JP5127315B2 - Built-in module - Google Patents

Description

  The present invention relates to a component built-in module in which an active component such as a semiconductor and a passive component such as a capacitor are built in an electrical insulating layer, and a method for manufacturing the same.

  In recent years, with the demand for higher performance and smaller size of electronic devices, wiring boards used in electronic devices are also desired to be small and dense. In response to such a demand, a conventional glass / epoxy substrate having a through-hole structure is becoming unable to cope with high-density mounting. For this reason, as a means for realizing high-density mounting, development of a high-density mounting board adopting an inner via connection method capable of connecting LSIs and components at the shortest distance is in progress.

  Resin substrates and ceramic substrates are common as high-density mounting substrates that employ such an inner via connection method. Since the resin substrate is made of a resin material, the thermal conductivity is low. For this reason, the higher the density of circuit component mounting, the more difficult it is to dissipate heat generated from the components. On the other hand, since the ceramic substrate has high thermal conductivity, the ceramic substrate is excellent in heat dissipation but is expensive.

For these reasons, a high-density mounting substrate using a mixture of an inorganic filler and a thermosetting resin as a substrate material has recently been attracting attention (see, for example, Patent Document 1).
This high-density mounting board can be connected to the inner vias in the same manner as the resin board and ceramic board described above, and not only enables high-density wiring, but also includes an inorganic filler with high thermal conductivity in the board material. It has better heat dissipation than the resin substrate. And since the manufacturing process in the high temperature of 1000 degreeC or more like a ceramic substrate is unnecessary, installation cost does not start. Furthermore, since active components such as semiconductors and passive components such as capacitors can be built in the substrate, higher density and higher performance can be expected.

FIG. 10 shows a component built-in module of Patent Document 2.
10A is a cross-sectional view of the component built-in module, and FIG. 10B is a plan view, which includes an electrical insulating layer 303 made of a mixture containing an inorganic filler and a thermosetting resin. The lower surface of the electrical insulating layer 303 is covered with the wiring substrate 301, and the upper surface of the electrical insulating layer 303 is covered with the wiring substrate 302. Wiring patterns are formed on both surfaces of the wiring boards 301 and 302, and via receiving lands 320 are formed on the surfaces of the wiring boards 301 and 302 on the side of the electrical insulating layer 303.

  A component 304 such as a semiconductor bare chip is bonded on the wiring pattern of the wiring substrate 301 by a bump 305, and the component 304 is embedded in the electrical insulating layer 303. The electrical insulating layer 303 is provided with an inner via 306 made of a thermosetting conductive resin paste material. The inner via 306 and the via receiving land 320 are electrically connected between the wiring boards 301 and 302. Connected.

  Similarly, the shield inner vias 307 are provided at high density around the periphery of the electrical insulating layer 303, and are connected to the ground (GND: ground connection) via the shield inner vias 307 and via receiving lands 320. Yes.

  The inner vias 306 and 307 are formed at the same time with the same material structure, although they have different functional purposes. Circuit components (not shown) are bonded to the wiring patterns on the surfaces of the wiring boards 301 and 302 as necessary to form a three-dimensional mounting module.

  FIG. 11 shows a state of a large-sized substrate for taking a multi-face drawing of the component built-in module of FIG. The cutting line 308 is cut into modules by a method such as dicing. Reference numeral 319 denotes a cutting width corresponding to the blade thickness at the time of dicing.

This component built-in module is manufactured as follows.
First, an uncured electrical insulating layer 303 on which inner vias 306 and 307 are formed is prepared. The electrical insulating layer 303 is made of a sheet-like material in which a thermosetting resin such as an uncured epoxy resin and an inorganic filler such as alumina are mixed. The inner vias 306 and 307 form through holes in the electrical insulating layer 303 by a device such as a laser or a puncher, and a conductive resin paste containing a thermosetting resin and conductive metal powder such as copper or silver is formed in the through holes. Fill to form.

