JP4654837B2 - Package for surface mount piezoelectric oscillator, surface mount piezoelectric oscillator - Google Patents

Description

  The present invention relates to an improvement of a surface mount piezoelectric oscillator that eliminates the inconvenience of adjustment work using a conventional adjustment terminal.

In the mobile communications market, an increasing number of manufacturers are promoting modularization of parts groups for each function, taking into account the mounting properties, maintenance and handling characteristics of various electrical components, and the commonality of parts between devices. . Further, along with modularization, there is a strong demand for downsizing and cost reduction.
In particular, there is an increasing tendency toward modularization of circuit components that have established functions and hardware configurations, such as a reference oscillation circuit, a PLL circuit, and a synthesizer circuit, and that require high stability and high performance. Furthermore, there is an advantage that a shield structure can be easily established by packaging these parts as a module.
Examples of surface mounting electronic components constructed by modularizing and packaging a plurality of related components include piezoelectric vibrators, piezoelectric oscillators, SAW devices, etc., but these functions are maintained at a high level. However, in order to further reduce the size, for example, a two-story structure module as shown in FIG. 8 is employed.
8A is a schematic longitudinal sectional view showing a conventional configuration of a surface-mount type piezoelectric device (quartz oscillator) as a two-story structure type (H type) module, and FIG. 8B is a bottom view thereof. This crystal oscillator includes a crystal resonator 100 in which a crystal resonator element 103 is housed in a container made of a ceramic container body 101 and a metal lid 102, and a void 105a in a container 105 to be joined to the bottom surface of the crystal resonator 100. An IC mounting electrode 105c provided on the inner ceiling surface is provided with a bottom structure (IC component unit) 107 in which an IC component 106 constituting an oscillation circuit, a temperature compensation circuit, and the like is mounted in a bare chip. When this crystal oscillator is mounted on a printed board, soldering is performed using mounting terminals 105b provided on the bottom surface of the container 105 (for example, Patent Document 1).

In the H-type surface-mount type piezoelectric device before the conventional example, the frequency of the crystal resonator element is adjusted while checking the characteristics of the crystal resonator element 103 as shown by the broken line in FIG. The adjustment terminal 110 was exposed on the outer surface of the container body 101. In the adjustment operation, a probe pin (not shown) is brought into contact with the adjustment terminal 110 and energized to check the frequency output by exciting the crystal resonator element, and an error is detected between the target frequency and the actual frequency. If there is, the adjustment is made by a method such as increasing or decreasing the thickness of the excitation electrode on the crystal resonator element.
However, since the area of the adjustment terminal formed on the side surface of the small oscillator having a vertical and horizontal dimension of about several tens of millimeters is inevitably smaller, the adjustment work with the contact of the flow pin is extremely complicated and efficient. It will be bad work. Further, since it is necessary to secure a necessary and sufficient area for abutting the probe pin, there is a limit to the reduction in area of the adjustment terminal 110, and accordingly, there is a limit to downsizing the oscillator. Therefore, there is a strong demand for improvement of these problems.
In order to solve such a problem, in Patent Documents 2 and 3, when the IC component is mounted, it is the ceiling surface of the space 105a of the bottom structure 107 shown in FIG. 8B (IC component is omitted). Has proposed a structure in which two large-sized and dedicated adjustment terminals 115 extending from two excitation electrodes formed on the crystal resonator element in the crystal resonator are patterned at positions hidden by the crystal resonator. According to this, the adjustment work is facilitated by bringing the probe into contact with the adjustment terminal 115 before mounting the IC component.

The procedure for assembling this crystal oscillator is as follows. First, after the crystal resonator element 103 is mounted in the container body 101, probe pins (not shown) are brought into contact with the two adjustment terminals 115 in the space 105a of the container 105, respectively, so that the characteristics of the crystal resonator element 103 are obtained. Make adjustments to the crystal element while checking. After the adjustment is completed, the upper space is sealed with the metal lid 102. Next, the IC component 106 is flip-chip mounted on the IC mounting electrode 105c in the space 105a.
In order to improve the contactability of the probe pin to improve the workability of measurement and ensure the reliability, it is preferable that the adjustment terminal 115 has a large area. However, despite the fact that the ceiling surface of the void 105a is a limited and narrow space, if two large adjustment terminals 115 are arranged, the layout of electrodes for mounting IC components formed on the same ceiling surface is reduced. There is a high risk of restrictions. Further, when the area of the adjustment terminal is increased, there is a problem that the parasitic capacitance increases. That is, since the quartz resonator element has high sensitivity in terms of electric circuit, an increase in parasitic capacitance due to an increase in the area of the adjustment terminal tends to cause a deterioration in performance.

