JP2009063551A - 半導体センサ装置 - Google Patents

半導体センサ装置 Download PDF

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Publication number
JP2009063551A
JP2009063551A JP2007234090A JP2007234090A JP2009063551A JP 2009063551 A JP2009063551 A JP 2009063551A JP 2007234090 A JP2007234090 A JP 2007234090A JP 2007234090 A JP2007234090 A JP 2007234090A JP 2009063551 A JP2009063551 A JP 2009063551A
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JP
Japan
Prior art keywords
sensor element
semiconductor
sensor device
sensor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007234090A
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English (en)
Japanese (ja)
Other versions
JP2009063551A5 (https=
Inventor
Junya Tanaka
淳也 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007234090A priority Critical patent/JP2009063551A/ja
Publication of JP2009063551A publication Critical patent/JP2009063551A/ja
Publication of JP2009063551A5 publication Critical patent/JP2009063551A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Pressure Sensors (AREA)
JP2007234090A 2007-09-10 2007-09-10 半導体センサ装置 Pending JP2009063551A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007234090A JP2009063551A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007234090A JP2009063551A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Publications (2)

Publication Number Publication Date
JP2009063551A true JP2009063551A (ja) 2009-03-26
JP2009063551A5 JP2009063551A5 (https=) 2010-10-07

Family

ID=40558238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007234090A Pending JP2009063551A (ja) 2007-09-10 2007-09-10 半導体センサ装置

Country Status (1)

Country Link
JP (1) JP2009063551A (https=)

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05215767A (ja) * 1991-12-03 1993-08-24 Nec Corp 半導体加速度センサ
JPH0854413A (ja) * 1994-08-12 1996-02-27 Zexel Corp 半導体加速度センサ素子及びその製造方法
JPH08320332A (ja) * 1995-05-26 1996-12-03 Fujitsu Ten Ltd 加速度センサの実装構造
JPH09213840A (ja) * 1996-01-31 1997-08-15 Nec Corp 樹脂封止型半導体装置
JP2001183389A (ja) * 1999-12-22 2001-07-06 Matsushita Electric Works Ltd マイクロセンサモジュールの実装構造および実装方法
JP2001227902A (ja) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp 半導体装置
JP2001235485A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp 加速度センサ
JP2003136494A (ja) * 2001-10-26 2003-05-14 Sumitomo Metal Ind Ltd マイクロ構造体、物理量検出装置及びその製造方法
JP2004135193A (ja) * 2002-10-11 2004-04-30 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2004525357A (ja) * 2001-01-10 2004-08-19 シルバーブルック リサーチ ピーティワイ リミテッド ウエハスケールで設けられるキャップによって保護される加速度計
JP2005140720A (ja) * 2003-11-10 2005-06-02 Oki Electric Ind Co Ltd 加速度センサ
JP2005169541A (ja) * 2003-12-10 2005-06-30 Hitachi Metals Ltd 半導体装置およびその製造方法
JP2005327880A (ja) * 2004-05-13 2005-11-24 Mitsui Chemicals Inc 高速・大容量信号接続用コネクター構造
JP2006060564A (ja) * 2004-08-20 2006-03-02 Alps Electric Co Ltd 表面弾性波装置
JP2006156674A (ja) * 2004-11-29 2006-06-15 Asahi Kasei Electronics Co Ltd 半導体装置及びその製造方法
JP2006179607A (ja) * 2004-12-21 2006-07-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007048994A (ja) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk 半導体装置及びその製造方法

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05215767A (ja) * 1991-12-03 1993-08-24 Nec Corp 半導体加速度センサ
JPH0854413A (ja) * 1994-08-12 1996-02-27 Zexel Corp 半導体加速度センサ素子及びその製造方法
JPH08320332A (ja) * 1995-05-26 1996-12-03 Fujitsu Ten Ltd 加速度センサの実装構造
JPH09213840A (ja) * 1996-01-31 1997-08-15 Nec Corp 樹脂封止型半導体装置
JP2001183389A (ja) * 1999-12-22 2001-07-06 Matsushita Electric Works Ltd マイクロセンサモジュールの実装構造および実装方法
JP2001227902A (ja) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp 半導体装置
JP2001235485A (ja) * 2000-02-25 2001-08-31 Mitsubishi Electric Corp 加速度センサ
JP2004525357A (ja) * 2001-01-10 2004-08-19 シルバーブルック リサーチ ピーティワイ リミテッド ウエハスケールで設けられるキャップによって保護される加速度計
JP2003136494A (ja) * 2001-10-26 2003-05-14 Sumitomo Metal Ind Ltd マイクロ構造体、物理量検出装置及びその製造方法
JP2004135193A (ja) * 2002-10-11 2004-04-30 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2004209585A (ja) * 2002-12-27 2004-07-29 Shinko Electric Ind Co Ltd 電子デバイス及びその製造方法
JP2005140720A (ja) * 2003-11-10 2005-06-02 Oki Electric Ind Co Ltd 加速度センサ
JP2005169541A (ja) * 2003-12-10 2005-06-30 Hitachi Metals Ltd 半導体装置およびその製造方法
JP2005327880A (ja) * 2004-05-13 2005-11-24 Mitsui Chemicals Inc 高速・大容量信号接続用コネクター構造
JP2006060564A (ja) * 2004-08-20 2006-03-02 Alps Electric Co Ltd 表面弾性波装置
JP2006156674A (ja) * 2004-11-29 2006-06-15 Asahi Kasei Electronics Co Ltd 半導体装置及びその製造方法
JP2006179607A (ja) * 2004-12-21 2006-07-06 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007048994A (ja) * 2005-08-11 2007-02-22 Akita Denshi Systems:Kk 半導体装置及びその製造方法

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