JP2008047723A - Surface-mounted electronic device, adjusting prober and adjusting method of surface-mounted electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adjusting prober having electrodes mounted on a package bottom and adjusting terminals on its sides, which stably contacts contact members to ensure the conduction even for a reduced area of the adjusting terminals due to the miniaturization of the package, and eliminates the need of replacing the prober body by replacing only the contact member when its durability deteriorates, thereby improving the productivity and reducing the product cost, and also to provide a method of adjusting the surface-mounted electronic device. <P>SOLUTION: The device comprises: a surface mounting insulation package P having mounting terminals 30 on the outer bottom and elements 7 mounted therein; and adjusting terminals 32 disposed conductively with the elements on the sides of the insulation package for measuring and adjusting the characteristics of the elements. The adjusting elements are disposed on inward down inclined taper surfaces 31 formed on the two opposed sides of the insulation package. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention is, for example, disadvantageous or inconvenient with the characteristic adjustment work of an electronic device using a probe device,
For example, the present invention relates to an adjustment probe device that eliminates various inconveniences in the frequency adjustment operation of a piezoelectric oscillator and a method for adjusting a surface-mount electronic device.

In the mobile communications market, an increasing number of manufacturers are promoting modularization of parts groups for each function, taking into account the mounting properties, maintenance and handling characteristics of various electrical components, and the commonality of parts between devices. . Further, along with modularization, there is a strong demand for downsizing and cost reduction.
In particular, there is an increasing tendency toward modularization of circuit components that have established functions and hardware configurations, such as a reference oscillation circuit, a PLL circuit, and a synthesizer circuit, and that require high stability and high performance. Furthermore, there is an advantage that a shield structure can be easily established by packaging these parts as a module.
Examples of surface mount electronic devices constructed by modularizing and packaging a plurality of related parts include piezoelectric vibrators, piezoelectric oscillators, SAW devices, etc., but these functions are maintained at a high level. However, for further miniaturization, for example, FIG.
The module of the two-story structure as shown in is adopted.

4A to 4D are a bottom perspective view, a plan view, a front view, and a bottom view showing a conventional configuration of a surface-mount type piezoelectric device (crystal oscillator) as a two-story structure type (H type) module. It is.
This crystal oscillator A has a crystal resonator element formed on a pad for mounting an element (not shown) provided in a space (upper side recess) of an upper container made of a ceramic container body 101 and a metal lid 102 by a conductive adhesive. In the crystal resonator 100 connected, the crystal resonator element in which excitation electrodes are formed on both the front and back surfaces of the crystal substrate, and the space (lower surface side recess) 105a of the lower container 105 joined to the bottom surface of the crystal resonator 100 Bottom structure (IC component unit) 1 in which an IC component 106 constituting an oscillation circuit, a temperature compensation circuit, etc. is bare-chip mounted on an IC component mounting pad provided on the ceiling surface of
07. When this crystal oscillator A is mounted on a printed circuit board, the container 10
Soldering is performed using mounting terminals 105b provided on the bottom surface of No. 5 (for example, Patent Document 1).
.

In this crystal oscillator A, two adjustment terminals 110 for adjusting the frequency of the crystal resonator element while checking the characteristics of the crystal resonator element are provided in the container 1 as shown in FIGS.
It is arrange | positioned at the bottom face of 05 (bottom contact type. Patent documents 2, 3). In the adjustment work, as shown in FIGS. 5A and 5B, the probe pin (contact member) 120 is brought into contact with each mounting terminal 105b and each mounting terminal 110 before the IC component is mounted. By checking the frequency output by exciting the crystal resonator element, if there is an error between the target frequency and the actual frequency, the method of increasing or decreasing the excitation electrode film thickness on the crystal resonator element, etc. It was adjusted by.
However, while it is necessary to increase the area of the mounting terminal in order to ensure sufficient bonding strength at the time of mounting, the adjustment terminal used only at the time of adjustment is made as small as possible. In particular, since the area of the adjustment terminal formed on a small oscillator having a vertical and horizontal dimension of about a few tens of millimeters must be even smaller, the adjustment work with the contact of the flow pin is extremely complicated and inefficient. Become.

As described above, in the conventional H-type crystal oscillator, the mounting terminal 10 is provided on the bottom surface of the container 105.
5b, the IC component mounting pad and the adjustment terminal 110 are juxtaposed, so that it becomes difficult to secure the installation space of the adjustment terminal with the progress of miniaturization of the container, and the adjustment terminal has to be reduced in area, There have been inconveniences such as a decrease in workability at the time of frequency measurement work with the probe pin in contact and a decrease in reliability at the time of measurement (occurrence of contact mistake). Further, since the mounting terminal and the adjustment terminal are arranged close to each other, there is a concern that a solder bridge is formed between the mounting terminal and the adjustment terminal when the crystal oscillator is soldered on the mother printed board.
In addition, it is difficult to visually check whether a short circuit occurs due to a solder bridge after mounting.
From such a point, a configuration (side contact type) has been proposed in which an adjustment terminal is exposed in a side cavity provided on the side of a container as disclosed in Patent Document 4.
According to this, not only can the mounting terminal area be ensured, but also the mounting terminal and the adjustment terminal are separated from each other, so that a solder bridge is not easily generated. Visual confirmation becomes easy.