As described above, in the conventional crystal oscillator having the H-type structure, the IC mounting electrode 105c and the adjustment terminal 115 are juxtaposed on the ceiling surface of the IC component mounting space 105a. With the progress of the process, it becomes difficult to secure the installation space for the adjustment terminal, the area of the adjustment terminal has to be reduced, the workability is lowered during the frequency measurement work with the probe pin in contact, and the reliability in the measurement It has caused problems such as a decline in sex. That is, since the adjustment terminals 115 are arranged between the IC mounting electrodes 105c as shown in FIG. 8B, when the IC component is downsized, the area of the adjustment terminals has to be reduced. If the adjustment terminal area is increased as much as possible in consideration of the adjustment workability, the distance between the IC mounting electrode 105c and the adjustment terminal 115 is shortened, and both are short-circuited due to the displacement of the probe pin during adjustment. Measurement error (inaccurate measurement due to the parasitic capacitance of the IC mounting electrode 105c).
In addition, when the adjustment terminal 115 is arranged on the ceiling surface of the space 105a, the coupling of signals generated between the wiring pattern disposed on the inner layer of the ceiling surface and the adjustment terminal, and the adjustment terminal The coupling between them falls into a situation that cannot be ignored.
JP 2000-278047 A Japanese Patent No. 3406845 Japanese Patent No. 3451018

  The present invention has been made in view of the above, and in a surface-mount type piezoelectric oscillator having an H-type package structure in which an IC component constituting an oscillation circuit or the like is assembled and integrated outside a package of a piezoelectric vibrator, Avoiding interference with the IC component mounting electrodes by placing the adjustment terminals dedicated to the adjustment work of the piezoelectric vibrator performed in the previous place on the bottom surface side where the IC component mounting electrodes are placed, avoiding the ceiling surface However, the present invention provides a surface mount piezoelectric oscillator package that prevents the adjustment terminal from becoming large, and a surface mount piezoelectric oscillator using the package.

In order to solve the above problems, the invention of claim 1 has a recess on the upper surface side in which the piezoelectric vibrator is accommodated, and a recess on the lower surface side in which the electronic components constituting the oscillation circuit are accommodated. a plurality of mounting terminals recess of the lower surface side is provided on the bottom surface of the side wall for constitution, in the recess of the upper surface, set to electrically connect the respective excitation electrodes of the piezoelectric vibrator digit and two top side inner pad, the ceiling surface of the recess of the lower surface side, a lower side inner pads placed for mounting the electronic components constituting the oscillation circuit, wherein each of the mounting terminals and the a wiring pattern for applying a predetermined wiring between the upper surface side inner pad and the lower surface side inner pad, e Bei said each upper side inner pads and respectively connected to two adjustment terminals were, the said side wall The inner wall surface inside the recess of the side wall, A circular arc shape having a constant curvature convex toward the surface side, and having a plurality of arc shape portions extending from the opening of the recess on the lower surface side into the recess on the lower surface side, and each of the two adjustment terminals, It is characterized by a surface-mount type piezoelectric oscillator package arranged in the individual arc-shaped portions .
According to a second aspect of the present invention, the side wall includes four corner portions that connect the two inner wall surfaces between two inner wall surfaces that extend in directions orthogonal to each other, and each corner portion has the circular arc shape. The surface-mount type piezoelectric oscillator package according to claim 1, which is a part.
According to a third aspect of the present invention, there is provided the surface mount type piezoelectric oscillator package according to the first aspect, wherein the arc-shaped portion is provided on the side wall.
According to a fourth aspect of the present invention, the arc-shaped portion extends from the position of the bottom surface to the position of the ceiling surface in the recess on the lower surface side. -Type piezoelectric oscillator package.
According to a fifth aspect of the invention, the two adjustment terminals are arranged in the arc-shaped portion arranged so as to have a point-symmetrical positional relationship. Features a package for surface mount piezoelectric oscillators.
According to a sixth aspect of the present invention, the opening shape of the recess on the lower surface side is substantially rectangular, and the two adjustment terminals are arranged in the arc-shaped portion arranged side by side along the side of the inner wall surface. The package for a surface mount piezoelectric oscillator according to claim 2 is characterized.
According to a seventh aspect of the present invention, the opening shape of the recess on the lower surface side is substantially rectangular, and the two adjustment terminals are arranged on the two arc-shaped portions facing each other diagonally. A package for a surface mount piezoelectric oscillator as described in 1. above.
The invention according to claim 8 is the surface according to any one of claims 1 to 7 , wherein the adjustment terminal is formed from the arcuate portion to the ceiling surface of the recess on the lower surface side. Features a package for a mounted piezoelectric oscillator.
According to a ninth aspect of the present invention, there is provided a surface-mount type piezoelectric oscillator package according to any one of the first to eighth aspects, the piezoelectric vibration element mounted on the upper surface side internal pad, and a recess on the upper surface side. A surface-mount type piezoelectric oscillator comprising a metal lid for sealing a portion and the electronic component mounted on the lower surface side internal pad.

