JP6818581B2

JP6818581B2 - Electronic component storage packages, electronic devices and electronic modules

Info

Publication number: JP6818581B2
Application number: JP2017029130A
Authority: JP
Inventors: 鬼塚　善友; 善友鬼塚
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2017-02-20
Filing date: 2017-02-20
Publication date: 2021-01-20
Anticipated expiration: 2037-02-20
Also published as: JP2018137534A; CN207868186U

Description

本発明は、圧電振動素子等の電子部品を収容するための電子部品収納用パッケージ等に関するものである。 The present invention relates to a package for storing electronic components for accommodating electronic components such as a piezoelectric vibrating element.

従来、圧電振動素子または半導体素子等の電子部品を搭載するための電子部品収納用パッケージとして、一般に、セラミック焼結体等からなる絶縁基板に電子部品が収容される搭載部が設けられたものが用いられる。電子装置が例えば温度補償型の圧電発振器であれば、圧電振動素子とその圧電振動素子に対して温度補償を行なう半導体素子とを収容するための圧電発振器用パッケージは、例えば酸化アルミニウム質焼結体等のセラミック焼結体からなる複数の絶縁層が積層されてなる絶縁基板の上面に、圧電振動素子および半導体素子を収容するための凹状の搭載部を設けた構造を有している。 Conventionally, as an electronic component storage package for mounting an electronic component such as a piezoelectric vibration element or a semiconductor element, generally, an insulating substrate made of a ceramic sintered body or the like is provided with a mounting portion for accommodating the electronic component. Used. If the electronic device is, for example, a temperature-compensated piezoelectric oscillator, the piezoelectric oscillator package for accommodating the piezoelectric vibrating element and the semiconductor element that performs temperature compensation for the piezoelectric vibrating element is, for example, an aluminum oxide sintered body. It has a structure in which a piezoelectric vibrating element and a concave mounting portion for accommodating the semiconductor element are provided on the upper surface of an insulating substrate in which a plurality of insulating layers made of a ceramic sintered body such as the above are laminated.

絶縁基板の上面には、搭載部を塞ぐように蓋体が接合される。このような電子部品収納用パッケージは、上面に電子部品の搭載部を有する平板状の基部、およびこの基部の上面に搭載部を取り囲んで積層された枠部を有する絶縁基板と、搭載部から基部の下面等にかけて形成された配線導体により基本的に構成されている。また、絶縁基板の外側面には、搭載した圧電振動素子から出力される周波数を確認するため、および圧電振動素子に対する温度補償のデータを半導体素子に書き込むためのプローブピンと電気的に接続される側面導体が形成されている。この側面導体は、例えば絶縁基板の長辺側の両側面等に一対として設けられた切欠きの内面に設けられており、この側面導体から絶縁基板の内部を通り、搭載部の内側に導通される配線導体を介して、半導体素子等の情報書き込み用電極に接続される搭載部内の配線導体にかけて電気的に接続されている。 A lid is joined to the upper surface of the insulating substrate so as to close the mounting portion. Such a package for storing electronic components includes an insulating substrate having a flat plate-shaped base having an electronic component mounting portion on the upper surface, and a frame portion laminated on the upper surface of the base so as to surround the mounting portion, and from the mounting portion to the base. It is basically composed of wiring conductors formed over the lower surface of the above. Further, on the outer surface of the insulating substrate, a side surface is electrically connected to a probe pin for confirming the frequency output from the mounted piezoelectric vibrating element and for writing temperature compensation data for the piezoelectric vibrating element to the semiconductor element. A conductor is formed. The side conductors are provided on the inner surface of a pair of notches provided on both side surfaces on the long side of the insulating substrate, for example, and are conducted from the side conductors through the inside of the insulating substrate to the inside of the mounting portion. It is electrically connected to the wiring conductor in the mounting portion connected to the information writing electrode of the semiconductor element or the like via the wiring conductor.

配線導体のうち、搭載部に設けられたものは電子部品が接続される接続導体として機能し、基部の下面（絶縁基板の下面）に設けられたものは、モジュール用基板へ半田付けするための外部接続導体として機能する。そして、搭載部に電子部品が搭載され、電子部品の各電極が接続導体に電気的に接続された後、搭載部が蓋体等で封止されて電子装置が製作される。 Of the wiring conductors, those provided on the mounting part function as connecting conductors to which electronic components are connected, and those provided on the lower surface of the base (lower surface of the insulating substrate) are for soldering to the module substrate. Functions as an external connecting conductor. Then, the electronic component is mounted on the mounting portion, and after each electrode of the electronic component is electrically connected to the connecting conductor, the mounting portion is sealed with a lid or the like to manufacture an electronic device.

特開2004−214799号公報Japanese Unexamined Patent Publication No. 2004-214799

しかしながら、近年、このような電子部品収納用パッケージおよび電子装置においては小型化が進んでおり、絶縁基板の一辺の長さが非常に小さくなってきている。そのため、プローブピンと電気的に接続される側面導体を十分な面積で形成するだけのスペースを絶縁基板の外面に確保することが困難となってきている。このような小型の絶縁基板を用いた圧電発振器においては、温度補償のデータを半導体素子に書き込むため等のプローブピンと電気的に接続される側面導体の面積が非常に小さなものとなるため、プローブピンを側面導体に当接させることによる調整作業は極めて煩雑であり、且つ効率が低下する工程となっていた。 However, in recent years, such electronic component storage packages and electronic devices have been miniaturized, and the length of one side of the insulating substrate has become extremely small. Therefore, it has become difficult to secure a space on the outer surface of the insulating substrate to form a side conductor electrically connected to the probe pin in a sufficient area. In a piezoelectric oscillator using such a small insulating substrate, the area of the side conductor electrically connected to the probe pin for writing temperature compensation data to the semiconductor element is very small, so that the probe pin The adjustment work by bringing the surface into contact with the side conductor is extremely complicated, and the efficiency is reduced.

本発明の１つの態様の電子部品収納用パッケージは、電子部品の搭載部を有した第１主面を有する基部と、前記第１主面と相対する第２主面に設けられた複数の外部接続導体と、前記基部の上面に前記搭載部を取り囲むように設けられ、第３主面を有する枠部と、該枠部の前記第３主面に設けられた枠状メタライズ層と、前記第１主面に電子部品が接続される複数の接続導体とを含んでおり、前記第２主面から前記基部の外周側面にかけて縦断面視で凹状のザグリ部が設けられており、該ザグリ部の主面は前記基部の外周下側方向へ傾斜しているとともに、前記ザグリ部内に傾斜導体が設けられており、前記接続導体と前記傾斜導体とはビア導体で接続されており、該ビア導体は、前記基体の中央側に向かって凸状の湾曲部を有しており、前記接続導体との接続部における断面積より前記傾斜導体との接続部における断面積が大きい。 The electronic component storage package according to one aspect of the present invention includes a base having a first main surface having a mounting portion for electronic components, and a plurality of external surfaces provided on a second main surface facing the first main surface. A connecting conductor, a frame portion provided on the upper surface of the base portion so as to surround the mounting portion and having a third main surface, a frame-shaped metallized layer provided on the third main surface of the frame portion, and the first. One main surface includes a plurality of connecting conductors to which electronic components are connected, and a concave counterbore portion is provided from the second main surface to the outer peripheral side surface of the base portion in a vertical cross-sectional view. The main surface is inclined downward from the outer periphery of the base portion, and an inclined conductor is provided in the counterbore portion. The connecting conductor and the inclined conductor are connected by a via conductor, and the via conductor is the has a convex curvature toward the central side of the substrate, the cross-sectional area of definitive connection portion of the inclined conductor than the cross sectional area at the connecting portion between the connection conductor is greater.

本発明の１つの態様の電子装置は、上記の電子部品収納用パッケージと、該電子部品収納用パッケージに搭載された電子部品とを有している。 The electronic device of one aspect of the present invention includes the above-mentioned electronic component storage package and electronic components mounted on the electronic component storage package.

本発明の１つの態様の電子モジュールは、上記の電子装置と、該電子装置が接続されたモジュール用基板とを有している。 The electronic module of one aspect of the present invention has the above-mentioned electronic device and a module substrate to which the electronic device is connected.

本発明の１つの態様の電子部品収納用パッケージによれば、電子部品を小型化したとしてもこのザグリ部に温度補償のデータを半導体素子に書き込むため等の傾斜導体を設けることができるため、検査用端子としての面積を大きくでき、検査用のプローブピンを当接させ易くなり、電子部品の電気特性の測定、および動作用の情報の入力等を容易に行うことができ、また、導通抵抗がより一層小さな配線構造を実現できるため、温度補償のデータを書き込む際等の入出力エラーを効果的に抑制できる。 According to one embodiment the electronic component storing package of the present invention, it is possible to provide an inclination conductor such as for writing data of the temperature compensation to the semiconductor element to the counterbore portion also electronic components as miniaturized, can increase the area of the test terminals, easily brought into contact with the probe pins for inspection, measurement of the electrical characteristics of the electronic components, and it is possible to easily perform input of information for operation, also, the conduction resistance since There can be realized a more smaller wiring structure, Ru can be effectively suppressed output error such writing the data of the temperature compensation.

本発明の１つの態様の電子装置によれば、上記の電子部品収納用パッケージを用いることにより、ザグリ部に十分な面積が確保された傾斜導体が設けられ、電子部品の電気特性の測定、および動作用の情報の入力等が容易に行われ、電気特性に優れた小型の電子装置を実現できる。 According to the electronic device of one aspect of the present invention, by using the above-mentioned electronic component storage package, an inclined conductor having a sufficient area is provided in the counterbore portion, and the electrical characteristics of the electronic component can be measured. Information for operation can be easily input, and a small electronic device having excellent electrical characteristics can be realized.

本発明の１つの態様の電子モジュールによれば、上記の電子装置を用いることにより、実装時の半田による短絡不良が低減され、実装信頼性に優れた電子装置が搭載された、動作信頼性に優れた電子モジュールを提供できる。 According to the electronic module of one aspect of the present invention, by using the above-mentioned electronic device, short-circuit defects due to soldering at the time of mounting are reduced, and an electronic device having excellent mounting reliability is mounted, resulting in operational reliability. It can provide excellent electronic modules.

（ａ）は本発明の実施形態の電子部品収納用パッケージおよび電子装置を示す上面透視図であり、（ｂ）は（ａ）のＸ−Ｘ’線における断面透視図である。(A) is a top perspective view showing an electronic component storage package and an electronic device according to an embodiment of the present invention, and (b) is a cross-sectional perspective view taken along line XX'of (a). 本発明の実施形態の電子部品収納用パッケージを示す側面透視図である。It is a side perspective view which shows the electronic component storage package of embodiment of this invention. （ａ）は本発明の実施形態の電子部品収納用パッケージの裏面を示す平面透視図であり、（ｂ）は（ａ）のＹ−Ｙ’線における断面透視図である。(A) is a plan perspective view showing the back surface of the electronic component storage package according to the embodiment of the present invention, and (b) is a cross-sectional perspective view taken along the line YY'of (a). 本発明の実施形態の電子部品収納用パッケージの要部を示す断面透視図である。It is sectional drawing which shows the main part of the electronic component accommodating package of embodiment of this invention. 本発明の実施形態の電子装置の検査工程を示す断面透視図である。It is sectional drawing which shows the inspection process of the electronic device of embodiment of this invention. 本発明の実施形態の電子モジュールを示す断面透視図である。It is sectional drawing which shows the electronic module of embodiment of this invention.

本発明の電子部品収納用パッケージ等について、添付の図面を参照しつつ説明する。図１（ａ）は本発明の電子部品収納用パッケージ、および電子装置の実施の形態の一例を示す上面透視図であり、図１（ｂ）は図１（ａ）のＸ−Ｘ’線における断面透視図であり、図２は側面透視図であり、図３（ａ）は裏面を示す平面透視図であり、（ｂ）は（ａ）の
Ｙ−Ｙ’線における断面透視図である。 The electronic component storage package and the like of the present invention will be described with reference to the accompanying drawings. FIG. 1 (a) is a top perspective view showing an example of an embodiment of the electronic component storage package and the electronic device of the present invention, and FIG. 1 (b) is taken along the line XX'of FIG. 1 (a). It is a cross-sectional perspective view, FIG. 2 is a side perspective view, FIG. 3 (a) is a plan perspective view showing a back surface, and (b) is a cross-sectional perspective view taken along the YY'line of (a).

図１において、100は電子部品収納用パッケージ、101は絶縁基板、102は基部、103は枠部、104は第１主面、105は第２主面、106は第３主面、107は搭載部、108は接続導体、109はザグリ部、110は傾斜導体、111は切欠き、112は圧電振動素子、113は半導体素子、114
は枠状メタライズ層、115は搭載パッド、116は接合材、117は外部接続導体、118はビア導体、119は段差部、120はプローブピンである。 In FIG. 1, 100 is a package for storing electronic components, 101 is an insulating substrate, 102 is a base, 103 is a frame, 104 is the first main surface, 105 is the second main surface, 106 is the third main surface, and 107 is mounted. Part, 108 is a connecting conductor, 109 is a counterbore part, 110 is an inclined conductor, 111 is a notch, 112 is a piezoelectric vibrating element, 113 is a semiconductor element, 114
Is a frame-shaped metallized layer, 115 is a mounting pad, 116 is a bonding material, 117 is an external connecting conductor, 118 is a via conductor, 119 is a stepped portion, and 120 is a probe pin.

電子部品収納用パッケージ100は、電子部品が搭載される搭載部107側に位置する第１主面104、およびモジュール用基板122への実装面側に位置する第２主面105を有している。
搭載部107には、圧電振動素子112等の電子部品が搭載される。絶縁基板101は、基部102、および枠部103から構成されている。そして、搭載部107に設けられた接続導体108、段差
部119の設けられた搭載パッド115、枠部103の第３主面106に設けられた枠状メタライズ層114、絶縁基板101の下面に設けられた外部接続導体117等から構成されている。 The electronic component storage package 100 has a first main surface 104 located on the mounting portion 107 side on which electronic components are mounted, and a second main surface 105 located on the mounting surface side on the module board 122. ..
Electronic components such as the piezoelectric vibration element 112 are mounted on the mounting portion 107. The insulating substrate 101 is composed of a base portion 102 and a frame portion 103. Then, the connecting conductor 108 provided on the mounting portion 107, the mounting pad 115 provided with the step portion 119, the frame-shaped metallized layer 114 provided on the third main surface 106 of the frame portion 103, and the lower surface of the insulating substrate 101 are provided. It is composed of the external connecting conductor 117 and the like.

また、この例の電子部品収納用パッケージ100では、圧電振動素子112が接続される搭載パッド115が、搭載部107の短辺側に設けられた段差部119の上面に一対として設けられて
いる。また、搭載部107の底面に設けられた複数の接続導体108には、半田等の接合材により半導体素子が接続されている。 Further, in the electronic component storage package 100 of this example, the mounting pads 115 to which the piezoelectric vibrating elements 112 are connected are provided as a pair on the upper surface of the stepped portion 119 provided on the short side side of the mounting portion 107. Further, semiconductor elements are connected to a plurality of connecting conductors 108 provided on the bottom surface of the mounting portion 107 by a bonding material such as solder.

なお、この実施の形態において、絶縁基板101は、厚み方向の断面透視で凹型の搭載部107を有している。この電子部品収納用パッケージ100に圧電振動素子等の電子部品が気密
封止されて電子装置200が設けられる。搭載部107を封止する蓋体121は、図１においては
見やすくするために省略し、また圧電振動素子112、半導体素子113については透視した図としている。 In this embodiment, the insulating substrate 101 has a concave mounting portion 107 in a cross-sectional perspective in the thickness direction. Electronic components such as piezoelectric vibrating elements are hermetically sealed in the electronic component storage package 100, and an electronic device 200 is provided. The lid 121 that seals the mounting portion 107 is omitted in FIG. 1 for the sake of clarity, and the piezoelectric vibration element 112 and the semiconductor element 113 are shown in perspective.

絶縁基板101は、例えば平板状の基部102上に、枠部103が積層されて構成されている。
また、平面視において、枠部103が基部102の上面の搭載部107を取り囲んでいる。この枠
部103の内側面と搭載部107の内側において露出する基部102とによって、電子部品を搭載
するための凹型の搭載部107が設けられている。 The insulating substrate 101 is configured by laminating a frame portion 103 on, for example, a flat plate-shaped base portion 102.
Further, in a plan view, the frame portion 103 surrounds the mounting portion 107 on the upper surface of the base portion 102. A concave mounting portion 107 for mounting electronic components is provided by the inner side surface of the frame portion 103 and the base portion 102 exposed inside the mounting portion 107.

枠部103および基部102は、例えば酸化アルミニウム質焼結体，窒化アルミニウム焼結体，ムライト質焼結体またはガラス−セラミック焼結体等のセラミック材料からなる。絶縁基板101は、例えば全体の外形が平面視で一辺の長さが1.6〜10ｍｍ程度の長方形状であり、厚みが0.3〜２ｍｍ程度の板状であり、その上面に凹型の搭載部107が設けられている。 The frame portion 103 and the base portion 102 are made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The insulating substrate 101 has, for example, a rectangular shape having a side length of about 1.6 to 10 mm and a plate shape having a thickness of about 0.3 to 2 mm in a plan view, and a concave mounting portion 107 is provided on the upper surface thereof. Has been done.

絶縁基板101は、基部102および枠部103が酸化アルミニウム質焼結体からなる場合であ
れば、酸化アルミニウム，酸化珪素，酸化マグネシウムおよび酸化カルシウム等の原料粉末に適当な有機バインダ，溶剤，可塑剤等を添加混合して泥漿状にするとともに、これを例えばドクターブレード法、ロールカレンダー法等のシート成形法によりシート状となすことにより複数枚のセラミックグリーンシートを得て、次に一部のセラミックグリーンシートに適当な打ち抜き加工を施して枠状に成形するとともに、枠状に成形していない平板状のセラミックグリーンシートの上面に、それぞれ枠状のセラミックグリーンシートが位置するように上下に積層し、その積層体を高温で焼成することにより製作できる。 In the case where the base 102 and the frame 103 are made of an aluminum oxide sintered body, the insulating substrate 101 has an organic binder, a solvent, and a plasticizer suitable for raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Etc. are added and mixed to form a slurry, and this is formed into a sheet by a sheet forming method such as a doctor blade method or a roll calendar method to obtain a plurality of ceramic green sheets, and then some ceramics. The green sheet is appropriately punched and molded into a frame shape, and the frame-shaped ceramic green sheet is laminated vertically on the upper surface of the flat plate-shaped ceramic green sheet that is not formed into a frame shape. , The laminate can be manufactured by firing at a high temperature.

