CN110677793B - 麦克风封装结构 - Google Patents

麦克风封装结构 Download PDF

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CN110677793B
CN110677793B CN201910796515.XA CN201910796515A CN110677793B CN 110677793 B CN110677793 B CN 110677793B CN 201910796515 A CN201910796515 A CN 201910796515A CN 110677793 B CN110677793 B CN 110677793B
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integrated circuit
microphone
component
package structure
substrate
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CN110677793A (zh
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张朝森
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Merry Electronics Shenzhen Co ltd
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Merry Electronics Shenzhen Co ltd
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    • H04R19/04—Microphones
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Abstract

本发明涉及一种麦克风封装结构包含一基板、一金属壳体、一微机电麦克风组件以及至少一集成电路组件。基板具有二彼此相反的第一表面与第二表面。金属壳体固定于第一表面，使基板与金属壳体共同形成一空腔。微机电麦克风组件固定于金属壳体上且位于空腔内。集成电路组件固定于第二表面，其中集成电路组件位于金属壳体于第二表面之垂直投影的区域内。

Description

麦克风封装结构
技术领域
本发明涉及一种电子组件封装结构，特别涉及一种包含麦克风组件之封装结构。
背景技术
在目前配戴型电子装置在不断缩小尺寸的潮流下，其装置内部的各种组件的尺寸也被要求不断的微型化，麦克风组件的封装结构即是其中之一。如何设计出小型化麦克风封装结构又能同时符合麦克风组件的效能需求是相关制造商研发的方向之一。
发明内容
本发明提出一种创新的麦克风封装结构，藉以满足先前技术问题的需求。
于本发明的一实施例中，一种麦克风封装结构包含一基板、一金属壳体、一微机电麦克风组件以及至少一集成电路组件。基板具有二彼此相反的第一表面与第二表面。金属壳体固定于第一表面，使基板与金属壳体共同形成一空腔。微机电麦克风组件固定于金属壳体上且位于空腔内。集成电路组件固定于第二表面，其中集成电路组件位于金属壳体于第二表面之垂直投影的区域内。
于本发明的一实施例中，集成电路组件至少部分位于微机电麦克风组件于第二表面之垂直投影的区域内。
于本发明的一实施例中，金属壳体具有一通孔，微机电麦克风组件固定于金属壳体上的位置对准通孔。
于本发明的一实施例中，麦克风封装结构更包含一封装胶层，且基板具有一穿孔，封装胶层覆盖穿孔且密封至少一集成电路组件于第二表面上。
于本发明的一实施例中，穿孔不位于至少一集成电路组件于基板垂直投影的区域内。
于本发明的一实施例中，至少一集成电路组件包含邻近于穿孔之声学讯号处理组件以及远离穿孔之电子讯号处理组件。
于本发明的一实施例中，声学讯号处理组件至少部分位于微机电麦克风组件于第二表面之垂直投影的区域内。
于本发明的一实施例中，麦克风封装结构更包含二金属导线穿越穿孔与封装胶层，并电连接至少一集成电路组件与微机电麦克风组件。
于本发明的一实施例中，麦克风封装结构更包含一重分布层配置于封装胶层上，且重分布层包含电连接至声学讯号处理组件之第一导电路径、电连接至电子讯号处理组件之第二导电路径以及接地导电路径。
于本发明的一实施例中，至少一集成电路组件系以金属导线连接至基板的第二表面。
于本发明的一实施例中，至少一集成电路组件系以覆晶方式连接至基板的第二表面。
于本发明的一实施例中，至少一集成电路组件包含复数个集成电路组件，且该些集成电路组件皆固定于基板之第二表面上，并且位于金属壳体于第二表面之垂直投影的区域内。
于本发明的一实施例中，该些集成电路包含复数个焊垫，并且该些复数个焊垫皆位于金属壳体于第二表面之垂直投影的区域内。
综上所述，本发明之麦克风封装结构利用前述金属壳体、集成电路组件以及麦克风组件于电路基板的二侧彼此重迭的设计，使得封装结构能架构于面积较小的电路基板，且有助于麦克风封装结构之缩小化或微型化。
以下将以实施方式对上述之说明作详细的描述，并对本发明之技术方案提供更进一步的解释。
附图说明
为让本发明之上述和其他目的、特征、优点与实施例能更明显易懂，所附图式之说明如下：
图1绘示依照本发明一实施例的一种麦克风封装结构的剖面示意图；
图2A～2D绘示依照本发明一实施例的一种麦克风封装结构的制程步骤的剖面示意图。
附图标记：
100：麦克风封装结构
102：金属壳体
102a：内表面
102b：通孔
104：基板
104a：穿孔
104b：表面
104c：表面
105：空腔
106：微机电麦克风组件
106a：振动膜
108：金属导线
108a：金属导线
108b：金属导线
110：集成电路组件
110a：焊垫
112：集成电路组件