6A to 6D are a bottom perspective view, a plan view, a front view, and a bottom view of an H-type crystal oscillator of the type having an adjustment terminal on the side of the container. The same parts as those of the crystal oscillator of FIG.
In this crystal oscillator B, consideration is given to avoid contact between the peripheral component and the adjustment terminal by providing the adjustment terminal 126 in the side cavity 125 provided on the side surface of the container 105.
In the crystal oscillator B, since the conductor film constituting the adjustment terminal 126 is formed on the side surface of the container, a sufficiently large area of the mounting terminal 105b provided on the bottom surface can be secured. In addition, the presence or absence of a short circuit after mounting on the mother printed circuit board can be easily visually confirmed. However, since the adjustment terminal 126 is formed in the side cavity 125 which is a recess provided on the side surface of the container (the inner surface is a vertical surface), the area must be smaller than that of the bottom contact type adjustment terminal. Further, since it is necessary to make adjustment so that the probe pin does not contact the metal lid 102 of the vibrator when the probe pin is brought into contact with the adjustment terminal 126, the positional accuracy during probing becomes severe, and the adjustment pin area However, it is necessary to prepare a probe pin having a sufficiently small tip.

FIG. 7 is a diagram showing a probing state with respect to the crystal oscillator of FIG. 6, while the probe pin 130 for mounting terminal needs to be brought into contact with the bottom surface side of the container 105, while the probe pin 131 for adjustment terminal is in the lateral direction Therefore, the configuration and operation of the probe device are complicated. That is, while the mounting terminal probe pin 130 is configured to move up and down, the adjustment terminal probe pin 131 needs to be configured to move laterally by pressing means (not shown), resulting in a complicated apparatus configuration. To do.
In addition, the tip of the adjustment terminal probe pin 131 needs to be pin-shaped in order to avoid contact with the lid 102, which makes it difficult to make contact with the adjustment terminal 126 having a reduced area. . Moreover, the container 1 formed by laminating ceramic sheets
05, if there is a stacking deviation between the ceramic sheets, the adjustment terminal pattern may be displaced in the lateral direction (X direction). In this case, one of the two probe pins 131 causes an offset, Proper contact may not be possible. Such a problem becomes more prominent as the oscillator becomes smaller.

FIG. 8 is a cross-sectional view showing the configuration and operation of the probe device for the side contact type crystal oscillator B shown in FIG.
The probe device 140 includes a base (socket base) 14 on which the crystal oscillator B is mounted.
1, an opening / closing member (socket lid) 150 that is pivotally supported by a pivot shaft 142 provided on both sides of the base 141 so as to be opened and closed in the direction of the arrow from the illustrated closed position, and a hole 141 a provided on the upper surface of the base 141. And the mounting terminal probe pin 130 urged upward by the elastic member 130a and the other end 141b provided in the base 141 are inserted and supported in the middle portion, and the curved upper end is disposed above the base 141. Probe pin 131 for adjustment terminal
And.

When probing using the probe device 140, the upper surface of the base 141 is opened by opening both the opening and closing members 150, and each mounting terminal probe pin 130 is in a one-to-one relationship with each mounting terminal 105b on the bottom surface of the container of the oscillator. Place the oscillator on the top surface of the base so that At this time, the adjustment terminal probe pin 131 is retracted to the side so as not to disturb the work of placing the oscillator on the upper surface of the base. Next, by closing both opening and closing members 150 around the rotation shaft 142, each adjustment terminal probe pin 131 is pressed inward as shown in the figure, and the tip thereof is brought into contact with the adjustment terminals 126 on both sides of the container. . In this state, frequency measurement is performed by energizing each probe pin.
In the probe device 140, the adjustment terminal 12 is caused by variation in the outer shape of the container 105.
Even if there is a variation in the horizontal position 6, a certain degree of stable conduction with the adjustment terminal 126 can be ensured by the spring property of the adjustment terminal probe pin 131. However, as the frequency of use of the probe device increases, the tip of the probe pin 131 may be worn and the contact with the adjustment terminal 126 may be reduced. Further, the probe pin 131 for adjustment terminal
Is provided for each probe device, it is not possible to replace only the probe pin. When the probe pin is worn out, it is necessary to replace the probe device itself. This causes a decrease in productivity and an increase in product cost.