A component 304 is flip-chip bonded and mounted on the wiring pattern of the wiring board 301.
Next, the wiring board 301 on which the built-in components are mounted, the electrical insulating layer 303 on which the in-via is formed, and the wiring board 302 are sequentially stacked, and further set in a hot press apparatus (not shown). By heating and pressing this using a hot press device, the electric insulating layer 303 is melted and softened, so that the built-in circuit component 304 is embedded in the electric insulating layer 303. Thereafter, by heating at a temperature higher than the curing temperature of the thermosetting resin of the electrical insulating layer 320, the thermosetting resin is cured and integrated with the wiring board, so that the component built-in shown in FIG. A module is obtained.
Japanese Patent Laid-Open No. 11-220262 JP 2006-210870 A (FIGS. 1 and 2)

Such a conventional component built-in module has structural problems and some problems to be solved that occur when the circuit component 304 is embedded in the electrical insulating layer 303.
As shown in FIG. 10A, when the circuit component 304 is embedded in the uncured electrical insulating layer 303, the uncured thermosetting resin contained in the electrical insulating layer 303 softens when heated and pressurized. Therefore, the circuit component 304 can be easily embedded.

  The inner via 306 of the electrical insulating layer 303 is compressed by the via land 320 of both the wiring boards 301 and 302 to obtain a low resistance via connection. Further, when the built-in circuit component 304 is a high-frequency operation component and easily generates noise or is easily affected by disturbance noise, a shield effect can be obtained by providing the shield via 307 on the outer peripheral portion of the electrical insulating layer 303. it can.

  However, in order to obtain a shielding effect, it is necessary to form the inner vias 307 at a high density on the outer peripheral portion of the electrical insulating layer 303. This increases the module size. There are problems such as increasing the number of man-hours for processing the through hole of the inner via.

  Further, the thermosetting resin softened during the hot pressing flows radially from the center of the substrate according to the material properties under the influence of the pressing pressure. At that time, the inner vias 306 and 307 formed in the electrical insulating layer 303 may also flow to cause displacement and bending. As a result, the connection resistance between the inner vias 306 and 307 and the via land 320 is increased, which causes a problem of adversely affecting the reliability.

In order to inspect the state of the inner vias 306 and 307, it is necessary to evaluate an oblique transmission image using an X-ray transmission apparatus in the manufacturing process.
SUMMARY OF THE INVENTION An object of the present invention is to provide a component built-in module having a structure capable of easily evaluating the displacement and bending of an inner via formed in an electrical insulating layer, and a method for manufacturing the module.

In the component built-in module according to claim 1 of the present invention, an electrical insulating layer is disposed between the first wiring board and the second wiring board, and the side of the electrical insulating layer of the first wiring board or the second wiring board. A component mounted on the side of the electrical insulation layer of the wiring board is embedded in the electrical insulation layer, and is formed on the electrical insulation layer and formed on the first wiring board and the second wiring board. the first inner vias is not between the first wiring board and the second wiring board to a component built-in module which is electrically connected, the exposed cut surfaces of the semi-cylindrical in the end surface of the electrically insulating layer the 1 wiring board and a second inner via not formed on the second wiring board, the second inner via being connected to a reference potential and connected to the second inner via On the end face of the electrical insulating layer And wherein the digit.

The component built-in module according to claim 2 of the present invention is the component built-in module according to claim 1, wherein the component mounted on the surface of the second wiring board opposite to the side of the electrical insulating layer is molded with a resin material, and A conductive film connected to the second inner via is provided on the end face of the electrical insulating layer and the surface of the resin material .

The component built-in module according to a third aspect of the present invention is the module according to the first or second aspect , wherein the conductive film is formed by any one of plating, vapor deposition, sputtering and CVD of a metal material. And

A component built-in module according to a fourth aspect of the present invention is characterized in that in any one of the first to third aspects, the first and second inner vias are made of a conductive resin paste. .

