JP2019220795A - Piezoelectric generator - Google Patents

Piezoelectric generator Download PDF

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JP2019220795A
JP2019220795A JP2018115509A JP2018115509A JP2019220795A JP 2019220795 A JP2019220795 A JP 2019220795A JP 2018115509 A JP2018115509 A JP 2018115509A JP 2018115509 A JP2018115509 A JP 2018115509A JP 2019220795 A JP2019220795 A JP 2019220795A
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base
piezoelectric
vibrating
integrated circuit
storage
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啓弘 金澤
Takahiro Kanazawa
啓弘 金澤
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株式会社大真空
Daishinku Corp
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Abstract

To provide a piezoelectric vibration generator with high reliability by corresponding to a low cost and a miniaturization.SOLUTION: A piezoelectric generator comprises: a rectangular parallelepiped shape base 2 made of an insulation material and having a housing part in which one opening part and a middle step are formed; a rectangular shape piezoelectric oscillation element 3 arranged in an inner bottom surface of the hosing part of the base 2 and forming an excitation electrode; a rectangular integrated circuit element 4 arranged in the middle part of the housing part of the base 2 and having a main surface area larger than the piezoelectric oscillation element 3; and a lid 5 hermetically sealing the opening part of the base 2. On the inner bottom surface of the housing part of the base 2, both end parts of the piezoelectric oscillation element 3 are bonded, and in a situation that the integration circuit element 4 covers the piezoelectric oscillation element 3, both end parts of the integration circuit element 4 are bonded in the middle step of the housing part of the base 2.SELECTED DRAWING: Figure 1

Description

本発明は表面実装型の圧電発振器に関する。   The present invention relates to a surface mount type piezoelectric oscillator.
圧電発振器として、例えば表面実装型の水晶発振器は、絶縁性材料からなるベース(パッケージ)に設けられた収納部の中に、水晶などからなる圧電振動素子と集積回路素子などが実装され、蓋で収納部を気密封止した構造となっている。前記ベースの外底面には複数の外部接続端子が形成されている。このような圧電発振器は、外部接続端子で外部回路基板上の搭載パッドとはんだなどの導電性接合材により電気的機械的に接合されることで外部回路基板に搭載される。   As a piezoelectric oscillator, for example, a surface mount type crystal oscillator has a piezoelectric vibrating element made of crystal or the like and an integrated circuit element mounted in a storage portion provided on a base (package) made of an insulating material, and is covered with a lid. It has a structure in which the storage section is hermetically sealed. A plurality of external connection terminals are formed on an outer bottom surface of the base. Such a piezoelectric oscillator is mounted on an external circuit board by being electrically and mechanically bonded to a mounting pad on the external circuit board by a conductive bonding material such as solder at an external connection terminal.
このような圧電発振器の中には、特許文献1〜3に開示されているように、一つの収納部に圧電振動素子と集積回路素子を収納して気密封止した所謂シングルパッケージ構造のものにおいて、収納部の内底面側に圧電振動素子を配置し収納部の開口部側に集積回路素子を配置することで、搭載された圧電振動素子の特性検査工程等の後に良品判定などを行った後で集積回路素子を搭載することができるなどにより、製造コストの低減と歩留まりの改善など生産性を高めることができるものが提案されている。   Among such piezoelectric oscillators, as disclosed in Patent Documents 1 to 3, a so-called single package structure in which a piezoelectric vibrating element and an integrated circuit element are housed in one housing and hermetically sealed. By arranging the piezoelectric vibrating element on the inner bottom surface side of the storage part and arranging the integrated circuit element on the opening side of the storage part, after performing the quality inspection etc. after the characteristic inspection step etc. of the mounted piezoelectric vibration element There has been proposed a device capable of mounting an integrated circuit element, thereby reducing production costs and improving yield, such as improving yield.
特開2000−77944号公報JP 2000-77944 A 特開2001−217650号公報JP 2001-217650 A 特開2001−3086644号公報JP 2001-306644 A
しかしながら、上述のような圧電発振器では、圧電振動素子と集積回路素子の隙間寸法が変化することによる寄生容量の変化やお互いの温度差の影響で、特性が悪影響を受けることに対して何ら考慮されていない。このような問題点は、圧電発振器の小型化とともにその影響度が大きくなっているのが現状である。   However, in the above-described piezoelectric oscillator, no consideration is given to the fact that the characteristics are adversely affected by the change in the parasitic capacitance due to the change in the gap size between the piezoelectric vibrating element and the integrated circuit element and the temperature difference between them. Not. At present, such a problem is becoming more significant as the size of the piezoelectric oscillator is reduced.
本発明は、かかる点に鑑みてなされたものであり、圧電発振器の低コスト化と小型化に対応させながら電気的特性がより安定した信頼性の高い圧電発振器を提供することを目的とするものである。












The present invention has been made in view of the above circumstances, and has as its object to provide a highly reliable piezoelectric oscillator having more stable electrical characteristics while responding to cost reduction and miniaturization of the piezoelectric oscillator. It is.