The above-described problems occur not only in piezoelectric oscillators such as crystal oscillators, but also in surface-mounted electronic devices that have mounting terminals on the bottom surface of the container and adjustment terminals on the side surfaces, such as surface-mounting crystal resonators. To do.
JP 2000-278047 A Japanese Patent No. 3406845 Japanese Patent No. 3451018 JP 2004-135000 A

The present invention has been made in view of the above, and in a surface-mounted electronic device having a mounting terminal on the bottom surface of the container and an adjusting terminal on the side surface, even if the adjustment terminal has a small area due to the miniaturization of the container. In addition to being able to secure contact by always contacting the contact member stably, it is necessary to replace only the contact member and replace the probe device body even when the contact member is deteriorated and replaced. An object of the present invention is to provide an adjustment probe device and a method for adjusting a surface-mount type electronic device that improve productivity and reduce product cost.

In order to solve the above problems, a surface-mount electronic device according to the present invention includes a surface-mount insulating container having a mounting terminal on the outer bottom portion and mounted with an element, and is electrically connected to the element to measure the characteristics of the element. An adjustment terminal disposed on a side surface of the insulating container for adjustment, the adjustment terminal comprising:
It is characterized by being disposed on two opposing side surfaces of the insulating container on tapered surfaces that are inclined inward and downward, respectively.
A tapered surface (tapered recess) whose lower portion is inclined inward is provided on two substantially vertical side surfaces of the insulating container, and a conductor film that is electrically connected to the element is formed on the tapered surface to form an adjustment terminal. Therefore, the area can be increased as compared with a conventional adjustment terminal in which a conductor film is formed on a surface parallel to a substantially vertical side surface. Further, certainty and stability can be ensured when the contact member is brought into contact with the adjustment terminal in order to measure and adjust the characteristics of the element. In addition, since it is easy to ensure a separation distance from the mounting terminal on the bottom surface of the insulating container, bridge formation by solder when mounted on the printed circuit board can be prevented.

Moreover, the present invention is characterized in that the respective adjustment terminals formed on the respective side surfaces are arranged in an opposing positional relationship.
By arranging the adjustment terminals so as to face each other, it is possible to secure the contact stability by each contact member and to hold the electronic device by each contact member.

In the invention, it is preferable that the adjustment terminal is formed on a tapered surface which is formed by cutting out at a bottom corner of the side surface of the insulating container.
If the adjustment terminal is displaced to the upper part of the side surface of the insulating container, there is a possibility that a contact portion (for example, a metal lid) provided on the upper part of the electronic device comes into contact with the contact member. Thus, if the adjustment terminal is formed on the tapered surface where the bottom corner portion of the insulating container is cut away, such a fear is eliminated.

Further, the present invention is characterized in that each of the adjustment terminals is arranged with a lateral position shifted with respect to a mounting terminal provided at the bottom of the insulating container.
According to this, it is possible to prevent a short circuit between terminals due to a solder bridge when mounted on a printed circuit board.

In the invention, it is preferable that the surface-mount type electronic device is a surface-mount type piezoelectric device.
The electronic device to which the present invention can be applied may be any surface mounting type electronic device having a mounting terminal on the bottom surface and an adjustment terminal on the side surface. Therefore, for example, a piezoelectric device (piezoelectric oscillator, piezoelectric vibrator, SAW resonator) may be used.

According to the present invention, the surface-mounted piezoelectric device is a surface-mounted piezoelectric vibrator or a surface-mounted piezoelectric oscillator.

The adjustment probe device according to the present invention is an adjustment probe device including contact members that respectively contact the mounting terminal and the adjustment terminal constituting the surface-mount electronic device, the surface mounting electronic device And a base portion provided with a mounting terminal contact member that comes into contact with the mounting terminal when the electronic device is placed, and is pivotally supported by the base portion on both sides of the mounting terminal contact member so as to be rotatable inward and outward. An open / close member adjacent to both side surfaces of the surface mount electronic device mounted on the base portion when in the closed position, and the adjustment terminal contact member is movable up and down with respect to the upper surface of the base portion. The opening / closing member that is in the closed position close to the adjustment terminal of the surface-mount type electronic device mounted on the upper surface of the base portion when lowered Accordingly, characterized in that it is configured to pressed to abut said that each adjusting pin and resiliently.
According to this, it is possible to perform a measurement method in which the contact member for the adjustment terminal is pressed against the adjustment terminal provided on the side surface of the electronic device by placing the electronic device on the base portion in advance and then moving the opening / closing member to the closed position. Become.