  ADVANTAGE OF THE INVENTION According to this invention, the component built-in module which improved small noise resistance can be provided.

The component built-in module according to the embodiment of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 shows Embodiment 1 of the present invention.

FIG. 1A is a cross-sectional view of the component built-in module, and FIG. 1B is a plan cross-sectional view along AA.
This component built-in module includes an electrical insulating layer 3 made of a mixture containing 70% to 95% by weight of an inorganic filler and 5% to 30% by weight of a thermosetting resin. The lower surface of the electrical insulating layer 3 is covered with a multilayer wiring board 1, and the upper surface of the electrical insulating layer 3 is covered with a multilayer wiring board 2. Wiring patterns are formed on both surfaces of the wiring boards 1 and 2, and via receiving lands 20 are formed on the surfaces of the wiring boards 1 and 2 on the side of the electrical insulating layer 3.

On the wiring pattern of the wiring board 1, a component 4 such as a semiconductor bare chip is flip-chip bonded by a bump 5, and this component 4 is embedded in the electrical insulating layer 3.
The electrical insulating layer 3 is provided with an inner via 6 as a first inner via made of a thermosetting conductive resin paste material, and the wiring board 1 is interposed via the inner via 6 and the via receiving land 20. , 2 are electrically connected. A plurality of inner vias 6 are provided surrounding the component 4. By selecting the inorganic filler and the thermosetting resin, the linear expansion coefficient, thermal conductivity, dielectric constant, and the like of the electrical insulating layer 3 can be easily controlled.

  As the inorganic filler of the electrical insulating layer 3, for example, alumina, magnesia, boron nitride, aluminum nitride, silicon nitride, fluororesin, silica, or the like can be used. When alumina, boron nitride, and aluminum nitride are used, a substrate having higher thermal conductivity than that of a conventional glass / epoxy substrate can be manufactured, and the heat generated by the component 4 can be effectively dissipated. In particular, when alumina is used, there is an advantage that the cost is low. When silica is used, the coefficient of linear expansion of the electrical insulating layer 3 approaches that of the silicon semiconductor as the component 4 and cracks due to temperature changes can be prevented. Therefore, it is preferable when flip chip mounting is performed to directly mount a semiconductor chip.

  Silica is preferable as a high-frequency module substrate for a mobile phone device and the like because an electric insulating layer having a low dielectric constant is obtained and its specific gravity is light. Even when silicon nitride or fluororesin is used, an electrical insulating layer having a low dielectric constant can be obtained. Further, when boron nitride is used, the linear expansion coefficient can be reduced.

  When an epoxy resin, phenol resin, or cyanate resin having high heat resistance is used as the thermosetting resin of the electric insulating layer 3, the heat resistance of the electric insulating layer 3 is improved. In addition, if a fluororesin having a low dielectric loss tangent, a PTFE resin (tetrafluoroethylene resin), a PPO resin (polyphenylene oxide), a resin containing PPE resin (polyphenylene ether), or a resin obtained by modifying these resins is used, The high frequency characteristics of the insulating layer 3 are improved.

  The wiring patterns of the wiring boards 1 and 2 are made of a material having electrical conductivity, and can be composed of, for example, a metal foil or a conductive resin composition. When a metal foil is used, a fine wiring pattern can be easily formed by etching or the like. Further, the wiring pattern can be formed by transfer using a release film.

  In addition, when the wiring pattern is composed of a conductive resin composition, a wiring pattern with low electrical resistance can be easily formed by printing using metal powder such as gold, silver, copper, palladium and nickel, or carbon powder. it can.

  Furthermore, the corrosion resistance and electrical conductivity can be improved by plating the surfaces of these wiring patterns. Furthermore, the adhesiveness with the electrical insulating layer 3 can be improved by roughening the contact surface of the wiring pattern with the electrical insulating layer 3.