112a：焊垫
114：封装胶层
116：重分布层
118a～118f：导电路径
P1：区域
P2：区域
具体实施方式
为了使本发明的叙述更加详尽与完备，可参照所附的附图及以下所述各种实施例，附图中相同的号码代表相同或相似的组件。另一方面，众所周知的组件与步骤并未描述在实施例中，以避免对本发明造成不必要的限制。
在实施方式与申请专利范围中，除非内文中对于冠词有所特别限定，否则“一”与“该”可泛指单一个或大于一个。
请参照第1图，其绘示依照本发明一实施例的一种麦克风封装结构的剖面示意图。一种麦克风封装结构100包含一基板104、一金属壳体102、一微机电麦克风组件106以及至少一集成电路组件(110,112)。基板104可以是印刷电路板或其他种类的电路板，且具有二彼此相反的表面104b与表面104c。金属壳体102固定于基板104的表面104b，使基板104与金属壳体102共同形成一空腔105。微机电麦克风组件106固定于金属壳体102的内表面102a上且位于空腔105内。集成电路组件(110,112)固定于基板104的表面104c，其中集成电路组件(110,112)位于金属壳体102于表面104c之垂直投影的区域(P2)内，即集成电路组件(110,112)与金属壳体102在垂直方向上彼此重叠。微机电麦克风组件106位于空腔105内，即使不另封胶，亦不受外界水气的侵蚀。上述金属壳体102与集成电路组件(110,112)彼此重叠的设计有助于使用较小面积的基板104，也有助于麦克风封装结构之整体结构的缩小化或微型化。
在本实施例中，集成电路组件110至少部分位于微机电麦克风组件106于基板104的表面104c之垂直投影的区域(P1)内，即集成电路组件110与微机电麦克风组件106在垂直方向上彼此重叠。此设计有助于使用较小面积的基板104，也有助于麦克风封装结构之整体结构的缩小化或微型化。
在本实施例中，虽示例二个集成电路组件(110,112)固定于基板104的表面104c，但不排除更多集成电路组件固定于基板104的表面104c。
在本实施例中，金属壳体102具有一通孔102b，微机电麦克风组件106固定于金属壳体102上的位置对准通孔102b。微机电麦克风组件106不另封胶的位于空腔105内，使其运作参数(例如其振动膜106a的运作参数)不会因封胶而需另行校正。
在本实施例中，基板104具有一穿孔104a，且封装胶层114覆盖基板104之穿孔104a且密封集成电路组件(110,112)于基板104的表面104c上。二金属导线(108a,108b)穿越穿孔104a与封装胶层114，并电连接集成电路组件110与微机电麦克风组件106。
在本实施例中，集成电路组件110可以是一声学讯号处理组件，而集成电路组件112可以是一电子讯号处理组件，集成电路组件110相较于集成电路组件112邻近于基板104的穿孔104a，使得微机电麦克风组件106与对应的声学讯号处理组件(即集成电路组件110)之间讯号传导距离能够尽可能缩短。
在本实施例中，麦克风封装结构更包含一重分布层116配置于封装胶层114上，且重分布层116包含电连接至集成电路组件110之导电路径(118b、118c)、电连接至集成电路组件112之导电路径118d以及接地导电路径(118a或118e)。
在本实施例中，集成电路组件110或112系以金属导线连接至基板104的表面104c或以覆晶方式连接至基板104的表面104c，但不以此为限。
在本实施例中，集成电路组件110或112之复数个焊垫(110a或112a)皆位于金属壳体102于基板104的表面104c之垂直投影的区域(P2)内。
请参照第2A～2D图，其绘示依照本发明一实施例的一种麦克风封装结构的制程步骤之剖面示意图。
在第2A图所绘示的制程步骤中，提供一具有通孔102b的金属壳体102，并将微机电麦克风组件106固定于金属壳体102的内表面102a上并对准通孔102b(使麦克风组件的振动膜106a对准通孔102b)。接着，将金属导线108的二端连接至微机电麦克风组件106的焊点上。
在第2B图所绘示的制程步骤中，提供一具有穿孔104a的电路基板104。将前述的金属壳体102固定于电路基板104的底表面104b，并使金属导线108通过穿孔104a，且微机电麦克风组件106位于电路基板104与金属壳体102所形成的空腔105内。基板104的上表面104c已先固定集成电路组件(110、112)，集成电路组件110之其中一焊垫以金属导线连接至基板104的上表面104c，集成电路组件112系以覆晶方式连接至基板104的上表面104c。为了于制程中金属导线108能顺利通过穿孔104a，穿孔104a的孔径应大于金属导线108之线径的二倍以上。
在第2C图所绘示的制程步骤中，形成一封装胶层114覆盖穿孔104a且密封集成电路组件(110、112)于基板104的上表面104c，并移除凸出于封装胶层114的金属导线108部分，藉以形成二金属导线(108a、108b)。在本实施例中，穿孔104a不位于集成电路组件(110,112)于基板(104)垂直投影的区域内。
在第2D图所绘示的制程步骤中，形成一重分布层116覆盖封装胶层114的顶面，重分布层116包含电连接至集成电路组件110之导电路径(118b、118c)、电连接至集成电路组件112之导电路径118d以及接地导电路径(118a或118e)。另有导电路径118f连接于二金属导线(108a、108b)与集成电路组件110之间。
综上所述，本发明之麦克风封装结构利用前述金属壳体、集成电路组件以及麦克风组件于电路基板的二侧彼此重叠的设计，使得封装结构能架构于面积较小的电路基板，且有助于麦克风封装结构之缩小化或微型化。
虽然本发明已以实施方式揭露如上，然其并非用以限定本发明，任何熟习此技艺者，于不脱离本发明之精神和范围内，当可作各种之更动与润饰，因此本发明之保护范围当视后附之申请专利范围所界定者为准。

