JP2014526150A5 - - Google Patents

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Publication number
JP2014526150A5
JP2014526150A5 JP2014524018A JP2014524018A JP2014526150A5 JP 2014526150 A5 JP2014526150 A5 JP 2014526150A5 JP 2014524018 A JP2014524018 A JP 2014524018A JP 2014524018 A JP2014524018 A JP 2014524018A JP 2014526150 A5 JP2014526150 A5 JP 2014526150A5
Authority
JP
Japan
Prior art keywords
electronic device
barrier stack
layer
assembly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014524018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014526150A (ja
JP6141842B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/048917 external-priority patent/WO2013019763A1/en
Publication of JP2014526150A publication Critical patent/JP2014526150A/ja
Publication of JP2014526150A5 publication Critical patent/JP2014526150A5/ja
Application granted granted Critical
Publication of JP6141842B2 publication Critical patent/JP6141842B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014524018A 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品 Expired - Fee Related JP6141842B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161515079P 2011-08-04 2011-08-04
US61/515,079 2011-08-04
PCT/US2012/048917 WO2013019763A1 (en) 2011-08-04 2012-07-31 Edge protected barrier assemblies

Publications (3)

Publication Number Publication Date
JP2014526150A JP2014526150A (ja) 2014-10-02
JP2014526150A5 true JP2014526150A5 (enExample) 2017-01-05
JP6141842B2 JP6141842B2 (ja) 2017-06-07

Family

ID=47629646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014524018A Expired - Fee Related JP6141842B2 (ja) 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品

Country Status (8)

Country Link
US (1) US20140230892A1 (enExample)
EP (1) EP2740326A4 (enExample)
JP (1) JP6141842B2 (enExample)
KR (1) KR20140051990A (enExample)
CN (1) CN103733726B (enExample)
SG (1) SG2014007884A (enExample)
TW (1) TWI583557B (enExample)
WO (1) WO2013019763A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103733305B (zh) * 2011-08-04 2017-06-23 3M创新有限公司 制备抗分层组件的方法
US9614113B2 (en) * 2011-08-04 2017-04-04 3M Innovative Properties Company Edge protected barrier assemblies
US9804305B2 (en) 2012-01-31 2017-10-31 3M Innovative Properties Company Methods for sealing the edges of multi-layer articles
JP6702720B2 (ja) 2012-05-03 2020-06-03 スリーエム イノベイティブ プロパティズ カンパニー 耐久性ソーラーミラーフィルム
PL3986972T3 (pl) 2019-06-18 2025-01-13 Avery Dennison Corporation Kleje przylepcowe na bazie kauczuku butylowego

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142756A (ja) * 1993-06-24 1995-06-02 Canon Inc 太陽電池モジュール及びその製造方法
EP0631328B1 (en) 1993-06-24 1998-05-27 Canon Kabushiki Kaisha Solar cell module having heat-fused portion to improve moisture resistance
US6066226A (en) * 1994-08-03 2000-05-23 Mitsubishi Gas Chemical Company, Inc. Method of making a sheet-shaped oxygen absorber
US5763555A (en) * 1996-01-22 1998-06-09 Ashland Inc. Water-borne acrylic emulsion pressure-sensitive adhesive compositions containing multifunctional monomer having improved stability and removability
JP3740251B2 (ja) * 1997-06-09 2006-02-01 キヤノン株式会社 太陽電池モジュールの製造方法
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) * 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
JP5127123B2 (ja) * 2005-07-22 2013-01-23 ダイキン工業株式会社 太陽電池のバックシート
EP1930953A4 (en) * 2005-09-30 2014-08-13 Toray Industries SEALING FILM FOR A SOLAR CELL MODULE AND SOLAR CELL MODULE
WO2008014492A2 (en) * 2006-07-27 2008-01-31 Nanosolar, Inc. Individually encapsulated solar cells and/or solar cell strings
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
EP1898470B1 (en) * 2006-08-30 2011-07-27 Keiwa Inc. Use of a back sheet for photovoltaic modules and resulting photovoltaic module
JP4251225B2 (ja) * 2007-04-10 2009-04-08 ソニー株式会社 光学素子包括体、バックライトおよび液晶表示装置
AU2009234506B2 (en) * 2008-04-09 2013-11-21 Agency For Science, Technology And Research Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
JP2010177384A (ja) * 2009-01-28 2010-08-12 Techno Polymer Co Ltd 太陽電池用バックシート
WO2010100943A1 (ja) * 2009-03-06 2010-09-10 リンテック株式会社 太陽電池モジュール用保護シートおよびこれを用いた太陽電池モジュール
EP2448032B1 (en) * 2009-06-24 2014-09-17 Mitsubishi Chemical Corporation Organic electronic device and method for producing the same
CN102859711A (zh) * 2009-11-18 2013-01-02 3M创新有限公司 柔性组件及其制备和使用方法
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation

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