上記目的を達成するために本発明は、絶縁材料からなり開口部と中段が形成された一つの収納部とを有する直方体形状のベース、上記ベースの収納部の内底面に配置され励振電極の形成された矩形状の圧電振動素子、上記ベースの収納部の中段部に配置されるとともに上記圧電振動素子より主面の面積が大きい矩形状の集積回路素子、上記ベースの開口部を気密封止する蓋、を備えており、上記ベースの収納部の内底面上で上記圧電振動素子の両端部が接合されるとともに、上記集積回路素子が上記圧電振動素子を被覆した状態で、上記ベースの収納部の中段上で上記集積回路素子の両端部が接合された
ことを特徴とする。
In order to achieve the above object, the present invention provides a base having a rectangular parallelepiped shape having an opening formed of an insulating material and one storage part having a middle step formed therein, and forming an excitation electrode disposed on an inner bottom surface of the storage part of the base. Rectangular piezoelectric vibrating element, a rectangular integrated circuit element that is arranged in the middle portion of the housing of the base and has a larger main surface area than the piezoelectric vibrating element, and hermetically seals the opening of the base. A lid, wherein both ends of the piezoelectric vibrating element are joined on an inner bottom surface of the base accommodating section, and the integrated circuit element covers the piezoelectric vibrating element, and the accommodating section of the base is provided. Characterized in that both ends of the integrated circuit element are joined on the middle stage.
上記発明によれば、上記ベースの一つの収納部に圧電振動素子と集積回路素子とが収納され蓋により気密封止されるシングルパッケージ構造となるため、シンプルで小型化低背化に有利なベース構造とすることができる。   According to the above invention, the piezoelectric vibrating element and the integrated circuit element are housed in one housing portion of the base and have a single package structure hermetically sealed by a lid. It can be structured.
また、上記ベースの収納部の内底面に圧電振動素子を配置するとともに、収納部の開口部側に位置する中段部に集積回路素子を配置している。このため、圧電振動素子のみをベースに搭載した状態で、圧電振動素子のみの特性検査工程を施した後に、良品判定が行われて満足の得られたもののみを選択して集積回路素子を搭載して圧電発振器を完成させることができる構成となる。従って、製造コストの低減と歩留まりの改善など生産性を高めることができる。   In addition, the piezoelectric vibrating element is arranged on the inner bottom surface of the storage section of the base, and the integrated circuit element is arranged in the middle section located on the opening side of the storage section. For this reason, with only the piezoelectric vibrating element mounted on the base, after performing a characteristic inspection process on only the piezoelectric vibrating element, a non-defective product is determined, and only those that are satisfied are mounted on the integrated circuit element. As a result, the piezoelectric oscillator can be completed. Therefore, productivity can be increased, such as reduction in manufacturing cost and improvement in yield.
また、上記ベースの収納部の内底面上で矩形状の圧電振動素子の両端部が接合されるとともに、上記ベースの収納部の中段上で矩形状の集積回路素子の両端部が接合されているため、圧電振動素子と集積回路素子とは搭載後に外部衝撃などが加わったとしても傾きが生じることなく、一定の隙間寸法を維持した状態でお互いの配置関係が保たれる。結果として、圧電振動素子に形成された励振電極と集積回路素子とが接触することがなくなるだけでなく、圧電振動素子に形成された励振電極と集積回路素子との間に生じる寄生容量が当初設計値に対して変化することがなくなり、発振周波数の変動が生じない電気的特性の安定した構成とすることができる。   In addition, both ends of the rectangular piezoelectric vibrating element are joined on the inner bottom surface of the storage part of the base, and both ends of the rectangular integrated circuit element are joined on the middle part of the storage part of the base. Therefore, even if an external impact is applied after mounting, the piezoelectric vibrating element and the integrated circuit element do not tilt, and the mutual positional relationship is maintained while maintaining a certain gap size. As a result, not only does the excitation electrode formed on the piezoelectric vibration element and the integrated circuit element not come into contact, but also the parasitic capacitance generated between the excitation electrode formed on the piezoelectric vibration element and the integrated circuit element is initially designed. It does not change with respect to the value, and it is possible to obtain a configuration in which the electrical characteristics are stable without fluctuation of the oscillation frequency.
加えて、上記集積回路素子が上記圧電振動素子を被覆した状態で、収納部の開口部側に位置する中段部に上記圧電振動素子より主面の面積が大きい矩形状の集積回路素子を配置されているため、圧電振動素子を完全に覆いつくした状態で圧電振動素子と集積回路素子とが一定の隙間寸法を維持した状態でお互いの配置関係が保たれる。つまり、圧電振動素子に対して、集積回路素子の熱が均等に伝わり、お互いの温度差が生じにくくできるため、圧電発振器の電気的特性に悪影響が生じることがない。特に、集積回路素子に温度補償機能を有する所謂TCXOとして圧電発振器を使用する場合には、集積回路素子に内蔵された温度センサと圧電振動素子との温度差が小さくなり、周波数温度特性に伴う補正ずれなどの影響もなくなり、より高性能で安定した電気的特性が得られる。   In addition, with the integrated circuit element covering the piezoelectric vibrating element, a rectangular integrated circuit element having a main surface area larger than that of the piezoelectric vibrating element is arranged in a middle portion located on the opening side of the storage section. Therefore, the arrangement relationship between the piezoelectric vibration element and the integrated circuit element is maintained while the piezoelectric vibration element and the integrated circuit element maintain a certain gap size in a state where the piezoelectric vibration element is completely covered. That is, the heat of the integrated circuit element is evenly transmitted to the piezoelectric vibrating element, and a temperature difference between the integrated circuit element and the piezoelectric vibrating element is less likely to occur, so that the electrical characteristics of the piezoelectric oscillator are not adversely affected. In particular, when a piezoelectric oscillator is used as a so-called TCXO having a temperature compensation function in an integrated circuit element, the temperature difference between the temperature sensor built in the integrated circuit element and the piezoelectric vibrating element becomes small, and correction accompanying the frequency temperature characteristic is performed. There is no influence of displacement and the like, and higher performance and stable electrical characteristics can be obtained.
