JP6141842B2 - エッジの保護されたバリアー性組立品 - Google Patents

エッジの保護されたバリアー性組立品 Download PDF

Info

Publication number
JP6141842B2
JP6141842B2 JP2014524018A JP2014524018A JP6141842B2 JP 6141842 B2 JP6141842 B2 JP 6141842B2 JP 2014524018 A JP2014524018 A JP 2014524018A JP 2014524018 A JP2014524018 A JP 2014524018A JP 6141842 B2 JP6141842 B2 JP 6141842B2
Authority
JP
Japan
Prior art keywords
substrate
barrier
layer
electronic device
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014524018A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014526150A (ja
JP2014526150A5 (enExample
Inventor
ディー.ウェイゲル マーク
ディー.ウェイゲル マーク
キダネ サミュエル
キダネ サミュエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2014526150A publication Critical patent/JP2014526150A/ja
Publication of JP2014526150A5 publication Critical patent/JP2014526150A5/ja
Application granted granted Critical
Publication of JP6141842B2 publication Critical patent/JP6141842B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/85—Protective back sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
    • H10F77/169—Thin semiconductor films on metallic or insulating substrates
    • H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
JP2014524018A 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品 Expired - Fee Related JP6141842B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161515079P 2011-08-04 2011-08-04
US61/515,079 2011-08-04
PCT/US2012/048917 WO2013019763A1 (en) 2011-08-04 2012-07-31 Edge protected barrier assemblies

Publications (3)

Publication Number Publication Date
JP2014526150A JP2014526150A (ja) 2014-10-02
JP2014526150A5 JP2014526150A5 (enExample) 2017-01-05
JP6141842B2 true JP6141842B2 (ja) 2017-06-07

Family

ID=47629646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014524018A Expired - Fee Related JP6141842B2 (ja) 2011-08-04 2012-07-31 エッジの保護されたバリアー性組立品

Country Status (8)

Country Link
US (1) US20140230892A1 (enExample)
EP (1) EP2740326A4 (enExample)
JP (1) JP6141842B2 (enExample)
KR (1) KR20140051990A (enExample)
CN (1) CN103733726B (enExample)
SG (1) SG2014007884A (enExample)
TW (1) TWI583557B (enExample)
WO (1) WO2013019763A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG2014007892A (en) * 2011-08-04 2014-04-28 3M Innovative Properties Co Method of making delamination resistant assemblies
WO2013019695A2 (en) 2011-08-04 2013-02-07 3M Innovative Properties Company Edge protected barrier assemblies
WO2013116032A1 (en) 2012-01-31 2013-08-08 3M Innovative Properties Company Methods for sealing the edges of multi-layer articles
EP2844464A4 (en) 2012-05-03 2015-12-23 3M Innovative Properties Co PERMANENT SOLAR MIRROR MOVIES
MX2021015334A (es) 2019-06-18 2022-03-25 Avery Dennison Corp Adhesivos sensibles a la presion a base de caucho butilico.

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69410536T2 (de) * 1993-06-24 1998-11-26 Canon K.K., Tokio/Tokyo Solarmodul mit warm-verschweisstem Teil zur Verbesserung der Feuchtigkeitsbeständigkeit
JPH07142756A (ja) * 1993-06-24 1995-06-02 Canon Inc 太陽電池モジュール及びその製造方法
US6066226A (en) * 1994-08-03 2000-05-23 Mitsubishi Gas Chemical Company, Inc. Method of making a sheet-shaped oxygen absorber
US5763555A (en) * 1996-01-22 1998-06-09 Ashland Inc. Water-borne acrylic emulsion pressure-sensitive adhesive compositions containing multifunctional monomer having improved stability and removability
JP3740251B2 (ja) * 1997-06-09 2006-02-01 キヤノン株式会社 太陽電池モジュールの製造方法
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
JP5127123B2 (ja) * 2005-07-22 2013-01-23 ダイキン工業株式会社 太陽電池のバックシート
EP1930953A4 (en) * 2005-09-30 2014-08-13 Toray Industries SEALING FILM FOR A SOLAR CELL MODULE AND SOLAR CELL MODULE
EP2095421A2 (en) 2006-07-27 2009-09-02 Nanosolar Inc. Individually encapsulated solar cells and/or solar cell strings
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
EP1898470B1 (en) * 2006-08-30 2011-07-27 Keiwa Inc. Use of a back sheet for photovoltaic modules and resulting photovoltaic module
JP4251225B2 (ja) * 2007-04-10 2009-04-08 ソニー株式会社 光学素子包括体、バックライトおよび液晶表示装置
AU2009234506B2 (en) * 2008-04-09 2013-11-21 Agency For Science, Technology And Research Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
JP2010177384A (ja) * 2009-01-28 2010-08-12 Techno Polymer Co Ltd 太陽電池用バックシート
JPWO2010100943A1 (ja) * 2009-03-06 2012-09-06 リンテック株式会社 太陽電池モジュール用保護シートおよびこれを用いた太陽電池モジュール
WO2010150759A1 (ja) * 2009-06-24 2010-12-29 三菱化学株式会社 有機電子デバイス及びその製造方法
KR20120094039A (ko) * 2009-11-18 2012-08-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 조립체, 및 그의 제조 및 사용 방법
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation

Also Published As

Publication number Publication date
TW201315604A (zh) 2013-04-16
TWI583557B (zh) 2017-05-21
CN103733726A (zh) 2014-04-16
CN103733726B (zh) 2017-11-17
KR20140051990A (ko) 2014-05-02
WO2013019763A1 (en) 2013-02-07
EP2740326A4 (en) 2015-05-20
EP2740326A1 (en) 2014-06-11
SG2014007884A (en) 2014-03-28
JP2014526150A (ja) 2014-10-02
US20140230892A1 (en) 2014-08-21

Similar Documents

Publication Publication Date Title
JP6139524B2 (ja) バリアアセンブリ
US10038112B2 (en) Edge protected barrier assemblies
JP6185465B2 (ja) 層間剥離抵抗アセンブリの作製方法
JP6208695B2 (ja) 連続多層フィルムを形成する方法
CN102067331B (zh) 包含具有硅烷基团的绝缘层的光伏组件
JP2014526985A (ja) エッジの保護されたバリアー性組立品
JP6228116B2 (ja) 縁部保護バリアアセンブリ
TWI583557B (zh) 邊緣經保護之阻障總成

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150730

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150730

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160511

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160517

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20160816

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20161117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170404

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170508

R150 Certificate of patent or registration of utility model

Ref document number: 6141842

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees