JP2002050928A - Piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive piezoelectric oscillator of which fine adjustment of electrical characteristics after hermetic sealing can be done with a simple configuration and which can facilitate subsequent connection with an oscillation circuit of a piezoelectric vibrator by enabling the measurement of the characteristics of a piezoelectric vibrator single body hermetically sealed. SOLUTION: An IC33 is stored in a ceramic package 1. A quartz resonator 3 is supported cantilever style on the electrode paddings 14 and 15, and the electrode paddings 14 and 15 are conductively bonded with a conductive resin adhesive. The ceramic package 1 is hermetically sealed subsequently with a metal cover. Then, the electrical characteristics of the crystal oscillator are measured, and adjustment is carried out by using the electrode exposed parts, when it has deviated from a prescribed characteristic range. For example, the electrode exposed parts 16 and 18 are electrically connected with a bonding wire W1, and a capacitor C3 is connected (electrical connection S1) to a ground terminal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator used for a communication device such as a portable telephone or an electronic device.

[0002]

2. Description of the Related Art Piezoelectric oscillators, for example, crystal oscillators, are used in various fields as reference frequency sources for electronic equipment and the like because they can obtain a stable and accurate oscillation frequency. As a conventional example, a configuration of a crystal oscillator using a crystal resonator will be described as an example. Japanese Patent No. 2969526 uses a ceramic package, arranges an oscillation circuit IC below the inside of the package, supports and fixes a crystal oscillator above the IC, and performs hermetic sealing by seam welding. . Such a configuration has a relatively small number of components due to customization of the IC, is a simple configuration, and contributes to cost reduction.

[0003] However, in such a configuration, the desired electrical characteristics sometimes fluctuate after hermetic sealing. That is,
In such a crystal oscillator, a crystal oscillator is mounted after mounting the IC, and in this state, electric characteristics such as frequency are adjusted for excitation electrodes formed on the crystal oscillator by adjusting the mass. For example, partial vapor deposition of a metal material is performed on the excitation electrode, and the frequency and the like are adjusted by adding a mass. And
After that, hermetic sealing by seam welding is performed, but at the time of this hermetic sealing, for example, thermal mechanical distortion at the time of welding or a splash in which a part of molten metal at the time of welding scatters, electric characteristics such as frequency fluctuate. There was something. Therefore, in the present configuration, it is necessary to allow for variations in frequency and the like, so that highly accurate electrical characteristics cannot be secured as guaranteed values.

[0004]

In order to cope with the above-mentioned problem, a configuration has been considered in which a mechanism for changing the constants of circuit components is mounted outside the package. That is, as shown in FIG. 9, the crystal oscillator and the oscillation circuit IC are housed in the upper housing portion 90 a of the ceramic package 90 and hermetically sealed by the metal lid 93. On the other hand, a lower storage portion 90b is formed below the ceramic package, and a variable capacitor 94 is attached to the lower storage portion 90b. Fine tune. However, the configuration shown in FIG. 9 can meet the demand for high accuracy, but has a problem in that the cost of parts increases and it is not possible to reduce the cost.

[0005] Further, after the hermetic sealing, the above-described configurations have a problem that the characteristics of the piezoelectric vibrator (quartz vibrator) alone cannot be confirmed. For example, in TCXO, VCXO, and the like, in order to perform advanced temperature compensation or voltage control, it is necessary to confirm electrical characteristics in a state where the circuit is not connected to other circuits, and to perform compensation and the like corresponding thereto.
In the conventional configuration, after the hermetic sealing, the characteristics of the piezoelectric vibrator alone were measured, and thereafter, necessary circuit connection could not be performed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an inexpensive piezoelectric oscillator that performs fine adjustment of electrical characteristics of a piezoelectric oscillator after hermetic sealing with a simple configuration. Another object of the present invention is to provide a piezoelectric oscillator capable of measuring characteristics of a hermetically sealed piezoelectric vibrator alone and easily connecting the piezoelectric vibrator to an oscillation circuit thereafter.

[0007]

SUMMARY OF THE INVENTION According to the present invention, a circuit for adjusting the electrical characteristics of a piezoelectric oscillation circuit is housed in a package, and a wiring connected to the circuit component is connected or disconnected to form a piezoelectric oscillation circuit. One of the features of the present invention is to adjust the electrical characteristics of the device.