Further, according to the present invention, the contact member for each adjustment terminal is held by a vertically movable holding member and elastically presses against each adjustment terminal located on both side surfaces of the surface mount electronic device when lowered. Therefore, it is configured to move up and down while holding the surface-mount type electronic device.
According to this, it becomes possible to raise / lower while holding the both side surfaces (adjustment terminal portions) of the electronic device with the contact member for adjustment terminal.

According to the present invention, the adjustment terminal contact member has a configuration that can be elastically deformed, and a tip thereof is configured in a cylindrical shape or a spherical shape.
According to this, not only the mechanical holding force between the contact member and the adjustment terminal but also electrical connectivity can be ensured.

In the invention, it is preferable that the mounting terminal contact member is accommodated in a hole provided in the upper surface of the base portion and elastically protruded and biased upward.
According to this, the connection stability of the contact member for mounting terminals and the mounting terminal on the bottom surface of the electronic device can be improved.

In the invention, it is preferable that the contact member is a probe pin or a tungsten probe.
When it is made of an elastic material such as a tungsten probe, the contact state with the adjustment terminal is improved even if the set angle of the electronic device changes slightly.

The method for adjusting a surface-mounted electronic device according to the present invention is a method for measuring a frequency of a surface-mounted electronic device using the adjustment probe device, the step of holding the opening / closing member in an open state, and the base The surface-mount electronic device is placed on the upper surface of the base portion so that the mounting terminals provided on the bottom of the surface-mount electronic device are in a one-to-one contact with the plurality of contact members for mounting terminals arranged in the portion. A step of positioning and mounting, a step of lowering the contact members for each adjustment terminal to bring their tip portions close to the adjustment terminals on both side surfaces of the surface-mount type piezoelectric device, and a rotation of the opening / closing member to the closed position The step of bringing the contact members for each adjustment terminal into pressure contact with each of the adjustment terminals, and energizing each contact member to change the characteristics of the element. Adjusting or adjusting, opening the opening / closing member, and raising the holding member in a state where the adjustment terminal contact member is in pressure contact with the adjustment terminals, thereby mounting the surface mount electronic device to the base Removing from the top surface of the part;
It is characterized by having.
According to this, after placing the electronic device on the base portion in advance, by moving the opening / closing member to the closed position, the adjustment terminal contact member is brought into pressure contact with the adjustment terminal provided on the side of the electronic device, and the measurement is performed. It becomes possible.

The method for adjusting a surface-mounted electronic device according to the present invention is a method for measuring a frequency of a surface-mounted electronic device using the adjustment probe device, the step of holding the opening / closing member in an open state, and the holding A step of holding the plurality of adjustment terminal contact members extending from the member in pressure contact with the respective adjustment terminals of the surface mount electronic device; and a plurality of the mountings disposed on the base portion by lowering the holding member A step of positioning and mounting the surface-mount type electronic device on the upper surface of the base portion so that the mounting terminals abut one-to-one on the contact member for terminals, and by rotating the opening / closing member to a closed position Measuring the characteristics of the element by energizing each contact member, and a step of pressing each adjustment terminal contact member against each adjustment terminal Or a step of adjusting, the step of opening the closing member, characterized in that the surface mount electronic device is raised to the holding member and a, and a step of separating from the base upper surface.
According to this, both side surfaces (adjustment terminal portions) of the electronic device are clamped and held by the adjustment terminal contact member, so that it is not necessary to provide a process and an apparatus for taking out the electronic device, and productivity is improved. Can be increased.

The adjustment probe apparatus according to the present invention is an adjustment probe apparatus comprising contact members that respectively contact the mounting terminal and the adjustment terminal that constitute the surface-mount type electronic device, and the mounting terminal A mounting terminal contact member that comes into contact with the adjustment terminal, and an adjustment terminal contact member that comes into contact with the adjustment terminal, and the mounting terminal contact member and the adjustment terminal contact member are arranged in the same direction. It is characterized by that.
Since each contact member faces the same direction, the configuration and operation of the probe device are simplified, the cost of the device can be reduced, and the productivity can be increased.