  A semiconductor chip as the component 4 is constituted by a semiconductor element such as a transistor, an IC, and an LSI. The semiconductor element may be a semiconductor bare chip. The wiring pattern and the component 4 are connected by flip chip bonding using, for example, a conductive adhesive or an anisotropic conductive film (ACF). Further, bumps 5 may be formed and connected. Moreover, since the component 4 can be shielded from the outside air by the electrical insulating layer 3, it is possible to prevent a decrease in reliability due to humidity. Further, when a mixture of a filler and a thermosetting resin is used as the material of the electrical insulating layer 3, unlike the ceramic substrate, it is not necessary to fire at a high temperature, and the component 4 can be easily incorporated.

  The inner via 6 is composed of a mixture of conductive powder having a function of connecting the wiring patterns of the wiring boards 1 and 2 and a thermosetting resin. For example, a metal powder such as gold, silver, copper, or nickel, or a mixture of carbon powder and a thermosetting resin can be used. As the thermosetting resin, for example, an epoxy resin, a phenol resin, or a cyanate resin can be used. Epoxy resins are particularly preferred because of their high heat resistance. The metal powder is preferably gold, silver, copper or nickel, and copper is particularly preferable because it has not only high conductivity but also less migration. Even when metal powder in which copper is coated with silver is used, it is possible to satisfy both characteristics of low migration and high conductivity.

  An inner via 7 as a second inner via having a cut surface exposed at the end face of the electric insulating layer 3 is provided on the outer peripheral portion of the electric insulating layer 3. The inner via 7 is preferably made of the same material as the inner via 6. As will be described later, the inner via 7 is used as a shield connection terminal for preventing malfunction of the component 4 due to the influence of high-frequency noise generated by the component 4 and external noise.

The inner via 7 is formed in a semi-cylindrical shape with the cut surface exposed at the end face of the electrical insulating layer 3, and is preferably connected to the ground of the wiring boards 1 and 2.
Since it comprised in this way, since the inner via | veer 7 should just be formed in the end surface of the electric-insulation layer 3 by semi-cylindrical shape, a component built-in area can be expanded or a module size can be reduced.

(Embodiment 2)
FIG. 2 shows a second embodiment of the present invention.
FIG. 2A is a cross-sectional view of the component built-in module, and FIG. 2B is a plan cross-sectional view along AA.

  A difference from the first embodiment is that a conductive film 10 serving as a noise shield layer is formed from the end face of the electrical insulating layer 3 to the end faces of the wiring boards 1 and 2. It is a point which is earth-connected (GND: ground connection) via. The conductive film 10 is formed into a film shape by a method such as plating, sputtering, vapor deposition, CVD (Chemical vapor deposition).

  Since it comprised in this way, since the conductive film 10 used as the shield layer formed in the end surface of a component built-in module and the ground connection with the wiring boards 1 and 2 can be performed through the cross section of the inner via 7, the connection area was wide and stable. A connection can be obtained.

  Further, as in the conventional example shown in FIG. 10, in this embodiment, the shield is formed by the combination of the conductive film 10 and the inner via 7 as compared with the case where the shielding effect is obtained only by arranging the inner vias in the periphery. Since the effect is achieved, the number of inner vias 7 can be reduced, and the number of processing steps can be reduced. Furthermore, since the inner vias may be formed in a semi-cylindrical shape on the module end face, the component built-in area can be increased or the module size can be reduced.

(Embodiment 3)
FIG. 3 shows a third embodiment of the present invention.
FIG. 3 is a cross-sectional view of the component built-in module. The difference from the second embodiment is that the component 8 is mounted on the surface layer of the wiring board 2, the component 8 is molded with the resin material 9 on the surface layer of the wiring board 2, and A conductive film 10 serving as a noise shield layer is formed from the end surface of the insulating layer 3 to the end surfaces of the wiring substrates 1 and 2 and further to the surface of the resin material 9, and this conductive film 10 is formed as an inner via. 7 is a ground connection (GND: ground connection). The entire module including the built-in component 4 and the component 8 mounted on the surface layer can have a shield structure.