また、上記構成において、中段部のうち集積回路素子が搭載されない領域には、圧電振動素子と接続される圧電振動素子用配線パターンが形成されていてもよく、その圧電振動素子用配線パターンの一部がベースの側壁の一部を露出する圧電振動素子用端子が形成されていてもよい。この場合、圧電振動素子用配線パターンや圧電振動素子用端子を使用して、圧電振動素子のみの特性検査工程などが実施しやすくできるだけでなく、集積回路素子を搭載された後でもこれらの圧電振動素子用配線パターンや圧電振動素子用端子を利用することができるため、圧電振動素子と集積回路素子とを組み合わせた圧電発振器として特性計測や調整も容易に行うことができる。   In the above configuration, a wiring pattern for a piezoelectric vibration element connected to the piezoelectric vibration element may be formed in a region of the middle section where the integrated circuit element is not mounted. A terminal for a piezoelectric vibrating element whose part exposes a part of the side wall of the base may be formed. In this case, it is not only possible to easily carry out a characteristic inspection process of only the piezoelectric vibrating element by using the wiring pattern for the piezoelectric vibrating element or the terminal for the piezoelectric vibrating element, but also to perform the piezoelectric vibration even after the integrated circuit element is mounted. Since the element wiring pattern and the piezoelectric vibrating element terminal can be used, characteristic measurement and adjustment can be easily performed as a piezoelectric oscillator combining a piezoelectric vibrating element and an integrated circuit element.
以上のように、圧電発振器の低コスト化と小型化に対応させながら電気的特性がより安定した信頼性の高い圧電発振器を提供することができる。   As described above, it is possible to provide a highly reliable piezoelectric oscillator with more stable electric characteristics while supporting cost reduction and miniaturization of the piezoelectric oscillator.
本発明の実施形態に係る水晶発振器の概略構成を示す断面図である。FIG. 1 is a cross-sectional view illustrating a schematic configuration of a crystal oscillator according to an embodiment of the present invention. 図1の水晶振動素子のみを搭載した状態の平面図である。FIG. 2 is a plan view showing a state where only the crystal resonator of FIG. 1 is mounted. 図2の蓋をする前の平面図である。FIG. 3 is a plan view before the lid of FIG. 2 is put on.
以下、本発明の実施形態について図面を参照しながら説明する。以下に述べる本発明の圧電発振器の実施形態としては、例えば発振回路を有するIC(集積回路素子)を内蔵した表面実装型水晶発振器(以下、水晶発振器と称する)を例に挙げて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. As an embodiment of the piezoelectric oscillator of the present invention described below, a surface-mounted crystal oscillator (hereinafter, referred to as a crystal oscillator) incorporating an IC (integrated circuit element) having an oscillation circuit will be described as an example.
水晶発振器1は略直方体状のパッケージであり、平面視では略矩形、断面では凹形状となっている。水晶発振器1は、ベース2と、水晶振動素子(圧電振動素子)3と、IC4と、蓋5とが主な構成部材となっている。以下、水晶発振器1を構成する各部材の概略について詳述する。   The crystal oscillator 1 is a substantially rectangular parallelepiped package having a substantially rectangular shape in plan view and a concave shape in cross section. The crystal oscillator 1 includes a base 2, a crystal vibrating element (piezoelectric vibrating element) 3, an IC 4, and a lid 5 as main components. Hereinafter, the outline of each member constituting the crystal oscillator 1 will be described in detail.
ベース2はセラミックなどの絶縁材料からなる長辺と短辺を有する平面視略矩形の基板部と枠部の積層体で構成され、上層と中層と下層の少なくとも3層以上の積層体により、一つの開口部2bと中段21bとが形成された収納部2aとを有する直方体形状の容器である。   The base 2 is composed of a laminate of a substrate part and a frame part, which are made of an insulating material such as ceramic and has a substantially rectangular shape in plan view having long sides and short sides, and is formed by a laminate of at least three layers of an upper layer, an intermediate layer, and a lower layer. It is a rectangular parallelepiped container having a storage section 2a in which two openings 2b and a middle section 21b are formed.
