor deposition or the like.
The subsequent steps are the same as in the prior art.
[0024]
FIG. 4 is a diagram showing another structure of the crystal oscillator according to the present invention.
As shown in FIG. 4 (a), as a crystal oscillator 40 of another embodiment of the present invention, a pair of side end surfaces facing the crystal oscillator 40, for example, groove-shaped side electrodes extending in the thickness direction on one short side end surface. That is, a monitor electrode pad 42 that is electrically connected to the wiring pattern 12 (not shown), and a groove-shaped side electrode that extends in the thickness direction on the other short-side end surface, that is, a monitor electrode pad 43 that is electrically connected to the wiring pattern 13 (not shown). The monitor electrode pads 42 and 43 are respectively provided under the short side end face of the ceramic insulating layer 1a and the short side end face of the ceramic insulating layer 1b. A notch disposed in the same position as the upper portion is combined and provided inside the groove, and a conductor film is deposited on the inner wall surface of the notch of the ceramic insulating layers 1a and 1b.
As shown in FIG. 4B, for example, the contact portion 32 is fitted into the groove of the monitor electrode pad 42 using the elastic deformation of the contact portion 32 of the measurement terminal 30 to obtain conduction.
[0025]
The measurement terminals according to the embodiment of the present invention are not limited to the crystal oscillators 20 and 40, but may be the conventional piezoelectric oscillator 100, that is, the monitor electrode pads 112 and 113 having a large area.
[0026]
In addition to the IC chip 3, the lower recess 5 may contain a capacitor or the like for removing high frequency noise superimposed on the power supply voltage supplied to the IC chip.
[0027]
Although the present invention has been described above using quartz, it is needless to say that the present invention is not limited to quartz and can be applied to piezoelectric materials such as langasite, lithium tetragonal acid, lithium tantalate, and lithium niobate. .
[0028]
【The invention's effect】
According to the first aspect of the present invention, there is an effect that a piezoelectric oscillator corresponding to downsizing can be obtained.
[0029]
According to the second or third aspect of the invention, there is provided an effect that a method of manufacturing a piezoelectric oscillator using a piezoelectric oscillator corresponding to downsizing and a manufacturing apparatus that reliably contacts (contacts) an electrode included in the piezoelectric oscillator can be obtained. Have
[0030]
According to the fourth aspect of the present invention, there is an effect that a manufacturing apparatus which has improved wear resistance and can reliably contact (contact) can be obtained.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a crystal oscillator as an embodiment of the present invention.
(A) Longitudinal sectional view.
(B) Bottom view.
FIG. 2 is a longitudinal sectional view showing a tip structure of a measurement terminal according to an embodiment of the present invention.
FIG. 3 is an explanatory diagram showing the effect of the measurement terminal according to the embodiment of the present invention.
FIG. 4 is a configuration diagram of a crystal oscillator as another embodiment of the present invention.
(A) Perspective view.
(B) Cross section.
FIG. 5 is a configuration diagram of a conventional crystal oscillator.
(A) Longitudinal sectional view.