絶縁基板101は、例えば、それぞれが個片の絶縁基板101になる配線基板領域が配列された母基板（図示せず）として作製された後に、個片に分割されて製作されている。母基板は、互いに積層された、基部102となる複数の領域を有する平板状の絶縁層（図示せず）
と、それぞれ枠部103となる複数の開口部が配列された複数の領域を有する絶縁層（図示
せず）とを有している。 The insulating substrate 101 is manufactured, for example, as a mother substrate (not shown) in which wiring board regions, each of which becomes an individual insulating substrate 101, are arranged, and then divided into individual pieces. The mother substrate is a flat insulating layer (not shown) laminated with each other and having a plurality of regions serving as a base 102.
And an insulating layer (not shown) having a plurality of regions in which a plurality of openings, each of which is a frame portion 103, are arranged.

枠部103は、上面に枠状メタライズ層114を有し、外側面に切欠き（図示せず）を有していてもよい。また、基部102には搭載部107に搭載される圧電振動素子112等の電子部品と
、モジュール用基板122の外部電気回路とを電気的に接続するための導電路として、接続
導体108、ビア導体118、および外部接続導体117等が設けられている。また、この例では
、絶縁基板101の外周に切欠き111が設けられているが、切欠き111が設けられていない絶
縁基板101としてもよい。また、電子部品収納用パッケージ100が小型化されたため、絶縁基板101の外周において、長辺側または短辺側には切欠きが設けられていない。 The frame portion 103 may have a frame-shaped metallized layer 114 on the upper surface and a notch (not shown) on the outer surface. Further, the base 102 has a connecting conductor 108 and a via conductor as a conductive path for electrically connecting an electronic component such as the piezoelectric vibrating element 112 mounted on the mounting portion 107 and an external electric circuit of the module substrate 122. 118, an external connecting conductor 117, etc. are provided. Further, in this example, although the notch 111 is provided on the outer periphery of the insulating substrate 101, the insulating substrate 101 may not be provided with the notch 111. Further, since the electronic component storage package 100 has been downsized, the outer periphery of the insulating substrate 101 is not provided with a notch on the long side or the short side.

また、絶縁基板101は、例えば１枚のシート状成形体の表面に、電子部品およびモジュ
ール用基板122と接続するための導体層、または蓋体と接合される枠状メタライズ層114となる導体層を、金属粉末ペーストを用いて印刷法等により印刷パターンとして形成しておき、この印刷パターンの一部が加圧治具の凸部に加圧されることにより製作してもよい。なお、使用されるシート状成型体やメタライズペーストに、添加するバインダーとしてガラス転移する温度が加圧治具で加圧されるときの温度以下のものを用いると、加圧治具でセラミックグリーンシート等を加圧した際に、枠部103や第３主面106等の成型を良好に行うことができる。 Further, the insulating substrate 101 is, for example, a conductor layer on the surface of one sheet-shaped molded body, which is a conductor layer for connecting to the electronic component and module substrate 122, or a frame-shaped metallized layer 114 to be joined to the lid. May be formed as a printing pattern by a printing method or the like using a metal powder paste, and a part of the printing pattern may be pressed against the convex portion of the pressurizing jig. If the binder to be added to the sheet-shaped molded body or metallized paste used is one in which the temperature at which the glass transitions to glass is equal to or lower than the temperature at which the glass is transferred by the pressure jig, the ceramic green sheet is used by the pressure jig. Etc. can be satisfactorily molded when the frame portion 103, the third main surface 106, etc. are pressed.

具体的には、一方の面に凸部を有する加圧治具を用意し、この加圧治具を用いて金属粉末ペーストの印刷パターンを形成したシート状成形体を加圧成形し、凸部に対応する部分が凹状の搭載部107となる加圧成形体を製作する。この場合、加圧治具の凸部が金属粉末
ペーストの印刷パターンの一部に重なるように加圧することにより、この加圧工程においてシート状成形体の表面に形成された印刷パターンのうち、凸部の周囲に対応する位置に設けられた印刷パターンは第３主面106に残留するように保持され、凸部で加圧された印
刷パターンは、シート状成形体の一方の面から凹部の底面（つまり、第１主面104）に向
かって移動しながら加圧時に変形して、凹部の底面に接続導体108、および搭載パッド115等が設けられる。こうして、凹状の搭載部107が設けられた絶縁基板101を製作することができる。 Specifically, a pressure jig having a convex portion on one surface is prepared, and a sheet-shaped molded body having a printed pattern of a metal powder paste formed by using this pressure jig is pressure-molded to form a convex portion. A pressure-molded body is manufactured in which the portion corresponding to is a concave mounting portion 107. In this case, by pressurizing the convex portion of the pressurizing jig so as to overlap a part of the printing pattern of the metal powder paste, the convex portion of the printing pattern formed on the surface of the sheet-shaped molded body in this pressurizing step is convex. The print pattern provided at the position corresponding to the periphery of the portion is held so as to remain on the third main surface 106, and the print pattern pressed by the convex portion is from one surface of the sheet-shaped molded body to the bottom surface of the concave portion. While moving toward (that is, the first main surface 104), it is deformed at the time of pressurization, and a connecting conductor 108, a mounting pad 115, and the like are provided on the bottom surface of the recess. In this way, the insulating substrate 101 provided with the concave mounting portion 107 can be manufactured.

ここで、電子装置がＴＣＸＯ（Temperature Compensated Crystal Oscillator、温度補償水晶発振器）等であり、圧電振動素子112、および半導体素子113等の複数の電子部品が搭載部107内に搭載される場合には、複数の電子部品が搭載される段差部119を有する搭載部を設けるために、枠部103が２層以上の絶縁層で構成されていてもよい。 Here, when the electronic device is a TCXO (Temperature Compensated Crystal Oscillator) or the like, and a plurality of electronic components such as the piezoelectric vibrating element 112 and the semiconductor element 113 are mounted in the mounting portion 107, The frame portion 103 may be composed of two or more insulating layers in order to provide a mounting portion having a stepped portion 119 on which a plurality of electronic components are mounted.

搭載部107は、例えば四角板状の電子部品に合わせて平面視で四角形状である。図１の
例では、その四角形状の搭載部107の互いに隣り合う２つの隅部に一対の搭載パッド115が設けられている。この搭載パッド115は、搭載部107に搭載される圧電振動素子112の電子
部品の電極（図示せず）を接続するための導体層として機能する。電子部品が圧電振動素子112であれば、通常、その外形が平面視で四角形状であり、その主面の隅部に接続用の
一対の電極（図示せず）が設けられている。そのような電極の接続を容易かつ確実に行なえるようにするために、搭載パッド115は搭載部107の隅部に設けられる。また、搭載部107の底部に設けられた複数の接続導体108は、半導体素子113の電子部品の電極（図示せず
）を接続するための導体層として機能する。 The mounting portion 107 has a rectangular shape in a plan view in accordance with, for example, a square plate-shaped electronic component. In the example of FIG. 1, a pair of mounting pads 115 are provided at two adjacent corners of the square mounting portion 107. The mounting pad 115 functions as a conductor layer for connecting electrodes (not shown) of electronic components of the piezoelectric vibrating element 112 mounted on the mounting portion 107. If the electronic component is a piezoelectric vibrating element 112, its outer shape is usually quadrangular in a plan view, and a pair of electrodes (not shown) for connection are provided at a corner of the main surface thereof. The mounting pads 115 are provided at the corners of the mounting portion 107 so that such electrodes can be easily and reliably connected. Further, the plurality of connecting conductors 108 provided at the bottom of the mounting portion 107 function as a conductor layer for connecting electrodes (not shown) of electronic components of the semiconductor element 113.