The present invention also includes a base portion that supports a mounting terminal contact member that contacts the mounting terminal when the bottom surface of the surface mount electronic device is placed on the top surface, and a tip portion that contacts the adjustment terminal. And an adjustment terminal contact member supported upward by the base portion.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
1A, 1B, 1C, and 1D are longitudinal sectional views and bottom side perspective views of a surface-mounted crystal oscillator (piezoelectric oscillator) as an example of a surface-mounted electronic device according to an embodiment of the present invention. It is a figure, a front view, and a bottom view.
This crystal oscillator 1 has a cavity in a state where a crystal vibrating element 7 is connected by a conductive adhesive 8 on an element mounting pad 6 provided in a cavity (upper side recess) 5 of an upper container 3 made of ceramic. 5 is hermetically sealed with a metal lid 4, a crystal resonator element (piezoelectric resonator) 7 having excitation electrodes formed on both front and back surfaces of the crystal substrate, and a bottom surface of the crystal resonator 2. A bottom structure in which an IC component 22 constituting an oscillation circuit, a temperature compensation circuit, etc. is bare-chip mounted on an IC component mounting pad 21a provided on a ceiling surface in a space (lower surface side recess) 21 of the lower container 20
IC component unit) 25. The upper container 3 and the lower container 20 constitute an insulating container P. Four mounting terminals 30 are disposed on the bottom surface of the lower container 20, and two of the mounting terminals 30 are electrically connected to the two excitation electrodes on the crystal resonator element 7.
In addition, a tapered surface 31 that is inclined inward and downward is formed at an appropriate position on the side surface of the insulating container P, in this example, on the two opposing side surfaces of the lower container 20. Are provided with adjustment terminals 32 that are electrically connected to the respective excitation electrodes of the crystal resonator element 7 and measure and adjust the characteristics of the elements. Each adjustment terminal 32 is preferably arranged in a laterally central portion of each opposing side surface so as to have an opposing positional relationship. In this example, a tapered surface 31 is provided so as to extend from the side surface of the lower container 20 to the outer bottom surface, that is, so as to obliquely cut out the bottom corner of the lower container.
By forming a conductor film constituting the adjustment terminal on the upper side, a large area of the adjustment terminal is ensured.

Moreover, since the lower end edge of each adjustment terminal 32 is separated from the lower surface of the lower container 20, it is possible to prevent a short circuit between the adjustment terminal 32 and the mounting terminal 30 due to the solder used during mounting.
Further, since each adjustment terminal 32 is arranged with its lateral position shifted from the mounting terminal 30 provided at the bottom of the insulating container, the distance between both terminals is sufficiently separated, and the mounting terminal is mounted on the printed circuit board. Solder bridges are less likely to occur when soldering. Further, even when a solder bridge is generated, it is easy to distinguish in appearance.
In the frequency adjustment work, by energizing each mounting terminal 30 and each adjustment terminal 32 with contact members extending from the adjustment probe device in contact with each other, it is possible to check the characteristics of the crystal vibrating element 7 while checking the characteristics. Adjust the frequency of the vibration element. Specifically, the frequency output by exciting the crystal resonator element is confirmed. If there is an error between the target frequency and the actual frequency, the thickness of the excitation electrode on the crystal resonator element is increased or decreased. Adjust according to the method.
When the crystal oscillator 1 is mounted on the printed board, soldering is performed using the mounting terminals 30 provided on the bottom surface of the insulating container P.

Next, FIGS. 2A, 2B, and 2C are a configuration, an operation explanatory diagram, and a main configuration of an adjustment probe device used for measuring and adjusting the frequency of the crystal oscillator 1 according to the embodiment. It is explanatory drawing.
The adjustment probe device 40 includes an apparatus main body 41, and contact members 50 and 60 that come into contact with the mounting terminal 30 and the adjustment terminal 32 provided on the bottom of the crystal oscillator 1 as a surface-mounted electronic device, respectively. I have. The mounting terminal contact member 50 is supported by the apparatus main body 41, and the adjustment terminal contact member 60 is held by a holding member 65 which is disposed above and below the apparatus main body so as to be movable up and down.
The apparatus main body 41 includes a base portion 42 provided with a mounting terminal contact member 50 that contacts the mounting terminal 30 when the crystal oscillator 1 is placed on the upper surface, and a base portion 42 (turned on both sides of the mounting terminal contact member 50. And an opening / closing member 45 that is pivotally supported in the inner and outer directions by the moving shaft 42a) and is close to both side surfaces of the crystal oscillator 1 mounted on the base portion when in the closed position. A mounting terminal contact member 50 is accommodated in a through hole 42b provided on the upper surface of the base portion 42 so as to be movable up and down and is urged upward by an elastic member 50a. The rotating shaft 42a is provided with a coil spring, and each opening and closing member 45 is closed (inward direction).
Always elastically biased.

Each adjustment terminal contact member 60 held by the holding member 65 is configured to be movable up and down (approaching and separating) with respect to the upper surface of the base portion, and on both side surfaces of the crystal oscillator 1 mounted on the upper surface of the base portion when lowered. Close to the provided adjustment terminal 32 and pressed by each opening / closing member 45 that has moved to the closed position as shown in FIG. Is configured to do.
The adjustment terminal contact member 60 is composed of, for example, a probe pin, a tungsten probe, or the like. By using a contact member that is easily elastically deformed, such as a tungsten probe, a large contact area with the adjustment terminal can be secured, and the adjustment terminal 32 is caused by a stacking error between the ceramic sheets constituting the insulating container P. Even if there is a variation in the horizontal direction position, it can be elastically deformed following the variation amount, so that each contact member 60 can be reliably brought into contact with each tone terminal 32.

