JP5251305B2 - 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 - Google Patents
温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 Download PDFInfo
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- JP5251305B2 JP5251305B2 JP2008175484A JP2008175484A JP5251305B2 JP 5251305 B2 JP5251305 B2 JP 5251305B2 JP 2008175484 A JP2008175484 A JP 2008175484A JP 2008175484 A JP2008175484 A JP 2008175484A JP 5251305 B2 JP5251305 B2 JP 5251305B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
1 耐熱保護ボックス
2 内側容器
2a 凹凸係合部
3 外側容器
3a 凹凸係合部
4 引き出し部
5 温度計測器
6 熱電対
7 ガラス基板
8 耐熱カバー
20 収納部
21 容器本体
21a 開口部
22 蓋体
23 側壁
24 凹溝
25 凸条
26 突起部
30 嵌合空間
31 容器本体
31a 開口部
32 蓋体
33 側壁
34 凹溝
34b 面取り部
35 凸条
36 切欠き部
37 突起部
38 切欠き部
39 突起部
41,42,43 貫通溝
60 開放溝
61 嵌合溝
62a 下面
62 分割ピース
63 貫通溝
70 取付穴
71,72 領域
81 分割カバー
82 分割カバー
Claims (10)
- 石膏材を用いて成形され、内部に温度計測器を収納するための収納部を備える内側容器と、
断熱材を用いて成形され、内部に前記内側容器が嵌め込まれる外側容器と、
前記温度計測器に接続される熱電対又は測温抵抗体の引き出し部と、
より構成した温度計測器の耐熱保護ボックス。 - 前記断熱材が、ヒュームドシリカよりなる請求項1記載の耐熱保護ボックス。
- 前記引き出し部として、前記内側容器及び外側容器の各側壁に互いに連通する貫通溝を形成した請求項1又は2記載の耐熱保護ボックス。
- 前記外側容器の側壁に幅広の嵌合溝を設けるとともに、該嵌合溝にはめ込まれる分割ピースを設け、該分割ピースの下面に前記貫通溝を形成してなる請求項3記載の耐熱保護ボックス。
- 前記内側容器を、前記収納部を備えた上端開放の容器本体と、該容器本体の上端開口部を閉塞する蓋体とより構成し、該容器本体の上端開口部の周りに該蓋体と係合する凹凸係合部を周設した請求項1〜4の何れか1項に記載の耐熱保護ボックス。
- 前記外側容器を、前記内側容器が嵌め込まれる嵌合空間を備えた上端開放の容器本体と、該容器本体の上端開口部を閉塞する蓋体とより構成し、該容器本体の上端開口部の周わりに該蓋体と係合する凹凸係合部を周設した請求項1〜5の何れか1項に記載の耐熱保護ボックス。
- 請求項1〜6の何れか1項に記載の耐熱保護ボックスに温度計測器を収納するとともに、被温度測定体の所定箇所に接続される単又は複数の熱電対又は測温抵抗体を、前記引き出し部を通じて前記温度計測器に接続してなる温度計測装置。
- 耐熱繊維よりなる耐熱カバーを上下分割して構成するとともに、一方又は双方の分割カバーに熱電対又は測温抵抗体を引き出すための切欠部を形成し、前記温度計測器を収納する耐熱保護ボックスを前記耐熱カバー内に収納してなる請求項7記載の温度計測装置。
- 請求項7又は8記載の温度計測装置により、加熱炉内を搬送中の被温度測定体の温度を計測する温度計測方法であって、前記耐熱保護ボックスから前記引き出し部を通じて延出される前記温度計測器の単又は複数の熱電対又は測温抵抗体を、前記被温度測定体の所定箇所に接続し、該耐熱保護ボックスを前記被温度測定体とともに加熱炉内を搬送してなる温度計測方法。
- 前記被温度計測体の温度測定領域を二以上の複数領域に分け、一の領域の所定箇所に単又は複数の熱電対又は測温抵抗体を接続し、且つその他の領域に前記耐熱保護ボックスを載置した状態で、当該被温度計測体を加熱炉内を搬送することにより一の領域の温度計測を行い、他の領域についても、順次同様にして温度計測を行い、すべての領域の温度計測を行う請求項9記載の温度計測方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2008175484A JP5251305B2 (ja) | 2007-08-28 | 2008-07-04 | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 |
KR1020080076378A KR101464183B1 (ko) | 2007-08-28 | 2008-08-05 | 온도계측기의 내열보호 박스 및 이것을 사용한온도계측장치 및 온도계측방법 |
TW097132816A TWI444701B (zh) | 2007-08-28 | 2008-08-27 | A temperature measuring device for a temperature measuring device and a temperature measuring device using the same, and a temperature measuring method |
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JP2007220799 | 2007-08-28 | ||
JP2007220799 | 2007-08-28 | ||
JP2008175484A JP5251305B2 (ja) | 2007-08-28 | 2008-07-04 | 温度計測器の耐熱保護ボックス及びこれを用いた温度計測装置、並びに温度計測方法 |
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JP2009075076A JP2009075076A (ja) | 2009-04-09 |
JP5251305B2 true JP5251305B2 (ja) | 2013-07-31 |
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JP (1) | JP5251305B2 (ja) |
KR (1) | KR101464183B1 (ja) |
TW (1) | TWI444701B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2133372B1 (en) | 2007-03-27 | 2019-07-31 | Sekisui Plastics Co., Ltd. | Particle of carbon-containing modified polystyrene resin, expandable particle of carbon-containing modified polystyrene resin, expanded particle of carbon-containing modified polystyrene resin, molded foam of carbon-containing modified polystyrene resin, and processes for producing these |
JP5627206B2 (ja) * | 2009-08-20 | 2014-11-19 | トヨタ自動車株式会社 | 耐熱ケース |
WO2012017903A1 (ja) * | 2010-08-02 | 2012-02-09 | 株式会社本宏製作所 | センサ付き真空断熱パネルとそのパネルを利用した断熱容器 |
US8681493B2 (en) * | 2011-05-10 | 2014-03-25 | Kla-Tencor Corporation | Heat shield module for substrate-like metrology device |
KR101291715B1 (ko) * | 2011-05-19 | 2013-07-31 | 주식회사 포벨 | 써미스터를 이용한 온도 측정 방법 |
JP5910990B2 (ja) * | 2012-03-26 | 2016-04-27 | Toto株式会社 | 燃料電池ユニット |
JP2015004624A (ja) * | 2013-06-21 | 2015-01-08 | トヨタ自動車株式会社 | 温度計測装置 |
JP5534092B2 (ja) * | 2013-09-02 | 2014-06-25 | トヨタ自動車株式会社 | 耐熱ケース |
JP6706522B2 (ja) * | 2016-03-25 | 2020-06-10 | 株式会社日立ハイテクサイエンス | 試料容器及び熱分析装置 |
JP6653282B2 (ja) * | 2017-03-08 | 2020-02-26 | 日本碍子株式会社 | ハニカム成形体の温度測定方法 |
JP7146659B2 (ja) * | 2019-01-25 | 2022-10-04 | 住友重機械プロセス機器株式会社 | 炉内観察装置、炉内観察装置のメンテナンス方法 |
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JPH01113646A (ja) * | 1987-10-28 | 1989-05-02 | Electric Power Dev Co Ltd | 堆積石炭用複合センサ |
JP3627316B2 (ja) * | 1995-09-25 | 2005-03-09 | いすゞ自動車株式会社 | 熱電対の構造 |
KR200179993Y1 (ko) | 1997-12-23 | 2000-05-01 | 김영환 | 패키지 테스트 장치 |
JP2002304689A (ja) | 2001-04-04 | 2002-10-18 | Nec San-Ei Instruments Ltd | 温度遠隔計測装置及びこれに用いる耐熱容器 |
JP2006189373A (ja) * | 2005-01-07 | 2006-07-20 | Yokohama Rubber Co Ltd:The | ゴム製品加硫中の温度測定方法 |
JP2007178253A (ja) | 2005-12-28 | 2007-07-12 | Tokyo Electron Ltd | 温度測定装置および温度測定方法 |
KR100688583B1 (ko) | 2005-12-31 | 2007-03-02 | 삼성전자주식회사 | 포토 에미션 분석 장치 및 포토 에미션 분석 방법 |
JP2008292421A (ja) * | 2007-05-28 | 2008-12-04 | Toyota Motor Corp | データ記録装置及びその取扱い方法 |
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- 2008-07-04 JP JP2008175484A patent/JP5251305B2/ja active Active
- 2008-08-05 KR KR1020080076378A patent/KR101464183B1/ko active IP Right Grant
- 2008-08-27 TW TW097132816A patent/TWI444701B/zh active
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JP2009075076A (ja) | 2009-04-09 |
KR101464183B1 (ko) | 2014-11-21 |
TWI444701B (zh) | 2014-07-11 |
TW200921186A (en) | 2009-05-16 |
KR20090023097A (ko) | 2009-03-04 |
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