JP2009075076A - 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 - Google Patents
温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 Download PDFInfo
- Publication number
- JP2009075076A JP2009075076A JP2008175484A JP2008175484A JP2009075076A JP 2009075076 A JP2009075076 A JP 2009075076A JP 2008175484 A JP2008175484 A JP 2008175484A JP 2008175484 A JP2008175484 A JP 2008175484A JP 2009075076 A JP2009075076 A JP 2009075076A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- temperature measuring
- temperature
- protective box
- resistant protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 239000011810 insulating material Substances 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000009529 body temperature measurement Methods 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 229910021485 fumed silica Inorganic materials 0.000 claims description 9
- 229910052602 gypsum Inorganic materials 0.000 claims description 9
- 239000010440 gypsum Substances 0.000 claims description 9
- 239000012210 heat-resistant fiber Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 24
- 239000011521 glass Substances 0.000 abstract description 23
- 239000011505 plaster Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000005338 heat storage Methods 0.000 description 4
- 238000011835 investigation Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000011232 storage material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
【解決手段】石膏材を用いて成形され、内部に温度計測器5を収納するための収納部20を備える内側容器2と、断熱材を用いて成形され、内部に前記内側容器2が嵌め込まれる外側容器3と、前記温度計測器5に接続される熱電対6又は測温抵抗体の引き出し部4とより耐熱保護ボックス1を構成した。そして耐熱保護ボックス1から延出される温度計測器の単又は複数の熱電対6又は測温抵抗体を被温度測定体の所定箇所に接続し、該耐熱保護ボックス1を被温度測定体とともに加熱炉内を搬送する。
【選択図】図1
Description
1 耐熱保護ボックス
2 内側容器
2a 凹凸係合部
3 外側容器
3a 凹凸係合部
4 引き出し部
5 温度計測器
6 熱電対
7 ガラス基板
8 耐熱カバー
20 収納部
21 容器本体
21a 開口部
22 蓋体
23 側壁
24 凹溝
25 凸条
26 突起部
30 嵌合空間
31 容器本体
31a 開口部
32 蓋体
33 側壁
34 凹溝
34b 面取り部
35 凸条
36 切欠き部
37 突起部
38 切欠き部
39 突起部
41,42,43 貫通溝
60 開放溝
61 嵌合溝
62a 下面
62 分割ピース
63 貫通溝
70 取付穴
71,72 領域
81 分割カバー
82 分割カバー
Claims (10)
- 石膏材を用いて成形され、内部に温度計測器を収納するための収納部を備える内側容器と、
断熱材を用いて成形され、内部に前記内側容器が嵌め込まれる外側容器と、
前記温度計測器に接続される熱電対又は測温抵抗体の引き出し部と、
より構成した温度計測器の耐熱保護ボックス。 - 前記断熱材が、ヒュームドシリカよりなる請求項1記載の耐熱保護ボックス。
- 前記引き出し部として、前記内側容器及び外側容器の各側壁に互いに連通する貫通溝を形成した請求項1又は2記載の耐熱保護ボックス。
- 前記外側容器の側壁に幅広の嵌合溝を設けるとともに、該嵌合溝にはめ込まれる分割ピースを設け、該分割ピースの下面に前記貫通溝を形成してなる請求項3記載の耐熱保護ボックス。
- 前記内側容器を、前記収納部を備えた上端開放の容器本体と、該容器本体の上端開口部を閉塞する蓋体とより構成し、該容器本体の上端開口部の周りに該蓋体と係合する凹凸係合部を周設した請求項1〜4の何れか1項に記載の耐熱保護ボックス。
- 前記外側容器を、前記内側容器が嵌め込まれる嵌合空間を備えた上端開放の容器本体と、該容器本体の上端開口部を閉塞する蓋体とより構成し、該容器本体の上端開口部の周わりに該蓋体と係合する凹凸係合部を周設した請求項1〜5の何れか1項に記載の耐熱保護ボックス。
- 請求項1〜6の何れか1項に記載の耐熱保護ボックスに温度計測器を収納するとともに、被温度測定体の所定箇所に接続される単又は複数の熱電対又は測温抵抗体を、前記引き出し部を通じて前記温度計測器に接続してなる温度計測装置。
- 耐熱繊維よりなる耐熱カバーを上下分割して構成するとともに、一方又は双方の分割カバーに熱電対又は測温抵抗体を引き出すための切欠部を形成し、前記温度計測器を収納する耐熱保護ボックスを前記耐熱カバー内に収納してなる請求項7記載の温度計測装置。
- 請求項7又は8記載の温度計測装置により、加熱炉内を搬送中の被温度測定体の温度を計測する温度計測方法であって、前記耐熱保護ボックスから前記引き出し部を通じて延出される前記温度計測器の単又は複数の熱電対又は測温抵抗体を、前記被温度測定体の所定箇所に接続し、該耐熱保護ボックスを前記被温度測定体とともに加熱炉内を搬送してなる温度計測方法。
- 前記被温度計測体の温度測定領域を二以上の複数領域に分け、一の領域の所定箇所に単又は複数の熱電対又は測温抵抗体を接続し、且つその他の領域に前記耐熱保護ボックスを載置した状態で、当該被温度計測体を加熱炉内を搬送することにより一の領域の温度計測を行い、他の領域についても、順次同様にして温度計測を行い、すべての領域の温度計測を行う請求項9記載の温度計測方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008175484A JP5251305B2 (ja) | 2007-08-28 | 2008-07-04 | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 |