Next, a first embodiment of a frequency measurement method for a surface-mount electronic device (crystal oscillator) using the adjustment probe device according to the present invention is as follows.
That is, the first frequency measuring method includes a step of holding each open / close member 45 in an open state using an open / close member drive source (not shown) as shown in FIG. A step of positioning and mounting the crystal oscillator 1 on the upper surface of the base portion so that the mounting terminals 30 provided at the bottom of the crystal oscillator 1 are in one-to-one contact with the mounting terminal contact member 50; Is operated to lower the holding member 65 to bring the tip of each adjustment terminal contact member 60 close to each adjustment terminal 32 on both sides of the crystal oscillator 1 and to rotate each opening / closing member 45 to the closed position. Accordingly, the contact member 60 for each adjustment terminal is pressed against each adjustment terminal 32, and the characteristics of the crystal resonator (crystal resonator element) are measured or adjusted by energizing each contact member 50, 60. A step of opening each open / close member 45, a step of lifting the holding member 65 in a state where the adjustment terminal contact member 60 is pressed against each adjustment terminal 32, and detaching the crystal oscillator 1 from the upper surface of the base portion. , Is composed of.

Next, each adjustment terminal contact member 60 held by the holding member 65 includes a main body 61 made of an elastic material and an abutting member 62 at the tip of the main body 61. By appropriately setting the interval between the contact members for adjustment terminals 60 in advance according to the size of the crystal oscillator 1, the contact member 62 is brought into pressure contact with the adjustment terminal 32 provided on the tapered surface 31 as shown in the figure. Thus, the crystal oscillator 1 can be held. Accordingly, as shown in FIG. 2 (a), the crystal oscillator 1 is held by the contact members 60 for adjusting terminals and lowered to the base portion 42, and then the opening / closing member 45 is closed as shown in FIG. 2 (b). Then, each contact member is energized to perform frequency measurement and adjustment work. After that, as shown in FIG. 2A, the opening / closing member 45 is opened, and then each adjustment terminal contact member 60 holding the crystal oscillator 1 is lifted. It becomes possible to make it.
The contact member 62 is preferably formed in a cylindrical shape or a spherical shape in order to easily ensure contact and conduction with the adjustment terminal 32.

In FIG. 2C, the point where the adjustment terminal contact member 60 applies a force to clamp the adjustment terminal 32 is the force point p1, and the contact point between the tip of the contact member 60 and the upper surface of the base 41 is the fulcrum p2. Since the contact point between the tip of the member 60 and the adjustment terminal 32 is the action point p3, the crystal oscillator 1 can be floated by the lever principle, and the degree of adhesion between the adjustment terminal and the tip of the contact member 60 is thereby improved. Rise.
The number of adjustment terminal contact members 60 used may be one or more.

A second embodiment of the frequency measurement method of the surface mount electronic device (crystal oscillator) using the adjustment probe device according to the present invention is as follows.
That is, the second frequency measuring method includes a step of holding each open / close member 45 in an open state using an open / close member drive source (not shown) as shown in FIG. 2A and a plurality of adjustment terminals extending from the holding member 65. A step of holding the contact member 60 in pressure contact with each adjustment terminal 32 of the crystal oscillator 1 and a pair of mounting terminals 30 with respect to the plurality of mounting terminal contact members 50 disposed on the upper surface of the base portion by lowering the holding member 65. The step of positioning and placing the crystal oscillator 1 on the upper surface of the base portion so as to be in contact with each other, and the adjustment terminal contact member 60 is pressurized to each adjustment terminal 32 by rotating the opening / closing member 45 to the closed position. A step, a step of measuring or adjusting the characteristics of the crystal resonator element by energizing each contact member 50, 60, a step of opening the opening / closing member 45, and an upper portion of the holding member 65. It includes a step of separating the crystal oscillator 1 by the base portion upper surface, a.

As described above, each adjustment terminal contact member 60 is held by the vertically movable holding member 65, and holds the crystal oscillator by elastically press-contacting each adjustment terminal 32 located on both sides of the crystal oscillator 1. In addition, since the electrical contact between the adjustment terminal and the abutting member 62 can always be ensured, the crystal oscillator is set on and detached from the apparatus main body 41. It is realizable by the holding member 65 provided separately. Accordingly, the crystal oscillator is detached along with the retracting operation of the adjustment terminal contact member 60, so that a special separation process is unnecessary, and the number of processes can be reduced. Further, when the durability of the adjustment terminal contact member is lowered, the probe device 40 can be continuously used by replacing only the adjustment terminal contact member without replacing the apparatus main body 41.

