JP2009070865A5 - - Google Patents

Download PDF

Info

Publication number
JP2009070865A5
JP2009070865A5 JP2007234919A JP2007234919A JP2009070865A5 JP 2009070865 A5 JP2009070865 A5 JP 2009070865A5 JP 2007234919 A JP2007234919 A JP 2007234919A JP 2007234919 A JP2007234919 A JP 2007234919A JP 2009070865 A5 JP2009070865 A5 JP 2009070865A5
Authority
JP
Japan
Prior art keywords
semiconductor device
film substrate
mounting region
semiconductor chip
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007234919A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009070865A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007234919A priority Critical patent/JP2009070865A/ja
Priority claimed from JP2007234919A external-priority patent/JP2009070865A/ja
Publication of JP2009070865A publication Critical patent/JP2009070865A/ja
Publication of JP2009070865A5 publication Critical patent/JP2009070865A5/ja
Pending legal-status Critical Current

Links

JP2007234919A 2007-09-11 2007-09-11 半導体装置 Pending JP2009070865A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007234919A JP2009070865A (ja) 2007-09-11 2007-09-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007234919A JP2009070865A (ja) 2007-09-11 2007-09-11 半導体装置

Publications (2)

Publication Number Publication Date
JP2009070865A JP2009070865A (ja) 2009-04-02
JP2009070865A5 true JP2009070865A5 (https=) 2010-10-14

Family

ID=40606844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007234919A Pending JP2009070865A (ja) 2007-09-11 2007-09-11 半導体装置

Country Status (1)

Country Link
JP (1) JP2009070865A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236615B2 (en) 2009-11-25 2012-08-07 International Business Machines Corporation Passivation layer surface topography modifications for improved integrity in packaged assemblies
JP6151616B2 (ja) * 2013-09-27 2017-06-21 京セラ株式会社 電子部品搭載用基板および電子装置
JP2020150117A (ja) * 2019-03-13 2020-09-17 株式会社リコー 電子装置、および電子装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203229A (ja) * 2000-01-18 2001-07-27 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2006005302A (ja) * 2004-06-21 2006-01-05 Matsushita Electric Ind Co Ltd フレキシブル基板およびその製造方法
JP4513532B2 (ja) * 2004-12-01 2010-07-28 セイコーエプソン株式会社 半導体装置の製造方法
JP4484750B2 (ja) * 2005-04-15 2010-06-16 シャープ株式会社 配線基板およびそれを備えた電子回路素子ならびに表示装置

Similar Documents

Publication Publication Date Title
TWI531283B (zh) 連接基板及層疊封裝結構
US10177130B2 (en) Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
US9780043B2 (en) Wiring board, semiconductor package, and semiconductor device
CN100495694C (zh) 半导体器件
JP4474431B2 (ja) 半導体パッケージおよび該製造方法
TWI452661B (zh) 線路直接連接晶片之封裝結構
JP5100878B1 (ja) 部品内蔵基板実装体及びその製造方法並びに部品内蔵基板
JP5237242B2 (ja) 配線回路構造体およびそれを用いた半導体装置の製造方法
JP2009044160A5 (https=)
JP2009545180A5 (https=)
TW201250961A (en) Chip-scale package structure
TWI569390B (zh) 電子封裝件及其製法
JP2014515187A5 (https=)
CN101661929B (zh) 芯片封装结构及堆叠式芯片封装结构
CN103779290A (zh) 连接基板及层叠封装结构
JP2009070865A5 (https=)
CN103229609B (zh) 第二级互连结构及其制造方法
TWM521807U (zh) 封裝結構及其中介板
TWI631684B (zh) 中介基板及其製法
JP5125349B2 (ja) 半導体装置の実装構造および実装方法
CN217933791U (zh) 一种芯片封装结构
CN101615607A (zh) 芯片封装结构
US20080224295A1 (en) Package structure and stacked package module using the same
JP2009147106A5 (https=)
JP2010219554A (ja) 半導体装置及びそれを用いた電子制御装置