JP5052940B2 - Piezoelectric oscillator - Google Patents

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device or the like.

FIG. 5 is an exploded perspective view showing a conventional piezoelectric oscillator. As shown in FIG. 5, the conventional piezoelectric oscillator 200 mainly includes a container body 201 having a recessed space 205, a piezoelectric vibration element 202, an integrated circuit element 203, and a lid body 204.
The container body 201 is formed of a substantially rectangular parallelepiped made of a ceramic material or the like, and a recessed space 205 is formed in one main surface. A mounting portion 206 is formed in the recessed space at a position higher than the bottom surface in the recessed space. Has been.
The piezoelectric vibration element 202 is mounted on a piezoelectric vibration element mounting pad formed in the mounting portion 206.
The integrated circuit element 203 is mounted on an integrated circuit element mounting pad formed on the bottom surface in the recessed space of the container body 201.
The lid 204 is placed on the concave space of the container body 201 and fixed to the top of the side wall of the container body 201, whereby the concave space is hermetically sealed.
In such a piezoelectric oscillator 200, a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal, which are external connection electrode terminals, are formed at the four corners of the other main surface of the container body 201. Is known (see, for example, Patent Document 1).

Further, two through holes 207 extending in the vertical direction are formed on the side surface on one short side of the container body 201, and a monitor electrode terminal 208 is provided in the central portion of the through hole 207.
When measuring the characteristics of the piezoelectric vibration element 202, a pair of contact probes are juxtaposed from one direction and brought into contact with the monitor electrode terminal 208, whereby characteristics such as a CI (crystal impedance) value and frequency of the piezoelectric vibration element 201 are measured. Is measured (see, for example, Patent Document 2).

JP 2002-111435 A (page 5-6, FIG. 2) JP 2004-214799 A

However, in the conventional piezoelectric oscillator 200, as the miniaturization progresses, the interval between the two through holes formed on one side surface becomes narrow. Furthermore, the formation area of the monitor electrode terminal 208 formed in the through hole is also reduced. As a result, there is a problem that the probes that are in contact with the through-hole 207 come into contact with each other, and the monitor electrode terminal cannot be contacted correctly.
In addition, in order to prevent contact failure, the tip of the contact probe is attached to the portion other than the monitor electrode terminal in the through hole 207 by bringing the contact probe into contact with the monitor electrode terminal 208 in the through hole 207 many times. There has been a problem that the container body 201 is in contact with the container body 201 and is cracked or chipped.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a piezoelectric oscillator having a structure in which measurement can be easily performed even if the size of the piezoelectric oscillator is reduced.

The present invention has been made to solve the above-described problems. A container body having a concave space on one main surface, a piezoelectric vibration element and an integrated circuit element mounted in the concave space, and a concave space are provided. A piezoelectric oscillator including a lid for hermetically sealing, wherein a monitor electrode terminal forming portion on which a monitor electrode terminal is formed is formed to be recessed toward the concave space side from the outer side surface on the short side of the container body One electrode terminal forming portion for monitoring is formed on each of the opposing outer side surfaces of the container body, and a groove is formed at the boundary between the outer side surface of the container body and the monitoring electrode terminal forming portion. It is characterized by being.

  According to the piezoelectric oscillator of the present invention, even when the piezoelectric oscillator is downsized, the monitor terminal forming portion on which the monitor electrode terminal is formed is formed to be recessed toward the recessed space side from the outer side surface of the container body. Therefore, the area of the monitor electrode terminal can be ensured, and contact failure of the contact probes can be prevented without contact of the contact probes. Therefore, it is possible to accurately measure the characteristics of the piezoelectric vibration element.

Furthermore, when the groove is formed at the boundary between the outer side surface of the container body and the monitor terminal forming portion, when the contact probe is brought into contact with the monitor electrode terminal formed in the monitor electrode terminal forming portion, If the corners of the contact probe are set within the groove, the corners of the contact probe do not contact the container body, so that cracks and cracks can be prevented.
Further, since the groove portion is formed, it is possible to prevent the monitoring electrode terminal formed in the monitoring electrode terminal forming portion from being short-circuited with the external connection electrode terminal.

Hereinafter, a detailed description of an embodiment of a piezoelectric oscillator according to the present invention will be given with reference to the drawings.
FIG. 1 is an exploded perspective view showing an example of a piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a piezoelectric oscillator according to an embodiment of the present invention. FIG. 3 is a plan view showing an example of a container body of a piezoelectric oscillator according to an embodiment of the present invention.
FIG. 4 is a plan view showing a state in which the contact probe is brought into contact with the piezoelectric oscillator according to the embodiment of the present invention.
Moreover, in each figure, a part of structure is not shown in order to clarify description. Further, some of the illustrated dimensions are exaggerated.

  As shown in FIGS. 1 to 4, the piezoelectric oscillator 100 according to the embodiment of the present invention includes a container body in which a recessed space 11 is formed on one main surface, and piezoelectric vibration in the recessed space 11 of the container body 10. An integrated circuit element 30 including an element 20 and an electronic circuit network such as an oscillation circuit and a frequency adjusting circuit electrically connected to the piezoelectric vibration element 20 is mounted, and the piezoelectric vibration element 20 and the integrated circuit element 30 are covered by a lid 50. Has a structure in which the recessed space 11 in which is mounted is hermetically sealed.