In the present invention, in the crystal oscillator provided with a container having an H-shaped longitudinal section, the adjustment terminal used for frequency measurement when adjusting the frequency of the crystal resonator element is disposed on the inner wall of the lower surface side recess. The parasitic capacitance generated due to the arrangement on the ceiling surface of the recess can be reduced.
In addition, since no adjustment terminal is arranged on the ceiling surface, signal coupling with the wiring pattern arranged inside the ceiling surface can be reduced, and further, the distance between the adjustment terminals is increased, so that the distance between the adjustment terminals is increased. Coupling can also be reduced.
Further, since the adjustment terminal is not arranged on the same ceiling surface as the lower surface side internal pad for IC connection, the two can be sufficiently separated from each other, and a short circuit between the two via the probe pin is prevented.
In addition, as a result of arranging the adjustment terminal on the inner wall of the recess on the lower surface side, especially the corner of the R shape, even if the position accuracy when the cylindrical probe pin is brought into contact with the adjustment terminal is low, the contact is made accurately as a result. It becomes possible to make it.
Furthermore, by arranging the adjustment terminals on the inner wall of the lower surface side recess, it becomes possible to select an arrangement location at an arbitrary position along the inner wall, and as a result of the progress of miniaturization of the package, the lower surface side recess becomes narrower. Even if it becomes, the freedom degree at the time of arrangement | positioning location of the terminal for adjustment does not fall.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
1A, 1B, and 1C are an external perspective view, a longitudinal sectional view, and a bottom view of a crystal oscillator as an example of a surface-mount piezoelectric oscillator having a package structure according to an embodiment of the present invention. is there.
This crystal oscillator has recesses 2 and 3 on the upper surface and the lower surface, respectively, and a driving power supply mounting terminal (Vcc terminal), a control voltage application mounting terminal (Vcon terminal), and a signal output mounting terminal on a rectangular annular bottom surface 4 (Out terminal), an insulating container 1 having a substantially H-shaped vertical cross section including four mounting terminals 5, that is, a ground mounting terminal (Gnd terminal), and two upper surface side internal pads provided in the upper surface side recess 2 11 is a metal lid 15 that hermetically seals the upper surface side recess 2 in a state where the two excitation electrodes on the crystal vibration element (piezoelectric vibration element) 12 are electrically connected to each other, and the ceiling surface of the lower surface side recess 3 3a, a lower surface side internal pad 6 electrically connected to each upper surface side internal pad 11 and each mounting terminal 5, and an IC component 20 constituting an oscillation circuit mounted on the lower surface side internal pad 6. In this embodiment, the case where the Vcc terminal and the Vcon terminal of the four mounting terminals 5 are electrically connected to one of the upper surface side internal pads 11 will be described as an example.
The insulating container 1, the lower surface side internal pad 6, the upper surface side internal pad 11, and the metal lid 15 constitute a surface mount type piezoelectric oscillator package.
The upper part of the insulating container 1 having the upper surface side recess 2, the upper surface side internal pad 11, the crystal resonator element 12, and the metal lid 15 constitute a crystal resonator (piezoelectric resonator). That is, the crystal resonator is electrically connected to the crystal resonator element 12 on the upper surface side inner pad 11 in the upper surface side recess 3 of the insulating container 1 made of an insulating material such as ceramic by using a conductive adhesive (conductive paste). It is mechanically connected, and the metal lid 15 is electrically and mechanically connected to the conductor ring on the upper surface of the outer wall of the insulating container 1 by welding or the like, and the inside of the upper surface side recess 2 is hermetically sealed.