(B) Bottom view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic package 2 ... Crystal oscillation element 3 ... IC chip 4 ... Upper recessed part 5 ... Lower recessed part 6 ... Cover body 7 ... Filling resin 8 ... Partition 10 ... Conductive adhesive agent 11 ... Pad electrode 12, 13, 15 ... Wiring pattern 14 ... Bonding pad 20, 40 ... Crystal oscillator 30 ... Measuring terminal 31a ... Base 31b ... Connection part 32 ... Contact part 33 ... Wear part 42, 43, 112, 113 ... Monitor electrode pad 100 ... Piezoelectric oscillator 101 ... Container Body 102 ... Piezoelectric vibration element 103 ... IC chip 104 ... Upper cavity portion 105 ... Lower cavity portion 106 ... Cover body 107 ... Filling resin 108 ... Partition wall 110 ... Conductive adhesive 111 ... Pad electrode

Claims (4)

外周形状が四角であり、その外周の内側に凹陥部を有する上部凹陥部材と、
外周形状が四角であり、その外周の内側に凹陥部を有する下部凹陥部材とを隔壁にて隔てるよう前記隔壁の表裏に配置した外周形状が略直方体形状の容器体と、
圧電振動素子と、
発振回路を構成する電子回路素子と、
蓋体と、を備え、
前記上部凹陥部材の凹陥部内に前記圧電振動素子を収容し、該凹陥部を前記蓋体により気密封止すると共に、前記下部凹陥部材の凹陥部内に少なくとも前記電子回路素子を収容する構造を有する圧電発振器であって、
前記容器体の４つの外周側面の一つの側面に一つの凹所を設け、
前記表裏間の方向に延びる方向を厚み方向とし、前記一つの側面内であり前記厚みの方向と直交する方向を幅方向としたとき、
前記凹所は、前記凹所の厚さ方向の長さが、前記一つの側面の厚さ方向の長さより短く、前記凹所の幅方向の長さが前記一つの側面の幅方向の長さよりも短い形状で前記隔壁の側面と前記下部凹陥部材の側面とを切り欠いた構成であって、
前記凹所の内壁には、導体膜を配設し、
該導体膜は、厚み方向よりも幅方向の長さが長く、
該導体膜を前記圧電振動素子と電気的に導通接続したことを特徴とする圧電発振器。 An upper recessed member having a square outer peripheral shape and having a recessed portion inside the outer periphery;
The outer peripheral shape is a square, and the outer peripheral shape disposed on the front and back of the partition so as to separate the lower recessed member having a recessed portion inside the outer periphery with the partition is a substantially rectangular parallelepiped container,
A piezoelectric vibration element;
Electronic circuit elements constituting the oscillation circuit;
Provided with a lid, the,
Before SL accommodating the piezoelectric vibrating element in the recess of the upper recessed member, for accommodating at least the electronic circuit elements to the recessed portion with hermetically sealed by the lid, into the recessed portion of the lower recess member structure A piezoelectric oscillator comprising:
One recess is provided on one side surface of the four outer peripheral side surfaces of the container body,
When the thickness direction is a direction extending in the direction between the front and back, and the width direction is a direction perpendicular to the direction of the thickness within the one side surface,
In the recess, the length in the thickness direction of the recess is shorter than the length in the thickness direction of the one side surface, and the length in the width direction of the recess is longer than the length in the width direction of the one side surface. Is a configuration in which the side surface of the partition wall and the side surface of the lower recessed member are cut out in a short shape,
A conductor film is disposed on the inner wall of the recess,
The conductor film is longer in the width direction than in the thickness direction,
A piezoelectric oscillator characterized in that the conductive film is electrically connected to the piezoelectric vibration element. 外周形状が四角であり、その外周の内側に凹陥部を有する上部凹陥部材と、
外周形状が四角であり、その外周の内側に凹陥部を有する下部凹陥部材とを隔壁にて隔てるよう前記隔壁の表裏に配置した外周形状が略直方体形状の容器体と、
圧電振動素子と、
発振回路を構成する電子回路素子と、
蓋体と、を備え、
前記上部凹陥部材の凹陥部内に前記圧電振動素子を収容し、該凹陥部を前記蓋体により気密封止すると共に、前記下部凹陥部材の凹陥部内に少なくとも前記電子回路素子を収容する構造を有し、
前記容器体の４つの外周側面の一つの側面に一つの凹所を設け、
前記表裏間の方向に延びる方向を厚み方向とし、前記一つの側面内であり前記厚みの方向と直交する方向を幅方向としたとき、
前記凹所は、前記凹所の厚さ方向の長さが、前記一つの側面の厚さ方向のは長さより短く、前記凹所の幅方向の長さが前記一つの側面の幅方向の長さよりも短い形状で前記隔壁の側面と前記下部凹陥部材の側面とを切り欠いた構成であって、
前記凹所の内壁には、導体膜を配設し、
該導体膜は、厚み方向よりも幅方向の長さが長く、
導体膜を前記圧電振動素子と電気的に導通接続した構成の圧電発振器の製造方法であって、
前記上部凹陥部材の凹陥部内に前記圧電振動素子を実装する工程と、
前記凹陥部に実装した前記圧電振動素子の周波数を測定する工程と、
前記測定工程の測定結果に基づいて前記圧電振動素子の周波数を調整する工程と、
前記下部凹陥部材の凹陥部内に前記電子回路素子を搭載する工程と、
を少なくとも含み、
前記周波数測定工程は、前記圧電振動素子と電気的に導通する前記容器体の側面に有する前記凹所の内壁に配設された導体膜に測定用端子を接触し、前記圧電振動素子の周波数を測定するものであることを特徴とする圧電発振器の製造方法。 An upper recessed member having a square outer peripheral shape and having a recessed portion inside the outer periphery;