Next, FIGS. 3A and 3B are explanatory views of the configuration and operation of a probe apparatus according to another embodiment of the present invention.
The probe device 70 adsorbs the crystal oscillator 1, the base 71, the mounting terminal contact member 75, the adjustment terminal contact member 76 whose tips are protruded upward from the holes 72 and 73 provided in the base 71, respectively. And a holding member 80 that moves up and down while being held.
The adjustment terminal contact member 76 is made of a conductive material that can be easily elastically deformed, such as a tungsten probe, for example, and is supported by a hole 73 so that its distal end portion 76a can be displaced inward and outward (left and right in the drawing). The distal end portion 76 a includes a contact surface having an inclination angle equivalent to that of the adjustment terminal 32 provided on the tapered surface 31.
The holding member 80 sucks and holds the upper surface of the lid of the crystal oscillator 1 with its lower surface by introducing negative pressure from the suction hole 81 and descends to the upper surface of the base 71 as shown in FIG. The configuration of the holding member 80 may be other than the vacuum suction pad type as illustrated.

When the crystal oscillator 1 is seated on the upper surface of the base as shown in FIG. 3B, the tip of each mounting terminal contact member 75 elastically biased upward by an elastic member (not shown) is mounted on each mounting terminal 30.
Abut.
The adjustment terminal contact member 76 is expanded by both side surfaces of the crystal oscillator in the process of shifting from FIG. 3A to FIG. 3B, and the crystal oscillator is seated on the upper surface of the base as shown in FIG. Then, the tip 76a is in close contact with the adjustment terminal 32.
In the probe device 70 according to this embodiment, since both the contact members 75 and 76 are directed in the same direction (upward), the device configuration and its operation are simplified, and both the contact members 75 are arranged.
, 76 and the terminals 30 and 32 are improved in contact and stabilized.
In the above embodiment, the crystal oscillator is illustrated as an example of the surface mount electronic device. However, the adjustment probe apparatus of the present invention is also used for frequency adjustment in a piezoelectric oscillator, a piezoelectric vibrator, a SAW device, etc. other than the crystal oscillator. be able to.

(A) (b) (c) and (d) are a longitudinal sectional view, a bottom side perspective view of a surface-mounted crystal oscillator (piezoelectric oscillator) as an example of a surface-mounted electronic device according to an embodiment of the present invention, It is a front view and a bottom view. (A) (b) and (c) are a configuration diagram, an operation explanatory diagram, and a main configuration explanatory diagram of an adjustment probe device used for measuring and adjusting the frequency of the crystal oscillator according to the embodiment of the present invention. is there. (A) And (b) is a structure and operation | movement explanatory drawing of the probe apparatus which concerns on other embodiment of this invention. (A) thru | or (d) are the bottom side perspective views, top views, front views, and bottom views which show the conventional structure of the surface mount type piezoelectric device (crystal oscillator) as a two-story structure type (H type) module. (A) And (b) is explanatory drawing of the conventional frequency adjustment procedure. (A) thru | or (d) are the bottom part perspective views, top views, front views, and bottom views of the crystal oscillator of the H-type structure which provided the adjustment terminal in the container side surface. It is a figure which shows the probing state with respect to the crystal oscillator of FIG. It is sectional drawing which shows the structure and operation | movement of the probe apparatus for side contact type crystal oscillators shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator, 2 ... Crystal oscillator, 3 ... Upper container, 4 ... Metal lid, 5 ... Empty space, 6 ... Element mounting pad, 7 ... Crystal oscillation element, 8 ... Conductive adhesive agent, 20 ... Lower side Container, 21a ... IC
Component mounting pad, 22 ... IC component, 30 ... mounting terminal, 31 ... tapered surface, 32 ... adjusting terminal, 40 ... probe device, 40 ... adjusting probe device, 41 ... device main body, 42 ... base portion, 42a ... times Dynamic shaft, 42b ... through hole, 45 ... opening / closing member, 50 ... contact member for mounting terminal, 50a ... elastic member, 60 ... contact member for adjusting terminal, 61 ... main body, 62 ... contact member,
65: holding member, 70: probe device, 71: base, 72, 73 ... hole, 75 ... contact member for mounting terminal, 76 ... contact member for adjusting terminal, 76a ... tip portion, 80 ... holding member, 81 ... suction hole .