That is, as set forth in claim 1, a piezoelectric vibrator, a first circuit component that forms a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a second circuit that adjusts electrical characteristics of the piezoelectric oscillation circuit. A piezoelectric oscillator in which components are housed in a package and electrically connected to each other by predetermined wiring, and the electrical characteristics of the piezoelectric oscillator are adjusted by connecting or disconnecting wiring that functions as an adjustment element of the second circuit component. It is characterized by:

[0009] In the above structure, as described in claim 2,
A first electrode exposed portion is provided in which a part of a wiring for causing the second circuit component to function as an adjustment element is exposed to the outside of the hermetically sealed package, and a wiring of the first electrode exposed portion is provided. The configuration may be such that the electrical characteristics are adjusted by connecting or disconnecting.

According to each of the above-described structures, a circuit component for adjusting the electric characteristics of the piezoelectric oscillation circuit is previously incorporated in the piezoelectric oscillator, and the electric characteristics are adjusted by wiring for functioning the circuit component as an adjustment element. This is done by connecting or disconnecting. Therefore, it is not necessary to use a variable circuit constant variable element such as a variable capacitor having a high component cost, and the electric characteristics can be adjusted with a simple configuration. In particular, by providing a configuration in which an electrode exposed portion is provided outside the package, the wiring of the electrode exposed portion is connected or disconnected, thereby electrically connecting the piezoelectric oscillator in a hermetically sealed state. Characteristics can be adjusted.

In recent years, there has been a tendency for circuit components other than the piezoelectric vibrator to be made into a monolithic IC.
As shown in (1), the electrical characteristics can be adjusted by connecting or disconnecting the wiring of the circuit component formed into an IC.

Further, according to the present invention, a wiring connected to a piezoelectric vibrator hermetically sealed in a piezoelectric oscillator is led out of a package, necessary electrical characteristics are checked, and then a necessary connection is made from the outside. Is another feature.

That is, in each of the above structures, the connection portion between the input / output terminal of the piezoelectric vibrator and the first circuit component is exposed to the outside of the package while being electrically disconnected. After the second electrode exposed portion is formed and the electrical characteristics of the piezoelectric vibrator are measured at the second electrode exposed portion, the cut connection portion is conductively joined.

According to the fourth aspect, since the input / output terminals of the piezoelectric vibrator are exposed to the outside without being connected to other circuits, the input / output terminals of the piezoelectric vibrator are not affected by other circuit components and are not affected by other circuit components. Properties can be measured. Therefore, TCX
In performing higher-precision compensation or control in O, VCXO, or the like, the characteristics of the piezoelectric vibrator alone can be confirmed, and the connection of the adjustment element for compensation or control corresponding to the confirmed characteristics can be performed.

[0015] Claim 5 discloses the configuration and arrangement of the electrode exposed portion. A concave portion is provided on either the bottom surface or the side surface of the package, or both the bottom surface and the side surface, and the first concave portion is provided in the concave portion. Or the second electrode exposed portion is formed.

[0016] Further, in claim 6, a connection structure at the electrode exposed portion is disclosed, and the electrical connection at the first electrode exposed portion or the second electrode exposed portion is made of a bonding wire, a conductive adhesive or a metal terminal. It is characterized in that it is performed by conductive bonding of the pieces.

[0017] Further, as set forth in claim 7, the concave portion may be filled with a resin after the electrical connection or disconnection processing of each electrode exposed portion. Since the conductor at the connection portion can be protected by filling the resin, the connection state or the disconnection state can be stably performed.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a crystal oscillation circuit diagram showing an embodiment of the present invention, FIG. 2 is an exploded perspective view of a crystal oscillator storing the circuit configuration of FIG. 1, and FIG. 3 is an inside of FIG. FIG. 4 is a sectional view and FIG. 4 is a bottom view.

The crystal oscillating circuit shown in FIG. 1 has an inverter A1 composed of transistors, a crystal oscillator Q arranged between the input and output terminals of the inverter A1, a feedback resistor R also connected between the input and output terminals. And capacitors C1 and C2 provided between the input / output terminals and the ground terminal. Frequency adjustment capacitors C3 and C4 are connected in parallel to the input terminal side of the inverter A1, and the other end of the capacitor is connectable to a ground terminal. The output from the inverter A1 is connected to the buffer inverter A2. In this embodiment, the inverters A1 and A2, the feedback resistor R, and the capacitors C1 and C2
Are the first circuit components, and the capacitors C3 and C4 are the second circuit components. As will be described later, the first circuit component and the second circuit component are integrated into one chip in the IC 33 (the configuration within the dotted line in FIG. 1 except for the crystal oscillator Q).
Have been.

