JP2009071234A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2009071234A
JP2009071234A JP2007240907A JP2007240907A JP2009071234A JP 2009071234 A JP2009071234 A JP 2009071234A JP 2007240907 A JP2007240907 A JP 2007240907A JP 2007240907 A JP2007240907 A JP 2007240907A JP 2009071234 A JP2009071234 A JP 2009071234A
Authority
JP
Japan
Prior art keywords
chip
conductive member
base portion
cover
functional surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007240907A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009071234A5 (https=
Inventor
Kazuhiko Koga
和彦 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2007240907A priority Critical patent/JP2009071234A/ja
Priority to US12/230,728 priority patent/US20090072360A1/en
Publication of JP2009071234A publication Critical patent/JP2009071234A/ja
Publication of JP2009071234A5 publication Critical patent/JP2009071234A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2007240907A 2007-09-18 2007-09-18 半導体装置 Pending JP2009071234A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007240907A JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置
US12/230,728 US20090072360A1 (en) 2007-09-18 2008-09-04 Molded semiconductor device including IC-chip covered with conductor member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007240907A JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2009071234A true JP2009071234A (ja) 2009-04-02
JP2009071234A5 JP2009071234A5 (https=) 2009-05-14

Family

ID=40453552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007240907A Pending JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置

Country Status (2)

Country Link
US (1) US20090072360A1 (https=)
JP (1) JP2009071234A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014879A (ja) * 2009-06-05 2011-01-20 Dainippon Printing Co Ltd 半導体装置
JP2012163145A (ja) * 2011-02-04 2012-08-30 Mie Univ 軸受装置及びそれを備える装置
JP2013513942A (ja) * 2009-12-10 2013-04-22 ナショナル セミコンダクター コーポレーション 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150061069A1 (en) * 2013-09-05 2015-03-05 Allegro Microsystems, Llc Integrating a capacitor in an integrated circuit
DE102014211524B4 (de) 2014-06-17 2022-10-20 Robert Bosch Gmbh Elektronikmodul mit einer Vorrichtung zur Wärmeabführung von durch eine in einem Kunststoffgehäuse angeordnete Halbleitereinrichtung erzeugter Wärme und Verfahren zur Herstellung eines Elektronikmoduls
US10283699B2 (en) * 2016-01-29 2019-05-07 Avago Technologies International Sales Pte. Limited Hall-effect sensor isolator
JP2017168704A (ja) * 2016-03-17 2017-09-21 東芝メモリ株式会社 半導体装置の製造方法および半導体装置
JP6759738B2 (ja) * 2016-06-13 2020-09-23 株式会社デンソー 磁気センサ
JP6776840B2 (ja) * 2016-11-21 2020-10-28 オムロン株式会社 電子装置およびその製造方法
CN110459532A (zh) * 2019-08-27 2019-11-15 业成科技（成都）有限公司 半导体静电防护结构
CN113793843B (zh) * 2021-09-30 2024-07-30 重庆平创半导体研究院有限责任公司 一种抗辐照封装结构及方法
EP4434086A4 (en) * 2021-12-17 2025-07-23 Vishay Siliconix Llc SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR A SEMICONDUCTOR DEVICE
EP4345890A1 (en) * 2022-09-29 2024-04-03 Infineon Technologies Austria AG A semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291054A (en) * 1991-06-24 1994-03-01 Sanyo Electric Co., Ltd. Light receiving module for converting light signal to electric signal
DE4212948A1 (de) * 1992-04-18 1993-10-21 Telefunken Microelectron Halbleiterbaugruppe, insbesondere Fernsteuer-Empfangsmodul
JP3278363B2 (ja) * 1996-11-18 2002-04-30 三菱電機株式会社 半導体加速度センサ
US7883278B2 (en) * 2005-07-04 2011-02-08 Fuji Xerox Co., Ltd. Optical module and optical transmission device
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011014879A (ja) * 2009-06-05 2011-01-20 Dainippon Printing Co Ltd 半導体装置
JP2014039067A (ja) * 2009-06-05 2014-02-27 Dainippon Printing Co Ltd 半導体装置
JP2013513942A (ja) * 2009-12-10 2013-04-22 ナショナル セミコンダクター コーポレーション 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ
JP2012163145A (ja) * 2011-02-04 2012-08-30 Mie Univ 軸受装置及びそれを備える装置

Also Published As

Publication number Publication date
US20090072360A1 (en) 2009-03-19

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