それぞれの電子部品の各電極と接続導体108、搭載パッド115との接続は、導電性接着剤や半田等の接合材116を介して行なわれる。すなわち、図１（ａ）、（ｂ）に示すように
、搭載部107の底部に設けられた複数の接続導体108に対向するように、半田等の接合材116が設けられた半導体素子113を搭載部107に位置決めしておき、加熱処理することで接合
材116が溶融し、半導体素子113の電極と接続導体108とが接続される。また、圧電振動素
子112の主面の隅部に設けられた一対の電極（図示せず）が、搭載部107の段差部119上に
設けられた一対の搭載パッド115に対向するように、圧電振動素子112を搭載部107に位置
決めして、あらかじめ搭載パッド115に被着させておいた導電性接着剤等の接合材116を加熱して硬化させ、圧電振動素子112の一対の電極と搭載パッド115とが接続される。 The connection between each electrode of each electronic component and the connecting conductor 108 and the mounting pad 115 is performed via a bonding material 116 such as a conductive adhesive or solder. That is, as shown in FIGS. 1A and 1B, the semiconductor element 113 provided with the bonding material 116 such as solder so as to face the plurality of connecting conductors 108 provided at the bottom of the mounting portion 107. By positioning it on the mounting portion 107 and heat-treating it, the bonding material 116 is melted, and the electrode of the semiconductor element 113 and the connecting conductor 108 are connected. Further, the piezoelectric vibration element 112 is piezoelectric so that the pair of electrodes (not shown) provided at the corners of the main surface of the piezoelectric vibrating element 112 faces the pair of mounting pads 115 provided on the stepped portion 119 of the mounting portion 107. The vibrating element 112 is positioned on the mounting portion 107, and the bonding material 116 such as the conductive adhesive that has been adhered to the mounting pad 115 in advance is heated and cured to cure the pair of electrodes of the piezoelectric vibrating element 112 and the mounting pad. 115 is connected.

なお、搭載部107に収納される電子部品は、この実施の形態の例では圧電振動素子112と半導体素子113を用いた例を説明しているので、上記のような位置に搭載パッド115、および接続導体108が設けられているが、その他の電子部品（図示せず）を搭載する場合、ま
たその他の電子部品を複数搭載する場合には、その電子部品の電極の配置に応じて接続導体108等の位置、形状を変えて設けられていてもよい。このようなその他の電子部品とし
ては、例えば、セラミック圧電素子、弾性表面波素子等の圧電素子，容量素子，感熱素子，および抵抗素子等が挙げられる。 As for the electronic components housed in the mounting portion 107, since the example in which the piezoelectric vibrating element 112 and the semiconductor element 113 are used is described in the example of this embodiment, the mounting pad 115 and the mounting pad 115 are positioned as described above. Although the connecting conductor 108 is provided, when other electronic components (not shown) are mounted, or when a plurality of other electronic components are mounted, the connecting conductor 108 is provided according to the arrangement of the electrodes of the electronic components. The positions and shapes of the components may be changed. Examples of such other electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, capacitive elements, heat-sensitive elements, and resistance elements.

本発明の１つの態様における電子部品収納用パッケージは、電子部品の搭載部107を有
した第１主面を104有する基部102と、第１主面104と相対する第２主面105に設けられた複数の外部接続導体117と、基部102の上面に搭載部107を取り囲むように設けられ、第３主
面106を有する枠部103と、枠部103の第３主面106に設けられた枠状メタライズ層114と、
第１主面104に電子部品が接続される複数の接続導体108とを含んでおり、第２主面105か
ら基部102の外周側面にかけて縦断面視で凹状のザグリ部109が設けられており、ザグリ部109の主面は基部102の外周下側方向へ傾斜しているとともに、ザグリ部109内に傾斜導体110が設けられている。 The electronic component storage package according to one aspect of the present invention is provided on a base 102 having 104 first main surfaces having a mounting portion 107 for electronic components and a second main surface 105 facing the first main surface 104. A plurality of external connecting conductors 117, a frame portion 103 provided on the upper surface of the base portion 102 so as to surround the mounting portion 107, and having a third main surface 106, and a frame provided on the third main surface 106 of the frame portion 103. State metallize layer 114 and
The first main surface 104 includes a plurality of connecting conductors 108 to which electronic components are connected, and a concave counterbore portion 109 in a vertical cross-sectional view is provided from the second main surface 105 to the outer peripheral side surface of the base 102. The main surface of the counterbore portion 109 is inclined downward on the outer circumference of the base portion 102, and an inclined conductor 110 is provided in the counterbore portion 109.

このような構造としたことから、電子部品を小型化したとしてもザグリ部109に温度補
償のデータを半導体素子113に書き込むため等の傾斜導体110を設けることができるため、検査用端子としての面積を大きく出来、検査用のプローブピン120を当接させ易くなり、
電子部品の電気特性の測定、および動作用の情報の入力等を容易に行うことができる。つまり、電子部品収納用パッケージ100が小型化して絶縁基板101の搭載部107を取り囲む枠
部103の幅が狭くなるとともに、絶縁基板101の厚みが小さくなっても、絶縁基板101の第
２主面105から側面にかけて検査用端子としての面積を大きくした傾斜導体110を設けることができるため、プローブピン120を当接させることが容易である。 With such a structure, even if the electronic component is miniaturized, an inclined conductor 110 for writing temperature compensation data to the semiconductor element 113 can be provided in the counterbore portion 109, so that the area as an inspection terminal can be provided. Can be made larger, making it easier to contact the probe pin 120 for inspection.
It is possible to easily measure the electrical characteristics of electronic components and input information for operation. That is, even if the electronic component storage package 100 is miniaturized and the width of the frame portion 103 surrounding the mounting portion 107 of the insulating substrate 101 is reduced and the thickness of the insulating substrate 101 is reduced, the second main surface of the insulating substrate 101 is reduced. Since the inclined conductor 110 having a large area as an inspection terminal can be provided from the 105 to the side surface, it is easy to bring the probe pin 120 into contact with the probe pin 120.

また、図２、図３（ｂ）で示したように、傾斜導体110はザグリ部109の内側に設けられており、プローブピン120を傾斜導体110に当接させた際にプローブピン120の当接直後の
反動によりプローブピン120に位置ずれが発生したとしても、プローブピン120はザグリ部109の内側で留まり易いため、半導体素子113への圧電振動素子112に対する温度補償のデ
ータ（情報）を書き込む際等の入出力エラーを抑制できる。このような傾斜導体110やザ
グリ部109は、図２、図３（ｂ）では直方体状の絶縁基板101の長辺側に四角形状で二対として設けた例を示したが、外部接続導体117を避けた絶縁基板101の第２主面105から側面
にかけた場所に、その他の形状、例えば円形状、楕円状、半円状等の形状で傾斜導体110
を設けてもよい。 Further, as shown in FIGS. 2 and 3B, the inclined conductor 110 is provided inside the counterbore portion 109, and when the probe pin 120 is brought into contact with the inclined conductor 110, the probe pin 120 is hit. Even if the probe pin 120 is misaligned due to the reaction immediately after contact, the probe pin 120 tends to stay inside the counterbore portion 109, so the temperature compensation data (information) for the piezoelectric vibration element 112 is written to the semiconductor element 113. I / O errors such as when can be suppressed. Although the inclined conductor 110 and the counterbore portion 109 are provided in pairs on the long side side of the rectangular parallelepiped insulating substrate 101 in FIGS. 2 and 3B, the external connecting conductor 117 is provided. In a place extending from the second main surface 105 of the insulating substrate 101 to the side surface, the inclined conductor 110 has other shapes such as a circular shape, an elliptical shape, and a semicircular shape.
May be provided.

なお、電子部品収納用パッケージ100に設けられる接続導体108、傾斜導体110、外部接
続導体117等の配線導体は、酸化腐食を防止するとともに、接続導体108と電子部品の電極との接続、傾斜導体110とプローブピン120との接触、外部接続導体117とモジュール用基
板122との接続等を容易なものとするために、それらの露出した表面に１〜20μｍ程度の
厚みのニッケルめっき層と0.1〜3.0μｍ程度の厚みの金めっき層とが順次被着されていてもよい。 Wiring conductors such as the connecting conductor 108, the inclined conductor 110, and the external connecting conductor 117 provided in the electronic component storage package 100 prevent oxidative corrosion, and connect the connecting conductor 108 to the electrode of the electronic component, and the inclined conductor. In order to facilitate the contact between 110 and the probe pin 120, the connection between the external connecting conductor 117 and the module substrate 122, etc., a nickel plating layer with a thickness of about 1 to 20 μm and 0.1 to 0.1 to the exposed surfaces thereof. A gold-plated layer having a thickness of about 3.0 μm may be sequentially adhered.

また、本発明の１つの態様における電子部品収納用パッケージ100は、傾斜導体110がザグリ部109の外縁から離間して設けられている。このような構造としたことから、傾斜導
体110が絶縁基板101の第２主面105からの上部に偏位する構造となり、モジュール用基板1
22の上部に設けられたその他の配線導体と傾斜導体110が接触することが抑制される。つ
まり、電子部品収納用パッケージ100を用いた電子装置200がモジュール用基板122に半田
等の接合材により接続される際、詳しくは電子部品収納用パッケージ100の第２主面105に設けられた外部接続導体117とモジュール用基板122の配線導体が接合材で接続される際に、図４で示すように傾斜導体110と第２主面105（ザグリ部109の外縁）との間が離間して
いることから、接合材の一部が傾斜導体110側に飛散したり拡がったりして、傾斜導体110が電位の異なる他の配線導体と短絡することが抑制される。 Further, in the electronic component storage package 100 according to one aspect of the present invention, the inclined conductor 110 is provided so as to be separated from the outer edge of the counterbore portion 109. Due to such a structure, the inclined conductor 110 is displaced upward from the second main surface 105 of the insulating substrate 101, and the module substrate 1
Contact between the other wiring conductors provided on the upper part of 22 and the inclined conductor 110 is suppressed. That is, when the electronic device 200 using the electronic component storage package 100 is connected to the module substrate 122 by a bonding material such as solder, in detail, the outside provided on the second main surface 105 of the electronic component storage package 100. When the connecting conductor 117 and the wiring conductor of the module substrate 122 are connected by a joining material, the inclined conductor 110 and the second main surface 105 (outer edge of the counterbore portion 109) are separated from each other as shown in FIG. Therefore, it is possible to prevent the inclined conductor 110 from being short-circuited with other wiring conductors having different potentials due to a part of the joining material being scattered or spread toward the inclined conductor 110 side.

