JP2009073943A5 - - Google Patents

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Publication number
JP2009073943A5
JP2009073943A5 JP2007244521A JP2007244521A JP2009073943A5 JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5 JP 2007244521 A JP2007244521 A JP 2007244521A JP 2007244521 A JP2007244521 A JP 2007244521A JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5
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JP
Japan
Prior art keywords
bonding film
adherend
region
bonding
metal atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007244521A
Other languages
English (en)
Japanese (ja)
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JP2009073943A (ja
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Publication date
Application filed filed Critical
Priority to JP2007244521A priority Critical patent/JP2009073943A/ja
Priority claimed from JP2007244521A external-priority patent/JP2009073943A/ja
Publication of JP2009073943A publication Critical patent/JP2009073943A/ja
Publication of JP2009073943A5 publication Critical patent/JP2009073943A5/ja
Withdrawn legal-status Critical Current

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JP2007244521A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009073943A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009073943A JP2009073943A (ja) 2009-04-09
JP2009073943A5 true JP2009073943A5 (enExample) 2010-09-02

Family

ID=40609243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244521A Withdrawn JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

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JP (1) JP2009073943A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569358B2 (ja) * 2015-07-29 2019-09-04 セイコーエプソン株式会社 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法
KR101888097B1 (ko) * 2017-06-13 2018-08-14 호서대학교 산학협력단 유기발광 다이오드 봉지구조체 및 그 제조방법
GB2573278A (en) * 2018-04-25 2019-11-06 Saralon Gmbh Method of electrically connecting two surfaces
JPWO2022038875A1 (enExample) * 2020-08-20 2022-02-24
JPWO2022038876A1 (enExample) * 2020-08-20 2022-02-24
CN114891449B (zh) * 2022-04-25 2024-02-02 歌尔股份有限公司 一种激光胶膜粘接工艺方法以及智能手表
CN115775722B (zh) * 2022-09-08 2025-11-18 武汉新芯集成电路股份有限公司 键合装置及键合方法

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