本実施形態では、ベース2は、ベース下層となる平板状(平面視略矩形)の基板部20と、当該基板部20の一主面201の外周部200に沿って上方に伸び外周縁210と内周縁211とが平面視略矩形で形成されベース中層となる第1枠部21と、当該第1枠部21の外周部200に沿って上方に伸び外周縁220と内周縁221とが平面視略矩形で形成されベース上層となる第2枠部22(枠部)とが主な構成部材(断面凹形状)との3層構成となっている。   In the present embodiment, the base 2 includes a flat (substantially rectangular in plan view) substrate portion 20 serving as a base lower layer, and an outer peripheral edge 210 extending upward along an outer peripheral portion 200 of one main surface 201 of the substrate portion 20. A first frame portion 21 having an inner peripheral edge 211 formed in a substantially rectangular shape in plan view and serving as a base middle layer, and an outer peripheral edge 220 and an inner peripheral edge 221 extending upward along the outer peripheral portion 200 of the first frame portion 21 are formed in plan view. A second frame portion 22 (frame portion) which is formed in a substantially rectangular shape and serves as an upper layer of the base has a three-layer structure including a main constituent member (concave shape in cross section).
そして、これらの基板部20の一主面201による内底面と、第1枠部21の内周縁より内側の内部空間と、第2枠部の内周縁より内側の内部空間とを組み合わせることで、ベースの収納部2aが構成されている。   Then, by combining the inner bottom surface of one main surface 201 of the substrate portion 20, the inner space inside the inner peripheral edge of the first frame portion 21, and the inner space inside the inner peripheral edge of the second frame portion, The storage section 2a of the base is configured.
ベース2の内部では、下方面(収納部2aの内底面側)には基板部20の一主面201による内底面と第1枠部21により構成され、後述する水晶振動素子3を収納する第1の収納部21aが形成され、第1の収納部21aの上部(収納部2aの開口部2b側)には第1の収納部の底面から上部に突き出した中段21bと第2枠部22により構成され、後述するIC4を収納する第2の収納部22aが形成されている。   Inside the base 2, the lower surface (the inner bottom surface side of the storage portion 2 a) includes an inner bottom surface formed by one main surface 201 of the substrate portion 20 and the first frame portion 21. One storage portion 21a is formed, and an upper portion of the first storage portion 21a (on the side of the opening 2b of the storage portion 2a) is formed by a middle step 21b and a second frame portion 22 projecting upward from the bottom surface of the first storage portion. A second storage section 22a configured to store an IC 4 described later is formed.
ベース2の下層である基板部20の上面(第1の収納部21aの内底面)のうち一端部には、図1,図2に示すように、後述する水晶振動素子3と電気的機械的に接続される一対の第1の配線パターンH21が並んで形成されており、他端部には後述する水晶振動素子3と機械的に接続される枕用の配線パターンH22が形成されている。一対の第1の配線パターンH21は、例えば、第1枠部21の外周縁の一端側に形成された切り欠き部21c,21dの上部に形成された引回用の配線パターンH23を介して、中段21bの上面に延出され、後述するIC4を搭載するための第2の配線パターンH24の一部に接続されている。   As shown in FIG. 1 and FIG. 2, one end of the upper surface of the substrate portion 20 (the inner bottom surface of the first storage portion 21 a), which is the lower layer of the base 2, Are formed side by side, and a pillow wiring pattern H22 that is mechanically connected to the crystal vibrating element 3 described later is formed at the other end. The pair of first wiring patterns H21 are, for example, via wiring wiring patterns H23 formed above cutouts 21c and 21d formed at one end of the outer peripheral edge of the first frame 21. It extends to the upper surface of the middle stage 21b and is connected to a part of a second wiring pattern H24 for mounting an IC 4 described later.
なお、一対の引回用の配線パターンH23は、後述する水晶振動素子3と電気的に接続される端子の機能も有しており、これらに対して、水晶振動素子特性装置のコンタクトプローブを接触することで後述する水晶振動素子3単独の特性を測定することができる。また、ベース2の下層である基板部20の下面には、外部回路基板と接続するための複数の外部接続端子H20が形成されている。 The pair of routing wiring patterns H23 also has a function of a terminal that is electrically connected to the later-described quartz-crystal vibrating element 3, and a contact probe of the quartz-crystal vibrating element characteristic device is brought into contact therewith. By doing so, it is possible to measure the characteristics of the crystal vibrating element 3 alone, which will be described later. Further, a plurality of external connection terminals H20 for connecting to an external circuit board are formed on the lower surface of the substrate portion 20 which is a lower layer of the base 2.
ベース2の中層である第1枠部21の上面(第2の収納部22aの底面)には、図1,図2に示すように、後述するIC4の長辺方向の両端部を搭載する中段21bが形成されており、その上面には後述するIC4と電気的機械的に接続される複数の第2の配線パターンH24が形成されている。複数の第2の配線パターンH24は、第1枠部21と基板部20とを貫通接続する図示しない導電ビアや第1枠部21の基板部20の外周縁の一部に形成された引回し配線パターンなどを介して、後述する基板部20の下面に形成された複数の各々の外部接続端子に接続されている。   On the upper surface of the first frame portion 21 (the bottom surface of the second storage portion 22a), which is the middle layer of the base 2, as shown in FIGS. 21b is formed, and a plurality of second wiring patterns H24 that are electrically and mechanically connected to an IC 4 described later are formed on the upper surface thereof. The plurality of second wiring patterns H24 are conductive vias (not shown) that penetrate and connect the first frame portion 21 and the substrate portion 20 and the routing formed on a part of the outer peripheral edge of the substrate portion 20 of the first frame portion 21. It is connected to a plurality of external connection terminals formed on the lower surface of the substrate unit 20 described later via a wiring pattern or the like.
ベース2の上層である第2枠部22の上面には、図1,図2に示すように、後述する蓋5を接合するための封止部222が形成されている。本形態では封止部222をメタライズにより構成しており、この封止部222と後述する蓋5とは金属ろう材など接合材によって接合される。   As shown in FIGS. 1 and 2, a sealing portion 222 for joining a lid 5 described later is formed on the upper surface of the second frame portion 22 which is the upper layer of the base 2. In this embodiment, the sealing portion 222 is formed by metallization, and the sealing portion 222 and the lid 5 described later are joined by a joining material such as a brazing metal.
以上のように構成された基板部20と第1枠部21と第2枠部22の各々は、例えば、セラミックグリーンシート(アルミナ)となっており、各外周縁が平面視略同一の矩形で形成されている。これら3つのシートが積層された状態で焼成によって一体成形され、平面視では略矩形、断面では凹形状となっている略直方体状のベース2を構成している。また、図示しない外部接続端子、第1の配線パターンH21、枕用の配線パターンH22、引回用の配線パターンH23、第2の配線パターンH24、封止部222の各々は、タングステンあるいはモリブデン等によるメタライズ層の上面にニッケルメッキ層、金メッキ層の各層が形成された構成である。   Each of the substrate portion 20, the first frame portion 21, and the second frame portion 22 configured as described above is, for example, a ceramic green sheet (alumina), and each outer peripheral edge has a substantially same rectangular shape in plan view. Is formed. These three sheets are integrally formed by firing in a laminated state, and constitute a substantially rectangular parallelepiped base 2 having a substantially rectangular shape in plan view and a concave shape in cross section. The external connection terminals (not shown), the first wiring pattern H21, the pillow wiring pattern H22, the wiring wiring pattern H23, the second wiring pattern H24, and the sealing portion 222 are each made of tungsten or molybdenum. In this configuration, a nickel plating layer and a gold plating layer are formed on the upper surface of the metallization layer.
なお、これらの各シート(基板部のシート・第1枠部のシート・第2枠部のシート)については、積層間の内部配線の延出形態に応じて単層だけでなく複数層に分けて形成してもよい。より具体的には、第1枠部21と第2枠部22の間に他の枠体に相当するシートを1層以上追加し、4層以上の積層体からなるベースとして構成してもよい。   Each of these sheets (the sheet of the substrate portion, the sheet of the first frame portion, and the sheet of the second frame portion) is divided not only into a single layer but also into a plurality of layers according to the form of extension of the internal wiring between laminations. May be formed. More specifically, one or more sheets corresponding to another frame may be added between the first frame 21 and the second frame 22 to form a base composed of a laminate of four or more layers. .
第1の収納部21aの内底面に搭載される水晶振動素子3は、例えば矩形状のATカット水晶振動板であり、その表裏面には一対の励振電極と引出電極が各々形成されている。このうち上記一対の引き出し電極は水晶振動素子3の一端部のみに延出されている。これらの電極は、例えば、クロムまたはニッケルの下地電極層と、銀または金の電極層を含む、少なくとも2層以上の積層薄膜である。これら各電極は真空蒸着法やスパッタリング法等の薄膜形成手段により形成することができる。   The crystal vibrating element 3 mounted on the inner bottom surface of the first storage portion 21a is, for example, a rectangular AT-cut crystal vibrating plate, and a pair of excitation electrodes and extraction electrodes are formed on the front and back surfaces, respectively. Among these, the pair of extraction electrodes extend only to one end of the crystal resonator element 3. These electrodes are, for example, at least two or more laminated thin films including a chromium or nickel base electrode layer and a silver or gold electrode layer. These electrodes can be formed by a thin film forming means such as a vacuum evaporation method or a sputtering method.
水晶振動素子3とベース2の第1の収納部21aの内底面上での接合は、例えばペースト状であり銀フィラー等の金属微小片を含有するシリコーン系の導電樹脂接着剤(導電性接合材)Sを用いている。つまり、図1,図2に示すように、ベース2の第1の収納部21aの内底面に形成された配線パターンH21および枕用の配線パターンH22のうちの一部の上面に導電性樹脂接着剤Sが塗布される。そして、導電性樹脂接着剤Sを水晶振動素子3の長辺方向の一端部に延出された一対の引出電極と内底面の第1の配線パターンH21の間にそれぞれ介在させ硬化させることで、お互いを電気的機械的に接合している。加えて、導電性樹脂接着剤Sを水晶振動素子3の長辺方向の他端部の中央の電極が形成されていない領域と内底面の枕用の配線パターンH22の間にそれぞれ介在させ硬化させることで、お互いを機械的に接合している。   Bonding of the quartz vibrating element 3 and the base 2 on the inner bottom surface of the first housing portion 21a is, for example, a paste of silicone-based conductive resin containing metal fine pieces such as silver filler (conductive bonding material). ) S is used. That is, as shown in FIGS. 1 and 2, the upper surface of the wiring pattern H21 formed on the inner bottom surface of the first storage portion 21a of the base 2 and the upper surface of a part of the wiring pattern H22 for the pillow are bonded to the conductive resin. The agent S is applied. Then, the conductive resin adhesive S is interposed between the pair of extraction electrodes extended to one end in the long side direction of the quartz crystal vibrating element 3 and the first wiring pattern H21 on the inner bottom surface, and is cured. They are electrically and mechanically joined to each other. In addition, the conductive resin adhesive S is interposed between the region where the central electrode is not formed at the other end in the long side direction of the quartz vibrating element 3 and the pillow wiring pattern H22 on the inner bottom surface, and is cured. By doing so, they are mechanically joined to each other.