傾斜導体110は、例えばタングステンやモリブデン，マンガン，銅，銀，パラジウム，
金等の金属材料からなり、メタライズ法やめっき法等により形成されている。ここでは、傾斜導体110を構成する金属材料としてモリブデンを選択し、メタライズ法で形成する場
合の一例について説明する。まず、モリブデンの粉末を有機溶剤やバインダなどとともに混練して、モリブデンのメタライズペーストを作製する。つぎに、絶縁基板101の基部102となるセラミックグリーンシートの下面（第２主面105となる面）に、傾斜導体110となるメタライズペーストをスクリーン印刷法により例えば二対の四角状として形成し、この傾斜導体110となるメタライズペーストを、加圧部分が傾斜した加圧治具で押し当てること
等で傾斜導体110を設けることができる。 The inclined conductor 110 includes, for example, tungsten, molybdenum, manganese, copper, silver, palladium, etc.
It is made of a metal material such as gold, and is formed by a metallizing method, a plating method, or the like. Here, an example in which molybdenum is selected as the metal material constituting the inclined conductor 110 and formed by the metallizing method will be described. First, molybdenum powder is kneaded with an organic solvent, a binder, or the like to prepare a molybdenum metallized paste. Next, a metallized paste to be the inclined conductor 110 is formed on the lower surface (the surface to be the second main surface 105) of the ceramic green sheet to be the base 102 of the insulating substrate 101 by a screen printing method, for example, as two pairs of squares. The inclined conductor 110 can be provided by pressing the metallized paste to be the inclined conductor 110 with a pressure jig having an inclined pressure portion.

この場合、傾斜導体110となるメタライズペーストを、加圧部分が傾斜した加圧治具で
押し当てる際に、ザグリ部109の主面においてメタライズペーストの一部が拡がる傾向が
ある。この場合、あらかじめ傾斜導体110となるメタライズペーストをザグリ部109となる領域の外縁から十分な間隔で離間するように設けることにより、加圧後のザグリ部109の
主面においてメタライズペーストの一部が拡がっても、その拡がりはザグリ部109の内側
で留まることから、傾斜導体110がザグリ部109の外縁から確実に離間して設けられた電子部品収納用パッケージ100を製作することができる。そして、傾斜導体110となるメタライズペーストが、加圧後にザグリ部109から第２主面105、および絶縁基板101の側面にはみ
出すことが抑制されるため、モジュール用基板122の上部に設けられたその他の配線導体
等と傾斜導体110が接触することが効果的に抑制される。 In this case, when the metallized paste to be the inclined conductor 110 is pressed by a pressure jig having an inclined pressure portion, a part of the metallize paste tends to spread on the main surface of the counterbore portion 109. In this case, by providing the metallized paste to be the inclined conductor 110 in advance so as to be separated from the outer edge of the region to be the counterbore portion 109 at a sufficient interval, a part of the metallized paste is formed on the main surface of the counterbore portion 109 after pressure. Even if it expands, the expansion remains inside the counterbore portion 109, so that it is possible to manufacture the electronic component storage package 100 in which the inclined conductor 110 is provided so as to be surely separated from the outer edge of the counterbore portion 109. Then, since the metallized paste serving as the inclined conductor 110 is prevented from protruding from the counterbore portion 109 to the second main surface 105 and the side surface of the insulating substrate 101 after pressurization, the other provided above the module substrate 122 is provided. The contact between the wiring conductor and the like of the inclined conductor 110 and the inclined conductor 110 is effectively suppressed.

また、本発明の１つの態様における電子部品収納用パッケージ100は、傾斜導体110の主面が、ザグリ部109の主面と同一平面となるように設けられている。このような構造とし
たことから、電子部品収納用パッケージ100の小型化が進み、傾斜導体110の面積が小さなものとなっても、絶縁基板101への接合強度が高い構造とすることができる。つまり、電
子部品収納用パッケージ100が小型化して絶縁基板101の搭載部107を取り囲む枠部103の幅が狭くなるとともに、絶縁基板101の厚みが小さくなり、絶縁基板101の第２主面105から
側面にかけて検査用端子としての面積を大きくした傾斜導体110を設けることができても
、プローブピン120を当接させる際の衝撃が傾斜導体110に加わることになる。この衝撃により、傾斜導体110の一部が剥がれたり欠けるようなダメージを受ける可能性があったが
、傾斜導体110の主面がザグリ部109の主面と同一平面となるように、傾斜導体110が絶縁
基板101のザグリ部109の内部へ埋設されることから、傾斜導体110の接合強度が高い構造
とすることができる。 Further, the electronic component storage package 100 according to one aspect of the present invention is provided so that the main surface of the inclined conductor 110 is flush with the main surface of the counterbore portion 109. With such a structure, even if the electronic component storage package 100 is miniaturized and the area of the inclined conductor 110 is small, the structure can have a high bonding strength to the insulating substrate 101. That is, the electronic component storage package 100 is miniaturized, the width of the frame portion 103 surrounding the mounting portion 107 of the insulating substrate 101 is narrowed, and the thickness of the insulating substrate 101 is reduced, from the second main surface 105 of the insulating substrate 101. Even if the inclined conductor 110 having a large area as an inspection terminal can be provided on the side surface, an impact when the probe pin 120 is brought into contact with the inclined conductor 110 is applied to the inclined conductor 110. Due to this impact, there was a possibility that a part of the inclined conductor 110 would be peeled off or chipped, but the inclined conductor 110 was made so that the main surface of the inclined conductor 110 was flush with the main surface of the counterbore portion 109. Is embedded inside the counterbore portion 109 of the insulating substrate 101, so that the structure in which the inclined conductor 110 has high bonding strength can be obtained.

このように傾斜導体110の主面が、ザグリ部109の主面と同一平面となるように設けるためには、例えば絶縁基板101となるシート状成形体の表面に、傾斜導体110となるメタライズペーストを加圧部分が傾斜した加圧治具で押し当てることにより、メタライズペーストの一部がザグリ部109の内側に埋設されるようにすればよい。加圧する前の絶縁基板101となるシート状成形体において、第１主面104となる領域（搭載部107）に複数の接続導体となるメタライズペーストが形成されており、また第２主面105となる領域（絶縁基板101の下面）に複数の外部接続導体117となるメタライズペーストが形成されており、第１主面104となる領域に形成されたメタライズペーストと、第２主面105となる領域に形成された
メタライズペーストは、それぞれビア導体118で接続されている。 In order to provide the main surface of the inclined conductor 110 so as to be flush with the main surface of the counterbore portion 109, for example, on the surface of the sheet-shaped molded body to be the insulating substrate 101, a metallized paste to be the inclined conductor 110. Is pressed by a pressure jig having an inclined pressure portion so that a part of the metallized paste is embedded inside the counterbore portion 109. In the sheet-shaped molded body that becomes the insulating substrate 101 before pressurization, metallized pastes that serve as a plurality of connecting conductors are formed in the region (mounting portion 107) that becomes the first main surface 104, and also with the second main surface 105. Metallized paste to be a plurality of external connecting conductors 117 is formed in the region (lower surface of the insulating substrate 101), and the metallized paste formed in the region to be the first main surface 104 and the region to be the second main surface 105. The metallized pastes formed in are connected by via conductors 118, respectively.

この絶縁基板101となるシート状成形体の表面に、傾斜導体110となるメタライズペーストを加圧部分が傾斜した加圧治具で押し当てることにより、図３（ｂ）、図４に示すように、メタライズペーストの一部がザグリ部109の内側に埋設されて傾斜導体110が形成されるとともに、ビア導体118が加圧されて、加圧する前のビア導体118よりも大きな断面積となる配線経路の湾曲部を有する構造とすることができる。この湾曲部により、搭載部107
に設けられた接続導体108と、ザグリ部109に設けられた傾斜導体110との距離が近いもの
となり、さらに大きな断面積で湾曲部を設けることが可能となり、導通抵抗がより小さな配線構造を実現できる。なお、ビア導体118は、加圧時の変形量の大きな領域において断
面積が大きく形成される。そして、図４に示すように、絶縁基板101の中央側に向かって
凸状に湾曲部が形成される。 As shown in FIGS. 3 (b) and 4 by pressing the metallized paste to be the inclined conductor 110 against the surface of the sheet-shaped molded body to be the insulating substrate 101 with a pressure jig having an inclined pressure portion. , A part of the metallized paste is embedded inside the counterbore portion 109 to form the inclined conductor 110, and the via conductor 118 is pressurized so that the cross-sectional area is larger than that of the via conductor 118 before the pressurization. The structure may have a curved portion of. Due to this curved part, the mounting part 107
The distance between the connecting conductor 108 provided in the counterbore portion 109 and the inclined conductor 110 provided in the counterbore portion 109 becomes shorter, and a curved portion can be provided with a larger cross-sectional area, realizing a wiring structure with a smaller conduction resistance. it can. The via conductor 118 is formed to have a large cross-sectional area in a region where the amount of deformation during pressurization is large. Then, as shown in FIG. 4, a curved portion is formed so as to be convex toward the center side of the insulating substrate 101.