The conductive film 10 is formed into a film shape by a method such as plating, sputtering, vapor deposition, CVD (Chemical vapor deposition).
Since it comprised in this way, since the conductive film 10 used as the shield layer formed in the end surface of a component built-in module and the ground connection with the wiring boards 1 and 2 can be performed through the cross section of the inner via 7, the connection area was wide and stable. A connection can be obtained.

  Further, as in the conventional example shown in FIG. 10, in this embodiment, the shield is formed by the combination of the conductive film 10 and the inner via 7 as compared with the case where the shielding effect is obtained only by arranging the inner vias in the periphery. Since the effect is achieved, the number of inner vias 7 can be reduced, and the number of processing steps can be reduced. Furthermore, since the inner vias may be formed in a semi-cylindrical shape on the module end face, the component built-in area can be increased or the module size can be reduced.

  In each of the above embodiments, an example in which the inner vias 6 and 7 are formed of a conductive resin paste has been described in the present embodiment, but the present invention is not limited to this and may be formed by through-hole plating or the like. . The conductive film 10 may be connected to a wiring pattern appearing in the cross section of the wiring boards 1 and 2 in parallel with the semi-cylindrical inner via 7.

Moreover, although the example which incorporated the component 4 in the electric insulation layer 3 was shown, you may incorporate passive components, such as a resistor, a capacitor | condenser, and an inductor.
(Embodiment 4)
4 to 8 show a specific manufacturing method of the component built-in module according to the third embodiment shown in FIG.

FIG. 4A to FIG. 5I are cross-sectional views for explaining the component built-in module manufacturing process.
The electrical insulating layer 3 in FIG. 4A is an uncured 0.6 mm thick layer composed of a mixture containing an inorganic filler of 70 wt% to 95 wt% and a thermosetting resin of 5 wt% to 30 wt%. State. A protective film 11 having a thickness of about 0.01 to 0.03 mm made of PET, PPS, PEN or the like is laminated on the surface of the electric insulating layer 3 for the purpose of protecting the surface of the electric insulating layer and forming protrusions of the inner vias. To do. Thereafter, the inner via hole 12 having a diameter of about 0.05 to 0.3 mm is processed by means of a laser or a puncher.

  Next, as shown in FIGS. 4B and 4C, the inner via hole 12 is filled with a conductive resin paste by printing. Furthermore, the electrical insulation sheet 13 provided with the inner vias 6 and 7 protruding from the surface of the electrical insulation layer 3 can be obtained by peeling and removing the protective film 11.

  FIG. 4 (d) shows a stacking process, and a component 4 having a thickness of 0.05 to 0.5 mm is flip-chip mounted on the wiring pattern of the wiring substrate 1 by bumps 5. The wiring board 1, the electrical insulating sheet 13 on which the inner vias 6 and 7 are formed, and the wiring board 2 are sequentially laminated. Note that a cavity for incorporating the component 4 may be formed in the electrical insulating sheet 13.

  As shown in FIG. 4E, after laminating the wiring board and the electrical insulating sheet, the component-embedded board 14 is completed by performing heat pressing. In the hot press, the surfaces of the wiring boards 1 and 2 are heated and pressed by a hot press machine (not shown) at, for example, a temperature of 200 ° C. and a pressure of 3 MPa. At this time, the electrical insulating sheet is softened at one end to embed the component 4 and is bonded to the wiring boards 1 and 2 and hardened. Further, the inner vias 6 and 7 formed in the electrically insulating resin sheet are compression-bonded by the amount of protrusion from the electrically insulating sheet and the thickness of the via receiving land 20 of the wiring board at the time of hot pressing. A stable electrical connection between the wiring boards 2 can be obtained.

  FIG. 5F is a diagram in which the component 8 is mounted on the surface wiring pattern of the component-embedded substrate 14, and the component 8 is molded with a thermosetting resin material 9, and is shown in FIG. 5G. Thus, a multi-sided substrate is formed.

  FIG. 5H is a process explanatory diagram for performing groove processing on the component-embedded substrate configured as described above in module units. Half dicing is performed to the module size with the blade 17 of the dicing apparatus. In addition, you may cut | disconnect the line used as the surrounding discard part completely. At this time, the arrangement of the modules with respect to the large-sized substrate is determined in the design stage in consideration of the tooth width 18 of the blade that becomes the cutting groove. In particular, the inner via 7 is designed to be arranged so that the inner via 7 remains in a semi-cylindrical shape on the cut end face. FIG. 5 (i) and FIG. 6 (a) are diagrams in which the cutting grooves 19 are half-diced for each module.

  FIG. 6B is a plan sectional view taken along line BB when the cutting groove is half-diced. The inner vias 7 arranged between the modules can be configured without any problem by arranging them slightly shifted by a distance d as shown in the figure.

Next, the appearance of the inner via 6 inside the electrical insulating layer 3 is evaluated by visual inspection of the shape of the inner via 7 exposed at the cut end face.
7 to 9 are cross-sectional views of the semi-cylindrical inner via used for the inspection of the component built-in module according to Embodiment 3 of the present invention.

FIG. 7 (a1) is a cross-sectional view showing a state of the normal inner via 7, and FIG. 7 (a2) is a front view of the end face of the electrical insulating layer 3 viewed from the direction of arrow J in FIG. 7 (a1).
Similarly, FIGS. 7 (b1), (c1), and (d1) are sectional views showing various states of various defective inner vias 7, and FIGS. 7 (b2), (c2), and (d2) are FIGS. 7 (b1) (c1). ) Is a front view of the end face of the electrical insulating layer 3 as viewed from the direction of arrow J in (d1).

In more detail,
7A1 and 7A2 show a normal state.
FIGS. 7B1 and 7B2 show a state in which bubbles are generated when the conductive resin paste is printed and filled in the inner via holes, and the bubbles appear in the semi-cylindrical cut section and an abnormality can be detected.

FIGS. 7C1 and 7C2 show a state in which the position of the inner via is deviated from the design position due to a stacking deviation or the like, and the semi-cylindrical cut cross section becomes thin and can be detected.
FIGS. 7 (d1) and (d2) show a state in which the inner via is bent along with the flow of the resin when the electrical insulating layer is softened in the hot press process. Can be detected.

  Conventionally, since the electrical connection between the upper and lower wiring boards is arranged in the module like the inner via 6 shown in FIG. 1 (b), an appearance inspection cannot be performed, and therefore an equipment such as an X-ray transmission device is used. In this embodiment, it is necessary to inspect the quality state of the via over time, but in this embodiment, the electrical insulating layer 3 is inspected by inspecting the cut surface of the inner via 7 exposed on the end surface of the electrical insulating layer 3. The quality of the inner via 6 inside can be evaluated, and an expensive inspection tool such as a conventional X-ray transmission device becomes unnecessary.

Subsequent processing is performed on the multi-sided board that has passed the inspection of the inner via 6.
As shown in FIG. 8A, the edge of the resin mold is chamfered as necessary, and then the conductive film 10 is formed on the resin mold surface and the cut end surface as shown in FIG. 8B. The conductive film is formed of a metal material by a method such as plating, vapor deposition, or sputtering.

  As a result, the conductive film 10 is electrically connected to the ground via the semi-cylindrical inner via 7 formed on the end face of the electrical insulating layer 3, whereby the entire component built-in module can be shielded. Thereafter, as shown in FIG. 8 (c), the half dicing portion is completely cut into individual components.

  In the fourth embodiment, the manufacturing method has been described by taking the case of the component built-in module of the third embodiment as an example. However, the component built-in module shown in the first and second embodiments is also manufactured in the same manner. The quality of the inner via 6 can be evaluated.