以上により、水晶振動素子3の長辺方向の両端部をベース2の第1の収納部21aの内底面から隙間を設けながら、両持ち保持され接合される。なお、本形態では、シリコーン系の導電樹脂接着剤により接合した構成を例にしているが、この導電性接合材として他の導電性樹脂接着剤や金属バンプ、金属メッキバンプなどのバンプ材料、ろう材を用いてもよい。   As described above, both ends of the quartz vibrating element 3 in the long side direction are held and joined while providing a gap from the inner bottom surface of the first storage portion 21 a of the base 2. In the present embodiment, a configuration in which bonding is performed using a silicone-based conductive resin adhesive is described as an example. However, as the conductive bonding material, other conductive resin adhesives, metal bumps, bump materials such as metal plated bumps, brazing materials, etc. A material may be used.
ベース2の中段21bに搭載されるIC4は、C−MOSなどのインバータ増幅器(発振用増幅器)を内蔵したワンチップの矩形状の集積回路素子であり、後述する水晶振動素子3とともに発振回路を構成する。また、IC4の主面の面積は、水晶振動素子3の主面の面積より大きいものが選択されている。IC4の底面側には複数のパッドが形成されている。IC4は、例えば金などの金属バンプCを介して、IC2の複数のパッドとベース2の中段21bに形成された複数の第2の配線パターンH24とを例えばFCBによりIC2の長辺方向の両端部が電気機械的に接合される。この際、水晶振動素子3は主面の面積が大きいIC2により被覆される。本形態では、金属バンプCにより接合した構成を例にしているが、金属ワイヤバンプを用いてもよい。なお、本形態に限らず、ベース2の中段の配置によっては、IC2の短辺方向の両端部を電気機械的に接合してもよい。   The IC 4 mounted on the middle stage 21b of the base 2 is a one-chip rectangular integrated circuit element having a built-in inverter amplifier (oscillation amplifier) such as a C-MOS, and constitutes an oscillation circuit together with the crystal resonator element 3 described later. I do. Further, the area of the main surface of the IC 4 is selected to be larger than the area of the main surface of the crystal resonator element 3. A plurality of pads are formed on the bottom side of the IC 4. The IC 4 connects the plurality of pads of the IC 2 and the plurality of second wiring patterns H24 formed on the middle stage 21b of the base 2 with, for example, FCB via a metal bump C such as gold at both ends in the long side direction of the IC 2. Are electromechanically bonded. At this time, the crystal resonator element 3 is covered with the IC 2 having a large main surface area. In the present embodiment, the configuration in which the metal bumps are joined by metal bumps C is used as an example, but metal wire bumps may be used. Note that the present invention is not limited to this embodiment, and both ends of the IC 2 in the short side direction may be electromechanically bonded depending on the arrangement of the middle stage of the base 2.
本形態で用いられるIC4は、水晶振動素子3の周波数信号を増幅する発振回路部のみを具備したいわゆるSPXO用のICに限らず、周波数調整回路を付加機能として具備されたいわゆるVCXO用のICであってもよく、温度補償機能などが付加機能として具備されたいわゆるTCXO用のICでもよい。また、これらを組みあわされたICであってもよい。IC4としては、CMOS以外のバイポーラ、バイCMOSなどであってもよい。   The IC 4 used in the present embodiment is not limited to a so-called SPXO IC having only an oscillation circuit section for amplifying the frequency signal of the crystal resonator element 3, but a so-called VCXO IC having a frequency adjusting circuit as an additional function. It may be a so-called TCXO IC provided with a temperature compensation function and the like as an additional function. Further, an IC in which these are combined may be used. The IC 4 may be a bipolar transistor other than the CMOS, a bi-CMOS, or the like.
ベース2を気密封止する蓋5は、例えば、コバール等からなるコア材に金属ろう材(封止材)が形成された構成である。この金属ろう材からなる接合材がベース2の封止部222と接合される構成となる。金属製の蓋5の平面視外形はセラミックベースの当該外形とほぼ同じであるか、若干小さい構成となっている。   The lid 5 that hermetically seals the base 2 has a configuration in which, for example, a metal brazing material (sealing material) is formed on a core material made of Kovar or the like. The joining material made of the brazing metal is joined to the sealing portion 222 of the base 2. The outer shape of the metal lid 5 in a plan view is substantially the same as or slightly smaller than the outer shape of the ceramic base.
収納部2aにIC4と水晶振動素子3が格納されたベース2の封止部222に対して金属製の蓋5にて被覆し、金属製の蓋5の接合材とベースの封止部222を溶融硬化させ、気密封止を行うことで表面実装型の水晶発振器1の完成となる。   The sealing portion 222 of the base 2 in which the IC 4 and the crystal resonator element 3 are stored in the storage portion 2a is covered with a metal lid 5, and the joining material of the metal lid 5 and the sealing portion 222 of the base are sealed. The surface-mounted crystal oscillator 1 is completed by melt-hardening and performing hermetic sealing.