また、ビア導体118が加圧される際に変形量が大きすぎると、ビア導体118が断線する可能性があるため、適度にビア導体118が加圧されて湾曲部が形成されるように、ビア導体118の形成位置が決定される。例えば、ビア導体118を加圧面となる第２主面105に近い側（ザグリ部109の下側）に設ければ、ビア導体118の変形量が小さくなり、ビア導体118が断
線する可能性が低くなる。また、第２主面105から離れた側（第１主面104に近い側）に設ければビア導体118の変形量が大きくなり、ビア導体118が断線する可能性が高くなる。 Further, if the amount of deformation is too large when the via conductor 118 is pressurized, the via conductor 118 may be disconnected. Therefore, the via conductor 118 is appropriately pressurized to form a curved portion. The formation position of the via conductor 118 is determined. For example, if the via conductor 118 is provided on the side close to the second main surface 105 which is the pressure surface (lower side of the counterbore portion 109), the amount of deformation of the via conductor 118 is reduced, and the via conductor 118 may be disconnected. It gets lower. Further, if it is provided on the side away from the second main surface 105 (the side closer to the first main surface 104), the amount of deformation of the via conductor 118 increases, and the possibility of disconnection of the via conductor 118 increases.

ここで、ビア導体118の変形量によるビア導体118の断線の可能性と、導通抵抗の変化とは相反するものであり、ビア導体118の変形量が小さくビア導体118の断線の可能性が低減される場合、ビア導体118の湾曲部の断面積が小さくなり、導通抵抗が小さくなり難い。
また、ビア導体118の変形量が大きくビア導体118の断線の可能性が高い場合、ビア導体118の湾曲部の断面積が大きくなり、導通抵抗が小さくなり易い。よって、ビア導体118の形成位置を変化させてビア導体118の変形量をコントロールすることにより、ビア導体118の断線を抑制しながら、導通抵抗がより小さな配線構造を有する電子部品収納用パッケージ100を実現できる。 Here, the possibility of disconnection of the via conductor 118 due to the deformation amount of the via conductor 118 and the change of the conduction resistance are contradictory, and the deformation amount of the via conductor 118 is small to reduce the possibility of disconnection of the via conductor 118. If this is the case, the cross-sectional area of the curved portion of the via conductor 118 will be small, and the conduction resistance will not be small.
Further, when the amount of deformation of the via conductor 118 is large and the possibility of disconnection of the via conductor 118 is high, the cross-sectional area of the curved portion of the via conductor 118 becomes large, and the conduction resistance tends to decrease. Therefore, by changing the forming position of the via conductor 118 to control the amount of deformation of the via conductor 118, the electronic component storage package 100 having a wiring structure having a smaller conduction resistance while suppressing disconnection of the via conductor 118 can be obtained. realizable.

また、本発明の１つの態様における電子部品収納用パッケージ100は、傾斜導体110が基部102と枠部103とに跨って設けられている。このような構造としたことから、電子部品が小型化してもザグリ部109に温度補償のデータを半導体素子113に書き込むため等の傾斜導体110を容易に設けることができる。よって、検査用端子としての面積をさらに大きく出
来、プローブピン120をさらに容易に当接させ易くなり、電子部品の電気特性の測定、お
よび動作用の情報の入力等を容易に行うことができる。つまり、電子部品収納用パッケージ100が小型化して絶縁基板101の搭載部107を取り囲む枠部103の幅が狭くなるとともに、絶縁基板101の厚みが小さくなっても、傾斜導体110が基部102と枠部103とに跨って設けられていることから、絶縁基板101の第２主面105から側面の基部102および枠部103にかけて検査用端子としての面積をさらに大きくした傾斜導体110を設けることができるため、プ
ローブピン120をさらに容易に当接させることができる。 Further, in the electronic component storage package 100 according to one aspect of the present invention, an inclined conductor 110 is provided straddling the base portion 102 and the frame portion 103. With such a structure, even if the electronic component is miniaturized, the inclined conductor 110 for writing the temperature compensation data to the semiconductor element 113 can be easily provided in the counterbore portion 109. Therefore, the area as the inspection terminal can be further increased, the probe pin 120 can be more easily brought into contact with the probe pin 120, the electrical characteristics of the electronic component can be measured, and information for operation can be easily input. That is, even if the electronic component storage package 100 is miniaturized and the width of the frame portion 103 surrounding the mounting portion 107 of the insulating substrate 101 is narrowed and the thickness of the insulating substrate 101 is reduced, the inclined conductor 110 is the base 102 and the frame. Since it is provided so as to straddle the portion 103, the inclined conductor 110 having a larger area as an inspection terminal can be provided from the second main surface 105 of the insulating substrate 101 to the side base portion 102 and the frame portion 103. Therefore, the probe pin 120 can be brought into contact with the probe pin 120 more easily.

このように、傾斜導体110が基部102と枠部103とに跨って設けられる構造とするために
は、例えば、絶縁基板101となるシート状成形体の表面に、傾斜導体110となるメタライズペーストを加圧部分が傾斜した加圧治具で押し当てることにより、図２（ｂ）、図４に示すように、メタライズペーストの一部がザグリ部109の内側に埋設されて傾斜導体110が形成されるとともに、ビア導体118が加圧されて、加圧する前のビア導体118よりも大きな断面積となる配線経路の湾曲部を有する構造とすることができる。この際、加圧により設けられたザグリ部109が基部102と枠部103とに跨って設けられているようにすればよい。そ
して、このザグリ部109に傾斜導体110が基部102と枠部103とに跨って設けられる。こうして形成された傾斜導体110は、搭載部107に設けられた接続導体108とビア導体118を介して
接続された構造となっており、このビア導体118は、図４に要部拡大図で示すように湾曲
部が設けられている。 In order to form the structure in which the inclined conductor 110 is provided so as to straddle the base portion 102 and the frame portion 103, for example, a metallized paste to be the inclined conductor 110 is applied to the surface of the sheet-shaped molded body to be the insulating substrate 101. By pressing the pressurized portion with an inclined pressurizing jig, a part of the metallized paste is embedded inside the counterbore portion 109 to form an inclined conductor 110 as shown in FIGS. 2 (b) and 4. At the same time, the via conductor 118 can be pressurized to have a structure having a curved portion of the wiring path having a larger cross-sectional area than the via conductor 118 before the pressurization. At this time, the counterbore portion 109 provided by pressurization may be provided so as to straddle the base portion 102 and the frame portion 103. An inclined conductor 110 is provided on the counterbore portion 109 so as to straddle the base portion 102 and the frame portion 103. The inclined conductor 110 formed in this way has a structure in which the connecting conductor 108 provided in the mounting portion 107 is connected via the via conductor 118, and the via conductor 118 is shown in an enlarged view of a main part in FIG. A curved portion is provided so as to.

そして、基部102と枠部103とに跨って設けられた傾斜導体110と接続されるこのビア導
体118の湾曲部により、搭載部107に設けられた接続導体108と、ザグリ部109に設けられた傾斜導体110との距離がさらに近いものとなり、さらに一層大きな断面積でビア導体118の湾曲部を設けることが可能となり、導通抵抗がより一層小さな配線構造を実現できる。よって、導通抵抗の悪化による半導体素子113への圧電振動素子112に対する温度補償のデータ（情報）を書き込む際等の入出力エラーを効果的に抑制できる。なお、ビア導体118は
、加圧時の変形量の大きな領域において断面積が大きく形成される。そして、図３（ｂ）、図４に示すように、絶縁基板101の中央側に向かって凸状に湾曲部が形成される。 Then, the connecting conductor 108 provided in the mounting portion 107 and the counterbore portion 109 are provided by the curved portion of the via conductor 118 connected to the inclined conductor 110 provided across the base portion 102 and the frame portion 103. The distance from the inclined conductor 110 is further shortened, the curved portion of the via conductor 118 can be provided with a larger cross-sectional area, and a wiring structure having a smaller conduction resistance can be realized. Therefore, input / output errors such as when writing temperature compensation data (information) for the piezoelectric vibrating element 112 to the semiconductor element 113 due to deterioration of conduction resistance can be effectively suppressed. The via conductor 118 is formed to have a large cross-sectional area in a region where the amount of deformation during pressurization is large. Then, as shown in FIGS. 3B and 4, a curved portion is formed so as to be convex toward the center side of the insulating substrate 101.