In the package of the present invention, the frequency characteristic of the crystal resonator element 12 is measured, and when there is an error between the measured actual frequency and the target frequency, the adjustment terminal 30 used for adjusting the error is provided. The configuration arranged on the inner wall surface 3b of the lower surface side recess 3 is characteristic. The adjustment terminal 30 is a means for outputting a frequency output by exciting the crystal resonator element 12 by energizing from the probe pin in a state where the probe pin (not shown) is in contact with a measuring instrument (not shown).
The bottom surface shape of the lower surface side recess 3 is substantially rectangular, but the inner walls of the four corner portions are formed in an R shape (arc surface shape, curved surface shape) having a constant curvature.
The two adjustment terminals 30 according to the embodiment shown in FIG. 1 are formed on the inner walls 3b of the two R-shaped corner portions opposed to each other along one diagonal line of the lower surface side recess 3 whose bottom surface shape is substantially rectangular. Each is arranged. That is, in this embodiment, the two adjustment terminals 30 are arranged on the inner wall surface so as to be point-symmetric.
FIGS. 2A and 2B show the conventional example and the state in which the probe pin according to the present invention is brought into contact with the adjustment terminal, respectively. As shown in FIG. 2A, when the adjustment terminal 30 is disposed on the ceiling surface 3a of the lower surface side recess 3, the probe pin 40 contacts the flat adjustment terminal surface only at its tip. For this reason, the contact area is reduced by a slight positional deviation or contact angle deviation, and contact failure is likely to occur. On the other hand, the adjustment terminal 30 of the present invention shown in FIG. 2B is formed in a corner portion having an R-shaped inner wall, so that the adjustment terminal surface is R-shaped and a cylindrical adjustment probe. It is possible to make surface contact or line contact with the outer peripheral surface of the material, and it becomes easy to secure a sufficient contact area and ensure sufficient conduction.

FIGS. 3A, 3B, and 3C show a procedure for performing measurement by bringing the probe pin pair into contact with the adjustment terminal according to the embodiment of FIG. 1 by an automatic device. At the beginning of the measurement, as shown in (a), the two probe pins are made to approach the inside of the lower surface side recess 3 from the direction orthogonal to the ceiling surface 3a and enter the vicinity of each R-shaped corner portion. Next, each probe pin 40 is moved in the moving direction indicated by the arrow (the diagonally outward direction) and brought into contact with the inner wall 3b. At this point, even if each probe pin 40 is in contact with a position shifted from the center of the adjustment terminal 30 as shown in FIG. 5B, a force is applied to move the probe pin in the moving direction indicated by the arrow. By continuing, the crossing angle between the vector of the moving direction of each probe pin and the inner wall 3b surface becomes ≠ 90 degrees, so that the probe pin moves by sliding the inner wall 3b surface toward the corner portion on its outer peripheral surface, Ultimately, it can be seated and adhered to the center of the adjustment terminal 30. For this reason, a highly accurate frequency measurement is realizable.
At this time, the diameter (or curvature) of the cylindrical probe pin becomes a curvature equivalent to the curvature of the R-shaped adjustment terminal surface in consideration of improvement in conductivity due to an increase in contact area with the adjustment terminal surface. Ideally, the probe pin curvature should be larger than the curvature of the adjustment terminal surface, but even if the diameter is reduced, sufficient contact and conduction with the adjustment terminal surface are ensured. it can.
Next, the range for forming the adjustment terminal may be limited to the recess inner wall 3b as shown in FIG. 2B, but from the inner wall 3b to the ceiling surface 3a as shown in FIG. 2C. The conductor film constituting the adjustment terminal may be extended so as to extend. By extending a part of the adjustment terminal to the ceiling surface 3a in this way, the tip surface of the probe pin 40 can also come into contact with a part of the adjustment terminal, increasing the contact area and improving the measurement accuracy. Can be increased.