The outer peripheral shape is a square, and the outer peripheral shape disposed on the front and back of the partition so as to separate the lower recessed member having a recessed portion inside the outer periphery with the partition is a substantially rectangular parallelepiped container,
A piezoelectric vibration element;
Electronic circuit elements constituting the oscillation circuit;
Provided with a lid, the,
Before SL accommodating the piezoelectric vibrating element in the recess of the upper recessed member, for accommodating at least the electronic circuit elements to the recessed portion with hermetically sealed by the lid, into the recessed portion of the lower recess member structure Have
One recess is provided on one side surface of the four outer peripheral side surfaces of the container body,
When the thickness direction is a direction extending in the direction between the front and back, and the width direction is a direction perpendicular to the direction of the thickness within the one side surface,
The length of the recess in the thickness direction of the recess is shorter than the length in the thickness direction of the one side surface, and the length in the width direction of the recess is the length in the width direction of the one side surface. It is a configuration in which the side surface of the partition wall and the side surface of the lower recessed member are cut out in a shorter shape,
A conductor film is disposed on the inner wall of the recess,
The conductor film is longer in the width direction than in the thickness direction,
A method of manufacturing a piezoelectric oscillator having a configuration in which a conductive film is electrically connected to the piezoelectric vibration element,
A step of mounting the piezoelectric vibrating element in the upper recessed member recessed in portion of,
Measuring the frequency of the piezoelectric vibration element mounted in the recess ,
Adjusting the frequency of the piezoelectric vibration element based on the measurement result of the measurement step;
A step of mounting said electronic circuit element on the lower recessed portion recessed portion of the member,
Including at least
The frequency measurement step is to contact the measuring terminals on the piezoelectric vibrating element and the electrically conductive film disposed on the inner wall of the recess having a side surface of the container body to conduct, the frequency of the piezoelectric vibrating element A method for manufacturing a piezoelectric oscillator, characterized in that the method is for measuring. 前記上部凹陥部材の凹陥部内に前記圧電振動素子を実装する工程と、
前記凹陥部に実装した前記圧電振動素子の周波数を測定する工程と、
前記測定工程の測定結果に基づいて前記圧電振動素子の周波数を調整する工程と、を少なくとも含み、
前記周波数測定工程は、前記圧電振動素子と電気的に導通する前記容器体の側面に有する凹所の内壁に配設された導体膜に弾性を有する導電材を導通固定した測定用端子を押し当てるものであることを特徴とする請求項２に記載の圧電発振器の製造方法。A step of mounting the piezoelectric vibrating element in the upper recessed member recessed in portion of,
Measuring the frequency of the piezoelectric vibration element mounted in the recess ,
Adjusting the frequency of the piezoelectric vibration element based on the measurement result of the measurement step, at least,
In the frequency measurement step, a measurement terminal in which a conductive material having elasticity is conductively fixed to a conductor film disposed on an inner wall of a recess provided on a side surface of the container body that is electrically connected to the piezoelectric vibration element is pressed. The method of manufacturing a piezoelectric oscillator according to claim 2 , wherein 前記測定用端子を構成する弾性を有する導電材が異方性導電シートであることを特徴とする請求項３に記載の圧電発振器の製造方法。4. The method for manufacturing a piezoelectric oscillator according to claim 3 , wherein the conductive material having elasticity constituting the measurement terminal is an anisotropic conductive sheet.
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