Claims (15)

A surface-mounting insulating container having a mounting terminal on the outer bottom and mounting the element, and an adjustment terminal arranged on the side surface of the insulating container to conduct and measure and adjust the characteristics of the element. Prepared,
The surface mount type electronic device, wherein the adjustment terminal is disposed on a tapered surface provided to be inclined inward and downward on two opposing side surfaces of the insulating container. The surface-mount type electronic device according to claim 1, wherein the adjustment terminals formed on the side surfaces are arranged in an opposing positional relationship. 3. The surface-mount type electronic device according to claim 1, wherein the adjustment terminal is formed on a tapered surface that is notched and formed in a bottom corner of the side surface of the insulating container. 4. The surface-mount type electronic device according to claim 1, wherein each of the adjustment terminals is disposed with a lateral position shifted with respect to a mounting terminal provided on a bottom portion of the insulating container. The surface-mount type electronic device according to claim 1, wherein the surface-mount type electronic device is a surface-mount type piezoelectric device. 6. The surface mount electronic device according to claim 5, wherein the surface mount piezoelectric device is a surface mount piezoelectric vibrator or a surface mount piezoelectric oscillator. An adjustment probe apparatus comprising contact members that respectively contact the mounting terminal and the adjustment terminal constituting the surface-mount electronic device according to claim 1,
A base portion provided with a contact member for a mounting terminal that comes into contact with the mounting terminal when the surface-mount type electronic device is placed, and can be rotated inward and outward by the base portion on both sides of the contact member for the mounting terminal. An opening / closing member that is pivotally supported and close to both side surfaces of the surface-mount electronic device mounted on the base portion when in the closed position;
The contact member for the adjustment terminal is configured to be movable up and down with respect to the upper surface of the base portion, and closes to the adjustment terminal of the surface mount electronic device mounted on the upper surface of the base portion when lowered, and is in a closed position. An adjustment probe device, wherein the adjustment probe device is configured to be pressed by a certain opening / closing member to elastically contact each adjustment terminal. Each adjustment terminal contact member is held by a vertically movable holding member, and elastically presses against each adjustment terminal located on both side surfaces of the surface mount electronic device, whereby the surface mount electronic The adjustment probe apparatus according to claim 7, wherein the adjustment probe apparatus is configured to move up and down while holding the device. The adjustment probe device according to claim 7 or 8, wherein the adjustment terminal contact member has a configuration that can be elastically deformed, and has a tip that is cylindrical or spherical. The adjustment probe device according to claim 7, wherein the mounting terminal contact member is accommodated in a hole provided on the upper surface of the base portion and elastically protruded and biased upward. . The adjustment probe device according to claim 7, wherein the contact member is a probe pin or a tungsten probe. A method for measuring a frequency of a surface mount electronic device using the adjustment probe device according to any one of claims 7 to 11,
Holding the open / close member in an open state;
The surface-mount type electronic device is placed on the base portion so that each of the mounting terminals provided on the bottom surface of the surface-mount type electronic device is in a one-to-one contact with the plurality of contact members for mounting terminals arranged on the base portion. A step of positioning and mounting on the upper surface;
Lowering the contact member for each adjustment terminal and bringing its tip portion close to each adjustment terminal on both side surfaces of the surface mount piezoelectric device;
Pressing each adjustment terminal contact member against each adjustment terminal by rotating the opening and closing member to a closed position; and
Measuring or adjusting the characteristics of the element by energizing each contact member; and
Opening the opening and closing member;
A step of raising the holding member in a state where the contact member for adjustment terminal is in pressure contact with each adjustment terminal to separate the surface mount electronic device from the upper surface of the base part;
A method for adjusting a surface-mount type electronic device, comprising: A method for measuring a frequency of a surface mount electronic device using the adjustment probe device according to any one of claims 7 to 11,
Holding the open / close member in an open state;
A step of holding the plurality of adjustment terminal contact members extending from the holding member in pressure contact with the respective adjustment terminals of the surface mount electronic device; and
The surface mounting type electronic device is positioned on the upper surface of the base portion by lowering the holding member so that the mounting terminals abut one-to-one against the plurality of mounting terminal contact members arranged on the base portion. A process of placing;
Pressing each adjustment terminal contact member against each adjustment terminal by rotating the opening and closing member to a closed position; and
Measuring or adjusting the characteristics of the element by energizing each contact member; and
Opening the opening and closing member;
Raising the holding member to separate the surface mount electronic device from the upper surface of the base part;
A method for adjusting a surface-mount type electronic device, comprising: An adjustment probe apparatus comprising contact members that respectively contact the mounting terminal and the adjustment terminal constituting the surface-mount electronic device according to claim 1,
A mounting terminal contact member that contacts the mounting terminal; and an adjustment terminal contact member that contacts the adjustment terminal;
The adjustment probe device, wherein the mounting terminal contact member and the adjustment terminal contact member are arranged in the same direction. A base portion that supports a mounting terminal contact member that contacts the mounting terminal when the bottom surface of the surface mount electronic device is placed on the upper surface;
The adjustment probe device according to claim 14, further comprising: an adjustment terminal contact member in which a tip portion in contact with the adjustment terminal is supported upward by the base portion.

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