(Embodiment 5)
In the description of the fourth embodiment, the inspection semi-cylindrical inner via is set to remain on the cut end surface on the component built-in module side. However, as shown in FIG. The layout of the inner vias 7 is designed so as to remain in the (discarded portion), and the semi-cylindrical vias on the end surface of the substrate (discarded portion) after cutting are inspected, and the inner via 6 inside the electrical insulating layer 3 is finished. Therefore, an expensive inspection tool such as a conventional X-ray transmission device becomes unnecessary.

  The semi-cylindrical inner via for inspection is set to remain on the cut end surface on the component built-in module side, and the arrangement of the inner via 7 is designed so as to remain on the peripheral portion of the board (discarded portion). Inspecting the cut surface of the inner via 7 exposed on the cut end surface or the cut surface of the inner via 7 remaining on the peripheral portion (discarded portion) of the substrate to evaluate the quality of the inner via 6 inside the electrical insulating layer 3. You can also.

  The present invention can determine the reliability of manufacturing of a component built-in module without using equipment such as an X-ray transmission device and without inspecting it over time, and can contribute to the realization of mass production. .

Sectional drawing of the component built-in module of Embodiment 1 concerning this invention Sectional drawing of the component built-in module of Embodiment 2 concerning this invention Sectional drawing for demonstrating the component built-in module of Embodiment 3 concerning this invention. Sectional drawing for demonstrating the production process of the board | substrate which has multiple arrangement | positioning of the component built-in module manufacturing method in Embodiment 4 concerning this invention Sectional drawing for demonstrating the process of carrying out the surface mounting to the board | substrate arrange | positioned in multiple surfaces in the same embodiment, and carrying out the half dicing of the surface mounting components for each module unit Sectional view and plan view of a multi-sided board that has been advanced up to a half dicing process in module units in the same embodiment Sectional drawing for demonstrating an inner via | veer inspection process in the same embodiment, and the front view of the end surface of an electrically insulating layer Sectional drawing for demonstrating the electroconductive film formation process in the embodiment Inner via plan view for explaining an example of inner via arrangement in the component built-in module inspection according to the fifth embodiment of the present invention. Sectional view and plan view of a conventional component built-in module Plan view when cutting a multi-sided substrate in a conventional manufacturing method

Explanation of symbols

1, 2 Wiring board 3 Electrical insulation layer 4, 8 Parts 6 Inner via (first inner via)
7 Inner via (second inner via)
9 Resin material 10 Conductive film 11 Protective film 12 Inner via hole 13 Electrical insulating sheet 14 Component-embedded substrate 17 Dicing device blade 19 Cutting groove 20 Via receiving land 21 Air bubble

Claims (4)

An electrical insulating layer is disposed between the first wiring board and the second wiring board, and is mounted on the side of the electrical insulating layer of the first wiring board or the side of the electrical insulating layer of the second wiring board. The first wiring board is embedded by the first inner via formed in the electric insulating layer and not formed in the first wiring board and the second wiring board. A module with a built-in component that is electrically connected between the wiring board and the second wiring board,
A semi-cylindrical cut surface is exposed at an end surface of the electrical insulating layer, and includes a first inner wiring board and a second inner via that is not formed on the second wiring board. A component built-in module in which a conductive film connected to a reference potential and connected to the second inner via is provided on an end face of the electrical insulating layer. Molding a component mounted on the surface of the second wiring board opposite to the side of the electrical insulating layer with a resin material;
The component built-in module according to claim 1, wherein a conductive film connected to a second inner via is provided on an end face of the electrical insulating layer and a surface of the resin material. The component built-in module according to claim 1, wherein the conductive film is formed of a metal material by any one of plating, vapor deposition, sputtering, and CVD. The component built-in module according to any one of claims 1 to 3 , wherein the first and second inner vias are made of a conductive resin paste.

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