Next, FIG. 4 is a bottom view of a package structure according to another embodiment of the present invention. The adjustment terminal 30 according to this embodiment includes two opposing inner walls of the inner walls 3b of the lower surface side recess 3. Are formed by conductive films formed on the inner surfaces of the recesses 3c provided respectively. Each adjustment terminal 30 is disposed oppositely on two opposing inner walls. Also in this embodiment, the two adjustment terminals 30 are arranged so as to be point-symmetric on the inner wall of the recess on the lower surface side.
In addition, as a formation range of each adjustment terminal 30, it may be provided only on the inner wall, or may be extended to the ceiling surface 3a as in the case of FIG.
FIGS. 5A and 5B are a perspective view of a main part of the embodiment of FIG. 4 and a perspective view showing a state in which a probe pin is in contact.
Since the adjustment terminal 30 according to this embodiment is formed in the recess 3c, the two probe pins 40 are located at inner positions corresponding to the recesses 3c in the lower surface side recess 3 (separated from the inner wall illustrated by dotted lines). The probe pin 40 can be brought into close contact with the adjustment terminal 30 by moving the probe pin 40 in the outward direction indicated by the arrow so that the probe pin 40 is fitted into the recess 3c. At this time, as shown in the figure, the diameter of the probe pin may be set so that the outer peripheral surface of the probe pin 40 is in close contact with the adjustment terminal 30, or the curvature of the probe pin is larger than the curvature of the recess 3c. The diameter may be small. In this embodiment, since the probe pin can be firmly positioned and held by the recess 3c, a measurement error or the like due to misalignment is less likely to occur during measurement.

Next, FIG. 6 is a bottom view showing an arrangement example of the adjustment terminals according to another embodiment of the present invention, and the adjustment terminals 30 according to this embodiment are arranged at two adjacent R-shaped corner portions. ing.
In the case where the two adjustment terminals cannot be arranged in a point-symmetrical positional relationship due to restrictions such as wiring routing, the two adjacent corner portions are selected as the adjustment terminal arrangement locations.
FIGS. 7A to 7D are diagrams showing a procedure for bringing the probe pin into contact with the adjustment terminal of FIG.
First, in FIGS. 7A and 7B, the probe pins 40 are moved into the lower surface side recess 3 so that the two probe pins 40 approach the positions close to the two corner portions where the adjustment terminals 30 are arranged. Thereafter, the probe pin 40 is moved in the X direction shown in (b) and brought into contact with each inner wall as shown in (c), and then moved in the Y direction shown by an arrow, as shown in (d). Each probe pin 40 can be brought into contact with each adjustment terminal 30 in close contact.
As described above, according to the present invention, in the crystal oscillator provided with the container having an H-shaped longitudinal section, the adjustment terminal used for frequency measurement when adjusting the frequency of the crystal resonator element is disposed on the inner wall of the lower side recess. Thus, it is possible to reduce the parasitic capacitance generated due to the adjustment terminal that is conventionally disposed on the ceiling surface of the lower surface side recess. In addition, since no adjustment terminal is arranged on the ceiling surface, signal coupling with the wiring pattern arranged inside the ceiling surface can be reduced, and further, the distance between the adjustment terminals is increased, so that the distance between the adjustment terminals is increased. Coupling can also be reduced. In addition, since the adjustment terminal is not arranged on the same ceiling surface as the lower surface side internal pad for IC connection, short-circuit between the two via the probe pin is prevented. Furthermore, as a result of the arrangement of the adjustment terminal on the inner wall of the recess on the lower surface side, particularly the corner portion, even if the positional accuracy when the probe pin is brought into contact with the adjustment terminal is low, it is possible to make an accurate contact as a result. . Further, by arranging the adjustment terminal on the inner wall of the lower side recess as in each of the above embodiments, it is possible to select the placement location at any position along the inner wall, resulting in the progress of downsizing of the package As a result, the degree of freedom with respect to the location of the adjustment terminal does not decrease even if the lower side recess is narrowed.
In the above-described embodiment, the crystal oscillator is illustrated as a typical example of the piezoelectric oscillator. However, the present invention can be applied to all oscillators using piezoelectric vibration elements made of other piezoelectric materials.
In addition, although the lower surface side recess 3 formed by the side wall of the annular structure is applied, a part of the side wall other than the part where the adjustment electrode 30 exists is opened, for example, to the side wall of the “U” -shaped structure or the like You may apply the lower surface side recess 3 formed in this way.