KR1020080076378A KR101464183B1 (ko) | 2007-08-28 | 2008-08-05 | 온도계측기의 내열보호 박스 및 이것을 사용한온도계측장치 및 온도계측방법 |
TW097132816A TWI444701B (zh) | 2007-08-28 | 2008-08-27 | A temperature measuring device for a temperature measuring device and a temperature measuring device using the same, and a temperature measuring method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007220799 | 2007-08-28 | ||
JP2007220799 | 2007-08-28 | ||
JP2008175484A JP5251305B2 (ja) | 2007-08-28 | 2008-07-04 | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009075076A true JP2009075076A (ja) | 2009-04-09 |
JP5251305B2 JP5251305B2 (ja) | 2013-07-31 |
Family
ID=40610167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008175484A Active JP5251305B2 (ja) | 2007-08-28 | 2008-07-04 | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5251305B2 (ja) |
KR (1) | KR101464183B1 (ja) |
TW (1) | TWI444701B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011043376A (ja) * | 2009-08-20 | 2011-03-03 | Toyota Motor Corp | 耐熱ケース |
WO2012017903A1 (ja) * | 2010-08-02 | 2012-02-09 | 株式会社本宏製作所 | センサ付き真空断熱パネルとそのパネルを利用した断熱容器 |
JP2013201042A (ja) * | 2012-03-26 | 2013-10-03 | Toto Ltd | 燃料電池ユニット |
JP2013238624A (ja) * | 2013-09-02 | 2013-11-28 | Toyota Motor Corp | 耐熱ケース |
CN103620735A (zh) * | 2011-05-10 | 2014-03-05 | 科磊股份有限公司 | 用于类衬底度量衡装置的热屏蔽模块 |
US8841353B2 (en) | 2007-03-27 | 2014-09-23 | Sekisui Plastics Co., Ltd. | Carbon-containing modified polystyrene type resin particle, foamable carbon-containing modified polystyrene type resin particle, carbon-containing modified polystyrene type resin foamed particle, carbon-containing modified polystyrene type resin foamed molded product, and production methods thereof |
JP2015004624A (ja) * | 2013-06-21 | 2015-01-08 | トヨタ自動車株式会社 | 温度計測装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101291715B1 (ko) * | 2011-05-19 | 2013-07-31 | 주식회사 포벨 | 써미스터를 이용한 온도 측정 방법 |
JP6706522B2 (ja) * | 2016-03-25 | 2020-06-10 | 株式会社日立ハイテクサイエンス | 試料容器及び熱分析装置 |
JP6653282B2 (ja) * | 2017-03-08 | 2020-02-26 | 日本碍子株式会社 | ハニカム成形体の温度測定方法 |
JP7146659B2 (ja) * | 2019-01-25 | 2022-10-04 | 住友重機械プロセス機器株式会社 | 炉内観察装置、炉内観察装置のメンテナンス方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113646A (ja) * | 1987-10-28 | 1989-05-02 | Electric Power Dev Co Ltd | 堆積石炭用複合センサ |
JPH0989681A (ja) * | 1995-09-25 | 1997-04-04 | Isuzu Ceramics Kenkyusho:Kk | 熱電対の構造 |
JP2006189373A (ja) * | 2005-01-07 | 2006-07-20 | Yokohama Rubber Co Ltd:The | ゴム製品加硫中の温度測定方法 |
JP2008292421A (ja) * | 2007-05-28 | 2008-12-04 | Toyota Motor Corp | データ記録装置及びその取扱い方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200179993Y1 (ko) | 1997-12-23 | 2000-05-01 | 김영환 | 패키지 테스트 장치 |
JP2002304689A (ja) | 2001-04-04 | 2002-10-18 | Nec San-Ei Instruments Ltd | 温度遠隔計測装置及びこれに用いる耐熱容器 |
JP2007178253A (ja) | 2005-12-28 | 2007-07-12 | Tokyo Electron Ltd | 温度測定装置および温度測定方法 |
KR100688583B1 (ko) | 2005-12-31 | 2007-03-02 | 삼성전자주식회사 | 포토 에미션 분석 장치 및 포토 에미션 분석 방법 |
-
2008
- 2008-07-04 JP JP2008175484A patent/JP5251305B2/ja active Active
- 2008-08-05 KR KR1020080076378A patent/KR101464183B1/ko active IP Right Grant
- 2008-08-27 TW TW097132816A patent/TWI444701B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01113646A (ja) * | 1987-10-28 | 1989-05-02 | Electric Power Dev Co Ltd | 堆積石炭用複合センサ |