このように構成された表面実装型の水晶発振器1は、図示しない回路基板の配線パターンに対してはんだなどの接合材を用いて接合される。   The surface-mounted crystal oscillator 1 configured as described above is joined to a wiring pattern of a circuit board (not shown) using a joining material such as solder.
上記実施形態により、ベース2の一つの収納部2aに水晶振動素子3とIC4とが収納され蓋5により気密封止されるシングルパッケージ構造となるため、シンプルで小型化低背化に有利な表面実装型の水晶発振器1とすることができる。   According to the above-described embodiment, a single package structure in which the crystal resonator element 3 and the IC 4 are housed in one housing portion 2 a of the base 2 and hermetically sealed by the lid 5 has a simple, compact and advantageous surface for reducing the height. The mounting type crystal oscillator 1 can be obtained.
また、ベースの収納部2aの内底面側に水晶振動素子3を配置するとともに、収納部2aの開口部2b側に位置する中段部21bにIC4を配置している。このため、水晶振動素子3のみをベース2に搭載した状態で、水晶振動素子2のみの特性検査工程などを施した後に、良品判定が行われて満足の得られたもののみを選択してIC4を搭載して水晶発振器1を完成させることができる構成となる。従って、製造コストの低減と歩留まりの改善など生産性を高めることができる。   Further, the quartz vibrating element 3 is arranged on the inner bottom surface side of the storage section 2a of the base, and the IC 4 is arranged on the middle section 21b located on the opening 2b side of the storage section 2a. For this reason, in a state where only the crystal resonator element 3 is mounted on the base 2, after performing a characteristic inspection process or the like of only the crystal resonator element 2, a non-defective product is determined, and only those which are satisfied are selected. Is mounted so that the crystal oscillator 1 can be completed. Therefore, productivity can be increased, such as reduction in manufacturing cost and improvement in yield.
また、ベースの収納部2aの内底面上で矩形状の水晶振動素子3の長辺方向の両端部が接合されるとともに、収納部2aの中段部21bに矩形状のIC4の長辺方向の両端部が接合されているため、水晶振動素子2とIC4とは搭載後に外部衝撃などが加わったとしても傾きが生じることなく、一定の隙間寸法を維持した状態でお互いの配置関係が保たれる。結果として、水晶振動素子2に形成された励振電極とIC4の機能面とが短絡することがなくなるだけでなく、水晶振動素子2に形成された励振電極とIC4との間に生じる寄生容量が当初設計値に対して変化することがなくなり、発振周波数の変動が生じない電気的特性の安定した構成とすることができる。   Further, both ends of the rectangular crystal vibrating element 3 in the long side direction are joined on the inner bottom surface of the base storage section 2a, and both ends of the rectangular IC 4 in the long side direction are connected to the middle section 21b of the storage section 2a. Since the parts are joined, the crystal resonator element 2 and the IC 4 do not tilt even if an external impact or the like is applied after mounting, and the mutual positional relationship is maintained while maintaining a certain gap size. As a result, not only is there no short circuit between the excitation electrode formed on the crystal resonator element 2 and the functional surface of the IC 4, but also the parasitic capacitance generated between the excitation electrode formed on the crystal resonator element 2 and the IC 4 is initially reduced. The configuration does not change with respect to the design value, and a configuration in which the electrical characteristics are stable and the oscillation frequency does not change can be obtained.
加えて、IC4が水晶振動素子3を被覆した状態で、収納部2aの開口部側に位置する中段部21bに水晶振動素子3より主面の面積が大きい矩形状のIC4を配置されているため、水晶振動素子2を完全に覆いつくした状態で水晶振動素子2とIC4とが一定の隙間寸法を維持した状態でお互いの配置関係が保たれる。つまり、水晶振動素子2に対して、IC4の熱が均等に伝わり、お互いの温度差が生じにくくできるため、水晶発振器1の電気的特性に悪影響が生じることがない。特に、IC4に温度補償機能を有する所謂TCXOとして水晶発振器1を使用する場合には、IC4に内蔵された温度センサと水晶振動素子2との温度差が小さくなり、周波数温度特性に伴う補正ずれなどの影響もなくなり、より高性能で安定した電気的特性が得られる。   In addition, since the IC 4 covers the quartz-crystal vibrating element 3, the rectangular IC 4 whose main surface area is larger than that of the quartz-crystal vibrating element 3 is arranged in the middle section 21 b located on the opening side of the storage section 2 a. In the state where the crystal vibrating element 2 is completely covered and the crystal vibrating element 2 and the IC 4 maintain a certain gap size, the mutual positional relationship is maintained. In other words, the heat of the IC 4 is evenly transmitted to the crystal vibrating element 2 and a temperature difference between the ICs 4 is hardly generated, so that the electrical characteristics of the crystal oscillator 1 are not adversely affected. In particular, when the crystal oscillator 1 is used as a so-called TCXO having a temperature compensation function in the IC 4, the temperature difference between the temperature sensor incorporated in the IC 4 and the crystal resonator element 2 becomes small, and the correction deviation due to the frequency-temperature characteristic, etc. And the stable and high-performance electrical characteristics can be obtained.