FIG. 2 shows a crystal oscillator in which these circuit components are housed. The ceramic package 1, an IC 33 and a crystal diaphragm 3 housed in the package,
And a metal lid 2 for hermetically sealing the package.

The ceramic package 1 is made of ceramics such as alumina, and has a configuration in which an upper storage portion 12 opened upward as a whole and a lower storage portion 13 opened downward. The upper accommodating portion 12 is formed with a two-stage concave portion, and a lower lower concave portion 12a and an upper concave portion 12b thereon are formed. An IC 33 is formed in the lower concave portion 12a, and electrode pads 14 and 15 are formed in the upper concave portion. The crystal resonator 3 is mounted on the electrode pads 14 and 15. These electrode pads 14 and 15 are IC
33 and is electrically connected. The electrode pads for the IC 33 are not shown. Further, first electrode exposed portions 16, 17, 18 are formed in the lower housing portion 13, and the electrode exposed portions 16, 17 are respectively provided with the capacitors C3, C3 shown in FIG.
Although it is electrically connected to C4, the electrode exposed portion 18 is connected to the ground terminal. However, in the present embodiment, each electrode is not electrically connected at the initial stage (stage before adjustment).

Further, castellations 1a, 1b, 1c, 1d are provided on the side surfaces of the ceramic package, and lead-out electrodes E1, E2, E3, E4 are formed inside the castellations and on the bottom surface of the package, respectively. The output terminal, the power supply terminal, and the ground terminal of the crystal oscillation circuit composed of the element and the IC are drawn out correspondingly.

The quartz oscillator 3 is formed of a rectangular AT-cut quartz plate, and excitation electrodes 31 and 32 (32 are not shown) and extraction electrodes 311 and 321 (321 are not shown) are formed on the front and back surfaces by vacuum evaporation. And the like. (Corresponding to the crystal unit Q in FIG. 1)
Reference numeral 3 denotes a one-chip IC in which the first circuit component and the second circuit component for adjustment are formed into a one-chip IC, and a plurality of input / output electrode pads (not shown) are formed.

The metal cover 2 has a structure in which a metal plate such as Kovar is plated with nickel on the front and back surfaces thereof. The metal cover 2 is joined to the metal seal portion 11 around the opening of the ceramic package by means of seam welding or the like. Seal tightly. Note that the metal seal portion 11 is electrically connected to the ground terminal, and has an electromagnetic shield configuration.

Next, the procedure for adjusting the electrical characteristics in the present embodiment will be described. IC in ceramic package 3
33, and make necessary electrical connections. In this embodiment, I
Although C33 is mounted on a flip chip and not shown in the drawing, a plurality of electrode pads formed on the ceramic package 3 and the electrode pads of the IC are electrically connected. Next, the crystal oscillator 3 is cantilevered on the electrode pads 14 and 15, and is conductively joined with a conductive resin adhesive. In this state, an operation of adjusting the electric characteristics of the crystal unit, for example, a metal material is partially vapor-deposited and adjusted to a desired oscillation frequency. Thereafter, the ceramic package 2 is hermetically sealed with a metal lid.

Next, the electrical characteristics of the crystal oscillator are measured, and if the electrical characteristics deviate from a predetermined characteristic range, adjustment is performed using the electrode exposed portions. For example, the electrode exposed portions 16 and 18 are electrically connected by a bonding wire W1, and the capacitor C3 shown in FIG. 1 is connected to a ground terminal (electric connection S
1) Yes. By adding a capacitor in this way, the output oscillation frequency is reduced. Further, depending on the measurement result, a capacitor C4 having a different constant may be connected (electric connection S2). Furthermore, capacitor C3
And C4 are connected in parallel, it is possible to further reduce the oscillation frequency. These frequencies can be adjusted stepwise by using capacitors having different constants or by selecting combinations of the respective connections. After these adjustments are completed, the lower housing portion 13 can be protected by filling the lower housing portion 13 with an insulating resin (not shown).

A second embodiment according to the present invention will be described with reference to FIGS. 5, 6, and 7, taking a temperature-compensated crystal oscillator as an example. FIG. 5 is a crystal oscillation circuit diagram showing the second embodiment, FIG. 6 is an internal cross-sectional view in a state of being hermetically sealed with a metal lid, and FIG. 7 is a bottom view. The basic configuration is similar to that of the first embodiment, and the same components are denoted by the same reference numerals, and a description thereof is partially omitted.

In the second embodiment, the wiring connected to the piezoelectric vibrator hermetically sealed in the piezoelectric oscillator is led out of the package, necessary electric characteristics are checked, and then the wiring is connected to the outside. Make the necessary connections to. Thereafter, wiring for making the circuit component function as an adjusting element is connected or cut to adjust.

The basic configuration of the crystal oscillation circuit shown in FIG. 5 is the same as that shown in FIG. 1, except that the input / output terminals of the crystal unit Q are initially disconnected. I have. Although not shown, a temperature compensation circuit is formed outside the crystal oscillation circuit. In this embodiment, the inverters A1 and A2, the feedback resistor R and the capacitor C1
C2 is the first circuit component, and the capacitors C3 and C4 and the temperature compensation circuit (not shown) are the second circuit components. The first circuit component and the second circuit component are IC
34, a one-chip IC is formed.

FIG. 6 shows a crystal oscillator accommodating these circuit components, which comprises a ceramic package 1, an IC 34 stored in the package, a crystal diaphragm 3, and a metal lid 2 for hermetically sealing the package. .

The configuration difference from the first embodiment is as follows.
The configuration of the lower housing 13 relating to the connection configuration of the crystal unit, the point that a circuit element for temperature compensation is incorporated inside the IC 34, and the electrical connection configuration of the IC 34 and the ceramic package. The ceramic package 1 is made of ceramics such as alumina, and has an upper storage portion 12 opened upward as a whole and a lower storage portion 13 opened downward as a whole.
It is a structure which has. The upper housing portion 12 has a two-stage recess, and a lower lower recess 12a and an upper recess 12b thereon. IC3 is provided in lower concave portion 12a.
4, and are electrically connected to the electrode pads 43, 44 and the like by bonding wires W3 and W4. Electrode pads 41 and 42 are formed in the upper concave portion, and the crystal resonator 3 is mounted on the electrode pads. Electrode pad 41,
42 (41 not shown) are predetermined electrode wirings 411, 42
1 connects to electrode exposure portions 45 and 46 to be described later.

The lower receiving portion 13 has electrode exposed portions 45-51.
Are formed, of which the electrode exposed portions 45 and 46 are respectively connected to the input / output terminals of the crystal oscillator, and finally connected to the electrode exposed portions 47 and 48, whereby the crystal oscillator is connected to other circuit components. Connected. Electrode exposed part 4
9, 50 and 51 are capacitors C3 and C3 shown in FIG.
Although it is electrically connected to C4, the electrode exposed portion 51 is connected to the ground terminal. However, in the present embodiment, each electrode is not electrically connected in the initial stage (stage before adjustment).

Castellations 1a, 1b, 1c, 1d are provided on the side surfaces of the ceramic package, and lead-out electrodes E1, E2, E3, E4 are formed inside the castellations and on the bottom surface of the package, respectively. The output terminal, the power supply terminal, and the ground terminal of the crystal oscillation circuit composed of the element and the IC are drawn out correspondingly.

The quartz oscillator 3 is formed of a rectangular AT-cut quartz plate, and excitation electrodes 31 and 32 (32 are not shown) and extraction electrodes 311 and 321 (321 are not shown) are formed on the front and back surfaces by vacuum evaporation. And the like. (Corresponding to the crystal unit Q in FIG. 5)
Reference numeral 4 denotes a one-chip IC in which the above-described first circuit component and the second circuit component for adjustment are formed into a one-chip IC, and a plurality of electrode pads (not shown) are formed.

The metal cover 2 has a structure in which a metal plate such as Kovar is nickel-plated on the front and back surfaces thereof, and is joined to the metal seal portion 11 around the opening of the ceramic package by means of seam welding or the like. Seal tightly. Note that the metal seal portion is electrically connected to the ground terminal, and has an electromagnetic shield configuration.

Next, the procedure for adjusting the electrical characteristics in the second embodiment will be described. The IC 34 is housed in the ceramic package 3 and necessary electric connection is performed by wire bonding. Next, the crystal unit 3 is
42, and are conductively bonded with a conductive resin adhesive. In this state, an operation of adjusting the electric characteristics of the crystal unit, for example, a metal material is partially vapor-deposited and adjusted to a desired oscillation frequency. Thereafter, the ceramic package 2 is hermetically sealed with a metal lid.

Using the electrode exposed portions 45 and 46,
The electrical characteristics of only the hermetically sealed quartz resonator are measured. Thereafter, the electrode exposed portions 45 and 47, the electrode exposed portion 46
And 48 are connected by bonding wires W5 and W6, thereby making electrical connections S1 and S2, and measuring the characteristics of the crystal oscillator. Based on the measurement results of the electric characteristics of the quartz oscillator alone and the measurement results of the electric characteristics of the crystal oscillator, an optimum adjustment condition is selected within an adjustable range, and adjustment is performed using the electrode exposed portions 49, 50, and 51. Do. For example, the electrode exposed portions 49 and 51 are electrically connected by a bonding wire W7, and the capacitor C3 shown in FIG. 5 is connected to a ground terminal. Further, depending on the measurement result, the electrode exposed portions 50 and 51 may be connected to each other and a capacitor C4 having a different constant may be connected. Further, by connecting both the capacitors C3 and C4 in parallel, the oscillation frequency can be further reduced. These frequencies can be adjusted stepwise by using capacitors having different constants or by selecting combinations of the respective connections. In the adjustment of the electrical characteristics after the hermetic sealing as described above, by taking into account the characteristics of the quartz oscillator alone, the TC
More accurate compensation or control can be performed in XO, VCXO, and the like.

A third embodiment according to the present invention will be described with reference to FIG. 8, taking a temperature-compensated crystal oscillator as an example. FIG.
FIG. 9 is a perspective view of a crystal oscillator according to a third embodiment. The basic configuration is similar to that of the first or second embodiment.
Some explanations are omitted.

In the third embodiment, an electrode exposed portion formed outside the package of the piezoelectric oscillator is provided on the side surface in addition to the bottom surface, and a pair of electrodes of the electrode exposed portion provided on the side surface are provided. Is different from each of the above embodiments in that the connection is made by a conductive adhesive.

The side surfaces of the ceramic package 1 are provided with side recesses 61 and 62, and in each recess, an electrode exposed portion 61 is provided.
1, 612 and electrode exposed portions 621, 622 are formed. These electrode exposed portions are connected to the adjustment circuit elements of the IC mounted inside the package, and the function of each adjustment circuit element can be exhibited by short-circuiting these electrode exposed portions. The electrical connection of the electrode exposed portion is performed by applying a conductive adhesive S. Note that a metal terminal piece may be conductively bonded instead of the conductive adhesive. According to the present embodiment, since the electrode exposed portion is formed on the side surface, the connection state can be easily checked, and the conductive adhesive is used for the wire bonding like the side surface of the package by using the conductive connecting means. It is possible to easily and reliably secure conduction even in a position where it is difficult.

The present invention is not limited to the above embodiment. For example, by increasing the number of exposed electrodes connected to the adjustment element, the number of means for connecting or disconnecting the wiring to the temperature compensation element is increased. Thereby, the range of adjustment may be expanded, or adjustment in more stages may be made possible. Further, the piezoelectric vibrator may be made of not only a crystal vibrator but also a piezoelectric single crystal material such as piezoelectric ceramics or LiNbO3.

In the electrode exposed portion of the adjustment circuit element, the electrical characteristics may be adjusted by connecting the electrode in the initial stage and disconnecting the connection in the adjustment stage. May be configured such that electrodes are formed in an initial stage, and adjustment may be performed by cutting the electrodes with a laser beam or the like.

[0043]

According to the present invention, a circuit component for adjusting the electric characteristics of the piezoelectric oscillation circuit is incorporated in the piezoelectric oscillator in advance, and the adjustment of the electric characteristics is performed by the wiring for making the circuit component function as an adjustment element. By connecting or disconnecting. Therefore, it is not necessary to use a variable circuit constant variable element such as a variable capacitor having a high component cost, and the electric characteristics can be adjusted with a simple configuration. Therefore, an inexpensive piezoelectric oscillator whose electric characteristics can be adjusted can be obtained. In particular, according to the second aspect of the present invention, since the electrode exposed portion is provided outside the package, by connecting or disconnecting the wiring of the electrode exposed portion, the electrical characteristics of the piezoelectric oscillator in a hermetically sealed state are obtained. Can be adjusted.

In recent years, there has been a tendency for circuit components other than the piezoelectric vibrator to be monolithic ICs. According to the third aspect, in addition to the effects described above, even when the circuit component is formed into an IC as described above, the electrical characteristics can be adjusted by connecting or disconnecting the conductive path connected to the circuit component. .

According to the fourth aspect, since the input / output terminals of the piezoelectric vibrator are exposed to the outside without being connected to other circuits, the input / output terminals of the piezoelectric vibrator are not affected by other circuit components and are not affected by other circuit components. Properties can be measured. Therefore, higher-precision compensation or control can be performed, so that electrical characteristics can be more efficiently and accurately adjusted in a TCXO, a VCXO, or the like that requires high precision.

According to the fifth aspect, in addition to the above-described effects, since the adjusting portion is provided at a plurality of portions, it is possible to obtain a highly reliable piezoelectric vibrator without short-circuit between electrodes.

According to the seventh aspect, since the conductor at the connection portion can be protected by filling with resin, the connection state or the disconnection state can be stably performed.

[Brief description of the drawings]

FIG. 1 is a crystal oscillation circuit diagram showing a first embodiment.

FIG. 2 is an exploded perspective view showing the first embodiment.

FIG. 3 is an internal cross-sectional view of a state where the components of FIG. 2 are assembled.

FIG. 4 is a bottom view of FIG. 2;

FIG. 5 is a crystal oscillation circuit diagram showing a second embodiment.

FIG. 6 is an internal sectional view showing a second embodiment.

FIG. 7 is a bottom view showing the second embodiment.

FIG. 8 is a perspective view showing a third embodiment.

FIG. 9 shows a conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Quartz crystal resonator 10 Ceramic package 11 Metal layer 2 Lid 21 Metal layer 3 Quartz vibrating plate (piezoelectric vibrating plate) 33, 34 IC 12 Upper accommodating part 13 Lower accommodating part 16, 17, 18, 45, 46, 47, 48, 49,5
0,51 Electrode exposed part 161,411,421,431,441 Electrode wiring W1, W2, W3, W4, W5, W6, W7, W8 Bonding wire

Continuing on the front page (72) Inventor Shunsuke Shigematsu 1389 Kono, Koza, Hiraoka-cho, Kakogawa-shi, Hyogo F term (reference) 5J079 AA04 BA12 BA43 DA16 FA14 FA21 FB03 FB48 GA04 GA09 GB04 HA03 HA07 HA09 HA14 HA16 HA28 HA29 KA05

Claims (7)

[Claims] 1. A package containing a piezoelectric vibrator, a first circuit component forming a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a second circuit component adjusting electric characteristics of the piezoelectric oscillation circuit, A piezoelectric oscillator electrically connected to each other by predetermined wiring, wherein the electric characteristics are adjusted by connecting or disconnecting a wiring that causes the second circuit component to function as an adjustment element. . 2. A first electrode exposed portion in which a part of a wiring for causing the second circuit component to function as an adjustment element is exposed to the outside of the hermetically sealed package,
By connecting or disconnecting the wiring of the electrode exposed part of
2. The piezoelectric oscillator according to claim 1, wherein the electric characteristics are adjusted. 3. The piezoelectric oscillator according to claim 1, wherein the first circuit component and the second circuit component are integrally formed as a one-chip IC. 4. A second electrode exposed portion which is exposed to the outside of the package in a state where a connection portion between an input / output terminal of the piezoelectric vibrator and the first circuit component is electrically disconnected, and forms a second electrode exposed portion.
4. The piezoelectric oscillator according to claim 1, wherein after the electrical characteristics of the piezoelectric vibrator are measured at the exposed portions of the electrodes, the cut connection portions are conductively bonded. 5. 5. The package according to claim 1, wherein a concave portion is provided on one of the bottom surface and the side surface, or both the bottom surface and the side surface, and the first electrode exposed portion or the second electrode exposed portion is formed in the concave portion. The piezoelectric oscillator according to any one of claims 1 to 4, wherein: 6. The electrical connection at the first electrode exposed portion or the second electrode exposed portion is made by a bonding wire, a conductive adhesive, or conductive bonding of a metal terminal piece. The piezoelectric oscillator according to claim 5. 7. The piezoelectric oscillator according to claim 5, wherein the concave portion is filled with a resin after an electrical connection or disconnection process of each electrode exposed portion.