FIGS. 3A, 3B, and 3C are an external perspective view, a longitudinal sectional view, and a bottom view of a crystal oscillator as an example of a surface mount piezoelectric oscillator having a package structure according to an embodiment of the present invention. (A) And (b) is explanatory drawing which shows the state which makes the probe pin by a prior art example and this invention contact an adjustment terminal, respectively, (c) is a block diagram of the adjustment terminal which concerns on other embodiment. (A) (b) And (c) is explanatory drawing which shows the procedure which makes a probe pin pair contact | abut with respect to the adjustment terminal which concerns on embodiment of FIG. 1 by an automatic device, and performs a measurement. The bottom view of the package structure concerning other embodiments of the present invention. (A) And (b) is a principal part perspective view of embodiment of FIG. 4, and the perspective view which shows the state which contact | abutted the probe pin. The bottom view which shows the example of arrangement | positioning of the terminal for adjustment which concerns on other embodiment of this invention. (A) thru | or (d) is a figure which shows the procedure which makes a probe pin contact | abut with respect to the terminal for adjustment of FIG. (A) is a longitudinal cross-sectional schematic diagram which shows the conventional structure of the surface mount-type piezoelectric device (crystal oscillator) as a two-story structure type (H type) module, (b) is the bottom view.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Insulation container, 2 ... Upper surface side recess, 3 ... Upper surface side recess, 3a ... Ceiling surface, 3b ... Inner wall, 3c ... Recessed part, 4 ... Bottom surface, 5 ... Mounting terminal, 6 ... Lower surface side internal pad, 11 ... Upper surface side internal pad, 12... Crystal vibrating element, 15... Metal lid, 20... IC component, 30.

Claims (9)

A recess on the upper surface side in which the piezoelectric vibrator is accommodated, and a recess on the lower surface side in which the electronic components constituting the oscillation circuit are accommodated,
A plurality of mounting terminals recess of the lower surface side is provided on the bottom surface of the side wall to be constructed,
In the recess of the top side, and two top side inner pad digits set to connect the respective excitation electrodes of the piezoelectric vibrator electrically,
In the ceiling surface of the recess of the lower surface side, a lower side inner pads placed for mounting the electronic components constituting the oscillation circuit,
A wiring pattern for applying predetermined wiring between each mounting terminal and the upper surface side internal pad and the lower surface side internal pad;
E Bei said each upper side inner pads and respectively connected to two adjustment terminals were, a
The side wall has an arc shape with a constant curvature convex toward the outer wall surface of the side wall on the inner wall surface inside the recess of the side wall, and from the opening of the recess on the lower surface side into the recess on the lower surface side A plurality of arc-shaped portions extending toward the
A package for a surface-mount type piezoelectric oscillator, wherein the two adjustment terminals are arranged on inner wall surfaces of the individual arc-shaped portions, respectively .   The side wall includes four corner portions connecting the two inner wall surfaces between two inner wall surfaces extending in directions orthogonal to each other.
  The surface mount piezoelectric oscillator package according to claim 1, wherein each corner portion is the arc-shaped portion.   The surface-mount type piezoelectric oscillator package according to claim 1, wherein the side wall includes the arc-shaped portion. The surface-mounted piezoelectric oscillator according to any one of claims 1 to 3, wherein the arc-shaped portion extends from the position of the bottom surface to a position of a ceiling surface in a recess on the lower surface side. package.   5. The surface-mount type piezoelectric element according to claim 1, wherein the two adjustment terminals are disposed in the arc-shaped portion disposed so as to have a point-symmetrical positional relationship. 6. Oscillator package.   The opening shape of the recess on the lower surface side is substantially rectangular,
  3. The surface mount piezoelectric oscillator package according to claim 2, wherein the two adjustment terminals are arranged in the arc-shaped portion arranged side by side along the side of the inner wall surface.   The opening shape of the recess on the lower surface side is substantially rectangular,
  3. The surface-mount type piezoelectric oscillator package according to claim 2, wherein the two adjustment terminals are arranged on the two arc-shaped portions facing each other diagonally.   8. The surface-mount piezoelectric oscillator according to claim 1, wherein the adjustment terminal is formed from the arc-shaped portion to a ceiling surface of a recess on the lower surface side. 9. For package.   A surface mount piezoelectric oscillator package according to any one of claims 1 to 8,
  The piezoelectric vibration element mounted on the upper surface side internal pad;
  A metal lid for sealing the recess on the upper surface side;
  The electronic component mounted on the lower surface side internal pad;
A surface-mounted piezoelectric oscillator comprising:

Images