For example, a quartz base plate is used as the piezoelectric vibration element 20. Excitation electrodes 21 are formed on both the front and back main surfaces of the quartz base plate, and an alternating voltage from the outside passes through the excitation electrode 21. When applied to a quartz base plate, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to external processing, and has a planar shape of, for example, a quadrangle.
Such a piezoelectric vibration element 20 includes an excitation electrode 21 attached to both main surfaces of the piezoelectric vibration element 20 and a piezoelectric vibration element mounting pad 15 formed on the opening side surface of the mounting portion 16 in the recessed space 11. It is mounted on the mounting portion 16 of the recessed space 11 by being electrically and mechanically connected via the conductive adhesive 40. The mounting portion 16 is formed to be higher than the bottom surface of the recessed space 11. Further, the piezoelectric vibration element mounting pad 15 is connected to the integrated circuit element 30 via the wiring conductor and via hole conductor inside the container body 10 and the integrated circuit element connecting electrode pad 14 formed on the bottom surface in the recessed space. Electrically connected.

  The conductive adhesive 40 contains a conductive filler in a silicone resin, and examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten (W), platinum (Pt), One containing palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used.

  The integrated circuit element 30 is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element 20 on the circuit forming surface, and an output signal generated by the oscillation circuit is piezoelectric via an external connection electrode terminal 13. The signal is output outside the oscillator and used as a reference signal such as a clock signal. The integrated circuit element 30 is mounted on an integrated circuit element mounting pad 14 described later formed in the recessed space 11 of the container body 10.

The container body 10 is formed, for example, by laminating a plurality of insulating layers made of a ceramic material such as alumina ceramics, glass-ceramics, etc., and one main surface of the container body 10 has a rectangular shape that opens to a central region. A recessed space 11 having a shape is formed. An annular sealing conductor pattern 12 is formed on the entire circumference of the opening side top surface of the side wall portion of the container body 10 surrounding the recessed space 11. In the recessed space 11, a mounting portion 16 formed at a position higher than the bottom surface of the recessed space 11, a piezoelectric vibration element mounting pad 15 formed on the mounting portion 16, and a bottom surface of the recessed space 11 are provided. An integrated circuit element mounting pad 12 is provided. Further, a power supply voltage terminal, a ground terminal, an oscillation control terminal, and an oscillation output terminal which are external connection electrode terminals 13 are formed on the other main surface of the container body 10.
A monitor electrode terminal forming portion 17 is formed to be recessed toward the concave space 11 side of the container body 10.

  Further, the integrated circuit element mounting pad 14 is electrically and mechanically connected to the connection pad formed on the integrated circuit element 30, via a wiring conductor, a via hole conductor, etc. formed inside the container body 10. The external connection electrode terminal 13 is electrically connected to the oscillation output terminal, the oscillation control terminal, and the power supply voltage terminal.

The external connection electrode terminal 13 includes a power supply voltage terminal, a ground terminal, an oscillation control terminal, and an oscillation output terminal. These external connection electrode terminals 13 make the piezoelectric oscillator 100 an external electric circuit such as a mother board. When mounting, it is electrically connected to the circuit wiring of the external electric circuit by soldering or the like.
Further, if the ground terminal and the oscillation output terminal are arranged close to each other among the external connection electrode terminals 13, it is possible to effectively prevent noise from being superimposed on the oscillation signal output from the oscillation output terminal. it can. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

The monitor electrode terminal forming portion 17 is recessed toward the concave space 11 side from the one main surface of the container body 10 to the other main surface on the outer side surface on the short side of the container body 10. Not formed.
The monitor electrode terminals 18 are formed one by one on the plane of the monitor electrode terminal forming portion 17 provided on the opposite outer side surface of the container body 10. That is, the monitor electrode terminals 18 are formed in a pair on the outer side surface on the short side or the outer side surface on the long side of the container body 10.
The monitor electrode terminal 18 is connected to the piezoelectric vibration element 20 via a piezoelectric vibration element mounting pad 15 formed on the inner bottom surface of the concave space 11 of the container body 10.

Thus, by configuring the piezoelectric oscillator 100 according to the embodiment of the present invention, the monitor electrode terminal 18 is formed on the plane of the monitor electrode terminal forming portion 17 provided on the outer side surface of the container body 10. .
By bringing the contact probe 60 into contact with the monitoring electrode terminal 18 as shown in FIG. 4, the characteristics of the piezoelectric vibration element 20 such as CI (crystal impedance) and frequency are measured.
By forming the monitor electrode terminals 18 one by one on the plane of the monitor electrode terminal forming portion 17, the area of the monitor electrode terminal 18 can be secured, and the characteristics of the piezoelectric vibration element 20 can be accurately determined. It becomes possible to measure.
Further, if one monitoring electrode terminal 18 is formed on each of the opposing outer side surfaces of the container body 10 at two locations in total, the container body 10 is sandwiched between the contact probes 60 as shown in FIG. Therefore, the characteristics of the piezoelectric vibration element 20 can be accurately measured.