Claims (13)

1.一种麦克风封装结构，其特征在于，包含：
一基板，具有二彼此相反的第一表面与第二表面，所述基板内设有一穿孔；
一金属壳体，固定于该第一表面，使该基板与该金属壳体共同形成一空腔，所述金属壳体具有一通孔；
一微机电麦克风组件，固定于该金属壳体的内表面且位于该空腔内，所述微机电麦克风组件固定于该金属壳体上的位置对准所述通孔；
至少一集成电路组件，固定于该第二表面，其中所述集成电路组件的至少部分、所述穿孔的至少部分以及所述通孔的至少部分都位于所述微机电麦克风组件的垂直投影的区域内；
封装胶层，覆盖所述穿孔且密封至少一所述集成电路组件于第二表面上；
其中，所述微机电麦克风组件与至少一所述集成电路组件通过所述穿孔直接电连接；
重分布层，设于所述封装胶层上，所述微机电 麦克风组件与第二表面的集成电路组件通过重分布层电连接。
2.根据权利要求1所述的麦克风封装结构，其特征在于：该集成电路组件至少部分位于该微机电麦克风组件于该第二表面之垂直投影的区域内。
3.根据权利要求1所述的麦克风封装结构，其特征在于：所述基板为电路板。
4.根据权利要求1所述的麦克风封装结构，其特征在于：更包含二金属导线穿越该穿孔与该封装胶层，并电连接该至少一集成电路组件与该微机电麦克风组件。
5.根据权利要求4所述的麦克风封装结构，其特征在于，所述穿孔孔径大于金属导线线径的二倍以上。
6.根据权利要求1所述的麦克风封装结构，其特征在于：该穿孔不位于该至少一集成电路组件于该基板垂直投影的区域内。
7.根据权利要求1所述的麦克风封装结构，其特征在于：该至少一集成电路组件包含邻近于该穿孔之声学讯号处理组件以及远离该穿孔之电子讯号处理组件。
8.根据权利要求7所述的麦克风封装结构，其特征在于：该声学讯号处理组件至少部分位于该微机电麦克风组件于该第二表面之垂直投影的区域内。
9.根据权利要求7所述的麦克风封装结构，其特征在于：所述重分布层包含电连接至该声学讯号处理组件之第一导电路径、电连接至该电子讯号处理组件之第二导电路径以及接地导电路径。
10.根据权利要求1所述的麦克风封装结构，其特征在于：该至少一集成电路组件系以金属导线连接至该基板的该第二表面。
11.根据权利要求1所述的麦克风封装结构，其特征在于：该至少一集成电路组件系以覆晶方式连接至该基板的该第二表面。
12.根据权利要求1所述的麦克风封装结构，其特征在于：该至少一集成电路组件包含复数个集成电路组件，且该些集成电路组件皆固定于该基板之第二表面上，并且位于该金属壳体于该第二表面之垂直投影的区域内。
13.根据权利要求12所述的麦克风封装结构，其特征在于：该些集成电路包含复数个焊垫，并且该些复数个焊垫皆位于该金属壳体于该第二表面之垂直投影的区域内。
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