本発明の１つの態様における電子装置200は、上記に記載の電子部品収納用パッケージ100と、電子部品収納用パッケージ100に搭載された電子部品とを有している。このような
構造としたことから、電子部品の小型化に伴い電子部品収納用パッケージ100が小型化し
ても、ザグリ部109に温度補償のデータを半導体素子113に書き込むため等の傾斜導体110
を設けることができるため、検査用端子としての面積を大きく出来、検査用のプローブピン120を当接させ易くなり、電子部品の電気特性の測定、および動作用の情報の入力等を
容易に行うことができる電子装置200を提供できる。つまり、電子部品収納用パッケージ100が小型化して絶縁基板101の搭載部107を取り囲む枠部103の幅が狭くなるとともに、絶
縁基板101の厚みが小さくなっても、絶縁基板101の第２主面105から側面にかけて検査用
端子としての面積を大きくした傾斜導体110を設けることができるため、プローブピン120を当接させることが容易である。 The electronic device 200 according to one aspect of the present invention includes the electronic component storage package 100 described above and the electronic components mounted on the electronic component storage package 100. Due to such a structure, even if the electronic component storage package 100 is miniaturized due to the miniaturization of the electronic components, the inclined conductor 110 for writing the temperature compensation data to the semiconductor element 113 in the counterbore portion 109, etc.
The area as an inspection terminal can be increased, the probe pin 120 for inspection can be easily brought into contact with the probe pin 120, and the electrical characteristics of electronic components can be easily measured and information for operation can be easily input. An electronic device 200 capable of providing 200 can be provided. That is, even if the electronic component storage package 100 is miniaturized and the width of the frame portion 103 surrounding the mounting portion 107 of the insulating substrate 101 is reduced and the thickness of the insulating substrate 101 is reduced, the second main surface of the insulating substrate 101 is reduced. Since the inclined conductor 110 having a large area as an inspection terminal can be provided from the 105 to the side surface, it is easy to bring the probe pin 120 into contact with the probe pin 120.

本発明の１つの態様における電子装置200について、詳細に説明する。図５は本発明の
実施形態の電子装置200の検査工程を示す断面透視図である。電子装置200は、電子部品が搭載される搭載部107側に位置する第１主面104、およびモジュール用基板122への実装面
側に位置する第２主面105を有している。搭載部107には、圧電振動素子112等の電子部品
が搭載されている。絶縁基板101は、基部102、および枠部103から構成されている。そし
て、搭載部107に設けられた接続導体108、段差部119の設けられた搭載パッド115、枠部103の第３主面106に設けられた枠状メタライズ層114、絶縁基板101の下面に設けられた外部接続導体117等から構成されている。 The electronic device 200 according to one aspect of the present invention will be described in detail. FIG. 5 is a cross-sectional perspective view showing an inspection process of the electronic device 200 according to the embodiment of the present invention. The electronic device 200 has a first main surface 104 located on the mounting portion 107 side on which electronic components are mounted, and a second main surface 105 located on the mounting surface side on the module substrate 122. Electronic components such as the piezoelectric vibrating element 112 are mounted on the mounting portion 107. The insulating substrate 101 is composed of a base portion 102 and a frame portion 103. Then, the connecting conductor 108 provided on the mounting portion 107, the mounting pad 115 provided with the step portion 119, the frame-shaped metallized layer 114 provided on the third main surface 106 of the frame portion 103, and the lower surface of the insulating substrate 101 are provided. It is composed of the external connecting conductor 117 and the like.

電子装置200としては、例えばＴＣＸＯ（Temperature Compensated Crystal Oscillator、温度補償水晶発振器）やＶＣＸＯ（Voltage Controlled Crystal Oscillator、電圧制御水晶発振器）等であり、圧電振動素子112、および半導体素子113等の複数の電子部品が搭載部107内に搭載される場合には、複数の電子部品が搭載される段差部119を有する搭載部を設けるために、枠部103が２層以上の絶縁層で構成されていてもよい。また、電子部
品収納用パッケージ100は、その開口部の上面（第３主面106）が枠状メタライズ層114で
覆われており、この枠状メタライズ層114に蓋体121が金すず合金等のろう材（図示せず）で接合されることにより、搭載部107内に搭載された各電子部品が気密封止されている。
なお、この枠状メタライズ層114に金属部材（例えば鉄−ニッケル−コバルト合金や鉄−
ニッケル合金等）で形成されたシールリング（図示せず）をろう付けしておき、このシールリングを介して、電子部品収納用パッケージ100の開口部に対応させて蓋体121を接合した構造としてもよい。 Examples of the electronic device 200 include TCXO (Temperature Compensated Crystal Oscillator) and VCXO (Voltage Controlled Crystal Oscillator), and a plurality of electrons such as a piezoelectric vibration element 112 and a semiconductor element 113. When a component is mounted in the mounting section 107, even if the frame section 103 is composed of two or more insulating layers in order to provide a mounting section having a stepped portion 119 on which a plurality of electronic components are mounted. Good. Further, in the electronic component storage package 100, the upper surface (third main surface 106) of the opening is covered with the frame-shaped metallized layer 114, and the lid 121 is made of gold tin alloy or the like on the frame-shaped metallized layer 114. By joining with a brazing material (not shown), each electronic component mounted in the mounting portion 107 is hermetically sealed.
A metal member (for example, iron-nickel-cobalt alloy or iron-) is formed on the frame-shaped metallized layer 114.
A seal ring (not shown) made of nickel alloy, etc.) is brazed, and the lid 121 is joined via this seal ring to correspond to the opening of the electronic component storage package 100. May be good.

このように構成された電子装置200において、電子部品収納用パッケージ100の外部に備えられる端子は、第２主面105に設けられた複数の外部接続導体117、およびザグリ部109
内に設けられた複数の傾斜導体110である。電子装置200の内部に収容された半導体素子113に情報（プログラム）を書き込む際に必要とする端子は、例えばクロック信号が入力さ
れる端子、接地用端子、クロック信号に同期してデータを入力する端子、電源電圧を供給する端子の４つである。これら４つの端子を傾斜導体110に割り当てて、圧電振動素子112に対する温度補償のデータ等を半導体素子113に書き込むために、プローブピン120が電気的に傾斜導体110と接続される。なお、図５に示すように電子装置200を上下反転させて傾斜導体110にプローブピン120を斜めに当接させることにより、傾斜導体110へのプローブ
ピン120の接続が容易になるとともに、プローブピン120の当接時の応力が電子装置200が
固定されている支持台（図示せず）側に上側から下側へ作用することから、電子装置200
の位置ずれを抑制できる。 In the electronic device 200 configured in this way, the terminals provided on the outside of the electronic component storage package 100 are a plurality of external connecting conductors 117 provided on the second main surface 105 and a counterbore portion 109.
A plurality of inclined conductors 110 provided inside. The terminals required for writing information (program) to the semiconductor element 113 housed inside the electronic device 200 are, for example, a terminal for inputting a clock signal, a grounding terminal, and a terminal for inputting data in synchronization with the clock signal. There are four terminals, a terminal and a terminal that supplies power supply voltage. The probe pin 120 is electrically connected to the inclined conductor 110 in order to assign these four terminals to the inclined conductor 110 and write the temperature compensation data for the piezoelectric vibrating element 112 to the semiconductor element 113. As shown in FIG. 5, by turning the electronic device 200 upside down and bringing the probe pin 120 into contact with the inclined conductor 110 at an angle, the probe pin 120 can be easily connected to the inclined conductor 110 and the probe pin 120 can be easily connected. Since the stress at the time of contact of 120 acts on the support (not shown) side to which the electronic device 200 is fixed from the upper side to the lower side, the electronic device 200
It is possible to suppress the misalignment of.

プローブピン120には、プローブピン120を当接させる際の電子部品収納用パッケージ100への衝撃を低減するとともに、傾斜導体110との電気的な接触性を良好とするため、コイルバネ等の緩衝機構が設けられている。しかしながら、電子部品収納用パッケージ100が
小型化した場合、電子部品収納用パッケージ100への衝撃を低減しつつ、電気的な接触性
を良好とする配線導体を設けることが難しかった。しかし、上記のような電子装置200と
したことから、電子部品が小型化してもザグリ部109に温度補償のデータを半導体素子113に書き込むため等の傾斜導体110を設けることができる。しかも、傾斜導体110と接続されるこのビア導体118の湾曲部により、搭載部107に設けられた接続導体108と、ザグリ部109に設けられた傾斜導体110との距離が近いものとなり、導通抵抗が小さい配線構造を実現
できる。よって、導通抵抗の悪化による半導体素子113への圧電振動素子112に対する温度補償のデータ（情報）を書き込む際等の入出力エラーが効果的に抑制されながら、検査用端子としての面積を大きく出来、プローブピン120との接触部分を比較的大きなものとす
ることができるため、電子部品収納用パッケージ100への衝撃が低減されるとともに、検
査用のプローブピン120を当接させ易くなり、電子部品の電気特性の測定、および動作用
の情報の入力等を容易に行うことができる電子装置200を実現できる。 The probe pin 120 has a cushioning mechanism such as a coil spring in order to reduce the impact on the electronic component storage package 100 when the probe pin 120 is brought into contact with the probe pin 120 and to improve the electrical contact with the inclined conductor 110. Is provided. However, when the electronic component storage package 100 is miniaturized, it is difficult to provide a wiring conductor that improves electrical contact while reducing the impact on the electronic component storage package 100. However, since the electronic device 200 is used as described above, the inclined conductor 110 for writing the temperature compensation data to the semiconductor element 113 can be provided in the counterbore portion 109 even if the electronic component is miniaturized. Moreover, due to the curved portion of the via conductor 118 connected to the inclined conductor 110, the distance between the connecting conductor 108 provided in the mounting portion 107 and the inclined conductor 110 provided in the counterbore portion 109 becomes short, and the conduction resistance becomes short. Can realize a small wiring structure. Therefore, the area as an inspection terminal can be increased while input / output errors such as when writing temperature compensation data (information) for the piezoelectric vibration element 112 to the semiconductor element 113 due to deterioration of conduction resistance are effectively suppressed. Since the contact portion with the probe pin 120 can be made relatively large, the impact on the electronic component storage package 100 is reduced, and the probe pin 120 for inspection can be easily brought into contact with the electronic component. It is possible to realize an electronic device 200 capable of easily measuring electrical characteristics and inputting information for operation.