また、一対の引回用の配線パターンH23は、水晶振動素子3の励振電極と電気的に接続され、かつ第1枠部21の外周縁の一端側に形成された切り欠き部21c,21dの上部に形成されてベース2の外部表面に露出する水晶振動素子用の端子として機能している。このため、この水晶振動素子用の端子を使用して、水晶振動素子3のみの特性検査工程などが実施しやすくできるだけでなく、IC4が搭載された後でもこの配線パターンH23や水晶振動素子用の端子3を利用することができるため、水晶振動素子3とIC4とを組み合わせた水晶発振器1として特性計測や調整も容易に行うことができる。   In addition, the pair of wiring patterns for wiring H23 are electrically connected to the excitation electrodes of the quartz vibrating element 3 and are provided with notches 21c and 21d formed on one end side of the outer peripheral edge of the first frame portion 21. It functions as a terminal for a crystal vibrating element formed on the upper part and exposed on the outer surface of the base 2. For this reason, using the terminals for the crystal vibrating element, it is not only easy to carry out the characteristic inspection step of only the crystal vibrating element 3 and the like, but also the wiring pattern H23 and the crystal vibrating element Since the terminal 3 can be used, characteristic measurement and adjustment can be easily performed as the crystal oscillator 1 in which the crystal resonator element 3 and the IC 4 are combined.
以上のように、水晶発振器の低コスト化と小型化に対応させながら電気的特性がより安定した信頼性の高い水晶発振器を提供することができる。   As described above, it is possible to provide a highly reliable crystal oscillator with more stable electrical characteristics while responding to cost reduction and size reduction of the crystal oscillator.
また、上記した本実施例では、圧電振動素子としてATカット水晶振動板を用いているが、これに限定されるものでなく、他の振動モードの水晶振動板であってもよい。また、圧電振動素子として水晶を材料としているが、これに限定されるものではなく、圧電セラミックスやLiNbO3等の圧電単結晶材料を用いてもよい。すなわち、任意の圧電振動素子が適用可能である。 In the above-described embodiment, the AT-cut quartz vibrating plate is used as the piezoelectric vibrating element. However, the present invention is not limited to this, and a quartz vibrating plate of another vibration mode may be used. In addition, although quartz is used as a material for the piezoelectric vibrating element, the material is not limited thereto, and a piezoelectric single crystal material such as piezoelectric ceramics or LiNbO 3 may be used. That is, any piezoelectric vibration element can be applied.
また、本実施例では、金属ろう材による封止を例にしたが、これに限定されるものではなく、シーム封止、ビーム封止(例えば、レーザビーム、電子ビーム)やガラス封止等でも適用することができる。   Further, in the present embodiment, the sealing with the metal brazing material is taken as an example, but the present invention is not limited to this, and it is also possible to use seam sealing, beam sealing (for example, laser beam, electron beam), glass sealing, or the like. Can be applied.
本発明は、その精神または主要な特徴から逸脱することなく、他のいろいろな形で実施することができる。そのため、上述の実施の形態はあらゆる点で単なる例示にすぎず、限定的に解釈してはならない。本発明の範囲は特許請求の範囲によって示すものであって、明細書本文には、なんら拘束されない。さらに、特許請求の範囲の均等範囲に属する変形や変更は、全て本発明の範囲内のものである。   The present invention may be embodied in various other forms without departing from its spirit or essential characteristics. Therefore, the above-described embodiment is merely an example in every aspect, and should not be interpreted in a limited manner. The scope of the present invention is defined by the appended claims, and is not limited by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.
圧電発振器の量産に適用できる。   Applicable to mass production of piezoelectric oscillators.
1 水晶発振器
2 ベース
3 水晶振動素子
4 IC
5 蓋
C 金属バンプ
S 導電性樹脂接着剤
1 crystal oscillator 2 base 3 crystal vibrating element 4 IC
5 Lid C Metal bump S Conductive resin adhesive

Claims (1)

  1. 絶縁材料からなり開口部と中段が形成された一つの収納部とを有する直方体形状のベース、上記ベースの収納部の内底面に配置され励振電極の形成された矩形状の圧電振動素子、上記ベースの収納部の中段部に配置されるとともに上記圧電振動素子より主面の面積が大きい矩形状の集積回路素子、上記ベースの開口部を気密封止する蓋、を備えており、
    上記ベースの収納部の内底面上で上記圧電振動素子の両端部が接合されるとともに、上記集積回路素子が上記圧電振動素子を被覆した状態で、上記ベースの収納部の中段上で上記集積回路素子の両端部が接合されたことを特徴とする圧電発振器。
    A rectangular parallelepiped base having an opening made of an insulating material and having a single storage section in which a middle step is formed; a rectangular piezoelectric vibrating element disposed on an inner bottom surface of the storage section of the base and formed with an excitation electrode; A rectangular integrated circuit element which is disposed in the middle part of the storage part and has a larger area of the main surface than the piezoelectric vibration element, a lid for hermetically sealing the opening of the base,
    In a state where both ends of the piezoelectric vibrating element are joined on the inner bottom surface of the housing of the base and the integrated circuit element covers the piezoelectric vibrating element, the integrated circuit is mounted on the middle stage of the housing of the base. A piezoelectric oscillator, wherein both ends of an element are joined.
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