The groove portion 19 is formed at the boundary between the outer side surface of the container body 10 and the monitor electrode terminal forming portion 17.
The shape of the groove portion 19 is an arc shape or a polygonal shape, and is formed so as to be recessed toward the concave space 11 of the container body 10 from the monitor electrode terminal forming portion 17.
By forming the groove portion 19 in this manner, when the contact probe 60 is brought into contact with the monitor electrode terminal 18 formed in the monitor electrode terminal forming portion 17, the corners of the contact probe 60 are aligned with the container body 10. Therefore, the container body 10 can be prevented from cracking or chipping.
Further, the groove portion 19 can prevent the monitoring electrode terminal 18 formed in the monitoring electrode terminal forming portion 17 from being short-circuited with the external connection electrode terminal 13.

  When the container body 10 is made of alumina ceramics, a sealing conductor pattern 12 and external connection electrode terminals are formed on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. 13. Conductive paste to be integrated circuit element mounting pad 14, piezoelectric vibration element mounting pad 15 and the like, and conductive paste to be a via conductor in a through-hole previously punched by punching a ceramic green sheet Is manufactured by conventionally known screen printing, and a plurality of these are laminated and press-molded, followed by firing at a high temperature.

  In addition, the sealing conductor pattern 12 formed on the top surface of the side wall portion of the container body 10 includes, for example, a nickel (Ni) layer and gold (Au) on the surface of a base layer made of tungsten (W), molybdenum (Mo), or the like. ) Layers are sequentially deposited in a form that surrounds the container body 10 in an annular shape, and is formed to have a thickness of 10 μm to 25 μm. The sealing conductor pattern 12 includes a lid body 50 described later. 50 is bonded to the top surface of the side wall portion of the container body 10 via a sealing member 51 formed on the surface of the base layer made of W or Mo. By adopting a configuration in which the Ni layer and the Au layer are sequentially deposited, the wettability of the sealing member 51 with respect to the sealing conductor pattern 12 is improved, and the hermetic reliability and productivity of the piezoelectric oscillator 100 are improved. .

  The lid 50 is manufactured by adopting a conventionally known metal processing method and molding a metal such as 42 alloy into a predetermined shape, and a nickel (Ni) layer is formed on the upper surface of the lid 50. A gold tin (Au—Sn) layer, which is the sealing member 51, is formed at a location corresponding to the sealing conductor pattern 12 on the upper surface of the nickel (Ni) layer. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 51 can relieve unevenness of the sealing conductor pattern 12 and prevent a decrease in hermeticity. Further, if the sealing member 51 is too thin, the function is not sufficiently exhibited.

  The contact probe 60 is made of, for example, a conductive rubber, and is formed by embedding thin metal wires having a thickness of about 20 to 30 μm in the thickness direction of the rubber at regular intervals. Is electrically connected to the lower surface via a fine metal wire, but since the insulating rubber is interposed between the adjacent fine metal wires, it is electrically insulated, and the conduction of the rubber up and down However, an anisotropic conductive sheet that maintains insulation in the lateral direction is used.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
In the above-described embodiment, the quartz resonator element using quartz as the piezoelectric material constituting the piezoelectric resonator element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics may be used as the piezoelectric material. The piezoelectric vibration element may be used.

It is a disassembled perspective view which shows an example of the piezoelectric oscillator which concerns on embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator which concerns on embodiment of this invention. It is a top view which shows an example of the container body of the piezoelectric oscillator which shows embodiment of this invention. It is a top view which shows the state which made the contact probe contact the piezoelectric oscillator which shows embodiment of this invention. It is a disassembled perspective view which shows the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Recessed space 12 ... Conductive pattern for sealing 13 ... Electrode terminal for external connection 14 ... Integrated circuit element mounting pad 15 ... Piezoelectric vibration element mounting pad 16. ..Mounting portion 17 ... Monitor electrode terminal forming portion 18 ... Monitor electrode terminal 19 ... Groove portion 20 ... Piezoelectric vibration element (crystal vibration element)
DESCRIPTION OF SYMBOLS 21 ... Electrode for excitation 30 ... Integrated circuit element 40 ... Conductive adhesive 50 ... Lid 51 ... Sealing member 60 ... Contact probe 100 ... Piezoelectric oscillator

Claims (1)

A container body having a recessed space on one main surface;
A piezoelectric vibration element and an integrated circuit element mounted in the recess space;
A piezoelectric oscillator comprising a lid for hermetically sealing the recessed space,
The electrode terminal forming part for monitoring in which the electrode terminal for monitoring is formed is formed to be recessed toward the concave space side from the outer side surface of the container body,
Each of the monitor electrode terminal forming portions is formed on each of the opposing outer side surfaces of the container body ,
A piezoelectric oscillator , wherein a groove is formed at a boundary between an outer side surface of the container body and the monitor electrode terminal forming portion .

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