JP2009046541A5 - - Google Patents

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Publication number
JP2009046541A5
JP2009046541A5 JP2007211991A JP2007211991A JP2009046541A5 JP 2009046541 A5 JP2009046541 A5 JP 2009046541A5 JP 2007211991 A JP2007211991 A JP 2007211991A JP 2007211991 A JP2007211991 A JP 2007211991A JP 2009046541 A5 JP2009046541 A5 JP 2009046541A5
Authority
JP
Japan
Prior art keywords
bonding film
substrate
bonding
atom
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007211991A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009046541A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007211991A priority Critical patent/JP2009046541A/ja
Priority claimed from JP2007211991A external-priority patent/JP2009046541A/ja
Publication of JP2009046541A publication Critical patent/JP2009046541A/ja
Publication of JP2009046541A5 publication Critical patent/JP2009046541A5/ja
Withdrawn legal-status Critical Current

Links

JP2007211991A 2007-08-15 2007-08-15 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体 Withdrawn JP2009046541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007211991A JP2009046541A (ja) 2007-08-15 2007-08-15 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007211991A JP2009046541A (ja) 2007-08-15 2007-08-15 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009046541A JP2009046541A (ja) 2009-03-05
JP2009046541A5 true JP2009046541A5 (enExample) 2010-08-26

Family

ID=40499064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007211991A Withdrawn JP2009046541A (ja) 2007-08-15 2007-08-15 接合膜付き基材、接合膜付き基材の製造方法、接合方法および接合体

Country Status (1)

Country Link
JP (1) JP2009046541A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9105561B2 (en) * 2012-05-14 2015-08-11 The Boeing Company Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide
JP6194767B2 (ja) 2013-03-14 2017-09-13 株式会社リコー 液体吐出ヘッド及び画像形成装置
CN117545337B (zh) * 2024-01-09 2024-04-09 北京青禾晶元半导体科技有限责任公司 一种压电衬底结构及其制备方法

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