また、本発明の１つの態様における電子モジュール300は、上記に記載の電子装置200と、電子装置200が接続されたモジュール用基板122とを有している。このような構造としたことから、上記の電子装置200を用いることにより、実装時の半田による短絡不良が低減
され、実装信頼性に優れた電子装置200が搭載された、動作信頼性に優れた電子モジュー
ルを提供できる。つまり、電子部品収納用パッケージ100の傾斜導体110がザグリ部109の
外縁から離間して設けられていることにより、傾斜導体110が絶縁基板101の第２主面105
からの上部に偏位する構造となり、モジュール用基板122の上部に設けられたその他の配
線導体（図示せず）と傾斜導体110が接触することが抑制される。 Further, the electronic module 300 according to one aspect of the present invention has the electronic device 200 described above and the module substrate 122 to which the electronic device 200 is connected. Due to such a structure, by using the above-mentioned electronic device 200, short-circuit defects due to soldering during mounting are reduced, and the electronic device 200 having excellent mounting reliability is mounted, and the operation reliability is excellent. Electronic modules can be provided. That is, since the inclined conductor 110 of the electronic component storage package 100 is provided apart from the outer edge of the counterbore portion 109, the inclined conductor 110 is provided on the second main surface 105 of the insulating substrate 101.
It has a structure that deviates from the upper part of the module, and prevents the inclined conductor 110 from coming into contact with other wiring conductors (not shown) provided on the upper part of the module substrate 122.

さらに、電子部品の小型化に伴い電子部品収納用パッケージ100が小型化しても、ザグ
リ部109に温度補償のデータを半導体素子113に書き込むため等の傾斜導体110を設けられ
ており、検査用端子としての面積が大きく、検査用のプローブピン120を当接させて電子
部品の電気特性の測定、および動作用の情報の入力等を容易に行われた電子装置200が組
み込まれた、電気特性に優れたモジュールを提供できる。つまり、電子部品収納用パッケージ100が小型化して絶縁基板101の搭載部107を取り囲む枠部103の幅が狭くなるとともに、絶縁基板101の厚みが小さくなっても、絶縁基板101の第２主面105から側面にかけて検
査用端子としての面積を大きくした傾斜導体110を設けることができ、プローブピン120を当接させることが容易であり、電子部品の電気特性の測定、および動作用の情報の入力等を容易に行われた電子装置200を用いることができる。よって、実装時の半田による短絡
不良が低減されるとともに実装信頼性、電気特性に優れた電子装置200が搭載された、動
作信頼性に優れた電子モジュール300を提供できる。 Further, even if the electronic component storage package 100 is miniaturized due to the miniaturization of electronic components, the counterbore portion 109 is provided with an inclined conductor 110 for writing temperature compensation data to the semiconductor element 113, and is provided with an inspection terminal. Incorporates an electronic device 200 that has a large area as a device and can easily measure the electrical characteristics of electronic components and input information for operation by contacting the probe pin 120 for inspection. We can provide excellent modules. That is, even if the electronic component storage package 100 is miniaturized and the width of the frame portion 103 surrounding the mounting portion 107 of the insulating substrate 101 is reduced and the thickness of the insulating substrate 101 is reduced, the second main surface of the insulating substrate 101 is reduced. An inclined conductor 110 having a large area as an inspection terminal can be provided from 105 to the side surface, and it is easy to bring the probe pin 120 into contact with the probe pin 120 to measure the electrical characteristics of electronic components and input information for operation. It is possible to use an electronic device 200 in which the above is easily performed. Therefore, it is possible to provide an electronic module 300 having excellent operation reliability, which is equipped with an electronic device 200 having excellent mounting reliability and electrical characteristics while reducing short-circuit defects due to soldering during mounting.

なお、本発明は上述の実施の形態の一例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。例えば、上述の実施の形態の一では、傾斜導体110を絶縁基板101の長辺側のザグリ部109に２つずつ、合計４つ設けられた構造を
示したが、搭載部107に搭載される電子部品の電気特性の測定、および動作用の情報の入
力等の検査内容に応じて、その他の数で設けられていてもよい。また、絶縁基板101の四
隅に切欠き111が設けられた構造を示したが、絶縁基板101の四隅に切欠き111が設けられ
ていない構造の絶縁基板101の長辺側および短辺側にザグリ部109を設けておき、このザグリ部109内に傾斜導体110が設けられた構造としてもよい。 The present invention is not limited to one example of the above-described embodiment, and various modifications can be made as long as the gist of the present invention is not deviated. For example, in one of the above-described embodiments, a structure in which two inclined conductors 110 are provided on the counterbore portion 109 on the long side of the insulating substrate 101, for a total of four, is provided, but the inclined conductor 110 is mounted on the mounting portion 107. Other numbers may be provided depending on the inspection contents such as measurement of electrical characteristics of electronic components and input of information for operation. Further, a structure in which notches 111 are provided at the four corners of the insulating substrate 101 is shown, but counterbore is provided on the long side and the short side of the insulating substrate 101 having a structure in which the notches 111 are not provided at the four corners of the insulating substrate 101. A structure may be provided in which a portion 109 is provided and an inclined conductor 110 is provided in the counterbore portion 109.

100・・・電子部品収納用パッケージ
101・・・絶縁基板
102・・・基部
103・・・枠部
104・・・第１主面
105・・・第２主面
106・・・第３主面
107・・・搭載部
108・・・接続導体
109・・・ザグリ部
110・・・傾斜導体
111・・・切欠き
112・・・圧電振動素子
113・・・半導体素子
114・・・枠状メタライズ層
115・・・搭載パッド
116・・・接合材
117・・・外部接続導体
118・・・ビア導体
119・・・段差部
120・・・プローブピン
121・・・蓋体
122・・・モジュール用基板
200・・・電子装置
300・・・電子モジュール 100 ・・・ Package for storing electronic components
101 ・・・ Insulated substrate
102 ・・・ Base
103 ・・・ Frame
104 ... 1st main surface
105 ・・・ 2nd main surface
106 ・・・ Third main surface
107 ・・・ Mounting part
108 ・・・ Connecting conductor
109 ・・・ Counterbore
110 ・・・ Inclined conductor
111 ・・・ Notch
112 ・・・ Piezoelectric vibration element
113 ・・・ Semiconductor element
114 ・・・ Frame-shaped metallized layer
115 ・・・ Mounted pad
116 ・・・ Joint material
117 ・・・ External connecting conductor
118 ・・・ Via conductor
119 ・・・ Step
120 ・・・ Probe pin
121 ・・・ Lid
122 ・・・ Module board
200 ・・・ Electronic device
300 ・・・ Electronic module

Claims

A base having a first main surface having a mounting part for electronic components,
A plurality of external connecting conductors provided on the second main surface facing the first main surface,
A frame portion provided on the upper surface of the base portion so as to surround the mounting portion and having a third main surface, and a frame portion.
A frame-shaped metallized layer provided on the third main surface of the frame portion,
It contains a plurality of connecting conductors located on the first main surface and connected to the electronic component.
A concave counterbore portion is provided from the second main surface to the outer peripheral side surface of the base portion in a vertical cross-sectional view, and the main surface of the counterbore portion is inclined in the downward direction of the outer circumference of the base portion and is inside the counterbore portion. Is provided with an inclined conductor
The connecting conductor and the inclined conductor are connected by a via conductor.
The via conductor has a convex curvature toward the central side of the base, it has a size sectional area definitive connection portion between the inclined conductor sectional area at the connecting portion between the connection conductor A package for storing electronic components.

The electronic component storage package according to claim 1, wherein the inclined conductor is provided apart from the outer edge of the counterbore portion.

The electronic component storage package according to claim 1 or 2, wherein the main surface of the inclined conductor is provided so as to be flush with the main surface of the counterbore portion.

The electronic component storage package according to any one of claims 1 to 3, wherein the inclined conductor is provided so as to straddle the base portion and the frame portion.

An electronic device comprising the electronic component storage package according to any one of claims 1 to 4, and an electronic component mounted on the electronic component storage package.

An electronic module comprising the electronic device according to claim 5 and a module substrate to which the electronic device is connected.