JP2009004584A5

JP2009004584A5 -

Info

Publication number: JP2009004584A5
Application number: JP2007164440A
Authority: JP
Filing date: 2007-06-22
Publication date: 2010-05-13
Anticipated expiration: 2027-06-22

Claims

An electrical insulating layer is disposed between the first wiring board and the second wiring board, and is mounted on the side of the electrical insulating layer of the first wiring board or the side of the electrical insulating layer of the second wiring board. A component built-in module in which the first wiring board and the second wiring board are electrically connected by a first inner via formed in the electrical insulating layer and embedded in the electrical insulating layer,
A second inner via having a cut surface exposed at an end face of the electrical insulating layer, the second inner via being connected to a reference potential, and a conductive film connected to the second inner via; A component built-in module provided on the end face of the electrical insulating layer .

Molding a component mounted on the surface of the second wiring board opposite to the side of the electrical insulating layer with a resin material ;
Before SL electrically insulating layer component built-in module according to claim 1, wherein the end face and the surface of the resin material providing the second connection to the inner via of the electrically conductive film.

The component built-in module according to claim 1, wherein the second inner via has a semi-cylindrical shape.

The component built-in module according to any one of claims 1 to 3, wherein the conductive film is formed of a metal material by any one of plating, vapor deposition, sputtering, and CVD.

The component built-in module according to any one of claims 1 to 4, wherein the first and second inner vias are made of a conductive resin paste.

An electrical insulating layer is disposed between the first wiring board and the second wiring board, and is mounted on the side of the electrical insulating layer of the first wiring board or the side of the electrical insulating layer of the second wiring board. Embedded in the electrical insulation layer and a plurality of component built-in modules in which the first wiring board and the second wiring board are electrically connected by the first inner via formed in the electrical insulation layer. When cutting the multi-sided board at the cutting line position and separating it for each component built-in module,
A second inner via is formed on the cutting line that becomes an end face of each component built-in module by the cutting , and a conductive film connected to the second inner via is provided on the end face of the electrical insulating layer,
A method of manufacturing a component built-in module that determines the formation state of the first inner via from the shape of the cut surface of the second inner via in which the cut surface is exposed at the end surface of the component built-in module cut by cutting along the cutting line.

An electrical insulating layer is disposed between the first wiring board and the second wiring board, and is mounted on the side of the electrical insulating layer of the first wiring board or the side of the electrical insulating layer of the second wiring board. Embedded in the electrical insulation layer and a plurality of component built-in modules in which the first wiring board and the second wiring board are electrically connected by the first inner via formed in the electrical insulation layer. When cutting the multi-sided board at the cutting line position and separating it for each component built-in module,
A second inner via is formed on the cutting line that becomes the end face of each component built-in module by the cutting, as well as on the peripheral portion of the substrate that becomes a discarded portion by the cutting and the cutting line that becomes the end face of each component built-in module . A conductive film connected to the inner via is provided on the end face of the electrical insulating layer;
The shape of the cut surface of the second inner via in which the cut surface is exposed at the end surface of the component built-in module cut by cutting along the cutting line, or the second surface in which the cut surface is exposed at the end surface of the peripheral portion of the substrate that becomes a discarded portion. Manufacturing method of the component built-in module which determines the formation state of the 1st inner via from the shape of the cut surface of the inner via.

An electrical insulating layer is disposed between the first wiring board and the second wiring board, and is mounted on the side of the electrical insulating layer of the first wiring board or the side of the electrical insulating layer of the second wiring board. Embedded in the electrical insulation layer and a plurality of component built-in modules in which the first wiring board and the second wiring board are electrically connected by the first inner via formed in the electrical insulation layer. When cutting the multi-sided board at the cutting line position and separating it for each component built-in module,
Forming a second inner via on a cutting line that becomes an end surface of a peripheral portion of the substrate that becomes a discarded portion by the cutting, and providing a conductive film connected to the second inner via on the end surface of the electrical insulating layer;
A module with a built-in component that determines the formation state of the first inner via from the shape of the cut surface of the second inner via with the cut surface exposed at the end surface of the peripheral portion of the substrate that is cut away along the cutting line. Manufacturing method.