JP2014526150A5 - - Google Patents

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Publication number
JP2014526150A5
JP2014526150A5 JP2014524018A JP2014524018A JP2014526150A5 JP 2014526150 A5 JP2014526150 A5 JP 2014526150A5 JP 2014524018 A JP2014524018 A JP 2014524018A JP 2014524018 A JP2014524018 A JP 2014524018A JP 2014526150 A5 JP2014526150 A5 JP 2014526150A5
Authority
JP
Japan
Prior art keywords
electronic device
barrier stack
layer
assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014524018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014526150A (ja
JP6141842B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/048917 external-priority patent/WO2013019763A1/en
Publication of JP2014526150A publication Critical patent/JP2014526150A/ja
Publication of JP2014526150A5 publication Critical patent/JP2014526150A5/ja
Application granted granted Critical
Publication of JP6141842B2 publication Critical patent/JP6141842B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014524018A 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品 Expired - Fee Related JP6141842B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161515079P 2011-08-04 2011-08-04
US61/515,079 2011-08-04
PCT/US2012/048917 WO2013019763A1 (en) 2011-08-04 2012-07-31 Edge protected barrier assemblies

Publications (3)

Publication Number Publication Date
JP2014526150A JP2014526150A (ja) 2014-10-02
JP2014526150A5 true JP2014526150A5 (enExample) 2017-01-05
JP6141842B2 JP6141842B2 (ja) 2017-06-07

Family

ID=47629646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014524018A Expired - Fee Related JP6141842B2 (ja) 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品

Country Status (8)

Country Link
US (1) US20140230892A1 (enExample)
EP (1) EP2740326A4 (enExample)
JP (1) JP6141842B2 (enExample)
KR (1) KR20140051990A (enExample)
CN (1) CN103733726B (enExample)
SG (1) SG2014007884A (enExample)
TW (1) TWI583557B (enExample)
WO (1) WO2013019763A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101985983B1 (ko) * 2011-08-04 2019-06-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 탈층 저항성 조립체의 제조 방법
KR101911581B1 (ko) 2011-08-04 2018-10-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 에지 보호된 배리어 조립체
EP2809509A4 (en) 2012-01-31 2015-09-23 3M Innovative Properties Co METHOD FOR BORDER SEALING OF MULTILAYER ARTICLES
JP6702720B2 (ja) 2012-05-03 2020-06-03 スリーエム イノベイティブ プロパティズ カンパニー 耐久性ソーラーミラーフィルム
PL3986972T3 (pl) 2019-06-18 2025-01-13 Avery Dennison Corporation Kleje przylepcowe na bazie kauczuku butylowego

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69410536T2 (de) * 1993-06-24 1998-11-26 Canon K.K., Tokio/Tokyo Solarmodul mit warm-verschweisstem Teil zur Verbesserung der Feuchtigkeitsbeständigkeit
JPH07142756A (ja) * 1993-06-24 1995-06-02 Canon Inc 太陽電池モジュール及びその製造方法
US6066226A (en) * 1994-08-03 2000-05-23 Mitsubishi Gas Chemical Company, Inc. Method of making a sheet-shaped oxygen absorber
US5763555A (en) * 1996-01-22 1998-06-09 Ashland Inc. Water-borne acrylic emulsion pressure-sensitive adhesive compositions containing multifunctional monomer having improved stability and removability
JP3740251B2 (ja) * 1997-06-09 2006-02-01 キヤノン株式会社 太陽電池モジュールの製造方法
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
JP5127123B2 (ja) * 2005-07-22 2013-01-23 ダイキン工業株式会社 太陽電池のバックシート
JPWO2007040039A1 (ja) * 2005-09-30 2009-04-16 東レ株式会社 太陽電池モジュール用封止フィルムおよび太陽電池モジュール
WO2008014492A2 (en) * 2006-07-27 2008-01-31 Nanosolar, Inc. Individually encapsulated solar cells and/or solar cell strings
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
EP1898470B1 (en) * 2006-08-30 2011-07-27 Keiwa Inc. Use of a back sheet for photovoltaic modules and resulting photovoltaic module
JP4251225B2 (ja) * 2007-04-10 2009-04-08 ソニー株式会社 光学素子包括体、バックライトおよび液晶表示装置
US10103359B2 (en) * 2008-04-09 2018-10-16 Agency For Science, Technology And Research Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
JP2010177384A (ja) * 2009-01-28 2010-08-12 Techno Polymer Co Ltd 太陽電池用バックシート
CN102341918A (zh) * 2009-03-06 2012-02-01 琳得科株式会社 太阳能电池组件用保护片以及使用该保护片的太阳能电池组件
EP2448032B1 (en) * 2009-06-24 2014-09-17 Mitsubishi Chemical Corporation Organic electronic device and method for producing the same
US20120227809A1 (en) * 2009-11-18 2012-09-13 Vivek Bharti Flexible assembly and method of making and using the same
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation

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