JPH0989681A (ja) * | 1995-09-25 | 1997-04-04 | Isuzu Ceramics Kenkyusho:Kk | 熱電対の構造 |
JP2006189373A (ja) * | 2005-01-07 | 2006-07-20 | Yokohama Rubber Co Ltd:The | ゴム製品加硫中の温度測定方法 |
JP2008292421A (ja) * | 2007-05-28 | 2008-12-04 | Toyota Motor Corp | データ記録装置及びその取扱い方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8841353B2 (en) | 2007-03-27 | 2014-09-23 | Sekisui Plastics Co., Ltd. | Carbon-containing modified polystyrene type resin particle, foamable carbon-containing modified polystyrene type resin particle, carbon-containing modified polystyrene type resin foamed particle, carbon-containing modified polystyrene type resin foamed molded product, and production methods thereof |
JP2011043376A (ja) * | 2009-08-20 | 2011-03-03 | Toyota Motor Corp | 耐熱ケース |
WO2012017903A1 (ja) * | 2010-08-02 | 2012-02-09 | 株式会社本宏製作所 | センサ付き真空断熱パネルとそのパネルを利用した断熱容器 |
CN103620735A (zh) * | 2011-05-10 | 2014-03-05 | 科磊股份有限公司 | 用于类衬底度量衡装置的热屏蔽模块 |
JP2013201042A (ja) * | 2012-03-26 | 2013-10-03 | Toto Ltd | 燃料電池ユニット |
JP2015004624A (ja) * | 2013-06-21 | 2015-01-08 | トヨタ自動車株式会社 | 温度計測装置 |
JP2013238624A (ja) * | 2013-09-02 | 2013-11-28 | Toyota Motor Corp | 耐熱ケース |
Also Published As
Publication number | Publication date |
---|---|
TW200921186A (en) | 2009-05-16 |
JP5251305B2 (ja) | 2013-07-31 |
TWI444701B (zh) | 2014-07-11 |
KR101464183B1 (ko) | 2014-11-21 |
KR20090023097A (ko) | 2009-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5251305B2 (ja) | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 | |
US7866882B2 (en) | Standard radiation source | |
US6572265B1 (en) | In situ optical surface temperature measuring techniques and devices | |
TWI470716B (zh) | 製程條件量測裝置及用於量測經組態以處理生產工件之工件處理工具中之製程條件之方法 | |
US20200166417A1 (en) | Adiabatic Concrete Calorimeter and Method | |
JP6632583B2 (ja) | 搬送装置及び基板処理装置 | |
ES2796274T3 (es) | Sistema de biorreactor que comprende un medio sensor de temperatura | |
CN106539567A (zh) | 身体核心温度测量 | |
JP2019508891A (ja) | 高温処理アプリケーションにおける計測パラメタ獲得用の計装基板装置 | |
US8378264B2 (en) | Heater for piping | |
JP5366772B2 (ja) | 温度検出装置 | |
TW202136728A (zh) | 用於測量真空及微波環境中溫度的設備 | |
TWI405846B (zh) | A furnace width measuring device and a pushing machine having the device | |
US1791020A (en) | Apparatus for measuring the temperature of gases | |
Ballico et al. | Novel experimental technique for measuring high-temperature spectral emissivities | |
CN106539566A (zh) | 身体核心温度测量 | |
WO1995022928A1 (en) | Infrared tympanic thermometer | |
US3452598A (en) | Immersion radiation pyrometer device | |
KR101230027B1 (ko) | 진공상태에서의 복사 열 유속 측정장치 | |
JP3380023B2 (ja) | 温度基準装置 | |
JP2012012660A (ja) | 蒸着温度計測装置、蒸着装置 | |
US11519787B2 (en) | Isothermal packaging device with temperature monitoring | |
Jones | Temperature uncertainties in oven heating tests for propensity to spontaneous combustion | |
JP2015087277A (ja) | 測温体校正装置、測温体校正システム及び測温体校正方法 | |
US20240027029A1 (en) | Integrated vapor plug temperature monitoring |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110414 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130319 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130401 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5251305 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160426 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |